CN102237468A - 发光二极管封装结构及其制造方法 - Google Patents

发光二极管封装结构及其制造方法 Download PDF

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CN102237468A
CN102237468A CN2010101597806A CN201010159780A CN102237468A CN 102237468 A CN102237468 A CN 102237468A CN 2010101597806 A CN2010101597806 A CN 2010101597806A CN 201010159780 A CN201010159780 A CN 201010159780A CN 102237468 A CN102237468 A CN 102237468A
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刘士龙
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Abstract

本发明发光二极管封装结构及其制造方法，封装结构至少包含有：壳体、至少两分离的支架、至少一发光晶片以及导电胶，该发光晶片设于其中一支架上，该发光晶片并与另一支架间设有第一导线而形成电性连接，而该导电胶设于该发光晶片与该支架之间而形成黏着与电性连接，且该支架与该导电胶间并设有一第二导线，藉由该第二导线的干涉牵引作用，可确保发光晶片与该等支架的黏着与电性连接，以提升发光二极管的良率。

Description

发光二极管封装结构及其制造方法
技术领域
本发明涉及发光二极管封装结构及其制造方法，尤指一种可确保发光晶片与支架的黏着与电性连接，以提升发光二极管良率的发光二极管封装结构及其制造方法。
背景技术
发光二极管为一种固态的半导体组件，利用电流通过二极管内产生的二个载子相互结合，将能量以光的形式释放出来，具有体积轻巧、反应速度快及无污染等优势，使发光二极管应用领域逐渐跨足各产业界，虽然初期发展时，面临其亮度不足与发光效率低的瓶颈，但后续的发展出高功率的发光二极管，解决上述的亮度不足的问题，使发光二极管逐渐跨足高效率照明光源市场，并有逐渐取代传统钨丝灯的趋势，是未来替代传统照明的潜力产品。
随着发光二极管制作技术不断增进，以及新型材料的开发，加上配合各种型态的需求，使得发光二极管的技术和结构越趋于成熟，以致后来能发展出高功率的发光二极管，其能量及亮度都向上提升，也渐渐被应用在各种领域中。在现今的高功率发光二极管的型态中，表面黏着型发光二极管(SMD LED)即为常见的一种发光二极管型态，而在一般的表面黏着型发光二极管中主要又区分为支架型与电路板型，支架型利用金属支架与耐温塑料材料射出成型一槽座，来作为发光二极管晶粒固定的基座；另外，电路板型则是以复合材料电路板作为基板，而这两种型式皆都会经由固晶、打线及封固等步骤完成该发光二极管的结构。
而一般发光二极管封装过程中，利用一焊接黏着材料将发光晶片固定于支架或基座上，但习用的焊接材料多含有铅、锡等成分，但铅的毒性及全球对于铅的管制及禁令，故现今改而采用无铅焊接黏着材料；惟，无铅焊接黏着材料却含有一个很大的缺点存在，也就是其玻璃转换温度较低而不能耐高温，特别是在发光二极管与其它电路板接合时需要经过高温锡炉(约250℃～300℃)，而无铅焊接黏着材料通常无法承受上述高温锡炉的高温，使该无铅焊接黏着材料产生软化变形的情况，令无铅焊接黏着材料上方的发光晶片产生位移，进而影响该发光晶片与支架间的打线，常常使得发光晶片与支架脱层分离，无法维持黏着与电性连接，使发光二极管本身造成不良品的出现。
发明内容
有鉴于此，本发明的主要目的在于解决上述的缺失，本发明为一种可确保发光晶片与支架的黏着与电性连接，以提升发光二极管良率的发光二极管封装结构及其制造方法。
为达上述目的，本发明的封装结构至少包含有：壳体、至少两分离的支架、至少一发光晶片以及导电胶，该发光晶片设于其中一支架上，该发光晶片并与另一支架间设有第一导线而形成电性连接，而该导电胶设于该发光晶片与该支架之间而形成黏着与电性连接，且该支架与该导电胶间并设有一第二导线。
藉由上述封装结构及其制造方法，可改良习有导电胶使用无铅焊接黏着材料的缺失，由该第二导线的干涉牵引，可对该导电胶产生辅助固定的作用，使封装结构于后续制程如经过高温锡炉时，可控制该发光晶片不易与支架脱层分离，而不至于影响黏着与电性连结，可确保发光晶片与该等支架的黏着与电性连接，以提升发光二极管的良率。
附图说明
图1A～D为本发明中制造方法第一实施例的结构示意图；
图2为本发明中第一实施例封装结构的结构示意图；
图3A、B为本发明中第二实施例封装结构的结构示意图；
图4为A～C为本发明中制造方法第二实施例的结构示意图；
图5为本发明中第三实施例封装结构的结构示意图。
【图号说明】
支架11、12        壳体13
容置部131         透光胶132
第二导线14        焊点141、142
导电胶15          发光晶片16
第一导线17        辅助线17a
焊点171、172      固晶胶18
具体实施方式
本发明中发光二极管封装结构的制造方法，其至少包含有下列步骤：
步骤A1、形成至少两分离支架11、12，如图1A所示，该支架11、12可以分别为P、N极；
步骤F1、壳体成型步骤，于该等支架11、12成型有包覆部份支架的壳体13，且该壳体13顶侧并形成至少有一凹坑状的容置部131，其容置部131并可使支架11、12外露；
步骤B1、于其中一支架11(P极)上形成第二导线14，该第二导线14两端连接于支架11上，如图所示的实施例中，该第二导线14两端藉由焊点141、142电性连接于支架11上；
步骤C1、于该支架11上形成导电胶15，该导电胶15可以为无铅焊接黏着材料，且该导电胶15与该第二导线14接触，如图1B所示，该第二导线14部分埋入于该导电胶15内，其中该第二导线14一端的焊点141位于该导电胶15内侧，而该第二导线14另端的焊点142位于该导电胶15外侧；
步骤D1、于该导电胶15上固置发光晶片16，如图1C所示；
步骤E1、打线步骤，如图1D所示，于该发光晶片16与另一支架12(N极)间形成第一导线17。
而藉由上述的制造方法所形成的发光二极管封装结构则如图2的第一实施例所示，其至少包含有：一壳体13、至少两分离的支架11、12、至少一发光晶片16以及导电胶15，该支架11、12以及发光晶片16设于壳体13中，而壳体13顶侧并形成至少有一凹坑状的容置部131，其容置部131并可使支架11、12外露，该发光晶片16藉由导电胶15设于其中一支架11上而形成黏着与电性连接，且该支架11与该导电胶15间并设有一第二导线14，该发光晶片16并与另一支架12间设有第一导线17而形成电性连接，而该容置部131中并设有透光胶132；当然，该透光胶亦可进一步混合有荧光粉，可形成有不同的颜色表现(例如白光或紫光等)。
本发明藉由该第二导线的干涉牵引，可对该导电胶产生辅助固定的作用，使封装结构于后续制程如经过高温锡炉时，可控制该发光晶片不易与支架脱层分离，可确保发光晶片与该等支架的黏着与电性连接，以提升发光二极管的良率。
再者，该步骤E3中的打线步骤可进一步将该第一导线于该支架上形成至少二个焊点，则形成如图3A、B的第二实施例所示，该第一导线17于该支架12上形成有二个焊点171、172，可使该第一导线17于二焊点171、172间形成有辅助线17a，使用时该透光胶132会因环境变化(如应力、温度或湿度)，使得该透光胶132产生变化(如热涨冷缩的应力所产生的拉力)，而令该热涨冷缩的变化使该透光胶132对该第一导线17产生拉力，此时若其中一焊点171脱离时，亦有另一焊点172与辅助线17a维持第一导线17与支架12的连接，可进一步确保发光晶片与该等支架的电性连接，以提升发光二极管的良率。
如图4A～C所示为本发明发光二极管封装结构的制造方法第二实施例，其至少包含有下列步骤：
步骤A2、形成至少两分离支架11、12，如图4A所示；
步骤F2、壳体成型步骤，于该等支架11、12成型有包覆部份支架的壳体13，且该壳体13顶侧并形成至少有一凹坑状的容置部131，其容置部131并可使支架11、12外露；
步骤B2、于其中一支架11上固置发光晶片16，如图4B所示，该发光晶片16与支架11之间设有不导电的固晶胶18；
步骤E1、打线步骤，如图4C所示，于该发光晶片16与该等支架11、12间分别设有第一、第二导线17、14而形成电性连接，且该第一、第二导线17、14于该支架11、12上形成至少二个焊点171、172、141、142。
而藉由第二实施例制造方法所形成的发光二极管封装结构则如图5的第三实施例所示，其至少包含有：一壳体13、至少两分离的支架11、12以及至少一发光晶片16，该支架11、12以及发光晶片16设于壳体13中，而壳体13顶侧并形成至少有一凹坑状的容置部131，其容置部131并可使支架11、12外露，该发光晶片16利用不导电的固晶胶18固设于其中一支架11上，而该发光晶片16与该等支架11、12间分别设有第一、第二导线17、14而形成电性连接，且该第一、第二导线17、14于该支架11、12上形成至少二个焊点171、172、141、142，而该容置部131中并设有透光胶132；当然，该透光胶亦可进一步混合有荧光粉，可形成有不同的颜色表现(例如白光或紫光等)。
使用时该透光胶132会因环境变化(如应力、温度或湿度)，使得该透光胶132产生变化(如热涨冷缩的应力所产生的拉力)，而令该热涨冷缩的变化使该透光胶132对该第一导线17产生拉力，此时若其中一焊点171脱离时，亦有另一焊点172维持第一导线17与支架12的连接，可确保发光晶片与该等支架的电性连接，以提升发光二极管的良率。

Claims (14)

1.一种发光二极管封装结构，其特征在于，其至少包含有：
一壳体，其壳体中设有支架以及发光晶片，而壳体顶侧并形成至少有一凹坑状的容置部，其容置部并可使支架外露；
至少两分离的支架，该支架与发光晶片形成黏着与电性连接；
至少一发光晶片，该发光晶片设于其中一支架上，该发光晶片并与另一支架间设有第一导线而形成电性连接；
导电胶，该导电胶设于该发光晶片与该支架之间而形成黏着与电性连接，且该支架与该导电胶间并设有一第二导线。
2.如权利要求1所述的发光二极管封装结构，其特征在于，该第一导线于该支架上形成至少二个焊点。
3.如权利要求1或2所述的发光二极管封装结构，其特征在于，该第二导线部分埋入于该导电胶内。
4.如权利要求1或2所述的发光二极管封装结构，其特征在于，该容置部中并设有透光胶。
5.如权利要求4所述的发光二极管封装结构，其特征在于，该透光胶混合有荧光粉。
6.如权利要求5所述的发光二极管封装结构，其特征在于，该第二导线部分埋入于该导电胶内。
7.一种发光二极管封装结构的制造方法，其特征在于，其至少包含有下列步骤：
A1、形成至少两分离支架；
B1、于其中一支架上形成第二导线，该第二导线两端连接于支架上；
C1、于该支架上形成导电胶，且该导电胶与该第二导线接触；
D1、于该导电胶上固置发光晶片。
8.如权利要求7所述的发光二极管封装结构的制造方法，其特征在于，该步骤D1之后进一步包含有一步骤E1，该步骤E 1为打线步骤，于该发光晶片与另一支架间形成第一导线。
9.如权利要求8所述的发光二极管封装结构的制造方法，其特征在于，该第一导线于该支架上形成至少二个焊点。
10.如权利要求7或8所述的发光二极管封装结构的制造方法，其特征在于，该第二导线部分埋入于该导电胶内。
11.如权利要求7或8所述的发光二极管封装结构的制造方法，其特征在于，该步骤A1之后进一步包含有一步骤F1，该步骤F1为壳体成型步骤，于该等支架成型有包覆部份支架的壳体。
12.如权利要求10所述的发光二极管封装结构的制造方法，其特征在于，该壳体顶侧并形成至少有一凹坑状的容置部，其容置部并可使支架外露。
13.如权利要求12所述的发光二极管封装结构的制造方法，其特征在于，该容置部中并设有透光胶。
14.如权利要求13所述的发光二极管封装结构的制造方法，其特征在于，该透光胶混合有荧光粉。
CN2010101597806A 2010-04-29 2010-04-29 发光二极管封装结构及其制造方法 Pending CN102237468A (zh)

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CN102456824A (zh) * 2010-10-21 2012-05-16 展晶科技(深圳)有限公司 发光二极管封装结构
CN103545435A (zh) * 2012-07-10 2014-01-29 深圳市斯迈得光电子有限公司 一种高可靠性的应用于smd发光二极管的焊线装置

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CN102456824A (zh) * 2010-10-21 2012-05-16 展晶科技(深圳)有限公司 发光二极管封装结构
CN103545435A (zh) * 2012-07-10 2014-01-29 深圳市斯迈得光电子有限公司 一种高可靠性的应用于smd发光二极管的焊线装置

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