CN102276793B - High-temperature-resistant liquid anhydride curing agent and preparation method thereof - Google Patents

High-temperature-resistant liquid anhydride curing agent and preparation method thereof Download PDF

Info

Publication number
CN102276793B
CN102276793B CN2011101972416A CN201110197241A CN102276793B CN 102276793 B CN102276793 B CN 102276793B CN 2011101972416 A CN2011101972416 A CN 2011101972416A CN 201110197241 A CN201110197241 A CN 201110197241A CN 102276793 B CN102276793 B CN 102276793B
Authority
CN
China
Prior art keywords
curing agent
parts
epoxy resin
temperature
maleic anhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011101972416A
Other languages
Chinese (zh)
Other versions
CN102276793A (en
Inventor
郝玉龙
吴月荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shucheng Jin Zexin Green Material Co Ltd
Original Assignee
Shucheng Jin Zexin Green Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shucheng Jin Zexin Green Material Co Ltd filed Critical Shucheng Jin Zexin Green Material Co Ltd
Priority to CN2011101972416A priority Critical patent/CN102276793B/en
Publication of CN102276793A publication Critical patent/CN102276793A/en
Application granted granted Critical
Publication of CN102276793B publication Critical patent/CN102276793B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

The invention discloses a high-temperature-resistant liquid anhydride curing agent, comprising the following components in parts by weight: 45-55 parts of maleic anhydride, 5-15 parts of phenyl hydroxide, 33-35 parts of diethylene glycol, 4-6 parts of triethanolamine and 1-1.2 parts of concentrated sulphuric acid. The raw materials are mixed according to requirements and react to generate the curing agent disclosed by the invention, then the curing agent disclosed by the invention can cure epoxy resin at the high temperature of 150 DEG C after being subjected to glue mixing with epoxy resin, the cured epoxy resin has high toughness and excellent mechanical strength, working temperature can resist 200 DEG C, insulation resistance is more than 1012 Omega, and the curing agent is applicable to filling and sealing constructions on a dry type transformer, a mutual inductor, a relay, a temperature sensor and various integrated circuits.

Description

High temperature resistant liquid anhydride curing agent and preparation method thereof
Technical field
The present invention relates to a kind of solidifying agent, definite a kind of novel epoxy curing agent of saying so is specially a kind of high temperature resistant liquid anhydride curing agent.
Background technology
In the epoxy resin field, using maximum acid anhydride type curing agents both at home and abroad is Tetra hydro Phthalic anhydride and MALEIC ANHYDRIDE.647 liquid anhydride have been produced afterwards again, 70 and 80 liquid anhydride.Above-mentioned all acid anhydride type curing agents are after joining glue with epoxy resin and solidifying; 200 ℃ of high temperature of ability not; Though and toughness increases than the epoxy resin of self-vulcanizing; But not ideal enough, can not satisfy electronic enterprises to perfusion sealing material H.T. low-stress, and want resistant to elevated temperatures particular requirement.
Summary of the invention
The invention provides a kind of high temperature resistant liquid anhydride curing agent.This solidifying agent and epoxy resin join glue and solidify after material have the characteristics of high temperature resistant, H.T., low-stress.
The technical scheme that adopts for the present invention of realization above-mentioned purpose is following:
A kind of high temperature resistant liquid anhydride curing agent is characterized in that the weight part of its each component is:
MALEIC ANHYDRIDE 45-55
Phenol 5-15
Glycol ether 33-35
Trolamine 4-6
Vitriol oil 1-1.2.
Described liquid anhydride solidifying agent is characterized in that, the weight part of its each component is:
MALEIC ANHYDRIDE 50
Phenol 10
Glycol ether 34
Trolamine 5
The vitriol oil 1.
The preparation method of described high temperature resistant liquid anhydride curing agent is characterized in that, concrete operations are following:
(1) takes by weighing starting material by formula rate;
(2) add in the reaction kettle glycol ether that takes by weighing and trolamine and stirring earlier;
(3) with pouring in the reaction kettle after the phenol heating and melting, mix with glycol ether and trolamine in the still, stir;
(4) mixture of step (3) stirs after 30 minutes and to add after the vitriol oil continues to stir half a hour, and MALEIC ANHYDRIDE is added wherein in batches, constantly stirs;
(5), MALEIC ANHYDRIDE begins system is heated after all adding; When treating that material is warming up to 80 ℃, stop heating, treat that MALEIC ANHYDRIDE all melts back restir half a hour; Vacuumize and remove moisture content, treat to go out still by blowing when material is cooled to 50 ℃ of left and right sides naturally.
Beneficial effect of the present invention:
This solidifying agent has the pyritous characteristics, and this solidifying agent mixes with epoxy resin, and the epoxy resin after the curing has high temperature resistant, and working temperature can be anti-200 ℃; Has H.T. simultaneously; Low internal stress, physical strength is good, the characteristics that insulation resistivity is high; Can be applicable in the perfusion seal construction of rly., wave filter, TP and unicircuit; Also can be applied in the non-electron trade simultaneously, as making the epoxy resin technology article, metal or nonmetallic high temperature resistant bonding are repaired.
Embodiment
A kind of high temperature resistant liquid anhydride curing agent, the weight part of its each component is:
MALEIC ANHYDRIDE 50
Phenol 10
Glycol ether 34
Trolamine 5
The vitriol oil 1.
The preparation method of liquid anhydride solidifying agent is following:
(1) takes by weighing starting material by formula rate;
(2) add in the reaction kettle glycol ether that takes by weighing and trolamine and stirring earlier;
(3) with pouring in the reaction kettle after the phenol heating and melting, mix with glycol ether and trolamine in the still, stir;
(4) mixture of step (3) stirs after 30 minutes and to add after the vitriol oil continues to stir half a hour, and MALEIC ANHYDRIDE is added wherein in batches, constantly stirs;
(5), MALEIC ANHYDRIDE begins system is heated after all adding; When treating that material is warming up to 80 ℃, stop heating, treat that MALEIC ANHYDRIDE all melts back restir half a hour; Vacuumize and remove moisture content, treat to go out still by blowing when material is cooled to 50 ℃ of left and right sides naturally.
Application examples: during use, with epoxy resin E 44Or E 51With the epoxy curing agent of the present invention ratio batching of 100:60~90 by weight; Can be poured in the electronic product after mixing, and insert in the electrothermostat, 150 ℃ of heating were completely solidified in 5~7 hours; Working temperature can be anti-200 ℃, and insulation resistance is greater than 10 12Ω.
Epoxy resin after the curing has very high toughness, and physical strength is excellent, and working temperature can be anti-200 ℃, and insulation resistance is greater than 10 12Ω, the perfusion seal construction of suitable dry type transformer, mutual inductor, rly., TP and each adhesive integrated circuit.
High and new technology industrial development zone, Hefei City three brilliant electronics corporations successfully make resistant to elevated temperatures TP with epoxy curing agent of the present invention, have obtained good effect, have produced in batches and steady quality.
The concrete prescription that three brilliant electronics corporations use is following:
E 4480 parts in 100 parts of liquid anhydride solidifying agent of the present invention of 100 parts of ferric oxide red powder of epoxy resin
The TP that perfusion finishes is inserted in 150 ℃ of electrothermostats, after heating in 6 hours, is completely solidified.
Need the user of high temperature resistant high-toughness epoxy resin to construct with reference to the prescription and the curing process of three brilliant electronics corporations.
In non-electron trade, also can vigorously promote the use.Especially to metal or the repairing of nonmetallic high temperature resistant H.T. bonding etc., can both reach the ideal effect.

Claims (3)

1. high temperature resistant liquid anhydride curing agent is characterized in that the weight part of its each component is:
Figure FDA0000172560291
2. liquid anhydride solidifying agent according to claim 1 is characterized in that, the weight part of its each component is:
Figure FDA0000172560292
3. the preparation method of high temperature resistant liquid anhydride curing agent as claimed in claim 1 is characterized in that, concrete operations are following:
(1) takes by weighing starting material by formula rate;
(2) add in the reaction kettle glycol ether that takes by weighing and trolamine and stirring earlier;
(3) with pouring in the reaction kettle after the phenol heating and melting, mix with glycol ether and trolamine in the still, stir;
(4) mixture of step (3) stirs after 30 minutes and to add after the vitriol oil continues to stir half a hour, and MALEIC ANHYDRIDE is added wherein in batches, constantly stirs;
(5), MALEIC ANHYDRIDE begins system is heated after all adding; When treating that material is warming up to 80 ℃, stop heating, treat that MALEIC ANHYDRIDE all melts back restir half a hour; Vacuumize and remove moisture content, treat to go out still by blowing when material is cooled to 50 ℃ naturally.
CN2011101972416A 2011-07-14 2011-07-14 High-temperature-resistant liquid anhydride curing agent and preparation method thereof Expired - Fee Related CN102276793B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011101972416A CN102276793B (en) 2011-07-14 2011-07-14 High-temperature-resistant liquid anhydride curing agent and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011101972416A CN102276793B (en) 2011-07-14 2011-07-14 High-temperature-resistant liquid anhydride curing agent and preparation method thereof

Publications (2)

Publication Number Publication Date
CN102276793A CN102276793A (en) 2011-12-14
CN102276793B true CN102276793B (en) 2012-11-28

Family

ID=45102566

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101972416A Expired - Fee Related CN102276793B (en) 2011-07-14 2011-07-14 High-temperature-resistant liquid anhydride curing agent and preparation method thereof

Country Status (1)

Country Link
CN (1) CN102276793B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106881445B (en) * 2017-02-08 2019-08-06 宁夏共享化工有限公司 A kind of furan resin casting is with applying curing agent and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2807094B2 (en) * 1990-12-27 1998-09-30 住友ベークライト株式会社 Epoxy resin composition for optical semiconductor encapsulation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平4-363054A 1992.12.15

Also Published As

Publication number Publication date
CN102276793A (en) 2011-12-14

Similar Documents

Publication Publication Date Title
CN104726045B (en) A kind of heat-resistant fireproof epoxy glue and preparation method thereof
CN103979985B (en) Environment-friendly converter bedding-face repairing material and preparation method thereof
CN101735560B (en) Casting mixture for epoxy casting transformer and preparation method thereof
CN103113544B (en) Phenolic aldehyde modified amine curing agent and preparation method thereof
CN103570259A (en) Geopolymer dry powder material as well as preparation method thereof
WO2019015654A1 (en) Epoxy resin and functional graphene integrated filtering ic and preparation method therefor
CN104726047A (en) Room-temperature cured high-temperature-resistant epoxy resin plugging material and preparation method thereof
CN101358121A (en) Preparation method of high temperature resistant epoxy adhesive capable of room temperature curing
CN103694889B (en) A kind of fire-resistant anticorrosion paint for wide variety of substrates and preparation method thereof
CN107779147A (en) A kind of high-strength epoxy honeycomb adhesive and preparation method thereof
CN106280278A (en) Dry-type transformer or dry type mutual inductor speed cured epoxy resin castable and preparation and application thereof
CN102276792B (en) Liquid anhydride curing agent capable of rapidly curing while heating and preparation method thereof
CN102276793B (en) High-temperature-resistant liquid anhydride curing agent and preparation method thereof
CN109108213A (en) Curing agent is used in a kind of casting
CN103980669A (en) Preparation method for epoxy resin board
CN105504688B (en) A kind of F grades of motor embedding composite ceramics/epoxy resin composite material and preparation method thereof
CN105251938B (en) Production technology for precoated sand
CN105001825A (en) Low temperature resisting epoxy resin adhesive and preparation method thereof
CN105001818B (en) Phenolic resin adhesive method is prepared using cresols production accessory substance
CN105062390A (en) Preparation method of adhesive for metal material packaging
CN103911116A (en) Adhesive for tile or steel brick
CN103613359B (en) Inorganic high-temperature adhesive for casting aluminum and aluminum alloy
CN104356989A (en) DMD (Dacron/Mylar/Dacron) flexible composite material adhesive
CN102344545B (en) Medium-temperature and quickly-cured colorless transparent epoxy resin curing agent and preparation method thereof
CN106554746A (en) A kind of wavy metal pipe binder being modified based on sodium silicate and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121128

Termination date: 20130714