CN102248285B - Produce the method and system of the spike train processed for material - Google Patents

Abstract

The present invention provides the system and method producing the pulse train processed for material.In one embodiment, the stabilized lasers spike train of high-repetition-rate is produced from continuous wave (CW) or quasi-CW laser beam.One or more laser pulses in described pulse train can be shaped to control to be delivered to the energy of target material.In another embodiment, multiple laser beams are assigned to multiple process head from single laser pulse, CW laser beam or quasi-CW laser beam.In this type of embodiment, single light deflector distributes multiple laser beam out of the ordinary process between head.

Description

Produce the method and system of the spike train processed for material

The application is the filing date December in 2007 7 days of original application, Application No. 200780050430.2, Dividing of the Chinese patent application of invention entitled " producing the method and system of the spike train processed for material " Case application.

Technical field

The present invention relates generally to laser treatment.Specifically, the present invention relates to produce with high pulse repetition frequency The shaped pulse that string is stable, and laser beam is delivered to multiple process head from single lasing light emitter.

Background technology

Can use various laser that the workpiece of number of different types is carried out laser treatment to realize kinds of processes.Swash Light can be used for forming the hole in (such as) single or multiple lift workpiece and/or blind path.Semiconductor wafer processing Various types of laser microcomputer tool can be comprised process, including (for example) ruling, cut, hole, remove partly Conductor links (fuse), thermal annealing, and/or finishing passivity is thick or film assembly.

Conventional laser boring or ruling are including (for example) using wavelength CO2 in the range of far infrared Laser.But, this type of laser generally can need high-energy to carry out some integrated circuits of ablation (IC) process material.

Additionally, this type for the treatment of technology generally uses long pulse, the slow raising and lowering timing in pulse is up to About 50 microseconds.Therefore, long pulse can allow too much heat to spread, thus causes heat affected zone, double teeming Oxide skin(coating), too much fragment, chip and rupture.Additionally, the CO2 laser of chopping normally tends to tool Having the interpulse energy unstability of high magnitude, this may negatively affect the concordance processing quality.

Conventional CO2 boring or scoring system generally use radio frequency (RF) pulse CO 2 laser, its excited state Typical relaxation times between about 50 microseconds and about 100 microseconds.In order to produce discrete laser pulses, logical Normal acceptable pulse recurrence frequency (PRF) is about the inverse of the twice in relaxation time.Therefore, CO2 swashs Light is typically provided in the maximum PRF between about 5 KHz and about 10 KHz.When the process needing increase During amount, these low prf values can reduce process quality.For example, when scoring system increase its relative to When workpiece moves the speed of laser beam, the structure along otch caused due to the separation between pulse is low Become notable under PRF.This class formation reduction in otch processes quality.

Summary of the invention

Embodiment disclosed herein provides for producing, with high pulse repetition frequency, the shaped pulse that string is stable And laser beam is delivered to from single lasing light emitter the system and method for multiple process head.

In one embodiment, a kind of laser treatment system at full speed producing stable pulse train System comprises: process head, and it is configured to the target location of pulse train illuminating material；Lasing light emitter, its It is configured to produce continuous wave (CW) or quasi-CW laser beam.Described system also comprises optical gate, and it is through joining Put to receive CW or quasi-CW laser beam from lasing light emitter, receive control signal, based on control signal from CW Or quasi-CW laser beam produces pulse train, and pulse train guiding is processed head.

In another embodiment, a kind of laser processing method comprises: produce CW or quasi-CW laser beam； The part of instantaneous cutting CW or quasi-CW laser beam is to produce pulse train；And by pulse train The target location of guide material.

In another embodiment, a kind of system comprise the component for producing CW or quasi-CW laser beam, For producing the component of pulse train from CW or quasi-CW laser beam, and for by pulse train The component of the target location of guide material.

In another embodiment, a kind of for using the laser processing system bag of multiple laser beam treatment material Contain: first processes head, and it is configured to the primary importance with the first pulse train illumination target material；The Two process head, and it is configured to the second position with the second pulse train illumination target material；Lasing light emitter, It is configured to produce laser beam；And optical gate, it is configured to receive laser beam, by first from lasing light emitter Pulse train guides the first process head, and the second pulse train guides the second process head.

In another embodiment, a kind of laser processing method comprises: laser beam provides the first acousto-optic modulation Device (AOM), a described AOM is configured to produce the first pulse train and second from laser beam and swashs Light pulse arranges；Driving a described AOM with first frequency, described first frequency is configured to along the first light Ways for education footpath deflects the first pulse train, in order to the primary importance of illumination target material；And with second frequency Driving a described AOM, described second frequency is configured to deflect the second laser arteries and veins along the second optical path Punching row, in order to the second position of illumination target material.

In another embodiment, a kind of laser processing system comprises: for producing the component of laser beam, being used for Produce the first pulse train and the component of the second pulse train, and component from laser beam, its for First deflection angle deflects the first pulse train, in order to on the first pulse train illumination target material One position, and for deflecting the second pulse train with the second deflection angle, in order to shine by the second pulse train The second position on bright target material.

Additional aspect and excellent is will be appreciated by from the following detailed description of the preferred embodiment carried out referring to accompanying drawing Point.

Accompanying drawing explanation

Fig. 1 and 2 schematically illustrate for driving laser instrument in case with relatively low pulse recurrence rate produce comprise discrete The sequential chart of the RF signal out of the ordinary of the respective laser output of pulse.

Fig. 3,4 and 5 schematically illustrate for driving laser instrument to produce each by the pulse recurrence rate increased The sequential chart of the RF signal of other laser output.

The schematically illustrate acousto-optic modulator (AOM) being triggered signal driving by RF according to an embodiment of Fig. 6 Output laser pulse row sequential chart.

Schematically illustrate at least one shaped pulse that comprises according to some embodiment of Fig. 7 A and 7B swashs to optimize The time profile of the pulse train of light/material thermal coupling.

Fig. 8 is schematically illustrate according to the laser shown in Fig. 7 A of the change comprising pulse height of an embodiment The time profile of spike train.

The schematically illustrate change comprising temporal pulse width and pulse recurrence rate according to an embodiment of Fig. 9 The time profile of the pulse train shown in Fig. 7 A.

Figure 10 A graphically illustrates to use the groove of conventional continuous wave CO2 laser incision plastic material.

Figure 10 B graphically illustrates to use according to an example embodiment to be triggered, by with RF, the AOM that signal drives The groove of the stabilized lasers spike train incision plastic material of the high-repetition-rate provided.

Figure 11 A and 11B graphically illustrates to use according to some example embodiment to be triggered signal driving by with RF The path that gets out in the printed circuit boards of the stabilized lasers spike train of high-repetition-rate that provides of AOM transversal Face.

Figure 12 is schematically illustrate relative to guiding the first pulse of the first process head, guiding the of the second process head What the gained laser beam of two pulses and pilot beam catcher was shown is produced by conventional RF pulse pump laser The sequential chart of temporal laser beam.

Figure 13 schematically illustrate according to an embodiment relative to guiding first, second, the 3rd and penetrate The sequential chart of the temporal laser beam produced by RF pulse pumped laser that the waveform of bundle catcher is shown.

Figure 14 is for producing the example system of multiple beams from single RF pulse laser according to an embodiment The block diagram of system.

Figure 15 schematically illustrate according to an embodiment relative to guide first, second, the 3rd, the The sequential of the temporal CW laser beam produced by CW laser instrument that the waveform of four-head and beam trap is shown Figure.

Figure 16 according to an embodiment for from single CW or quasi-CW laser instrument produce multiple beams The block diagram of instance system.

Figure 17 is for using less AOM to produce the instance system of multiple beams according to an embodiment Block diagram.

Figure 18 is the block diagram of the example AOM driven by two RF signals according to an embodiment.

Figure 19 is to show that according to an embodiment CW having AOM and RF power supply illustrated in fig. 18 swashs The block diagram of light device.

Detailed description of the invention

The present invention is provided to produce in stable pulse train shaped laser pulses row with high-repetition-rate The one or more of system and method for pulse.Some embodiment also by multiple laser beams from single arteries and veins Impulsive motion continuous wave (CW) or quasi-CW laser instrument are delivered to multiple process head to improve treating capacity.At one In this type of embodiment, single light deflector is configured to be assigned to multiple laser beams multiple process head.

Referring now to graphic, wherein same reference numerals represents similar elements.For clarity, reference number First instruction figure number of being first used of counter element.It is described below in content, it is provided that a large amount of Specific detail is thoroughly to understand embodiments of the invention.However, it will be apparent to those skilled in the art that, There is no the one or more of described specific detail or the feelings of other method, assembly or material can be utilized The present invention is put into practice under condition.Additionally, in some cases, non-detail display or describe well-known structure, Material or operation are in order to avoid obscuring each aspect of the present invention.Additionally, in one or more embodiments, institute The feature, structure or the characteristic that describe can combine in any suitable manner.

The most stable spike train

As discussed above, conventional RF pumping CO2 laser does not produce the discrete laser higher than some PRF Pulse, and it is generally of between pulse the energy unstability of height.Therefore, this type of laser can not produce one The process quality caused.Additionally, and not all to be applied to the energy of target material the most converted for thermal ablation In technique.Be applied to the energy of material and difference between the dosage of the energy of ablation can as heat energy portion Code insurance stays in the material.This too much heat energy may result in (such as) too much melted, layering, heat affected zone, Double teeming oxide skin(coating), too much fragment, chip and rupture.

Therefore, according to certain embodiments disclosed herein, the stable pulse of the time that produces upper rectangular laser pulse Arrange to control the laser/material interaction between pulse and in Sing plus.To between string pulse with And pulse energy within Sing plus and temporal pulse width be fine-tuned can by make thermal ablation no Profit side effect minimizes or reduces and optimize thermal ablation.So that it takes up a position, for example, can for path Drilling or draw Line realizes hand work control.

In one embodiment, such as acousto-optic modulator (AOM) or the light of electrooptic modulator (EOM) Lock or apparatus for fast switching receive CW or quasi-CW laser beam and produce stable under the highest PRF Spike train.For example, in one embodiment, under the PRF being up to about 1 MHz, produce one Arrange stable rectangular laser pulse.PRF can be depending on such as apparatus for fast switching (such as, AOM) The factor of the size etc. of rise/fall time and/or laser beam.For example, bigger laser beam can need phase To long rise/fall time.The higher PRF that system disclosed herein and method produce provides and can be used for producing The stable rectangular pulse train of the smooth kerf in raw target material.

In one embodiment, the persistent period that the RF of laser beam excites it is selectively adjusted, in order to modulation Pulse energy and/or temporal pulse width realize process quality that is optimal or that increase.This embodiment allows essence Thin tuning, so that the material processed in printed circuit board (PCB) (PCB) industry, processes in flat panel display industry Light polarizing film, and/or process metal and the metal/plastic of other industry (such as, auto industry).

As discussed above, there is the relaxation time of excited state between about 50 microseconds and about 100 microseconds Conventional RF pulse CO2 laser can provide discrete laser pulses under the PRF of below about 10 KHz. For example, Fig. 1 and 2 schematically illustrate for driving laser instrument in case with relatively low pulse recurrence rate produce bag The sequential chart of the RF signal out of the ordinary 110,210 of the respective laser output 112,212 containing discrete pulse.Figure Laser output 112,212 shown in 1 and 2 has about the same pulse recurrence rate.But, owing to swashing Relaxation time of the excited state of light and RF signal as shown in Figure 1 110 (have relatively wide pulse and The cycle of operation of about 50%) (there is the pulse and about 25% of opposite, narrow with the RF signal 210 shown in Fig. 2 Cycle of operation) reason of the difference of persistent period that excites of the RF that provides, the pulse in laser output 112 Have and the variform shape of the pulse in laser output 212.

But, when laser exports under relatively high pulse repetition rate, pulse train starts to comprise increase CW component.For example, Fig. 3,4 and 5 schematically illustrate for driving laser instrument in case with increase arteries and veins Rush the sequential that repetitive rate produces the RF signal 310,410,510 of respective laser output 312,412,512 Figure.The temporal width of the pulse of the RF signal 310 shown in Fig. 3 and the RF signal 110 shown in Fig. 1 The temporal width of pulse is substantially the same.But, the RF signal 310 shown in Fig. 3 has ratio shown in Fig. 1 The high cycle of operation (about 66.6%) of the cycle of operation (about 50%) of RF signal 110.Shown in Fig. 3 Laser output 312 has the pulse recurrence rate higher than the laser output shown in Fig. 1.But, due to The reason in the relaxation time of the excited state of laser, the higher duty cycle of the RF signal 310 shown in Fig. 3 exists Skew or CW component is introduced between pulse in laser output 312 shown in Fig. 3.

Similarly, the temporal width of the pulse in the RF signal 410,510 shown in Figure 4 and 5 and Fig. 2 The temporal width of the shown pulse in RF signal 210 is substantially the same.But, the RF shown in Fig. 4 Signal 410 has the cycle of operation higher than the cycle of operation of the RF signal shown in Fig. 2 (about 25%) (about 50%).Therefore, the laser output 412 shown in Fig. 4 has corresponding higher than the laser shown in Fig. 2 exports Pulse recurrence rate.But, due to the reason in relaxation time of the excited state of laser, the RF shown in Fig. 4 The higher duty cycle of signal 410 export at the laser shown in Fig. 4 introduce between the pulse in 412 skew or CW component.Therefore, the pulse recurrence rate increasing laser can reduce the energy of the stable discrete pulse of laser offer Power.

Along with cycle of operation continue increase (such as, as it is shown in figure 5, wherein the work of RF signal 510 follow Ring is about 83.3%), laser output 512 exports close to the laser of CW laser instrument.This laser output 512 Can be described as quasi-CW laser output 512 in this article.According to an embodiment, in order to produce with high PRF Stable pulse arranges, and provides AOM by quasi-CW laser output 512 (or the output of CW laser).By AOM The stability of the spike train provided is improved close to the laser output of CW laser instrument along with laser output.

For example, Fig. 6 is schematically illustrate is triggered, by RF, the AOM that signal 614 drives according to an embodiment The sequential chart of output laser pulse row 610,612.In the example corresponding to pulse train 610, AOM receives by the laser beam comprising CW component produced with 40% cycle of operation driving laser instrument (not Diagram).As shown in Figure 6, this promotes the pulse train 610 provided by AOM to comprise pulse height Obvious interpulse change.This pulse train 610 may result in poor kerf quality.

In the example corresponding to pulse train 612, AOM receives by driving with 99% cycle of operation sharp Light device and the quasi-CW laser beam (not shown) that produces.Pulse train 614 is highly stable and at target material Material produces high-quality otch.Technical staff from the disclosure herein it will be appreciated that depend on exciting of laser The relaxation time of state, can be by driving laser instrument to produce stable pulse train with other cycle of operation 614.For example, in one embodiment, the cycle of operation between about 80% and about 100% is used to drive Dynamic laser instrument.In order to realize suitable quasi-CW laser beam, RF source is configured to the excited state than laser Relaxation time substantially faster drives laser instrument.

In one embodiment, for driving the RF triggering signal 614 of AOM to have about 100 KHz And the frequency in the range of between about 250 KHz.But, RF triggers the frequency of signal 614 can essence Upper higher than 250 KHz.For example, in another embodiment, RF triggering signal 614 has up to The frequency of about 1 MHz.In certain embodiments, RF triggers the frequency of signal based on AOM Rise/fall time.

B. shaping pulse

Except producing stable pulse train, or in other embodiments, AOM (or another quickly cuts Changing device, such as EOM) pulse one or more in shaped laser pulses row, swash to improve Optical processing quality.When the material being exposed to laser beam experiences heating or the phase transformation from solid-state to liquid, material Absorption cross section can change.By regulating one or more characteristics of laser beam, can realize relatively having The laser/material coupling of effect.

For example, Fig. 7 A and 7B is schematically illustrate comprises at least one shaped pulse according to some embodiment To provide the time profile of the pulse train 700 of laser/material thermal coupling.For illustration purposes, will Pulse train 700 is shown as First Series pulse 710 and second series pulse 712.Real at these examples Executing in example, last pulse 714 in AOM shaping the most a series of 710,712 is to increase coupling efficiency. It addition, or in other embodiments, AOM can in shaping the most a series of 710,712 one or one with Other pulse upper.The number of pulse in optional the most a series of 710,712, the most a series of 710,712 In the number of shaped pulse 714, and/or the given shape of shaped pulse 714 is to control to be applied to target The dosage of the laser energy of material.

In one embodiment, the given shape of shaped laser pulses 714 is based on being applied to AOM RF triggers the shape of signal 614 (see Fig. 6).For example, RF generator (not shown) can be used for Produce RF and trigger signal 614, to have the required time profile being substantially similar to pulse train 700 Time profile.So that it takes up a position, for example, RF generator can be configured to switch to triangle from rectangular pulse Shape pulse, or rectangular pulse is combined with triangular pulse, to produce the shaping arteries and veins shown in Fig. 7 A and 7B Punching 714.

In example embodiment, First Series pulse 710 can be applied to be in first object position (such as, First via positions) material, and second series pulse 712 can be applied to be in the second target location (example Such as, alternate path position) material.Certainly, technical staff from the disclosure herein it will be appreciated that laser Spike train 700 is not limited to First Series pulse 710 and second series pulse 712.Additionally, technical staff from The disclosure herein is it will be appreciated that First Series pulse 710 need not comprise and second series pulse 712 Equal number of pulse, and arbitrary serial 710,712 can comprise any number of pulse.

In addition to shaping at least one laser pulse 714, or in another embodiment, optionally change The CW component of spike train 700.For example, Fig. 8 is schematically illustrate comprises pulse according to an embodiment The time profile of the pulse train 700 shown in Fig. 7 A of the change of height.Protect in pulse train 700 During time cycle 808 when holding more than deviant (as illustrated by the dashed line 810), with being added to target material The offset laser energy (such as, laser energy does not return to the minima between pulse) of the overall thermal state of material Illumination target material consistently.Therefore, pulse train shown in Fig. 8 700 by ratio by shown in Fig. 7 A The heat energy of the heat energy more high dose that pulse train 700 delivers is delivered to target material.As discussed above, RF generator can be configured provides the RF of AOM to trigger signal 614 optionally to provide institute with shaping Need skew.

It addition, or in another embodiment, the work being selectively adjusted the pulse in spike train 700 follows Ring value.For example, Fig. 9 is schematically illustrate comprises temporal pulse width and pulse repetition according to an embodiment The time profile of the pulse train 700 shown in Fig. 7 A of the change of rate.Again, can be provided by shaping RF to AOM triggers signal 614 and realizes this type of regulation.For example, RF generator is alternative Ground controls RF and triggers RF value and/or the temporal pulse width of signal 610, with in pulse train 610 The middle correspondence that produces changes.

Technical staff from the disclosure herein it will be appreciated that pulse train 700 be not limited to Fig. 7 A, 7B, Pulse shape shown in 8 and 9 and other spike train are revised.It practice, AOM can be used for optionally Multiple difformity and amendment is provided to control to provide the laser of target material to pulse train 700 The dosage of energy.Additionally, described amendment one or more (such as, pulse shape, CW skew, Temporal pulse width, pulse height and cycle of operation) it is combined into Sing plus row and/or single series arteries and veins In punching.

C. the example of the stable pulse train of high-repetition-rate is used

Merely for illustrative purpose rather than following instance is provided in a restricted way.Figure 10 A and 10B is to scheme Shape explanation when use conventional CW CO2 laser and provided by AOM stable spike train time the difference that realizes Process quality.Figure 10 A graphically illustrates to use the groove of conventional CW CO2 laser incision plastic material 1000.Figure 10 B graphically illustrate according to some embodiment use as herein disclosed by with RF trigger letter Number drive AOM provide high-repetition-rate stabilized lasers spike train incision plastic material groove 1001.

As it can be seen, the groove 1000 being made up of conventional CW CO2 laser has ratio by stabilized lasers pulse Arrange the broader cutout regions of groove 1001 and more significant heat effect made.For example, normal for using The groove 1000 that rule CW CO2 laser is made, corner width 1004 it be observed that about 314.02 microns, Top width 1002 it be observed that about 201.18 microns, and side width 1006 it be observed that about 207.23 Micron.The corresponding measured value of the groove 1001 using CO2 laser to make is comprised about 245.61 microns Corner width 1014, the top width 1012 of about 159.23 microns and the side width of about 172.48 microns 1016.It addition, less shown in Figure 10 B melts compared with the melted and fragment 1008 shown in Figure 10 A Proved with fragment 1018, by using AOM to decrease heat effect.

By another example, Figure 11 A and 11B graphically illustrates to use by with RF according to some embodiment The stabilized lasers spike train of the high-repetition-rate triggering the AOM offer that signal drives gets out in the printed circuit boards The cross section of path 1102,1112.In this example, the institute's cutting material in Figure 11 A is GX-3 And the institute's cutting material in Figure 11 B is GX-13, it is can be from commonly using that Ajinomoto company buys Electronic package material.Although as it can be seen, using AOM to reduce compared with conventional RF pulsed lasers Peak pulse power, but disclosed herein for producing stable pulse train at relatively higher repetition rates System and method produce good quality path.

D. multiple beams are produced from pulse laser

For not having the laser of enough peak powers, beam delivery is not penetrated by division laser beam to multiple The method for optimizing in bundle path.Therefore, in one embodiment, by by laser beam from Sing plus or CW CO2 laser instrument is delivered to multiple process head to improve process throughput.Traditionally, the difference in spike train The single part of pulse or different pulse is guided different disposal head along different course of the beams.For example, figure 12 is schematically illustrate relative to guiding the first pulse 1212 of the first process head (1), guiding the second process Second pulse 1214 of head (2) and the gained laser beam 1216 of pilot beam catcher show by often The sequential chart of the temporal laser beam 1210 that rule RF pulse pumped laser produces.As it can be seen, from laser The first pulse 1212 of the first process head is guided under first pulse 1218 instantaneous " cutting " of bundle 1210, And from the second instantaneous cutting of pulse 1220 of laser beam 1210, guide the second pulse of the second process head 1214。

In one embodiment, out of the ordinary by the multiple pulses under the instantaneous cutting of single laser pulse are guided Process head and increase pulse recurrence rate.For example, Figure 13 schematically illustrate according to an embodiment relative to Guide first (1), second (2), the 3rd (3) and the waveform exhibition of beam trap The sequential chart of the temporal laser beam 1310 produced by RF pulse pumped laser shown.Laser beam 1310 wraps Containing the first pulse 1312 and the second pulse 1314.

AOM in this example is configured to from the first instantaneous cutting of pulse 1312 of laser beam more than first Individual pulse 1316,1318,1320, and each of more than first pulse 1316,1318,1320 is led To distinctly processing head.AOM is also configured to under the second instantaneous cutting of pulse 1314 of laser beam more than second Individual pulse 1322,1324,1326, and each of more than second pulse 1322,1324,1326 is led To distinctly processing head.Therefore, use from the first pulse 1312 and the second pulse 1314 each relatively Many temporal width.But, it is provided that the pulse recurrence rate to each process head is excited the pulse weight of light beam 1310 Multiple rate limits.As discussed above, along with pulse recurrence rate increases (such as, more than 5 KHz), arteries and veins Laser beam generally becomes unstable and starts to comprise CW component.Therefore, from the instantaneous cutting of pulse laser Lower laser beam (as shown in figure 13) may be unsuitable for some application (such as, film processes).

Figure 14 according to an embodiment for producing multiple beam from single RF pulse laser 1410 The block diagram of instance system 1400.System shown in Figure 14 can be used for (such as) and produces the ripple shown in Figure 13 Shape.RF pulse laser 1410 produces the laser of the AOM 1412,1414,1416 by arranged in series Bundle.System 1400 uses AOM 1412,1414,1416 to cut to deliver in producing transient pulse Multiple beams shown in Figure 13.In other words, each AOM 1412,1414,1416 is along path out of the ordinary The first pulse 1312 and appropriate section of the second pulse 1314 is deflected towards processing head.By each AOM 1412, 1414,1416 deflection angles provided are by the RF signal (example for driving AOM 1412,1414,1416 As, RF shown in Fig. 6 triggers signal 614) frequency determine.In certain embodiments, it is possible to use The combination of EOM or AOM and EOM.

E. multiple beams are produced from CW or quasi-CW laser instrument

In another embodiment, by CW or quasi-CW laser instrument and beam distribution/temporal shaping device (example As, AOM and/or EOM) it is used together with dispense-pulse between multiple process heads.Disclosed herein System and method allows to deliver multiple beam quickly than the delivery of the multiple beams carried out by conventional method.? In some embodiment, the number of the beam distribution/temporal shaping device in many machining systems also reduces. Therefore, process throughput increases.

Figure 15 schematically illustrate according to an embodiment relative to guide first (1), second (2), What the waveform of the 3rd (3), four-head (4) and beam trap was shown is produced by CW laser instrument The sequential chart of raw temporal CW laser beam 1510.That CW laser beam 1510 is timesharing and be delivered to difference Optical path.In other embodiments, quasi-CW laser instrument can also be used for producing laser beam 1510 (such as, See Fig. 5).

Because use CW or quasi-CW lasing light emitter, so provide to each path pulse recurrence rate by with Speed in AOM and/or EOM producing respective waveforms determines.As discussed above, an enforcement In example, AOM can be up to about the speed switching of 1 MHz.If processing between head instantaneous at four Extraction laser beam 1510, as shown in (by example) Figure 15, then provide the waveform of each process head Pulse recurrence rate may be up to AOM switching rate about 1/4th.

Figure 16 is for producing multiple from single CW or quasi-CW laser instrument 1610 according to an embodiment The block diagram of the instance system 1600 of beam.System 1600 shown in Figure 16 can be used for (such as) and produces figure Waveform shown in 15.CW or quasi-CW laser instrument 1610 produce by the AOM 1612 of arranged in series, 1614, the laser beam of 1616,1618.Each AOM 1612,1614,1616,1618 is along corresponding road Footpath is towards the corresponding momentary partial processing head deflection laser beam 1510.As discussed above, by AOM 1612, 1614,1616,1618 deflection angles provided drive AOM 1612,1614,1616,1618 by being used for The frequency of RF signal determine.

Instance system 1600 shown in Figure 16 uses an AOM for each course of the beam.Implement at this In example, laser beam is affected by the diffraction efficiency of each AOM.It addition, the number of the AOM used increases The cost of adding system 1600.Therefore, in one embodiment, single AOM is configured to penetrate along multiple The part out of the ordinary of bundle path deflection laser beam.Therefore, the number of AOM can be reduced.

For example, Figure 17 is for using less AOM 1710,1712 to produce according to an embodiment The block diagram of the instance system 1700 of multiple beams.Each AOM 1710,1712 is driven by two RF signals Dynamic.As discussed above, the deflection angle of each AOM 1710,1712 is proportional to the frequency of RF signal. In this example, drive under first frequency (RF frequency 1) and second frequency (RF frequency 2) each AOM 1710、1712.The RF frequency of AOM 1710,1712, each AOM it is applied to by switching 1710,1712 can be by beam deflection to different optical paths.Total angular deviation can be by RF frequency, wavelength and material Material characteristic determines.Compared with the system 1600 shown in Figure 16, the system 1700 shown in Figure 17 uses half Laser beam is provided equal number of head by the AOM of number.It addition, or in other embodiments, each AOM 1710,1712 can be configured to provide different temporal pulse width, pulse recurrence rate and/or pins Shaping pulse to each of its laser beam, as discussed above.

Figure 18 is the block diagram of the example AOM 1810 driven by two RF signals according to an embodiment. In this example, AOM 1810 include can from Virginia, Springfield (Virginia, Springfield) high power acousto-optic modulator/deflector that Yi Suomente (Isomet) company buys.AOM 1810 are driven by RF power supply 1812.In this example, include also can be from Yi Suomente for RF power supply 1812 RF driver/amplifier RFA4060-2 that company buys.

RF power supply 1812 comprises frequency and selects input and modulation input.Frequency selects input to be used for switching RF Output frequency.In one embodiment, frequency selects input to be dragged down in inside by RF power supply 1812.Borrow Help example, select input to maintain optional about 60 MHzs of low level of (assert) in frequency, and High level may select about 40 MHzs.Modulation input control two RF output (RF1 and RF2) with Numeral or analog-modulated are provided simultaneously.In this example embodiment, the amplifier in RF power supply 1812 RF switching rising and falling time was about for 200 how seconds.Maximum RF under each frequency exports by RF power supply Power adjustments potentiometer in 1812 sets.

Figure 19 is to show there is AOM 1810 and RF power supply 1812 illustrated in fig. 18 according to an embodiment The block diagram of CW laser instrument 1910.As shown in figure 19, by input being switched to RF controller, depend on According to selected frequency RF1, RF2 with different angles guided laser bundle.

The angle of departure between zero degree and first time is:

${\mathrm{\&theta;}}_{\mathrm{SEP}}=\frac{\mathrm{\&lambda;}<\mathrm{fc}>}{v}$

The optical rise time of Gaussian input beam is about:

$t_r=\frac{0.65<d>}{v}$

Wherein: λ=wavelength；Fc=mid frequency (such as, 40 MHz/60 MHz)；V=hands over The velocity of sound (such as, 5.5 millimeters/microsecond (Ge)) of interaction material；And d=1/e2 beam diameter.Belonging to Skilled artisan will know that of field, can be without departing from the basic principles of the present invention to above-described embodiment Details many changes may be made.Therefore, the scope of the present invention should only be determined by appended claims.

Claims (12)

1. for using a laser processing system for multiple laser beam treatment material, comprising:

For producing the lasing light emitter of CW or quasi-CW laser beam；

Separating with described lasing light emitter and acousto-optic modulator outside, wherein said acousto-optic modulator is instantaneous Cutting produces the first pulse train through described CW or quasi-CW laser beam produced by described lasing light emitter With the second pulse train, described acousto-optic modulator optionally adjusts in described first pulse train and institute State the CW component between the pulse in the second pulse train；And

For by the target location of described first pulse train and described second pulse train guide material Component, wherein said acousto-optic modulator is further configured to optionally shaping in described first pulse train Or more than one laser pulse in described second pulse train, to control to be applied to the target of described material The dosage of the laser energy of position, being chosen for shape increases described in described laser energy and described material Coupling efficiency between target location.

2., for using a laser processing system for multiple laser beam treatment material, described system includes:

First processes head, and it is configured to the primary importance with the first pulse train illumination target material；

Second processes head, its second position being configured to illuminate described target material by the second pulse train；

Lasing light emitter, it is configured to produce laser beam；And

Optical gate, it is outside and separated that it is positioned at described lasing light emitter, and is configured to:

Described laser beam is received from described lasing light emitter；

By the instantaneous cutting of part of the described laser beam being received to produce described first laser pulse simultaneously Row, described second pulse train and the first remainder of described laser beam；

Optionally more than one laser pulse of the most described first pulse train of shaping, to control to execute Being added to the dosage of the laser energy of described target material, being chosen for shape increases in described laser energy and institute State the coupling efficiency between target material；

Described first pulse train is guided described first and processes head；

Described second pulse train is guided described second and processes head；And

By the first remainder output of described laser beam.

System the most according to claim 2, wherein said lasing light emitter includes continuous wave CW or quasi-CW Lasing light emitter.

System the most according to claim 2, wherein said optical gate include by the first radio frequency rf signal and First sound-optic modulator AOM, a described AOM that 2nd RF signal controls are configured to based on described The frequency of the oneth RF signal is with the first pulse train described in the first angular deflection, and based on described 2nd RF The frequency of signal is with the second pulse train described in the second angular deflection.

System the most according to claim 4, it farther includes:

3rd processes head, its 3rd position being configured to illuminate described target material by the 3rd pulse train；

Fourth process head, its 4th position being configured to illuminate described target material by the 4th pulse train； And

2nd AOM, it is configured to:

Receive the first remainder of described laser beam from a described AOM, a described AOM is The instantaneous cutting of part from described laser beam and produce described first pulse train and described second laser arteries and veins Punching row；

The instantaneous cutting of part of the first remainder of the described laser beam through using is described to produce simultaneously 3rd pulse train, described 4th pulse train and the second remainder of described laser beam；

Described 3rd pulse train is guided the described 3rd and processes head；

Described 4th pulse train is guided described fourth process head；And

By the second remainder output of described laser beam.

6. a laser processing method, comprising:

Continuous wave CW or quasi-CW laser beam is provided first sound-optic modulator AOM, described first AOM be configured to the part by the described laser beam of instantaneous cutting and produce the first pulse train, second swash Light pulse row and the first remainder of described laser beam；

Driving a described AOM with first frequency, described first frequency is configured to along the first optical path inclined Turn described first pulse train, in order to the primary importance of illumination target material；

Optionally more than one laser pulse of the first pulse train described in shaping, to control to be applied to institute Stating the dosage of the laser energy of target material, being chosen for shape increases in described laser energy and described target Coupling efficiency between material；

Driving a described AOM with second frequency, described second frequency is configured to along the second optical path inclined Turn described second pulse train, in order to illuminate the second position of described target material, wherein said first AOM simultaneously drives under described first frequency and described second frequency；And

By the first remainder output of described laser beam.

Method the most according to claim 6, it farther includes the first remainder of described laser beam Dividing and provide the 2nd AOM from a described AOM, a described AOM is by the part of described laser beam Instantaneous cutting is to produce described first pulse train and described second pulse train.

Method the most according to claim 7, wherein said 2nd AOM is configured to from from described First remainder of the described laser beam that one AOM receives produces the 3rd pulse train and the 4th laser arteries and veins Punching row.

Method the most according to claim 8, it farther includes to drive described second with the 3rd frequency AOM, described 3rd frequency is configured to deflect described 3rd pulse train along the 3rd optical path, in order to 3rd position of illumination target material.

Method the most according to claim 9, it farther includes to drive described second with the 4th frequency AOM, described 4th frequency is configured to deflect described 4th pulse train along the 4th optical path, in order to Illuminate the 4th position of described target material.

11. methods according to claim 6, wherein said laser beam includes multiple laser pulse.

12. methods according to claim 11, its farther include to drive a described AOM with Just at least one Part I of the pulse of described laser beam is guided described first optical path, and by described arteries and veins At least one Part II of punching guides described second optical path.