CN102251271A - Method for peeling nickel plated gold finger - Google Patents
Method for peeling nickel plated gold finger Download PDFInfo
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- CN102251271A CN102251271A CN2011101723945A CN201110172394A CN102251271A CN 102251271 A CN102251271 A CN 102251271A CN 2011101723945 A CN2011101723945 A CN 2011101723945A CN 201110172394 A CN201110172394 A CN 201110172394A CN 102251271 A CN102251271 A CN 102251271A
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- nickel
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- peeling
- gold
- liquid medicine
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Abstract
The invention relates to a method for peeling nickel plated gold fingers. The method comprises a gold peeling process and a nickel peeling process, wherein in the gold peeling process, a gold layer is erased by using external force friction of a coarse eraser till nickel white color is exposed; and in the nickel peeling process, a nickel plated layer is removed by adopting metallic conductive forceps, the head of which is wound with cotton dipped with nickel peeling lotion. The nickel peeling lotion adopted in the nickel peeling process is formed by mixing NaCl, KCl, hydrochloric acid and water. The nickel peeling lotion contains the following components in percentage by weight: 20 to 30 percent of NaCl, 3 to 5 percent of KCl, 3 to 5 percent of hydrochloric acid and the balance of water. In the nickel peeling process, the nickel plated layer is peeled under the action of reverse current electrolysis by using the nickel peeling lotion under direct-current stable voltage of 0 to 10 volts at the temperature of between 22 and 280 DEG C. By implementing the technical scheme, a nickel plated gold finger can be safely and efficiently peeled, and the quality of a circuit board is improved.
Description
Technical field
The present invention relates to the electronickelling golden finger and divest technical field, be specifically related to a kind of electronickelling golden finger process for stripping.
Background technology
The electronickelling golden finger has two-layer usually, surface layer is the gold layer, nexine is a nickel layer, tend in supplied materials or the manufacturing processed because of be stained with printing ink, be stained with cull, nickel approaches, burn, reveal copper, get rid of the defective products that quality defect appears in the nickel gold, if under the situation that the golden mode of brush all can't be repaired by hand, often defective products can only be scrapped processing.In order to reduce the condemnation factor of defective products, industry adopts golden agent of stripping and liquid medicine sealing that gold layer and nickel dam are divested more.Shelling golden agent is prussiate, belongs to hypertoxic objectionable impurities, personnel safety is caused a hidden trouble, and also must start the place when adopting the golden agent of stripping that gold layer is divested and shell golden operation, promptly wastes the danger again of space, place.And the liquid medicine that divests nickel dam had both been attacked the copper layer, injured printing ink on the wiring board again, easily the wiring board quality was caused detrimentally affect.
Summary of the invention
In view of this, the technical problem to be solved in the present invention provides that a kind of security is good, efficient is high, be of value to the electronickelling golden finger process for stripping that improves the wiring board quality.
For solving the problems of the technologies described above, technical scheme provided by the invention is: a kind of electronickelling golden finger process for stripping, comprise stripping metal working preface and stripping nickel operation, stripping metal working preface is to utilize thick eraser external force to rub the gold layer is wiped until exposing nickel white, and stripping nickel operation is that the employing head is tied with the cotton metallic conduction tweezers removal nickel coating that is stained with stripping nickel liquid medicine.
Utilize the friction of thick eraser external force that gold layer is wiped, the stripping gold liquid medicine that contains severe toxicity need not to use again, uses the thick eraser of grey with the gold plate wiping, can stop and the contacting of harmful liquid medicine prussiate, and security is good and can efficiently peel off golden layer.
The stripping nickel liquid medicine that adopts in the above-mentioned stripping nickel operation is mixed by NaCL, KCL, hydrochloric acid and water, and wherein NaCL, KCL, hydrochloric acid and glassware for drinking water body burden are calculated as by weight proportion: the water of NaCL20-30%, KCL3-5%, salt 3-5% and surplus.
In the above-mentioned stripping nickel operation, stripping nickel liquid medicine is at 0-10 volt DC voltage stabilizing electricity and 22-28
0Carry out under the C temperature condition, utilize the effect of electric current back-electrolysis that nickel coating is divested.
Compared with prior art, the present invention has following advantage: 1, the present invention utilize nontoxic, thick eraser external force is wiped the gold layer cheaply, has stopped and the contacting of harmful liquid medicine prussiate, security is good and can efficiently peel off golden layer.2, the present invention adopts stripping nickel liquid medicine to divest nickel dam, has simple operation, efficient height, produces the yield height, does not waste advantage such as place.
Embodiment
For the ease of it will be appreciated by those skilled in the art that the present invention is explained in further detail below in conjunction with embodiment.
Embodiment 1
Utilize this electronickelling golden finger process for stripping that the defective products that reveals copper is handled, concrete treatment step comprises stripping metal working preface and stripping nickel operation, promptly utilize thick eraser external force friction that the gold layer is wiped until exposing nickel white earlier, adopt head to be tied with again and be stained with the cotton metallic conduction tweezers removal nickel coating of shelling nickel liquid medicine.
The stripping nickel liquid medicine that adopts in the stripping nickel operation is mixed by NaCL, KCL, hydrochloric acid and water, and wherein NaCL, KCL, hydrochloric acid and glassware for drinking water body burden are calculated as by weight proportion: the water of NaCL25%, KCL3%, salt 3% and surplus.
And stripping nickel liquid medicine is in 6 volt DC voltage stabilizings electricity and 22
0Carry out under the C temperature condition, utilize the effect of electric current back-electrolysis that nickel coating is divested.
Dew copper defective products after above method is handled, gold layer and nickel coating are removed all right, and the nickel plating gold need not be scrapped again.
Embodiment 2
Utilize this electronickelling golden finger process for stripping that the defective products of being stained with printing ink is handled, concrete treatment step comprises stripping metal working preface and stripping nickel operation, promptly utilize thick eraser external force friction that the gold layer is wiped until exposing nickel white earlier, adopt head to be tied with again and be stained with the cotton metallic conduction tweezers removal nickel coating of shelling nickel liquid medicine.
The stripping nickel liquid medicine that adopts in the stripping nickel operation is mixed by NaCL, KCL, hydrochloric acid and water, and wherein NaCL, KCL, hydrochloric acid and glassware for drinking water body burden are calculated as by weight proportion: the water of NaCL20%, KCL5%, salt 5% and surplus.
And stripping nickel liquid medicine is in 10 volt DC voltage stabilizings electricity and 28
0Carry out under the C temperature condition, utilize the effect of electric current back-electrolysis that nickel coating is divested.
Be stained with the printing ink defective products after above method is handled, gold layer and nickel coating are removed all right, are stained with printing ink and zone of oxidation and are wiped fully, and the maintenance copper face does not totally have foreign matter, again the nickel plating gold.
The foregoing description is a preferred implementation of the present invention, and in addition, the present invention can also have other implementations.That is to say that under the prerequisite that does not break away from the present invention's design, any conspicuous replacement also should fall within protection scope of the present invention.
Claims (4)
1. electronickelling golden finger process for stripping, comprise stripping metal working preface and stripping nickel operation, it is characterized in that: described stripping metal working preface is to utilize thick eraser external force friction that the gold layer is wiped until exposing nickel white, and described stripping nickel operation is to adopt head to be tied with to be stained with the cotton metallic conduction tweezers removal nickel coating of shelling nickel liquid medicine.
2. electronickelling golden finger process for stripping according to claim 1 is characterized in that: the stripping nickel liquid medicine that adopts in the described stripping nickel operation is mixed by NaCL, KCL, hydrochloric acid and water.
3. electronickelling golden finger process for stripping according to claim 2 is characterized in that: in the described stripping nickel liquid medicine, NaCL, KCL, hydrochloric acid and glassware for drinking water body burden are calculated as the water of NaCL20-30%, KCL3-5%, salt 3-5% and surplus by weight proportion.
4. electronickelling golden finger process for stripping according to claim 1 is characterized in that: in the described stripping nickel operation, stripping nickel liquid medicine is at 0-10 volt DC voltage stabilizing electricity and 22-28
0Carry out under the C temperature condition, utilize the effect of electric current back-electrolysis that nickel coating is divested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101723945A CN102251271A (en) | 2011-06-24 | 2011-06-24 | Method for peeling nickel plated gold finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101723945A CN102251271A (en) | 2011-06-24 | 2011-06-24 | Method for peeling nickel plated gold finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102251271A true CN102251271A (en) | 2011-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101723945A Pending CN102251271A (en) | 2011-06-24 | 2011-06-24 | Method for peeling nickel plated gold finger |
Country Status (1)
| Country | Link |
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| CN (1) | CN102251271A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721570A (en) * | 2012-06-29 | 2012-10-10 | 宝山钢铁股份有限公司 | Device for stripping tin coating from tin plate and using method for device |
| CN103281863A (en) * | 2013-04-28 | 2013-09-04 | 胜宏科技（惠州）股份有限公司 | Reworking method of gold plating finger of circuit board |
| CN109121315A (en) * | 2018-08-15 | 2019-01-01 | 江门崇达电路技术有限公司 | A kind of PCB gold planar defect method for repairing and mending |
| CN110129796A (en) * | 2018-11-16 | 2019-08-16 | 江西凤凰光学科技有限公司 | A kind of strip Rework Technics |
| CN112004338A (en) * | 2020-07-25 | 2020-11-27 | 苏州浪潮智能科技有限公司 | Gold finger repairing method |
Citations (2)
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| CN1206754A (en) * | 1997-07-01 | 1999-02-03 | 德国汤姆逊-布朗特公司 | Process for stripping/coating conductive material and device thereof |
| CN1500917A (en) * | 2002-10-09 | 2004-06-02 | ���չ�˾ | The electrical process for the simultaneous stripping of diverse coatings from a metal substrate |
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2011
- 2011-06-24 CN CN2011101723945A patent/CN102251271A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1206754A (en) * | 1997-07-01 | 1999-02-03 | 德国汤姆逊-布朗特公司 | Process for stripping/coating conductive material and device thereof |
| CN1500917A (en) * | 2002-10-09 | 2004-06-02 | ���չ�˾ | The electrical process for the simultaneous stripping of diverse coatings from a metal substrate |
Non-Patent Citations (4)
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| 《化学世界》 19860513 李基森等 "电刷镀技术中的退镀溶液" 245-247 1-4 , 第6期 * |
| 《电镀与精饰》 19860501 裴国喜 "剥落刷镀层的修复方法分析和选择" 41 1-4 , 第4期 * |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721570A (en) * | 2012-06-29 | 2012-10-10 | 宝山钢铁股份有限公司 | Device for stripping tin coating from tin plate and using method for device |
| CN102721570B (en) * | 2012-06-29 | 2014-04-30 | 宝山钢铁股份有限公司 | Device for stripping tin coating from tin plate and using method for device |
| CN103281863A (en) * | 2013-04-28 | 2013-09-04 | 胜宏科技（惠州）股份有限公司 | Reworking method of gold plating finger of circuit board |
| CN103281863B (en) * | 2013-04-28 | 2016-04-20 | 胜宏科技（惠州）股份有限公司 | The reworking method of the gold-plated finger of a kind of wiring board |
| CN109121315A (en) * | 2018-08-15 | 2019-01-01 | 江门崇达电路技术有限公司 | A kind of PCB gold planar defect method for repairing and mending |
| CN110129796A (en) * | 2018-11-16 | 2019-08-16 | 江西凤凰光学科技有限公司 | A kind of strip Rework Technics |
| CN112004338A (en) * | 2020-07-25 | 2020-11-27 | 苏州浪潮智能科技有限公司 | Gold finger repairing method |
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Application publication date: 20111123 |