CN102254585A - Method for manufacturing conductive paste - Google Patents
Method for manufacturing conductive paste Download PDFInfo
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- CN102254585A CN102254585A CN2011100975046A CN201110097504A CN102254585A CN 102254585 A CN102254585 A CN 102254585A CN 2011100975046 A CN2011100975046 A CN 2011100975046A CN 201110097504 A CN201110097504 A CN 201110097504A CN 102254585 A CN102254585 A CN 102254585A
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- conductive paste
- paste
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- viscosity
- treatment
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- 238000000034 method Methods 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000843 powder Substances 0.000 claims abstract description 151
- 239000006185 dispersion Substances 0.000 claims abstract description 88
- 239000002270 dispersing agent Substances 0.000 claims abstract description 46
- 239000003960 organic solvent Substances 0.000 claims abstract description 20
- 238000001914 filtration Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims description 69
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 238000002203 pretreatment Methods 0.000 claims description 37
- 239000000203 mixture Substances 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 25
- 238000005245 sintering Methods 0.000 claims description 18
- 239000003112 inhibitor Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000003990 capacitor Substances 0.000 abstract description 3
- 229910052573 porcelain Inorganic materials 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 84
- 239000002245 particle Substances 0.000 description 76
- 229910052759 nickel Inorganic materials 0.000 description 31
- 230000008569 process Effects 0.000 description 24
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 22
- 229910002113 barium titanate Inorganic materials 0.000 description 21
- 230000008859 change Effects 0.000 description 21
- 238000010008 shearing Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 16
- 238000009736 wetting Methods 0.000 description 15
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 9
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 8
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000002002 slurry Substances 0.000 description 8
- 229940116411 terpineol Drugs 0.000 description 8
- GNEPLYVYORHREW-UHFFFAOYSA-N 1,1,3,3,6-pentamethyl-7-nitro-2h-inden-5-amine Chemical compound CC1=C(N)C=C2C(C)(C)CC(C)(C)C2=C1[N+]([O-])=O GNEPLYVYORHREW-UHFFFAOYSA-N 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000004840 adhesive resin Substances 0.000 description 6
- 229920006223 adhesive resin Polymers 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 235000019260 propionic acid Nutrition 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000001354 calcination Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 5
- 230000006641 stabilisation Effects 0.000 description 5
- 238000011105 stabilization Methods 0.000 description 5
- 238000004438 BET method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 239000002003 electrode paste Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 201000007336 Cryptococcosis Diseases 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- IGODOXYLBBXFDW-UHFFFAOYSA-N alpha-Terpinyl acetate Chemical compound CC(=O)OC(C)(C)C1CCC(C)=CC1 IGODOXYLBBXFDW-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 235000019326 ethyl hydroxyethyl cellulose Nutrition 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- 239000013528 metallic particle Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000003016 phosphoric acids Chemical class 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- FFQALBCXGPYQGT-UHFFFAOYSA-N 2,4-difluoro-5-(trifluoromethyl)aniline Chemical class NC1=CC(C(F)(F)F)=C(F)C=C1F FFQALBCXGPYQGT-UHFFFAOYSA-N 0.000 description 1
- WWJLCYHYLZZXBE-UHFFFAOYSA-N 5-chloro-1,3-dihydroindol-2-one Chemical compound ClC1=CC=C2NC(=O)CC2=C1 WWJLCYHYLZZXBE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000896 Ethulose Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000001859 Ethyl hydroxyethyl cellulose Substances 0.000 description 1
- KGEKLUUHTZCSIP-UHFFFAOYSA-N Isobornyl acetate Natural products C1CC2(C)C(OC(=O)C)CC1C2(C)C KGEKLUUHTZCSIP-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000001940 [(1R,4S,6R)-1,7,7-trimethyl-6-bicyclo[2.2.1]heptanyl] acetate Substances 0.000 description 1
- FAFMZORPAAGQFV-BREBYQMCSA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] propanoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)CC)C[C@@H]1C2(C)C FAFMZORPAAGQFV-BREBYQMCSA-N 0.000 description 1
- JIMPAYYJPMENLQ-UHFFFAOYSA-N acetic acid;2-(2-methoxypropoxy)propan-1-ol Chemical class CC(O)=O.COC(C)COC(C)CO JIMPAYYJPMENLQ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JQPDCKOQOOQUSC-OOZYFLPDSA-N dihydrokainic acid Chemical compound CC(C)[C@H]1CN[C@H](C(O)=O)[C@H]1CC(O)=O JQPDCKOQOOQUSC-OOZYFLPDSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920003089 ethylhydroxy ethyl cellulose Polymers 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- DIICMQCJAQLQPI-UHFFFAOYSA-N isobornyl propionate Natural products CCC(=O)C1CC2CCC1(C)C2(C)C DIICMQCJAQLQPI-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
Abstract
The invention provides a method for manufacturing a conductive paste which has high dispersivity and excellent viscosity stability as a paste for an internal electrode of a laminated porcelain capacitor. The method for manufacturing the conductive paste is characterized by including one to three steps of: a preliminary treatment dispersion step, heating and mixing the coarse conductive paste including the conductive metallic powders, a dispersant, an organic adhesive and an organic solvent, permitting it to pass through a nozzle having an orifice; a dispersion step, dispersing the heated conductive paste by a high-pressure homogenizer; and a filtering step, filtering the conductive paste after dispersion treatment by a filter.
Description
Technical field
The present invention relates to a kind ofly in the multi-layer ceramic capacitor internal electrode paste, keep polymolecularity, the manufacture method of the conductive paste of viscosity stability excellence simultaneously.
Background technology
Be accompanied by the frivolous compact of electronic equipments such as mobile phone and digital device, for as the multi-layer ceramic capacitor of chip part (below be called MLCC) also at expectation its miniaturization, high capacity and high performance.Be used to realize that these effective method is that attenuate interior electrode layer and dielectric layer are sought multiple stratification.
This MLCC generally makes by following operation.In order to form dielectric layer, at first with barium titanate (BaTiO
3) comprise on the dielectric raw cook of organic bonds such as barium titanate and polyvinyl butyral resin for principal component, to be principal component with the electroconductive powder, make its be dispersed in form in the carrier that comprises resin binder and solvent, print as the conductive paste pattern in accordance with regulations of internal electrode, and its dry removing is desolvated, form desciccator diaphragm.Then, the dielectric raw cook that will be formed with desciccator diaphragm adds thermo-compressed and carries out integrated under multilayer laminated state, cut off then, in oxidizing atmosphere or inert atmosphere, carrying out the unsticking mixture below 500 ℃, thereafter, not make the mode of internal electrode oxidation, in reducing atmosphere, about 1300 ℃, carry out heating and calcining.Then, will calcine chip coating, calcining after, externally implement nickel plating etc. on the electrode, make MLCC.
But, in this calcination process, the temperature that dielectric ceramic powder begins sintering is about 1200 ℃ because with the sintering of conductive metal powder such as nickel, shrink the beginning temperature and produce sizable inconsistently, therefore be easy to generate faults of construction such as delamination (splitting) or crackle.Particularly be accompanied by small-sized, high capacity, stacked number thickness many more or the ceramic dielectric layer is thin more, and it is obvious more that the generation of fault of construction just becomes.
For example, use in the nickel paste at common internal electrode, at least near dielectric layer begins the temperature of sintering, contraction, in order to control its sintering, contraction, the perofskite type oxide that is added with the barium titanate class of the composition that is similar to dielectric layer or strontium zirconate class etc. is the ceramic powders of main component.Its result can control the sintering behavior of nickel by powder, and the sintering that suppresses interior electrode layer and dielectric layer shrinks the inconsistent of behavior.In addition, add ceramic powders can alleviate formation element difference when the dielectric medium powder that is comprised in the formation element of the principal component of dielectric layer and the electrode paste agent when big dielectric absorption increase etc. bring the such trouble of influence to electrical characteristics.
In recent years, the requirement of, high capacity more small-sized along with MLCC is used the interior electrode layer of conductive metal powder such as nickel and is used the further thin layerization progress rapidly of dielectric layer of the ceramic powders of barium titanate etc.Therefore, just need to be used for the conductive metal powder such as nickel of conductive paste and micronize, the enhancement of dispersion of ceramic powders.
Yet; owing to be accompanied by the micronize progress of conductive metal powder and ceramic powders; the easness of aggegation increases gradually; therefore; only shear with the existing mechanicalness of 3 roller machines of utilizing; the conductive paste of required dispersity be can not make, level and smooth dry coating or high dry film density are difficult to obtain.Thereby, as patent documentation 1,2,, make conductive paste in the time of must increasing worker for fine-particle powder being handled until obtaining required dispersiveness, manufacturing time is elongated as a result.
In addition, the manufacture method of the common conductive paste that utilizes 3 roller machines is that raw material is mixing, then makes its dispersion, then carry out viscosity adjustment as needs, but in this manufacture method,, disperse also limited for conductive metal powder or the ceramic powders that makes particulate even when considering worker.
On the other hand, be distributed to the method beyond the 3 roller machines of carrier and solvent as inorganic powders such as conductive metal powder that is used for making dry aggegation or ceramic powders, disclose the method that makes its mechanical dispersion, pulverizing with ball mill or ball mill etc. in the patent documentation 3,4.
But, in utilizing the process for dispersing of ball mill, there is the problem of the conductive metal powder distortion that causes by medium, in utilizing the process for dispersing of ball mill, be under the situation of firm aggegation at the conductive metal powder, limited for it is disperseed fully.
Recently, as the process for dispersing beyond above-mentioned 3 roller machines, ball mill, the ball mill, the manufacture method (for example, with reference to patent documentation 5,6) that has proposed to use the conductive metal slurry of high-pressure homogenizer and used its conductive paste.
In this patent documentation 5, behind the moistened surface with metallic particles and ceramic particle, use high-pressure homogenizer, run foul of each other by making from the injection stream that nozzle sprayed that is arranged at relative direction, make conductive paste, but in the method, the slurry viscosity that utilizes high-pressure homogenizer to be produced from the injection stream that nozzle sprayed limits, and then handle the problem that occurs under the situation of the high viscosity slurry be added with organic carrier with high-pressure homogenizer at normal temperatures and be, hindered by organic carrier owing to give the impact force of conductive metal powder or ceramic powder, therefore the impact force that is produced by high-pressure homogenizer can't play a role to conductive metal powder or ceramic powder effectively, can not disperse fully.
In addition, patent documentation 6 has reported that the thick slurry that premixed inorganic particle and organic solvent are formed utilizes high-pressure homogenizer to carry out dispersion treatment and makes the conductivity slurry, uses this conductivity slurry to make conductive paste.
But, the common ground of the compounding process in the existing conductive paste manufacturing process is, use high speed shear mixer or the devices such as planetary mixer more than 2, inorganic powder such as conductive metal powder or ceramic powder and organic substance (organic solvent, dispersant, organic carrier etc.) are mixed.Yet, in these compounding process, the surface that often becomes organic carrier undercompounding, conductive metal powder or ceramic powders becomes fully not wetting etc. state, under the situation of the dispersion treatment of utilizing high-pressure homogenizer of operation under these compounding process of process, be easy to generate following problem.
The first, because of adding organic carrier, the viscosity of the thick paste of conductivity raises, its as a result flowability become not enough, thereby be difficult to utilize the dispersion treatment of high-pressure homogenizer.
The second, there is the organic carrier that does not mix fully in the thick paste of conductivity, when it was put in the high-pressure homogenizer, the solid constituent that includes organic carrier was attached in the device, and becoming is difficult to operate as normal.
The 3rd, hindered by organic carrier, (organic carrier becomes cushion pad by can not bringing into play to greatest extent the impact force of conductive metal powder or ceramic powder or shearing force of producing of high-pressure homogenizer, mechanical shear stress can't play a role to conductive metal powder or ceramic powders effectively, can not obtain sufficient dispersiveness).
The 4th, because the surface of conductive metal powder or ceramic powders is not wetting fully, so conductive paste is almost lackluster, in addition, owing to have the agglutinator bigger than nozzle diameter, and so the frequency gets higher of obstruction takes place in nozzle.
In addition, though different with purposes of the present invention, as the method for the dispersiveness that improves solder paste, patent documentation 7 has been reported and has been made its method by throttle orifice, but in this way, particulate conductive metal powder or ceramic powders can not disperse.
Also have, under situation about handling with 3 roller machines and since just begun back conductive metal powder form laminar, or because a little less than the mechanical shear stress, therefore under the wetting inadequate situation on the surface of material powder, there is limit to obtaining required dispersiveness.
Usually, the dispersion process of conductive metal powder and ceramic powders comprises following process:
(1) " wetting " of conductive metal powder and ceramic powders, promptly be present in air in the space of 2 particle surfaces and 2 granule interior by the process of organic solvent and dispersant displacement;
(2) 2 particles are by the process of dispersion machine dispersion, pulverizing;
(3) dispersant adsorption is carried out the process of particle " preventing aggegation again " at the particle surface through disperseing, pulverizing.
In this dispersion process, utilize the pretreatment procedure of the mixing stirring of mixer etc. to influence the wetability of conductive metal powder and ceramic powders or the time of handling in next step dispersion step, utilize the dispersion step of dispersion machines such as 3 roller machines to influence the dispersiveness of conductive metal powder and ceramic powders, under the situation of the bad dispersibility of particle after the dispersion step, because the part that exists dispersant not adsorbed by particle surface is therefore owing to being difficult to prevent that aggegation again from descend dispersion stabilization.
On the other hand, the micronize of conductive metal powder or ceramic powders is becoming main flow, but except making particulate inorganic powder disperses, in the conductive paste that uses particulate inorganic powder, exist because of through the time viscosity that the causes problem that changes.This is because when paste viscosity changes, because the variation of generation printing can make can not obtain suitable thickness or shape when printing, causes can not quality bills of materials stable electrode etc.
To this, as suppressing the method that viscosity changes, patent documentation 8 has proposed to use Ni/Ni (OH)
2The conductive paste that/NiO obtains than being controlled at the nickel by powder in the distinctive composition ratio scope.
But, be accompanied by the micronize of nickel by powder, for control because of through the time conductive paste that causes viscosity change, the selection of dispersant or dispersant become important to the absorption of nickel surface.Especially, for using the conductive paste of the particulate nickel powder below the 0.2 μ m, only make its dispersion have limit by the present mechanical shearing that utilizes 3 roller machines because dispersant becomes insufficient to the absorption of nickel surface, the result just be difficult to control because of through the time viscosity that causes change.
The prior art document
Patent documentation
Patent documentation 1: the spy opens the 2006-351348 communique
Patent documentation 2: the spy opens the 2003-86449 communique
Patent documentation 3: the spy opens the 2006-156204 communique
Patent documentation 4:WO2005-043568 communique
Patent documentation 5: the spy opens the 2004-288528 communique
Patent documentation 6: the spy opens the 2005-104070 communique
Patent documentation 7: the spy opens the 2002-001528 communique
Patent documentation 8: the spy opens the 2004-330247 communique
Summary of the invention
Invent problem to be solved
Point in view of the above problems, for the full-bodied conductive paste that includes organic carrier, the present invention can utilize the high-pressure homogenizer manufacturing to be difficult to the method for the full-bodied conductive paste made at present, can obtain polymolecularity, and can obtain the paste characteristic of viscosity stability excellence.It can improve " wetting " and " viscosity " in the pretreatment procedure by in the presence of organic carrier, and " viscosity " improved in addition when carrying out dispersion treatment with high-pressure homogenizer is made.
Promptly, in existing pre-treating method, in the presence of organic carrier, the surface of conductive metal powder or ceramic powders is difficult to wetting, but in the present invention,, make it have flowability by heating reduction viscosity even in the presence of organic carrier, when having the nozzle of throttle diameter, can not cushioned and make the particle surface of conductive metal powder or ceramic powders wetting easily by organic carrier.And then, in pretreatment procedure, the moistened surface of conductive metal powder or ceramic powders, even under the state that organic carrier exists, make it have mobile conductive paste so long as heat, even if put into down in the high-pressure homogenizer of operation, the powerful shearing force that acts on conductive metal powder or ceramic powders is not cushioned by organic carrier yet and plays a role effectively, and dispersion efficiency improves.
Like this, by improving present pre-treating method and the process for dispersing that utilizes high-pressure homogenizer, even in the presence of organic carrier, utilize high-pressure homogenizer also can make conductive paste, utilize the conductive paste of the conductive metal slurry of high-pressure homogenizer manufacturing to compare with conductive paste that utilizes 3 roller machines or use, obtain the conductive paste of dispersed height and viscosity stability excellence.In addition, with regard to viscosity stability, " wetting " of particle surface improves, and obtains polymolecularity in utilizing the dispersion process of high-pressure homogenizer.At this moment, because dispersant adsorption at particle surface, can prevent " aggegation again " of particle, therefore, even long preservation also can be kept the dispersion stabilization of conductive paste.
As above, the objective of the invention is to, the conductive paste that provides the multilayer ceramic electronic component of a kind of polymolecularity and viscosity stability excellence to use, it is for for the miniaturization of multilayer ceramic electronic component, slimming and the conductive metal powder or the ceramic powder of miniaturization, even there is the full-bodied conductive paste of organic carrier, also available high-pressure homogenizer manufacturing.
Be used to solve the means of problem
The 1st invention of the present invention is the manufacture method of conductive paste, it is characterized in that, has following the 1st operation to the 3 operations.
[the 1st operation]: while will contain at least the thick paste of conductivity of conductive metal powder, dispersant, organic bond and organic solvent heat mix stir after, make it by possessing the nozzle of throttle orifice, carry out the pre-treatment dispersion step of dispersion treatment thus.
[the 2nd operation]: will utilize high-pressure homogenizer to carry out the dispersion step of dispersion treatment by the conductive paste that the 1st operation pre-treatment disperses through heating.
[the 3rd operation]: the filtration operation that will utilize filter to filter by the conductive paste of the 2nd operation dispersion treatment.
The 2nd invention of the present invention be characterised in that, the nozzle that possesses throttle orifice of the 1st operation in the 1st invention in series arrange 2 with on the thick paste of conductivity is disperseed.
The 3rd invention of the present invention be characterised in that, the throttle diameter of the throttle orifice of the 1st operation in the 1st invention is 0.2～0.5mm.
The 4th invention of the present invention be characterised in that, the viscosity of the thick paste of conductivity in the 1st invention is below the 10Pas.
The 5th invention of the present invention be characterised in that, the high-pressure homogenizer in the 1st invention carries out dispersion treatment with the pressure of 50～250MPa.
The 6th invention of the present invention be characterised in that, the throttle diameter of the throttle orifice that possesses in the high-pressure homogenizer that the conductive paste of the 2nd operation in the 1st invention flows is 0.05～0.2mm.
The 7th invention of the present invention be characterised in that, the high-pressure homogenizer in the 1st invention possesses cooler in export department's side of throttle orifice.
The 8th invention of the present invention be characterised in that, the viscosity through the conductive paste of heating of the 2nd operation in the 1st invention is below the 10Pas.
The 9th invention of the present invention is characterized in that for utilizing the 1st the formed conductive paste of invention the content of conductive metal powder is 30～70 weight % with respect to the conductive paste total amount.
The 10th invention of the present invention is characterised in that in the conductive paste of the 9th invention, conductive paste comprises ceramic powders as sintering inhibitor.
The invention effect
According to the present invention, in the manufacture method of the conductive paste in multilayer ceramic electronic component, give conductive paste is finished the conductive paste that the paste characteristic of excellence is specialized with polymolecularity formation by utilizing the mechanical shearing effect, and then, realized keeping the conductive paste of polymolecularity, while viscosity stability excellence as the multi-layer ceramic capacitor internal electrode paste.
Description of drawings
Fig. 1 is the manufacturing flow chart according to conductive paste of the present invention.
Fig. 2 is the generalized section of the nozzle that possesses throttle orifice that uses in the pre-treatment dispersion step of the 1st operation.
Fig. 3 is the key diagram of dispersal device that is used for the pre-treatment dispersion step of the 1st operation.
Fig. 4 is the figure of the relation of expression viscosity and paste temperature.
Symbol description
1 jar
2 heaters
3 stirrer paddles
4 pumps
5 nozzles
The diameter of D nozzle (external diameter)
Distance between the L throttle orifice
6 throttle orifices
D throttle diameter (internal diameter of throttle orifice)
Embodiment
The conductive paste that the internal electrode of the multi-layer ceramic capacitor among the present invention forms usefulness is a kind ofly conductive metal powder and ceramic powders to be dispersed in adhesive is dissolved in the organic carrier that forms in the organic solvent and the paste that makes.
Such conductive paste is to form through 3 following procedures.
1. the 1st operation (pre-treatment dispersion step)
With the thick paste of the conductivity that contains conductive metal powder, dispersant, organic bond and organic solvent at least while heat mix stir after, make it carry out dispersion treatment by the nozzle that possesses throttle orifice.
2. the 2nd operation (dispersion step)
To carry out the dispersion treatment that conductive paste that pre-treatment disperses uses high-pressure homogenizer that it is further disperseed by the 1st operation.
3. the 3rd operation
To use filter to filter by the conductive paste that the 2nd operation has been carried out dispersion treatment.
Below, explain these operations.
(the 1st operation)
The 1st operation be with the thick paste of the conductivity that contains conductive metal powder, dispersant, adhesive and organic solvent at least while heat mix stir after, make it by being installed in the nozzle that possesses throttle orifice on the drive-type pump, give mechanical shearing thus and carry out the operation that pre-treatment disperses.Need to prove, be for the viscosity of the thick paste of conductivity when reducing pre-treatment and disperse while heat the reason that stirs, and gives flowability.
Stir common mixed stirring devices such as to use the propeller type agitating device in the mixing that this operation is carried out.Preferred especially dispersion machine high speed mixing stirring devices such as (デ イ ス パ one).
In the pre-treatment dispersion process of the 1st operation, by the thick paste of conductivity being sent into the nozzle of throttle orifice, by throttle orifice the time, give this conductivity thick paste shearing force with specified diameter, carry out dispersion treatment thus.
Make its carrying method as being used for that the thick paste of this conductivity is sent into nozzle, can from various pumps such as charge pump, single-screw (single screw) pump (モ one ノ Port Application プ), membrane pump, gear pump, suitably select to use by throttle orifice.The pressure that is imposed on the thick paste of conductivity by these pumps is not particularly limited, but preferably uses 5kg/cm in the scope of not bringing influence to productivity ratio
2More than be advisable.
Fig. 2 represents to be used for the nozzle 5 of pre-treatment dispersion and an example of throttle orifice 6.
To making the thick paste of conductivity be subjected to the internal diameter (below be called throttle diameter, among Fig. 2 with symbol " d " expression) of the throttle orifice of shear action, the preferred nozzle that uses throttle diameter with 0.2～0.5mm.
Under the situation of this throttle diameter less than 0.2mm, might in the pre-treatment dispersion step spray nozzle clogging take place, under the situation greater than 0.5mm, in the presence of organic carrier, the wetting of the surface of conductive metal powder or ceramic powders becomes insufficient.In addition, as long as throttle diameter is the nozzle of internal diameter 0.2～0.5mm, just can make up.
Nozzle with throttle orifice both can be the nozzle that possesses a throttle orifice in the nozzle, also can be the nozzle that has a plurality of throttle orifices as shown in Figure 2 in nozzle.The number of its throttle orifice preferably is connected in series with more than 2.When setting like this, only the number of throttle orifice just can give conductivity thick paste mechanical shearing.Need to prove that the number of throttle orifice is not stipulated especially, but selected to possess the nozzle number that gives the throttle orifice of the number of the mechanical shearing of necessity in the pre-treatment dispersion step.And then the distance L between throttle orifice can consider that also the paste characteristics such as viscosity of conductive paste suitably set.
As shown in Figure 2, be connected in series, the thick paste of conductivity is passed through, produce the shearing force of the stream internal face of thick paste of conductivity and throttle orifice, make the surface of conductive metal powder or ceramic powders wetting easily by throttle orifice with a plurality of narrow gaps.Need to prove that in the present embodiment, the size of the nozzle that possesses throttle orifice that the pre-treatment dispersion step is used is that diameter (external diameter) is 4.7mm (being shown in the D of Fig. 2), length is 10mm (being shown in the L of Fig. 2).
This its shape of nozzle preferably drum shape, do not have the nonabradable linearity of bend or flexing portion, and then, for example can enumerate: diamonds such as sintered diamond and single-crystal diamond as the material that forms throttle orifice; Ceramic materials such as aluminium oxide, zirconia, carborundum; Metals such as stainless steel, iron, titanium.
Pre-treatment for the 1st operation disperses, as present pre-treating method, when only stirring when mixing with high speed shear mixer or the agitating devices such as planetary mixer more than 2, because the surface of conductive metal powder or ceramic powder is not wetting fully in organic carrier, the big agglutinator that has the organic carrier, conductive metal powder and the ceramic powders that do not mix fully, therefore the dispersion efficiency that utilizes high-pressure homogenizer in the 2nd operation descends.And the remaining organic carrier that does not mix fully in the thick paste of conductivity descends the glossiness of desciccator diaphragm.
One of the pre-treatment dispersion step of the conductive paste among the present invention is illustrated in Fig. 3.As shown in Figure 3, while use the heater 2 heating nozzle 5 of interior thick paste Jie of conductivity of jar that stirrer paddle 3 stirs 1 by the throttle orifice of pump 4 by having a plurality of narrow gaps that are connected in series.
(the 2nd operation)
In the 2nd operation, will further disperse with high-pressure homogenizer by the conductive paste that the 1st operation pre-treatment disperses to form.
Preferred 50～the 250MPa of the pressure of high-pressure homogenizer of the present invention more preferably handles with 100～200MPa.When this insufficient pressure 50MPa, owing to the speed of the injection stream that sprays from throttle orifice is not enough, therefore, act on a little less than the energy of handled thing, so cause dispersion bad.In addition, pressure is that the following reason of 250MPa is the wearing and tearing from the parts that suppress dispersion machine, makes its viewpoint that can tolerate long use consider and select.
The high-pressure homogenizer of bearing dispersion treatment in the 2nd operation is the equipment that utilizes fine throttle orifice in order to produce high velocity jet, its throttle diameter is considered to be preferably set to about 0.05～0.2mm from the efficiency of productivity ratio or device, in addition, its shape does not preferably have the nonabradable linearity of bend or flexing portion.And then the material that forms throttle orifice can be enumerated diamonds such as sintered diamond or single-crystal diamond; Ceramic materials such as aluminium oxide, zirconia, carborundum; Metals such as stainless steel, iron, titanium, the material of wherein preferred nonabradable high rigidity material.
Usually, the pass through speed more fast then shearing force of paste in throttle orifice also becomes big more, can make particle grain size finer.Yet, when particle diameter becomes too small,,, need to regulate this throttle orifice by speed therefore for particle being maintained under the state of suitable particle diameter owing to become and cause aggegation easily so that in the throttle orifice and throttle orifice by after act on paste stress be optimum.
Should carry out according to conditions such as throttle diameter, processing pressure by the adjusting of speed, by with the throttle orifice of paste by the scope of speed regulation at 100～1000m/sec, can make particle be in suitable fine particle size state and prevent aggegation.
In addition, in order to prevent to cause paste, make paste while also can apply counter-pressure by behind the throttle orifice collision of spatial portion inwall and the uneven homogenize of shearing force being produced bubble.In addition, the stability decreases owing to particle when the paste temperature uprises produces problems such as aggegation again, so not preferred, therefore, preferably be equipped with cooling device for anti-paste suppressing agent temperature rises.
Dispersion number of pass times in the high-pressure homogenizer can suitably be selected according to desired particle diameter, particle size distribution etc.It should be noted that, disperse number of pass times preferably to be undertaken by the structure that makes the such device of paste circulation.
The putting into of the 2nd operation carried out dispersion treatment in the high-pressure homogenizer conductive paste expectation is for evenly and low viscosity, but below the preferred 10Pas of viscosity of the conductive paste when implementing the high pressure homogenizing, more preferably below the 5Pas.
For example, shown in the relation of the temperature of the conductive paste of Fig. 4 and viscosity, the paste temperature 25 ℃ viscosity be the conductive paste of 30Pas when being heated, viscosity descends when the temperature of conductive paste rises.
Be higher than in this viscosity under the situation of 10Pas, conductive paste does not have flowability, and therefore, in the time of in putting into high-pressure homogenizer, processing pressure can not get improving, and can't implement dispersion treatment.In addition, be higher than in the temperature of conductive paste under 70 ℃ the situation, the viscosity of conductive paste becomes below the 10Pas, but the Compositional balance of secure context such as the volatility of the organic solvent that uses, inflammability and conductive paste changes easily, and is therefore not preferred.
As the high-pressure homogenizer that uses, microjet homogenizer (マ イ Network ロ Off Le イ ダ イ ザ one) (manufacturings of マ イ Network ロ Off Le イ デ イ Network ス society), Na ノ マ イ ザ one (the industrial strain formula of Jitian's machinery can shut out manufacturings), Nano3000 (beautiful manufacturing of Co., Ltd.), ア Le テ イ マ イ ザ one (manufacturing of the ス ギ ノ マ シ of Co., Ltd. Application) etc. are arranged.
(the 3rd operation)
The 3rd operation operation that to be the conductive paste that will carry out dispersion treatment through the high-pressure homogenizer that utilizes the 2nd operation filter with the filter of regulatory specifications.
Filter as filter, with 99% filtering filtering accuracy (カ Star ト ろ
Precision), be that the following filter of 5 μ m filters with mesh.Using mesh to surpass under the situation of filter of 5 μ m, can not remove the not dispersion thing, big particle of inorganic matter etc., when the material of sneaking into greater than dielectric layer thickness, because the paste film coated surface produces projection, flatness descends.Therefore, can not obtain the conductive paste of flatness excellence.
Need to prove that so-called is that filter below the 5 μ m filters with 99% filtering filtering accuracy mesh, be meant with 99% filtering precision and replenish more than 99% particle above 5 μ m.For example, can enumerate based on the one way test of 7 kinds of JIS z 8901 regulations tests with powder (5mg/L dispersion liquid, 10L/min).In addition, as filter materials, metal, PTFE (polytetrafluoroethylene), polypropylene etc. are arranged, but be not limited to these materials.And then, as in this employed structure of filter, can the illustration membrane type, rivel formula, degree of depth formula (デ プ ス タ イ プ) etc., but be not limited to these structures.
(conductive paste formation thing)
For the conductive paste of the flatness and the desciccator diaphragm density that obtain to improve dry coating, nickel by powder preferably uses the micropowder of particle diameter 0.03～0.5 μ m.Nickel by powder produces big particle because of aggegation sometimes, when the particle diameter of nickel powder surpasses 0.5 μ m, film forming variation during with the coated film thin layer of paste, the static capacity that can not obtain to stipulate not only, and the probability of sneaking into of big particle increases, and occurs the bad phenomenon that disintegration voltage (BDV) reduces easily.In addition, in the time will forming such electrode film of corresponding thin layerization, the flatness of desciccator diaphragm is not enough, and the filling of nickel by powder particle becomes insufficient, can not guarantee required desciccator diaphragm density.
On the other hand, be set at reason below the 0.5 μ m as particle diameter with nickel by powder, be because this be for the electrode film that in the thin layerization of stacked capacitor, forms the continuity excellence necessary.And then when particle diameter was lower than 0.03 μ m, the specific area of particle became excessive, the surface activity of metallic particles becomes too high, not only dry, unsticking mixture characteristic are brought harmful effect, and might can not obtain suitable viscosity characteristics, or at the long preservation mesometamorphism of conductive paste.
In the present invention, the particle diameter of nickel by powder is based on promptly that BET method contrast table area calculates and the particle diameter that draws unless otherwise specified.Its calculating formula is shown in mathematical expression 1.
[mathematical expression 1]
The particle diameter of nickel by powder=6/ (SA
1* ρ
1)
ρ
1=8.9 (real densities of nickel)
SA
1: the specific area of nickel powder (BET method)
Conductive metal proportion of particles in the conductive paste of the present invention is preferably 30～70 weight %.When the conductive gold metal particles was lower than 30 weight %, the obvious attenuation of the thickness of electrode after the calcining, resistance value were risen, or the formation of electrode film is insufficient and lose conductivity, can not obtain the static capacity as target sometimes.When surpassing 70 weight %, electrode film becomes and is difficult to thin layerization.The conductive metal powder is 40～60 weight % with respect to the paste set overall more preferably.
Under situation about ceramic powders being added on as sintering inhibitor in the conductive paste, can be from being generally the BaTiO of perofskite type oxide
3Deng or wherein be added with in the perofskite type oxide of various additives and select.In addition, go back employed ceramic powders same composition of the principal component as the dielectric layer raw cook or similar composition the preferred and that MLCC uses.
This ceramic powders can use the ceramic powders of various method for making manufacturings such as utilizing solid phase method, hydrothermal synthesis method, alkoxide process, sol-gal process.In addition, as required, for ceramic powders, the ceramic slurry that devices such as utilizing ball mill or high-pressure homogenizer can have been implemented dispersion, pulverization process is added in the conductive paste as sintering inhibitor.
The particle diameter of ceramic powders is preferably in the scope of 0.01 to 0.2 μ m.When the particle diameter of ceramic powders surpassed 0.2 μ m, desciccator diaphragm density descended.In desciccator diaphragm, in the formed gap of torulose nickel by powder particle packing, fill ceramic powders.When the particle diameter of ceramic powders surpasses 0.2 μ m, become and be difficult to enter between the contact point of torulose nickel by powder particle, therefore, be difficult to obtain required desciccator diaphragm density, and then the sintering of conductive paste is begun the effect that temperature delay to the sintering of ceramic layer begins temperature die down.
On the other hand, when the particle diameter of ceramic powders was lower than 0.01 μ m, the sintering carryover effects of conductive paste was difficult to manifest, and produced faults of construction such as delamination or crackle.In addition, occur that above-mentioned desciccator diaphragm density descends or be the problem (insulation resistance descend or short circuit ratio rising etc.) of reliability variation of capacitors such as thin layer change difficulty of the dielectric layer of cause with the aggegation powder of ceramic powders.
In the present invention, the particle diameter of ceramic powders is based on promptly that BET method contrast table area calculates and the particle diameter that draws unless otherwise specified.The calculating formula that with the barium titanate is example is as follows.
[mathematical expression 2]
The particle diameter of barium titanate powder=6/ (SA
2* ρ
2)
ρ
2=6.1 (real densities of barium titanate)
SA
2: the specific area of barium titanate powder (BET method)
In addition, the containing ratio of ceramic powders is 3～25 weight portions with respect to conductive metal powder 100 weight portions preferably.Be 5～15 weight portions more preferably with respect to conductive metal powder 100 weight portions.Under the situation of containing ratio less than 3 weight portions of ceramic powders, for example can not control the sintering of nickel by powder, the sintering of interior electrode layer and dielectric layer shrinks the inconsistent of behavior and becomes remarkable.On the other hand, when the containing ratio of ceramic powders surpasses 25 weight portions, for example because of with dielectric layer in the sintering of ceramic particle, dielectric layer thickness expands from interior electrode layer, composition is offset, and therefore brings degradation harmful effect under the permittivity to electrical characteristic.In addition, when the content of ceramic powders was less than 3 weight portions, because the sintering of internal electrode from low temperature just, it is big that the difference of the sintering temperature of interior electrode layer and dielectric layer becomes, and therefore produces the calcining crackle.
In conductive paste of the present invention, adhesive resin uses with the form of the organic carrier that is pre-mixed with organic solvent.Though adhesive resin uses the material that is dissolved in organic solvent, but because of need stirring fully etc. for it is dissolved equably, the result is the time of the mixing process overspending of the 1st operation, consider from the viewpoint that makes productivity ratio decline or undermixing, there is the danger that causes quality variation, on the meaning of its eliminating, preferably uses organic carrier.
Can enumerate organic resins such as methylcellulose, ethyl cellulose, ethyl hydroxy ethyl cellulose, nitrocellulose, acrylate, polyvinyl butyral resin in this adhesive resin, from these organic resins, select more than a kind.For its molecular weight,, preferably use the resin of 20000～200000 molecular weight for being dissolved in the resin of organic solvent.It should be noted that the preferred 1.0～5.0wt% of the amount of resin in the conductive paste, more preferably 2.0～4.0wt% especially.Under the situation of not enough 1.0wt%, be difficult to obtain to be suitable for the viscosity of silk screen printing, when surpassing 5.0wt%, the residual carbon amount increases during owing to the unsticking mixture, causes the delamination of laminated chips, and is therefore not preferred.
In the organic solvent of conductive paste, can use terpineol (α, β, γ and their mixture), dihydro-terpineol, dihydrokainic acid terpinyl acetate, isobornyl acetate, propionic acid isobornyl thiocyanoacetate (isobornyl propionate), butyric acid isobornyl thiocyanoacetate, isobutyric acid isobornyl thiocyanoacetate, ethylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetic acid esters of dissolved adhesive resin etc.
As the dispersant that comprises in the conductive paste, be not particularly limited, so long as cationic dispersant, anionic species dispersant, nonionic class dispersant, amphoteric surfactant, high score subclass dispersant etc. can make conductive metal powder or ceramic powders get final product with the dispersant that is dispersed in adhesive and the organic solvent of miniaturization in stable conditionly, can use known dispersant.Especially, preferred anionic class dispersant in these dispersants for example can be enumerated: carboxylic acids dispersant, phosphoric acid class dispersant, phosphoric acid salt dispersant etc.These dispersants can use a kind or make up more than 2 kinds and to use.The anionic species dispersant helps to improve the dispersiveness of inorganic constituents owing to big to the absorption affinity of inorganic surfaces by this surface modification effect, so improves the flatness of filming, the effect of desciccator diaphragm density in addition.
The mean molecule quantity of this dispersant is preferably 200～20000.More preferably 300～10000.When mean molecule quantity less than 200 the time, particle can not obtain sufficient electrostatic repulsion, the dispersiveness of particle or storage stability descend sometimes.Usually, dispersant adsorption forms the adsorption layer of dispersant at particle surface, by giving particle with electrostatic repulsion or three-dimensional repulsion, obtains the paste of excellent dispersion.But, owing to think,, surpass the repulsion of adsorption layer owing to the collision between the particle along with the process of time, aggegation between the particle, so mean molecule quantity is being advisable more than 200.In addition, when molecular weight greater than 20000 the time, the compatibility with organic carrier and organic solvent descends sometimes, or causes the aggegation between the particle, causes the decline of dispersiveness, storage stability.In addition, also produce the problem that paste viscosity uprises.
For the addition of dispersant,, be preferably 0.01～2.00 mass parts, 0.20～1.00 mass parts more preferably with respect to inorganic content 100 mass parts as addition with respect to the conductive metal powder.If dispersant less than 0.01 mass parts has to be difficult to obtain dispersed fully tendency.On the other hand, when surpassing 2.00 mass parts, produce degradation problem under drying property variation and the desciccator diaphragm density.
For the viscosity characteristics of the viscosity adjustment of giving conductive paste or appropriateness etc., also can add organic solvent or organic bond in the conductive paste among the present invention according to purpose.As this organic solvent or organic bond, preferably constitute the material of conductive paste basically.And then, can also add known additive in the conductive pastes such as defoamer, plasticizer, thickener as required.
Embodiment
Below, according to embodiment more specifically, explain the present invention.Need to prove that scope of the present invention is not subjected to any qualification of embodiment.
[characteristic of conductive paste]
(1) viscosity of conductive paste
The viscosity of conductive paste of the present invention uses the Brookfield viscometer of Block Le Star Network Off イ one Le De society manufacturing at 10rmp (sliding speed=4sec
-1) condition under measure.Need to prove, the viscosity shown in the embodiment represent paste make after viscosity during through 8 hours.
(2) conductive paste through the time viscosity rate of change
For conductive paste through the time viscosity rate of change, with the viscosity during through 8 hours after the conductive paste manufacturing is initial viscosity, after leaving standstill 30 days under the normal temperature (25 ℃), the viscosity variable quantity of initial viscosity with the viscosity of measuring once more removed with initial viscosity, with percentage (%) expression.Need to prove, conductive paste through the time viscosity rate of change preferably the smaller the better.
(3) surface roughness (Ra)
After coating Ni paste on the glass substrate, under 120 ℃, make it with spreader (the thick 5 μ m in gap), make the desciccator diaphragm of the about 3 μ m of thickness air drying 5 minutes.
Projection to the optical method measuring surface of this desciccator diaphragm by utilizing the phase shift interference mode.Particularly, from the light source that is defined in particular wavelength region with rayed at sample and on reference to mirror, utilization is radiated at sample and observes surface state with reference to the Light Interference Streaks on the mirror, further specifying, then is to make sample move from Light Interference Streaks along the direction that light shone every 1/4 wavelength to observe surface state.The surface roughness of this desciccator diaphragm uses light interference type surface-profile measuring instrument (WYCO makes NT-1100) to measure.
(4) glossiness and desciccator diaphragm density (DFD)
The assay method of desciccator diaphragm density is measured by following method.
The area of conductive paste with 5 * 10cm is printed on the PET film, make become 30 μ m thickness after, make it air drying 40 minutes under 120 ℃, (the hole field makes manufacturing グ ロ ス チ エ Star カ one: the glossiness (60 ℃) of IG-320) measuring the paste desciccator diaphragm of drying to use Grossmeters.Further, the paste desciccator diaphragm is cut to 1 * 1cm, measures its thickness and quality, calculate desciccator diaphragm density.
The mensuration of desciccator diaphragm density is conductive paste to be printed on the PET film carry out, and certainly, even conductive paste of the present invention is printed on the dielectric layer raw cook, also can bring into play same characteristic.
At this, so-called desciccator diaphragm density is to make the dried density of conductive paste.
(5) organic carrier
Organic carrier A for using in an embodiment cooperates 13 quality % ethyl celluloses as the adhesive resin composition, cooperates 87 quality % terpineols as organic solvent, is heated to 60 ℃ and makes.
Similarly,, cooperate 18 quality % ethyl hydroxy ethyl celluloses, cooperate 82 quality % propionic acid isobornyl thiocyanoacetates, be heated to 60 ℃ and make as organic solvent as the adhesive resin composition for organic carrier B.
Embodiment 1
The nickel by powder (Ni), the 21.69 quality % organic carrier A that in the conductive metal powder, cooperate 47 quality % particle diameters, 0.4 μ m, and then cooperate the dispersant of 0.2 quality %, the terpineol of 31.11 quality %, while heat mix stir after, in being installed on the nozzle that throttle orifice drive-type delivery side of pump portion, that to make 6 throttle diameters be 0.5mm is connected in series, the thick paste of conductivity that makes 60 ℃ is by giving mechanical shearing, the conductive paste that pre-treatment disperses was implemented in making, measured the glossiness of this paste desciccator diaphragm.It is the results are shown in table 1～table 3.
Embodiment 2
The nickel by powder (Ni) that in the conductive metal powder, cooperates 47 quality % particle diameters, 0.4 μ m, the barium titanate (BT), the 19.88 quality % organic carrier A that in ceramic powders, cooperate 11.75 quality % particle diameters, 0.1 μ m, and then cooperate the dispersant of 0.3 quality %, the terpineol of 21.07 quality %, while heat mix stir after, in being installed on the nozzle that throttle orifice drive-type delivery side of pump portion, that be 0.5mm with 6 throttle diameters is connected in series, the thick paste of conductivity that makes 60 ℃ is implemented pre-treatment and is disperseed by giving mechanical shearing.
Then, with 60 ℃ through conductive paste utilizations that pre-treatment disperses according to throttle diameter 0.19mm, processing pressure 100MPa, to disperse number of pass times be after the high-pressure homogenizer of 1 time condition enactment is implemented dispersion treatment and made conductive paste, with 99% filtering filtering accuracy, to utilize mesh be that filter below the 3 μ m carries out filtration treatment, make required conductive paste, measure paste characteristic (viscosity, surface roughness, DFD), reach the viscosity rate of change.It is the results are shown in table 1～table 3.
Embodiment 3
Except the dispersion number of pass times that will utilize high-pressure homogenizer is set at 3 times,, measure paste characteristic and viscosity rate of change by making required conductive paste with embodiment 2 the same terms.It is the results are shown in table 1～table 3.
Embodiment 4
Except the dispersion number of pass times that will utilize high-pressure homogenizer is set at 5 times,, measure paste characteristic and viscosity rate of change by making required conductive paste with embodiment 2 the same terms.It is the results are shown in table 1～table 3.
The nickel by powder (Ni) that in the conductive metal powder, cooperates 48.12 quality % particle diameters, 0.2 μ m, the barium titanate (BT) that in ceramic powders, cooperates 4.81 quality % particle diameters, 0.04 μ m, 16.06 quality % organic carrier B, and then with the dispersant of 0.43 quality %, 21.93 the propionic acid isobornyl thiocyanoacetate of quality %, 8.65 the ethylene glycol monomethyl ether acetate of quality % cooperates, while heat mix stir after, be installed on drive-type delivery side of pump portion, in the nozzle that the throttle orifice that to make 11 throttle diameters be 0.2mm is connected in series, the thick paste of conductivity that makes 60 ℃ is implemented pre-treatment and is disperseed by giving mechanical shearing.
Then, with 60 ℃ through conductive paste utilizations that pre-treatment disperses according to throttle diameter 0.13mm, processing pressure 200MPa, to disperse number of pass times be after the high-pressure homogenizer of 5 times condition enactment is implemented dispersion treatment and made conductive paste, carry out with 99% filtering filtering accuracy, to utilize mesh be the filtration treatment of the filter below the 1 μ m, make required conductive paste, measure its paste characteristic and viscosity rate of change.It is the results are shown in table 1～table 3.
The nickel by powder (Ni) that in the conductive metal powder, cooperates 48.12 quality % particle diameters, 0.08 μ m, the barium titanate (BT) that in ceramic powders, cooperates 4.81 quality % particle diameters, 0.03 μ m, 16.06 quality % organic carrier B, and then cooperate the dispersant of 0.43 quality %, 21.93 the propionic acid isobornyl thiocyanoacetate of quality %, 8.65 the ethylene glycol monomethyl ether acetate of quality %, while heat mix stir after, be installed on drive-type delivery side of pump portion, in the nozzle that the throttle orifice that to make 11 throttle diameters be 0.2mm is connected in series, the thick paste of conductivity that makes 60 ℃ is implemented pre-treatment and is disperseed by giving mechanical shearing.
Then, with 60 ℃ through conductive paste utilizations that pre-treatment disperses according to throttle diameter 0.09mm, processing pressure 250MPa, to disperse number of pass times be after the high-pressure homogenizer of 10 times condition enactment is implemented dispersion treatment and made conductive paste, carry out with 99% filtering filtering accuracy, to utilize mesh be the filtration treatment of the filter below the 1 μ m, make required conductive paste, measure its paste characteristic and viscosity rate of change.It is the results are shown in table 1～table 3.
(comparative example 1)
The nickel by powder (Ni), the 21.69 quality % organic carrier A that in the conductive metal powder, cooperate 47 quality % particle diameters, 0.4 μ m, and then cooperate the dispersant of 0.2 quality %, the terpineol of 31.11 quality %, while heat mix stir after, be installed on drive-type delivery side of pump portion, to make throttle diameter be in each 6 nozzle that are connected in series of throttle orifice of 1.0mm, the thick paste of conductivity that makes 60 ℃ is by giving mechanical shearing, the conductive paste that pre-treatment disperses was implemented in making, measured the glossiness of this paste desciccator diaphragm.It is the results are shown in table 1～table 3.
(comparative example 2)
The nickel by powder (Ni), the 21.69 quality % organic carrier A that in the conductive metal powder, cooperate 47 quality % particle diameters, 0.4 μ m, and then cooperate the dispersant of 0.2 quality %, the terpineol of 31.11 quality %, use planetary mixer (プ ラ イ ミ Network ス Co., Ltd. makes T.K. Ha イ PVC ス デ イ ス パ one ミ Star Network ス 3D-125 type) to mix to stir and make conductive paste, measure the glossiness of this paste desciccator diaphragm.It is the results are shown in table 1～table 3.Need to prove that the mixing time of planetary mixer is set at 30 minutes.
(comparative example 3)
The nickel by powder (Ni), the 21.69 quality % organic carrier A that in the conductive metal powder, cooperate 47 quality % particle diameters, 0.4 μ m, and then cooperate the dispersant of 0.2 quality %, the terpineol of 31.11 quality %, use planetary mixer (プ ラ イ ミ Network ス Co., Ltd. makes T.K. Ha イ PVC ス デ イ ス パ one ミ Star Network ス 3D-125 type) to mix to stir and make conductive paste, measure the glossiness of this paste desciccator diaphragm.It is the results are shown in table 1～table 3.Need to prove that the mixing time of planetary mixer is set at 120 minutes.
(comparative example 4)
The nickel by powder (Ni) that in the conductive metal powder, cooperates 47 quality % particle diameters, 0.4 μ m, the barium titanate (BT) that in ceramic powders, cooperates 11.75 quality % particle diameters, 0.1 μ m, 19.88 quality % organic carrier A, and then cooperate the dispersant of 0.3 quality %, 21.07 the terpineol of quality %, after using planetary mixer (プ ラ イ ミ Network ス Co., Ltd. makes T.K. Ha イ PVC ス デ イ ス パ one ミ Star Network ス 3D-125 type) to mix stirring, utilize 3 roller machines to implement dispersion treatment and make conductive paste, measure paste characteristic (viscosity, surface roughness, DFD), and viscosity rate of change.It is the results are shown in table 1～table 3.
(comparative example 5)
The nickel by powder (Ni) that in the conductive metal powder, cooperates 47 quality % particle diameters, 0.4 μ m, the barium titanate (BT), the 19.88 quality % organic carrier A that in ceramic powders, cooperate 11.75 quality % particle diameters, 0.1 μ m, and then cooperate the dispersant of 0.3 quality %, the terpineol of 21.07 quality %, while heat mix stir after, in being installed on the nozzle that throttle orifice drive-type delivery side of pump portion, that be 0.5mm with 6 throttle diameters is connected in series, the thick paste of conductivity that makes 60 ℃ is implemented pre-treatment and is disperseed by giving mechanical shearing.Then, utilize 3 roller machines to implement dispersion treatment and make conductive paste, measure paste characteristic (viscosity, surface roughness, DFD), reach the viscosity rate of change.It is the results are shown in table 1～table 3.
(comparative example 6)
The nickel by powder (Ni) that in the conductive metal powder, cooperates 48.12 quality % particle diameters, 0.2 μ m, the barium titanate (BT) that in ceramic powders, cooperates 4.81 quality % particle diameters, 0.04 μ m, 16.06 quality % organic carrier B, and then cooperate the dispersant of 0.43 quality %, 21.93 the propionic acid isobornyl thiocyanoacetate of quality %, 8.65 the ethylene glycol monomethyl ether acetate of quality %, after using planetary mixer (プ ラ イ ミ Network ス Co., Ltd. makes T.K. Ha イ PVC ス デ イ ス パ one ミ Star Network ス 3D-125 type) to mix stirring, utilize 3 roller machines to implement dispersion treatment and make conductive paste, measure its paste characteristic and viscosity rate of change.It is the results are shown in table 1～table 3.
(comparative example 7)
The nickel by powder (Ni) that in the conductive metal powder, cooperates 48.12 quality % particle diameters, 0.08 μ m, the barium titanate (BT) that in ceramic powders, cooperates 4.81 quality % particle diameters, 0.03 μ m, 16.06 quality % organic carrier B, and then cooperate the dispersant of 0.43 quality %, 21.93 the propionic acid isobornyl thiocyanoacetate of quality %, 8.65 the ethylene glycol monomethyl ether acetate of quality %, after using planetary mixer (プ ラ イ ミ Network ス Co., Ltd. makes T.K. Ha イ PVC ス デ イ ス パ one ミ Star Network ス 3D-125 type) to mix stirring, will through the heating the conductive paste utilization according to throttle diameter 0.09mm, processing pressure 250MPa, the dispersion number of pass times is that the high-pressure homogenizer enforcement dispersion treatment that 10 times treatment conditions are set is made conductive paste, measures its paste characteristic and viscosity rate of change.It is the results are shown in table 1～table 3.
Table 1
Table 2
Table 3
(effect of the pre-treatment dispersion step of the 1st operation)
About the effect of pre-treatment dispersion step, describe with the glossiness of the dry coating of the conductive paste of the pre-treatment dispersity of the 1st operation of making in embodiment 1 and comparative example 1～3 that is shown in table 4.
Table 4
As shown in Table 4, be that the nozzle of the thick throttle orifice of 1.0mm carries out under the situation of the comparative example 1 that pre-treatment disperses with possessing throttle diameter, the glossiness of filming is 3, is and 2,3 o'clock identical mixing states of comparative example with planetary mixer mixing stirring.In addition, will mix under the situation that the time set that stirs is 30 minutes and 120 minutes with planetary mixer as can be known, the glossiness of filming does not have big variation.On the other hand, be that the nozzle of the throttle orifice of 0.5mm carries out under the situation of the embodiment 1 that pre-treatment disperses with possessing throttle diameter as can be known, it is 32 that the glossiness of filming raises, and compares and utilizes the mixing of mixer to handle at present, the melting effect height.
Like this, with throttle diameter is that the nozzle of the 0.5mm mechanical shear stress when carrying out pre-treatment and disperseing is big when comparing the nozzle that uses throttle diameter 1.0mm or use mixer in the past and carrying out that pre-treatment disperses, by the difference of glossiness as can be known the desciccator diaphragm wettability of the surface obviously improve.
(the 2nd operation is to the influence of paste characteristic)
Embodiment 2～4 and in the past the paste characteristic of utilizing the comparative example 4,5 that 3 roller machine methods implement that is shown in the dispersion treatment that high-pressure homogenizer is used for the 2nd operation of table 5 compared illustrate and use high-pressure homogenizer to carry out under the situation of dispersion treatment of the 2nd operation influence the paste characteristic.
Table 5
As shown in table 5, when the viscosity of using high-pressure homogenizer and 3 roller machines to carry out the conductive paste of dispersion treatment in the 2nd operation is compared, it is 1 time if utilize the number of pass times (number of times of dispersion treatment) of high-pressure homogenizer as can be known, then be 27Pas (following) with reference to embodiment 2, but when number of processes being increased to 3 times (following with reference to embodiment 3) or 5 times (following with reference to embodiment 4), viscosity drops to 24Pas.This is because the strong shearing force of high-pressure homogenizer has improved the dispersiveness of nickel powder or ceramic powder.In addition, then be 0.26 μ m and 5.8g/cm if surface roughness and DFD handle 1 time
3, but when number of processes being increased to 3 times or 5 times, then become 0.24 μ m and 6.0g/cm
3, thus also as can be known the dispersiveness of nickel powder or ceramic powder improved.
But, be higher than the viscosity of utilizing the conductive paste that high-pressure homogenizer makes significantly with the viscosity of the conductive paste of 3 roller machine manufacturings, surface wetting poor, reason is because a little less than the shearing of 3 roller machines, therefore nickel powder or ceramic powder can not disperse fully, become the result of surface roughness or DFD difference.
In addition, even use throttle diameter as the nozzle of 0.5mm after the pre-treatment that utilizes throttle orifice to shear under the condition identical with embodiment 2～4 disperses, utilize 3 roller machines to carry out under the situation of dispersion treatment (with reference to comparative example 5), also present the result that nickel powder disperses bad, surface roughness or DFD difference.
The embodiment 2～4 that is shown in the dispersion treatment that high-pressure homogenizer is used for the 2nd operation of table 6 is compared with in the past the viscosity rate of change that utilizes the comparative example 4,5 that 3 roller machine methods implement.
Table 6
Because the conductive paste of the use high-pressure homogenizer of embodiment has improved " wetting " of particle surface, and obtained polymolecularity, dispersant adsorption is at particle surface thus, prevent " aggegation again " of particle, even preserve the dispersion stabilization that 30 day time also can keep conductive paste, so its viscosity rate of change is little.But the conductive paste of comparative example 4,5 that uses 3 roller machines in the dispersion treatment of the 2nd operation is because " wetting " of particle surface is poor, and dispersiveness is also low, therefore dispersant is not adsorbed on particle surface effectively, therefore, can not keep dispersion stabilization, the viscosity rate of change is big.
(influence of the dispersion treatment in the 1st operation and the 2nd operation)
The combination of the dispersion treatment of the 1st operation and the 2nd operation is shown in table 7, the influence of viscosity rate of change is shown in table 8 influence of paste characteristic.
Table 7
Table 8
As shown in Table 7, implement the conductive paste (with reference to comparative example 6) that in the past the pre-treatment that utilizes mixer disperses, makes with the dispersion treatment of utilizing 3 roller machines owing to compare and utilize the wetting poor of conductive paste surface that high-pressure homogenizer makes shown in the embodiment 5,6, a little less than the shearing of other 3 roller machines, therefore become nickel powder or ceramic powder can not disperse fully, surface roughness or DFD are poor, and then the also big result of viscosity rate of change.
On the other hand, as shown in Table 8, the pre-treatment of implementing in the past that utilizes mixer disperses, compares with the conductive paste of making among the dispersion treatment of utilizing high-pressure homogenizer conductive paste of making (with reference to comparative example 7) and the embodiment 6 that carries out the high pressure homogenizing under the same conditions, because the wetability of particle surface is poor, and dispersiveness is also poor, dispersant can not be adsorbed onto particle surface fully, can not prevent " aggegation again " of particle, therefore the dispersion stabilization of conductive paste is poor, so it is big that the viscosity rate of change becomes.
Claims (10)
1. the manufacture method of a conductive paste is characterized in that, has following the 1st operation to the 3 operations:
[the 1st operation]
With the thick paste of the conductivity that contains conductive metal powder, dispersant, organic bond and organic solvent at least while heat mix stir after, make it by having the nozzle of throttle orifice, carry out the pre-treatment dispersion step of dispersion treatment thus;
[the 2nd operation]
To utilize high-pressure homogenizer to carry out the dispersion step of dispersion treatment by the conductive paste that the 1st operation pre-treatment disperses through heating;
[the 3rd operation]
The filtration operation that to utilize filter to filter by the conductive paste of the 2nd operation dispersion treatment.
2. the manufacture method of the described conductive paste of claim 1 is characterized in that, the nozzle that possesses throttle orifice of described the 1st operation in series arrange 2 with on the thick paste of conductivity is disperseed.
3. the manufacture method of the described conductive paste of claim 1 is characterized in that, the throttle diameter of the throttle orifice of described the 1st operation is 0.2～0.5mm.
4. the manufacture method of the described conductive paste of claim 1 is characterized in that, the viscosity of the thick paste of described conductivity is below the 10Pas.
5. the manufacture method of the described conductive paste of claim 1 is characterized in that, described high-pressure homogenizer carries out dispersion treatment with the pressure of 50～250MPa.
6. the manufacture method of the described conductive paste of claim 1 is characterized in that, the throttle diameter of the throttle orifice that possesses in the described high-pressure homogenizer that the conductive paste of described the 2nd operation flows is 0.05～0.2mm.
7. the manufacture method of the described conductive paste of claim 1 is characterized in that, described high-pressure homogenizer possesses cooler in export department's side of described throttle orifice.
8. the manufacture method of the described conductive paste of claim 1 is characterized in that, the viscosity of the conductive paste through heating in described the 2nd operation is below the 10Pas.
9. the formed conductive paste of the manufacture method of conductive paste according to claim 1 is characterized in that, the content of conductive metal powder is 30～70 weight % with respect to the conductive paste total amount.
10. the described conductive paste of claim 9 is characterized in that, described conductive paste comprises ceramic powders as sintering inhibitor.
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Cited By (2)
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| CN104399378A (en) * | 2014-11-10 | 2015-03-11 | 华玉叶 | Method for dispersing conductive powder and monomers |
| TWI834389B (en) | 2022-11-18 | 2024-03-01 | 國巨股份有限公司 | Metal electrode of ceramic capacitor and method of forming the same |
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| JP5429491B2 (en) * | 2010-06-17 | 2014-02-26 | 住友金属鉱山株式会社 | Conductive paste using inorganic material slurry and method for producing the paste |
| JP5772621B2 (en) * | 2012-01-19 | 2015-09-02 | 住友金属鉱山株式会社 | Conductive paste for internal electrodes |
| CN104885260B (en) * | 2013-01-17 | 2017-04-26 | 日本瑞翁株式会社 | Method for manufacturing conductive adhesive composition for electrochemical element electrode |
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| JP6292014B2 (en) * | 2014-05-12 | 2018-03-14 | 株式会社村田製作所 | Conductive paste and ceramic electronic components |
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| JP6809280B2 (en) * | 2017-02-21 | 2021-01-06 | 株式会社村田製作所 | Method of manufacturing conductive paste |
| CN111373490B (en) * | 2017-11-30 | 2022-05-31 | 住友金属矿山株式会社 | Conductive paste, electronic component, and multilayer ceramic capacitor |
| JP6637097B2 (en) * | 2018-03-30 | 2020-01-29 | 株式会社ノリタケカンパニーリミテド | Conductive paste |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1266533A (en) * | 1998-07-17 | 2000-09-13 | 株式会社村田制作所 | Method for producing conductive composition and conductive composition |
| CN1534693A (en) * | 2003-03-24 | 2004-10-06 | Tdk��ʽ���� | Conductive composition mfg. method and conductive paste mfg. method |
| CN1812024A (en) * | 2004-08-20 | 2006-08-02 | Tdk株式会社 | Method of production of peeling layer paste and method of production of a multilayer type electronic device |
| JP2007137693A (en) * | 2005-11-15 | 2007-06-07 | Tdk Corp | Method for producing ceramic slurry |
| CN101142152A (en) * | 2005-03-14 | 2008-03-12 | 株式会社村田制作所 | Dispersing apparatus, ceramic slurry preparation method, and monolithic ceramic electronic component and manufacturing method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4389431B2 (en) * | 2001-12-13 | 2009-12-24 | 株式会社村田製作所 | Conductive paste for gravure printing, method for producing the same, and multilayer ceramic electronic component |
| JP2003187638A (en) * | 2001-12-20 | 2003-07-04 | Murata Mfg Co Ltd | Conductive paste for gravure printing and its manufacturing method as well as laminated ceramic electronic component |
| JP2004288832A (en) * | 2003-03-20 | 2004-10-14 | Sumitomo Metal Mining Co Ltd | Manufacturing method for paste for laminated ceramic capacitor internal electrode |
| JP4387175B2 (en) * | 2003-07-07 | 2009-12-16 | 積水化学工業株式会社 | Coated conductive particles, anisotropic conductive material, and conductive connection structure |
| WO2005043568A1 (en) * | 2003-09-30 | 2005-05-12 | Tdk Corporation | Method for producing conductive paste for internal electrode of multilayer ceramic electronic component |
| JP2005104070A (en) * | 2003-10-01 | 2005-04-21 | Murata Mfg Co Ltd | Manufacturing method of slurry, ceramic green sheet and conductive paste |
| WO2005099941A1 (en) * | 2004-04-16 | 2005-10-27 | National Institute For Materials Science | Colloidal solution of fine metal particles, electroconductive pasty material, electroconductive ink material and method for producting them |
| JP4687042B2 (en) * | 2004-09-09 | 2011-05-25 | 住友電気工業株式会社 | Method for producing conductive paste |
-
2010
- 2010-04-19 JP JP2010096486A patent/JP5051553B2/en active Active
-
2011
- 2011-04-15 TW TW100113117A patent/TWI449768B/en active
- 2011-04-18 KR KR1020110035765A patent/KR101313930B1/en active IP Right Grant
- 2011-04-19 CN CN2011100975046A patent/CN102254585B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1266533A (en) * | 1998-07-17 | 2000-09-13 | 株式会社村田制作所 | Method for producing conductive composition and conductive composition |
| CN1534693A (en) * | 2003-03-24 | 2004-10-06 | Tdk��ʽ���� | Conductive composition mfg. method and conductive paste mfg. method |
| CN1812024A (en) * | 2004-08-20 | 2006-08-02 | Tdk株式会社 | Method of production of peeling layer paste and method of production of a multilayer type electronic device |
| CN101142152A (en) * | 2005-03-14 | 2008-03-12 | 株式会社村田制作所 | Dispersing apparatus, ceramic slurry preparation method, and monolithic ceramic electronic component and manufacturing method thereof |
| JP2007137693A (en) * | 2005-11-15 | 2007-06-07 | Tdk Corp | Method for producing ceramic slurry |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104399378A (en) * | 2014-11-10 | 2015-03-11 | 华玉叶 | Method for dispersing conductive powder and monomers |
| TWI834389B (en) | 2022-11-18 | 2024-03-01 | 國巨股份有限公司 | Metal electrode of ceramic capacitor and method of forming the same |
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| KR20110116999A (en) | 2011-10-26 |
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