CN102236062A - Radiation module of laptop and insulation detecting method thereof - Google Patents
Radiation module of laptop and insulation detecting method thereof Download PDFInfo
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- CN102236062A CN102236062A CN2010101695160A CN201010169516A CN102236062A CN 102236062 A CN102236062 A CN 102236062A CN 2010101695160 A CN2010101695160 A CN 2010101695160A CN 201010169516 A CN201010169516 A CN 201010169516A CN 102236062 A CN102236062 A CN 102236062A
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- insulation assembly
- inspection
- radiating module
- processing unit
- insulativity
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Abstract
The invention discloses a radiation module of a laptop and an insulation detecting method thereof. The insulation detecting method is used for detecting the assembly state of insulation components of the laptop, and comprises the following steps: a processing unit and a radiation module of the laptop are provided, wherein the processing unit comprises a chip and a plurality of electrical contacts, the electrical contacts are adjacent to the chip, and detecting pores are formed on the radiation module; and whether the insulation components are assembled is determined through the detecting pores.
Description
Technical field
The invention relates to a kind of radiating module and the insulativity method of inspection thereof, and particularly relevant for a kind of radiating module and the insulativity method of inspection thereof of notebook computer.
Background technology
The motherboard of traditional notebook computer has chip and a plurality of electrical contact, and those electrical contact adjacent chips are provided with.Be the heat production of dissipation chip, a radiating module covers chip and is located on the motherboard.
Insulation assembly is located between chip and the radiating module, with the metal shell of avoiding radiating module because of touching the short circuit that electrical contact was taken place around the chip.
Yet insulation assembly regular meeting in production or heavy industry process is short-circuited notebook computer by neglected loading or mistake dress after test (for example being the burning machine), therefore cause entire block palpus heavy industry, on foot weightening finish worker's cost and man-hour.
Summary of the invention
The present invention is relevant for a kind of radiating module and the insulativity method of inspection thereof of notebook computer, by the inspection hole of radiating module, can check out insulation assembly whether neglected loading or mistake dress, and is quite convenient.
A kind of insulativity method of inspection of radiating module of notebook computer is proposed according to an aspect of the present invention.The insulativity method of inspection may further comprise the steps.One processing unit and a radiating module of notebook computer are provided, and processing unit comprises a chip and several electrical contacts, and electrical contact is adjacent to the chip setting and radiating module has an inspection hole.Wherein, an insulation assembly optionally is located between processing unit and the radiating module; And, by the assembled state of inspection hole judgement insulation assembly.
A kind of radiating module of notebook computer is proposed according to a further aspect in the invention.Radiating module is located on the chip of a processing unit, and an insulation assembly optionally is located between radiating module and the processing unit.Radiating module comprises a housing and a radiating subassembly.Housing has an inspection hole, and the position of inspection hole is corresponding to insulation assembly.Radiating subassembly is located on the housing, in order to transmit the heat production of chip.
Description of drawings
Fig. 1 is the process flow diagram of assemble method of the radiating module of notebook computer of the present invention;
Fig. 2 A to 2D is the assembling synoptic diagram of radiating module of the notebook computer of present embodiment;
Fig. 3 is the top view according to processing unit among Fig. 2 A;
Fig. 4 is the top view of the processing unit of another embodiment of the present invention.
Wherein, Reference numeral:
100: circuit board 102,202,208: chip
104,204: electrical contact 106,206: processing unit
108: bearing
110: the first insulation assemblies
112: the second insulation assemblies
114: hollow-out parts
116: radiating module
118: inspection hole
120: upper surface
122: thermal grease
124: housing
S102-S110: step
Embodiment
Preferred embodiment is below proposed as explanation of the present invention, however the content that embodiment proposed, usefulness only for illustrating, and the accompanying drawing of drawing illustrates for cooperating, and is not the usefulness as limit protection domain of the present invention.Moreover the accompanying drawing of embodiment also omits unnecessary assembly, in order to clear demonstration technical characterstic of the present invention.
Please be simultaneously with reference to Fig. 1 and Fig. 2 A to 2D, Fig. 1 is the process flow diagram according to the assemble method of the radiating module of the notebook computer of preferred embodiment of the present invention, Fig. 2 A to 2D is the assembling synoptic diagram of radiating module of the notebook computer of present embodiment.
In step S102, shown in Fig. 2 A, provide circuit board 100, circuit board 100 comprises processing unit 106 and bearing 108 thereof, processing unit 106 herein for example be CPU (central processing unit) (CentralProcessing Unit, CPU).Be the clear processing unit 106 of expressing, Fig. 2 A only shows the part of circuit board 100.
Because the housing 124 of radiating module 116 is that conducting metal is made, so, touch electrical contact 104 as if housing 124 and will cause processing unit 106 to be short-circuited and lose function.Therefore, need between radiating module 116 and processing unit 106, to dispose insulation assembly, please continue with reference to the following step.
In step S104, shown in Fig. 2 B, provide first insulation assembly 110 and second insulation assembly 112.The material of first insulation assembly 110 and second insulation assembly 112 is laminate polyester (Mylar).
The color of the color of first insulation assembly 110 and second insulation assembly 112 is inequality.For example, the color of first insulation assembly 110 is a black, and the color of second insulation assembly 112 is a white.
Come again, in step S106, also please be shown in Fig. 2 C simultaneously with reference to Fig. 3, it is the top view according to processing unit among Fig. 2 A.According to the kenel of processing unit 106, select to be fit to cover the insulation assembly of whole electrical contacts 104, i.e. first insulation assembly 110.
Saying that further the chip 102 of different processing units is different with the relative position of 104 of electrical contacts, is not that every kind of insulation assembly all is suitable for covering electrical contact whole in the processing unit 106 104 therefore.In present embodiment, can cover whole electrical contact 104 and exposed chip 102 according to selected first insulation assembly 110 of kenel of the processing unit 106 of Fig. 2 A, electrically contact and short circuit with the radiating module 116 of subsequent step to avoid electrical contact 104.Yet, implement in the attitude in another, please be simultaneously with reference to Fig. 4, it is the top view of the processing unit of another embodiment of the present invention.According to the processing unit 206 of Fig. 4, can select be fit to cover in the processing unit 206 insulation assembly of whole electrical contacts 204 and exposed chip 202 and 208, for example be second insulation assembly 112.
Then, in step S108, shown in Fig. 2 D, radiating module 116 is set on first insulation assembly 110, radiating module 116 is fixed on the circuit board 100 and more comprises a radiating subassembly and have inspection hole 118.The position of inspection hole the some of first insulation assembly 110 is exposed from inspection hole 118, and radiating subassembly herein for example is a heat pipe (heat pipe) (not illustrating) corresponding to first insulation assembly 110.This heat pipe extends to a radiator fan (not illustrating), and this radiator fan dissipates to the external world with the heat production of processing unit 106.
In addition, radiating module 116 more comprises thermal grease 122, and it is located on the housing 124 and in order to be contacted with chip 102, is passed to the housing 124 of radiating module 116 apace with the heat production with chip 102.
The area of first insulation assembly 110 is slightly larger than or equals haply the area of the upper surface 120 of processing unit 106, can save the materials cost of first insulation assembly 110.And,, only have inspection hole 118 can expose first insulation assembly 110 in the radiating module 116 after the feasible assembling because radiating module 116 covers first insulation assembly 110 fully.
Then, in step S110, can judge the assembled state of insulation assembly fast by inspection hole 118.
For instance, according to the color (being black) that first insulation assembly 110 exposes from inspection hole 118, judge that first insulation assembly 110 is the correct insulation assembly corresponding to the kenel of processing unit 106.
Say that further if mistake has been adorned second insulation assembly 112 in step S106, then the color of exposing from inspection hole 118 is the color of second insulation assembly 112, i.e. white.What reviewer, assembler or perceptron (sensor) can be judged assembling according to this is wrong insulation assembly; Perhaps, if in step S106 neglected loading first insulation assembly 110, what then expose from inspection hole 118 is processing unit 106 but not insulation assembly, therefore, reviewer, assembler or perceptron can have been judged neglected loading according to this insulation assembly.
Before notebook computer is tested, can judge the assembled state of insulation assembly earlier by the inspection hole 118 of radiating module 116.If insulation assembly mistake dress can be pulled down wrong insulation assembly and change correct insulation assembly before notebook computer is tested; Perhaps, if the insulation assembly neglected loading can be mended before notebook computer is tested and be loaded onto correct insulation assembly.So, can avoid notebook computer mistake dress because of insulation assembly after test to be short-circuited.
The design of the inspection hole 118 by radiating module 116 can be finished the action of the assembled state of judging insulation assembly in assembling process, in order to avoid the notebook computer of dress mistake or neglected loading insulation assembly just tests out in the back segment checking engineering.Therefore, the design of the inspection hole 118 by radiating module 116 can be found the problem of mistake dress or neglected loading insulation assembly early, avoids increasing on foot the cost and the man-hour of follow-up heavy industry.
The assemble method of the radiating module of notebook computer disclosed in this invention and the insulativity method of inspection by the inspection hole of radiating module, can be checked out insulation assembly whether neglected loading or mistake dress, and be quite convenient.In sum, though the present invention with preferred embodiment openly as above, is not in order to limit the present invention.The technician of the technical field of the invention without departing from the spirit and scope of the present invention, can do various changes and modification.Therefore, protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (10)
1. the insulativity method of inspection of the radiating module of a notebook computer is characterized in that, comprising:
One processing unit and a radiating module of this notebook computer are provided, this processing unit comprises a chip and a plurality of electrical contact, this electrical contact is adjacent to this chip setting, and this radiating module has an inspection hole, wherein, an insulation assembly optionally is located between this processing unit and this radiating module; And
Judge the assembled state of this insulation assembly by this inspection hole.
2. the insulativity method of inspection as claimed in claim 1 is characterized in that, also comprises in this step of the assembled state of judging this insulation assembly by this inspection hole:
Judge by this inspection hole whether this insulation assembly has assembling.
3. the insulativity method of inspection as claimed in claim 1 is characterized in that the some of this insulation assembly is exposed from this inspection hole, and this method of inspection also comprises:
According to this color partly of this insulation assembly, judge whether the corresponding relation of this insulation assembly and this processing unit is correct.
4. the insulativity method of inspection as claimed in claim 3 is characterized in that, the color of this insulation assembly is white or black.
5. the insulativity method of inspection as claimed in claim 1 is characterized in that, this insulation assembly is a laminate polyester.
6. the insulativity method of inspection as claimed in claim 1 is characterized in that this insulation assembly has a hollow-out parts, and this hollow-out parts is exposed this chip.
7. the insulativity method of inspection as claimed in claim 1 is characterized in that this insulation assembly covers this electrical contact.
8. the insulativity method of inspection as claimed in claim 1 is characterized in that this radiating module covers this insulation assembly fully.
9. the radiating module of a notebook computer is located on the chip of a processing unit, and an insulation assembly optionally is located between this radiating module and this processing unit, it is characterized in that, this radiating module comprises:
One housing has an inspection hole, and the position of this inspection hole is corresponding to this insulation assembly; And
One radiating subassembly is located on this housing, in order to transmit the heat production of this chip.
10. radiating module as claimed in claim 1 is characterized in that, the color of this insulation assembly is white or black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101695160A CN102236062A (en) | 2010-04-30 | 2010-04-30 | Radiation module of laptop and insulation detecting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101695160A CN102236062A (en) | 2010-04-30 | 2010-04-30 | Radiation module of laptop and insulation detecting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102236062A true CN102236062A (en) | 2011-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101695160A Pending CN102236062A (en) | 2010-04-30 | 2010-04-30 | Radiation module of laptop and insulation detecting method thereof |
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| Country | Link |
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| CN (1) | CN102236062A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576467A (en) * | 2015-01-05 | 2015-04-29 | 武汉新芯集成电路制造有限公司 | Mold capable of loading SOP chips quickly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227358A (en) * | 1998-02-27 | 1999-09-01 | 鸿海精密工业股份有限公司 | Heat radiator for computer chip |
| CN1499165A (en) * | 2002-11-07 | 2004-05-26 | 缪志先 | Plate heat exchanger possessing exterior passageway and welded structure in new type sealing way |
| CN2901363Y (en) * | 2006-04-26 | 2007-05-16 | 认知显示株式会社 | Detecting hole machine for LCD display main frame producing device |
| CN2938064Y (en) * | 2006-07-27 | 2007-08-22 | 攀枝花新钢钒股份有限公司 | Quick detection device for band steel weld seam quality |
| CN101465331A (en) * | 2007-12-21 | 2009-06-24 | 鸿富锦精密工业（深圳）有限公司 | Fixed device of radiating module |
-
2010
- 2010-04-30 CN CN2010101695160A patent/CN102236062A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227358A (en) * | 1998-02-27 | 1999-09-01 | 鸿海精密工业股份有限公司 | Heat radiator for computer chip |
| CN1499165A (en) * | 2002-11-07 | 2004-05-26 | 缪志先 | Plate heat exchanger possessing exterior passageway and welded structure in new type sealing way |
| CN2901363Y (en) * | 2006-04-26 | 2007-05-16 | 认知显示株式会社 | Detecting hole machine for LCD display main frame producing device |
| CN2938064Y (en) * | 2006-07-27 | 2007-08-22 | 攀枝花新钢钒股份有限公司 | Quick detection device for band steel weld seam quality |
| CN101465331A (en) * | 2007-12-21 | 2009-06-24 | 鸿富锦精密工业（深圳）有限公司 | Fixed device of radiating module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576467A (en) * | 2015-01-05 | 2015-04-29 | 武汉新芯集成电路制造有限公司 | Mold capable of loading SOP chips quickly |
| CN104576467B (en) * | 2015-01-05 | 2019-02-15 | 武汉新芯集成电路制造有限公司 | A kind of mold of quick load SOP chip |
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Application publication date: 20111109 |