CN102243546B - Contact panel and manufacture method thereof - Google Patents
Contact panel and manufacture method thereof Download PDFInfo
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- CN102243546B CN102243546B CN201010180388.XA CN201010180388A CN102243546B CN 102243546 B CN102243546 B CN 102243546B CN 201010180388 A CN201010180388 A CN 201010180388A CN 102243546 B CN102243546 B CN 102243546B
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- glass substrate
- indium tin
- tin oxide
- oxide layer
- circuit
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Abstract
The present invention relates to a kind of contact panel and manufacture method thereof.The method of disclosed formation contact panel comprises: by chemical method tempered glass substrate, wherein said glass substrate comprises alkali metal oxide; Indium tin oxide layer is formed below described glass substrate; And formed on described indium tin oxide layer sensing circuit, driving circuit and between interconnection circuit.
Description
Technical field
The present invention relates to a kind of contact panel, relate in particular to a kind of capacitance type touch-control panel.
Background technology
Figure 1A shows conventional condenser contact panel 100, except liquid crystal, colored filter, touch-control circuit also needs extra at least one glass substrate 101, there is in described glass substrate both sides the indium tin oxide 102,103 as sensing cell and driver element, its at the middle and upper levels indium tin oxide 102 and lower floor's indium tin oxide 103 in being arranged vertically, and between glass substrate 101 and panel 104, being furnished with UV film optical cement 105, glass substrate 101 and panel 104 are fitted by recycling vacuum mode.Figure 1B is the sectional view of this conventional condenser contact panel of display.
Due to the demand that electronic installation is compact, many hand-held electronic devices conveniently carry, and require that integral thickness is more frivolous further.And in traditional contact panel, the substrate of panel and touch-control circuit is independent separately, thus add the integral thickness of electronic installation.
In addition, because contact panel surface needs the pressure of bearing from panel outside to touch, if therefore touch-control circuit is directly formed on said panel 104, the stress so touched from outside pressure may cause the electrical impact of circuit, and panel 104 applies through repeatedly pressing tactile stress, panel may be made to produce slight crack, even cause the damage of internal circuit.Therefore, be badly in need of a kind of can the structure of integrated component substrate and technique, and improve contact panel intensity.
Summary of the invention
For effectively reducing the substrate number of electronic installation, the touch-control circuit of contact panel to be integrated on panel and to improve contact panel intensity by the present invention, to reduce the substrate number needing laminating, problem that substrate attaching causes can be reduced whereby and effectively reduce contact panel integral thickness.
Embodiments of the invention disclose a kind of method forming contact panel, and it comprises: by chemical method tempered glass substrate, wherein said glass substrate comprises alkali metal oxide; Indium tin oxide layer is formed below described glass substrate; And formed on described indium tin oxide layer sensing circuit, driving circuit and between interconnection circuit.
Another embodiment of the present invention discloses a kind of contact panel, it comprises: through the glass substrate of chemical method strengthening, described glass substrate comprises the alkali metal oxide (M of the monox of 60wt% to 80wt%, the aluminium oxide of 1wt% to 15wt% and 0.1wt% to 15wt%
2o); And indium tin oxide layer, it is formed at below described glass substrate, described indium tin oxide layer is formed sensing circuit, driving circuit and between interconnection circuit.
Accompanying drawing explanation
Figure 1A shows conventional condenser contact panel;
Figure 1B shows the sectional view of conventional condenser contact panel;
Fig. 2 shows the embodiment of the method for formation contact panel of the present invention; And
Fig. 3 shows four-point bending method of testing.
Embodiment
Fig. 2 discloses disclosed a kind of method and process flow diagram forming contact panel.First provide glass substrate, described glass substrate comprises alkali metal oxide (M
2o), utilize chemical method to carry out intensive treatment to glass substrate, the glass substrate through chemical method intensive treatment forms compressive stress by the upper and lower surface of substrate.Indium tin oxide layer is formed in the below of glass substrate, and make formed indium tin oxide layer approximately consistent with the above-mentioned glass surface stress through chemical method intensive treatment, thus be formed as the indium tin oxide layer of compressive stress, to maintain the glass surface through intensive treatment.Then formed on indium tin oxide layer the sensing circuit of contact panel, driving circuit and between interconnection circuit.
In a preferred embodiment, the glass substrate provided has the alkali metal oxide that percentage by weight is the monox of 60% to 80%, the aluminium oxide of 1wt% to 15wt% and 0.1wt% to 15wt%.In another preferred embodiment, glass substrate separately comprises at least one in the following further: calcium oxide, magnesium oxide, iron oxide, boron oxide and sulfur oxide and its analog, calcium oxide content wherein in glass substrate can reach 13wt% at most, magnesium oxide can reach 13wt% at most, and iron oxide, boron oxide and sulfur oxide can reach 1wt% at most respectively.
In a preferred embodiment, the alkali metal oxide wherein in glass substrate is Lithia (Li
2o), (Na is received in oxidation
2o).In another preferred embodiment, in nitrous acid glass substrate being immersed high temperature or salpeter solution, utilize the intensive treatment that nitrous acid or salpeter solution and glass substrate generation chemical reaction carry out glass substrate.Potassium ion in solution enters in glass substrate, is cemented out by the alkali metal ion in glass substrate.Such as, in glass substrate, there is Lithia and/or oxidation is received, potassium ion and lithium ion and/or sodium ion exchange, compared with lithium ion and sodion, because the ionic radius of potassium ion is larger, therefore it enters in glass substrate, the Lithia of glass substrate surface and/or oxidation is installed and is changed to kali, thus will form the compressive stress of glass substrate surface.
In an embodiment, in glass substrate after above-mentioned chemical method intensive treatment, utilize four-point bending to test (4point-bendingtest), known glass substrate surface compressive stress is for being greater than 8GPa, in a preferred embodiment, glass substrate surface is about 9GPa.
Four-point bending method of testing as shown in Figure 3, carries out chemical method intensive treatment to glass substrate 301, is positioned on two supporting levers 302, and adjusts to make the distance d1 at supporting lever and glass substrate 301 edge for about 9mm to it.Two load thick sticks 303 are positioned over above glass substrate 301, and make the spacing d3 of two load thick sticks 303 be about 32mm.And the load thick stick 303 of glass substrate the right and left is about 16mm with the spacing d2 of supporting lever 302.Sentence speed Vb (its medium velocity Vb is 10mm/min) at two load thick sticks 303 and apply stress Fb gradually to glass substrate 301,10% accumulation destroys, and learns glass surface stress with weber (Weibull) analysis.The thickness testing glass substrate used is 0.55mm.
In a preferred embodiment, formed the sensing circuit on contact panel, driving circuit and between interconnection circuit comprise the indium tin oxide layer utilizing and formed below the mode patterned glass substrate of laser beam marking further.
In a preferred embodiment, the Q that the lasing condition that the laser beam marking process of patterning indium tin oxide layer utilizes is radiation wavelength is 355nm switches the ultraviolet radiation of continuous wave laser, and linear scanning velocity is about 1000mm/sec, and energy is less than 3W.
In another preferred embodiment, the pulsed UV optical radiation that the lasing condition that the laser beam marking process of patterning indium tin oxide layer utilizes is radiation wavelength is 532nm, linear scanning velocity is about 120mm/sec, and energy is less than 120mW.
In a further preferred embodiment, the lasing condition that the laser beam marking process of patterning indium tin oxide layer utilizes is infrared radiation, and wavelength is about 1064nm, and frequency is 20kHZ, linear scanning velocity is about 100mm/sec to 500mm/sec, and energy is about 100mW to 800mW.
In a preferred embodiment, glass substrate itself is about 15% to the absorptivity of the radiant light that patterning indium tin oxide layer uses.In another preferred embodiment, being formed at the absorptivity of the indium tin oxide layer in glass substrate to radiant light is about 8% to about 10%.Take thickness as the glass substrate of 0.55mm be example, control radiation condition, radiation irradiation region local temperature is improved within 2.4K, thus the compressive stress that glass substrate formed after intensive treatment can not be destroyed.
In another embodiment of the invention, indium tin oxide layer is formed sensing circuit, driving circuit and between interconnection circuit be utilize ink-jetting style to be printed onto in described glass substrate by electrically conductive ink.In a preferred embodiment, after forming circuit with ink-jetting style, then annealing in process is carried out to contact panel, and annealing temperature is no more than 205 degrees Celsius.
For formed through above-mentioned laser beam marking or ink-jetting style sensing circuit, driving circuit and between the contact panel of interconnection circuit, test known contact panel surface through aforementioned four-point bending and still maintain compressive stress, and with approximately suitable in the compressive stress after chemical mode intensive treatment, known above-mentioned laser beam marking or ink-jetting style can not destroy the compressive stress through intensive treatment of glass substrate surface, but maintain the intensity of glass substrate.Therefore; the contact panel formed through the present invention has reliable intensity; thus make the sensing circuit of contact panel in use below cover glass substrate, driving circuit and between interconnection circuit; make the pressure from glass substrate opposite side can not affect sensing circuit, driving circuit and between interconnection circuit electrical, even cause circuit to damage.
Although technology contents of the present invention be characterized as mentioned above, but those skilled in the art still can carry out many changes and amendment when not deviating from teaching of the present invention and disclosure.Therefore, scope of the present invention is not limited to the embodiment disclosed, but comprises and do not deviate from other change of the present invention and amendment, its for as appended claims the scope that contained.
Claims (13)
1. form a method for contact panel, it comprises:
By chemical method tempered glass substrate, wherein said glass substrate comprises the alkali metal oxide of the monox of 60wt% to 80wt%, the aluminium oxide of 1wt% to 15wt% and 0.1wt% to 15wt%, wherein said glass substrate has the surface stress being greater than 8Gpa after described chemical method strengthening
Below described glass substrate, form indium tin oxide layer, wherein, described glass substrate has the first surface as touch-control surface, and the second surface relative with described first surface, forms described indium tin oxide layer at the second surface of described glass substrate; And
Described indium tin oxide layer is formed sensing circuit, driving circuit and between interconnection circuit, wherein, described sensing circuit is printed onto in described glass substrate by ink-jetting style by electrically conductive ink; And
Annealing in process, the temperature of described annealing in process is less than 205 degrees Celsius.
2. method according to claim 1, wherein said chemical method comprises in described glass substrate immersion high temperature nitrous acid or salpeter solution.
3. method according to claim 1, wherein by laser beam marking formed described formation sensing circuit, driving circuit and between the step of interconnection circuit.
4. method according to claim 3, the Q of the condition of wherein said laser beam marking to be radiation wavelength be 355nm switches the ultraviolet radiation of continuous wave laser, and linear scanning velocity is about 1000mm/sec, and energy is for being less than 3W.
5. method according to claim 3, the pulsed UV optical radiation of the condition of wherein said laser beam marking to be radiation wavelength be 532nm, linear scanning velocity is about 120mm/sec, and energy is for being less than 120mW.
6. method according to claim 3, the condition of wherein said laser beam marking is radiation wavelength is about 1064nm, and frequency is 20kHZ, and linear scanning velocity is about 100mm/sec to 500mm/sec, and energy is about 100mW to 800mW.
7. method according to claim 1, wherein said glass substrate has the surface stress being greater than 8Gpa after described chemical method strengthening.
8. method according to claim 7, wherein said glass substrate has the surface stress of about 9Gpa.
9. method according to claim 1, wherein said alkali metal oxide comprises at least one in the following: Lithia (Li
2o), sodium oxide molybdena (Na
2o).
10. method according to claim 3, wherein said glass substrate is about 15% to the absorptivity of radiation.
11. methods according to claim 10, wherein said indium tin oxide is about 8% to about 10% to the scope of the absorptivity of described radiation.
12. 1 kinds of contact panels, it comprises:
Through the glass substrate of chemical method strengthening, described glass substrate comprises the alkali metal oxide of the monox of 60wt% to 80wt%, the aluminium oxide of 1wt% to 15wt% and 0.1wt% to 15wt%, and wherein said glass substrate has the surface stress being greater than 8Gpa after described chemical method strengthening; And
Indium tin oxide layer, it is formed at below described glass substrate, described indium tin oxide layer is formed sensing circuit, driving circuit and between interconnection circuit, wherein, described glass substrate has the first surface as touch-control surface, and the second surface relative with described first surface, form described indium tin oxide layer at the second surface of described glass substrate
Wherein, described sensing circuit is printed onto in described glass substrate by ink-jetting style by electrically conductive ink, carries out annealing in process afterwards to described contact panel, and the temperature of described annealing in process is less than 205 degrees Celsius.
13. contact panels according to claim 12, wherein said glass substrate comprises at least one in the following in addition: calcium oxide, magnesium oxide, iron oxide, boron oxide and sulfur oxide.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010180388.XA CN102243546B (en) | 2010-05-13 | 2010-05-13 | Contact panel and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010180388.XA CN102243546B (en) | 2010-05-13 | 2010-05-13 | Contact panel and manufacture method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102243546A CN102243546A (en) | 2011-11-16 |
| CN102243546B true CN102243546B (en) | 2016-02-03 |
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| CN103364847B (en) * | 2012-04-10 | 2015-08-26 | 永恒科技有限公司 | The protective lens of electronic installation and manufacture method thereof |
| US8981230B2 (en) * | 2012-07-24 | 2015-03-17 | Htc Corporation | Electronic apparatus and touch cover |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553776A (en) * | 2007-02-08 | 2009-10-07 | 夏普株式会社 | Touch panel apparatus and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7415841B2 (en) * | 2002-03-27 | 2008-08-26 | Hoya Corporation | Method for producing chemically strengthened glass substrate for information recording medium |
| JP2004131314A (en) * | 2002-10-09 | 2004-04-30 | Asahi Glass Co Ltd | Chemically strengthened glass substrate with transparent conductive film and its manufacturing process |
| US8259079B2 (en) * | 2006-06-14 | 2012-09-04 | Alps Electric Co., Ltd. | Input panel having flexible circuit board inserted into passage through base and input device having the input panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101553776A (en) * | 2007-02-08 | 2009-10-07 | 夏普株式会社 | Touch panel apparatus and method for manufacturing the same |
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| CN102243546A (en) | 2011-11-16 |
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