CN104576467B - A kind of mold of quick load SOP chip - Google Patents

A kind of mold of quick load SOP chip Download PDF

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Publication number
CN104576467B
CN104576467B CN201510003946.8A CN201510003946A CN104576467B CN 104576467 B CN104576467 B CN 104576467B CN 201510003946 A CN201510003946 A CN 201510003946A CN 104576467 B CN104576467 B CN 104576467B
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CN
China
Prior art keywords
chip
sop
hard plate
mold
upper layer
Prior art date
Application number
CN201510003946.8A
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Chinese (zh)
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CN104576467A (en
Inventor
陈晓
庞金存
Original Assignee
武汉新芯集成电路制造有限公司
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Priority to CN201510003946.8A priority Critical patent/CN104576467B/en
Publication of CN104576467A publication Critical patent/CN104576467A/en
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Publication of CN104576467B publication Critical patent/CN104576467B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Abstract

The present invention relates to chip package fields, more particularly to a kind of mold of quick load SOP chip, the mold includes upper layer and lower layer hard plate, several vertical rods are set on lower layer's hard plate, upper layer hard plate is sheathed on these vertical rods by a snap-in structure, and several through-holes identical with SOP chip form are arranged on the hard plate of upper layer.By using above-mentioned loading mold, multiple chip conversion seats can be opened simultaneously, improve the efficiency of loading of chip;And in upper layer hard plate and through-hole pin foot position printing different colours, solve the problems, such as that identification chip whether put by correct placement and whether leaking, and reduces error rate in this way.

Description

A kind of mold of quick load SOP chip

Technical field

The present invention relates to chips to load field more particularly to a kind of mold of quick load SOP chip.

Background technique

SOP (the small outline packages of Small Out-Line Package) is a kind of very common component form, surface patch One of dress type encapsulation, it is in sea-gull wing that pin is drawn from encapsulation two sides, and material has two kinds of plastics and ceramics.

When carrying out product test at present, need to load SOP chip toward on the chip conversion seat plank for carrying SOP encapsulation.? It in engineering test, needs manually to open the lock of each chip conversion seat, then a SOP chip is installed, until all installations It finishes, then whether visual inspection installs as required, carries out product test after errorless.

However, there is a problem that when installing SOP chip following:

1, a chip conversion seat is opened, the operation mode working efficiency for installing a SOP chip is lower and more numerous It is trivial, it wastes time;

2, the color of SOP chip is Dark grey, and the color of chip conversion seat is black, and the color of the two is approximate, easily It causes neglected loading in installation process and accidentally fills.

Chinese patent (CN103811361A) describes a kind of intelligent card chip packaging system and packaging method, wherein envelope Assembling device includes pressure head, upper feeding machine in a slot dug in advance for intelligent card chip pressing to be mounted on card body Structure and intelligent care positioner, wherein upper feeding mechanism is single-stage cylinder, and pressure head is connected on the cylinder, smart card positioning Device is located at the lower section of upper feeding mechanism;In addition, should include lower feeding structure, which include motor and in motor Driving it is lower can vertical back and forth movement transmission mechanism, wherein transmission mechanism input terminal is connected to motor, output end with it is intelligent locking Position device connection.

The technical issues of above-mentioned patent is there is no in the presence of the solution prior art.

Summary of the invention

In view of the above problems, the present invention provides a kind of mold of quick load SOP chip, wherein the mold includes upper Several vertical rods are fixedly installed on lower layer's hard plate in layer hard plate and lower layer's hard plate, and the upper layer hard plate passes through one Snap-in structure is sheathed on the vertical rod;

Wherein, several through-holes identical with the SOP chip form are provided on the upper layer hard plate.

Above-mentioned mold, wherein the mold is applied to load SOP chip on SOP chip IC conversion seat.

Above-mentioned mold, wherein the SOP chip IC conversion seat is made of upper and lower two parts, wherein use upper part In the fixation SOP chip, lower part connecting PCB board circuit.

Above-mentioned mold, wherein the hardness of the upper layer hard plate is greater than the hardness of the SOP chip IC conversion seat.

Above-mentioned mold, wherein the SOP chip is SOP8 chip, and SOP8 chip both sides pin foot respectively has 4.

Above-mentioned mold, wherein the vertical rod is bolt, and the snap-in structure is nut.

Above-mentioned mold, wherein the color of the upper layer hard plate is white.

A method of SOP chip is loaded using upper mold, wherein

SOP chip IC conversion seat is placed on lower layer's hard plate, and wait load in the SOP chip IC conversion seat The position of SOP chip and the through-hole alignment;

And after unlocking the SOP chip IC conversion seat by snap-in structure described in clamping, SOP chip is installed to described On SOP chip IC conversion seat;

The snap-in structure is unclamped, the loading of the SOP chip is completed.

Above-mentioned method, wherein the through-hole corresponds at the SOP chip pin foot using hollow design.

Above-mentioned method, wherein the color that the through-hole corresponds to the SOP chip pin foot position is red.

By using above-mentioned loading mold, multiple chip conversion seats can be opened simultaneously, improve the efficiency of loading of chip; And in upper layer hard plate and through-hole pin foot position printing different colours, solve in this way identification chip whether correct placement and be The problem of no leakage is put, reduces error rate.

Detailed description of the invention

Fig. 1 is inventive die overall structure diagram;

Fig. 2 is the single through-hole schematic diagram of inventive die;

Fig. 3 is inventive die overall top view;

Fig. 4 is schematic diagram after the completion of inventive die chip.

Specific embodiment

At present when loading SOP chip, the operation mould of a SOP chip could be installed by needing to open a chip conversion seat Formula, and the color of SOP chip and the color of chip conversion seat are approximate, easily cause neglected loading in installation process and accidentally fill.For above-mentioned Problem, the present invention relates to the molds of a quick load SOP chip.

Main idea is that designing a mold with upper layer and lower layer structure, upper layer and lower layer plate can be used hard Several chip conversion seats are uniformly placed on lower layer's hard plate by scutum, and upper plate covers plate similar to chip conversion seat substrate, The position aperture of corresponding installation SOP chip, the shape in hole is identical as SOP, and upper and lower plates are connected by several vertical rods, these are vertical Bar is equipped with snap-in structure, and snap-in structure is pressed down against upper layer hard plate step by step, is squeezed by the place of the non-aperture of upper layer hard plate Pressure chip conversion seat achievees the purpose that unlocking.In order not to maloperation, upper layer hard plate is printed to the color of difference chip conversion seat, The discrimination different components that can be apparent in this way.

The invention will be further described with concrete operations embodiment with reference to the accompanying drawing.

A kind of mold of quick load SOP chip can be applied to load SOP chip on SOP chip IC conversion seat, such as scheme 1, shown in Fig. 2, Fig. 3, which includes two layers of hard plate, respectively upper layer hard plate 1 and lower layer's hard plate 2, in lower layer's hard Several vertical rods 4 is fixedly installed on plate 2, upper layer hard plate 1 is sheathed on vertical rod 4, for simplicity and meets reality Production needs, and 4 numbers of vertical rod in inventive die are preferably 4.

The pcb board for loading several SOP chip IC conversion seat (not shown)s is placed on lower layer's hard plate 2, for Actual production demand, the uniform SOP chip IC conversion seat of the placement fixed number of rule on the pcb board on lower layer's hard plate 2, on Layer hard plate 1 similar to SOP chip IC conversion seat covers plate, opens up through-hole 3 in the position of installation SOP chip, the shape of through-hole 3 with SOP chip is identical, and the quantity of through-hole 3 and position are consistent with SOP chip IC conversion seat.Upper layer hard plate 1 corresponds to SOP chip pin 5 position of foot uses hollow design, and by taking SOP8 chip as an example, each 4 of the chip both sides pin foot, on the correspondence both sides of through-hole, there are 4 The gap of a pin foot 5, and the width in gap is equal to the width of chip pin foot, convenient for the accurate placement of chip.

Since the color of SOP chip is Dark grey, the color of SOP chip IC conversion seat is black, by several SOP cores Piece is installed on SOP chip IC conversion seat, because color is approximate, is filled during installation it is easy to appear neglected loading or accidentally Problem.So for this problem, by the color of the one significant difference SOP chip IC conversion seat of surface printing of upper layer hard plate 1, such as White, but it is not limited only to white, as shown in figure 4, chip is put in leakage at label 6 in figure, can thus be clearly seen that.Upper The color that another sharp contrast is printed at the gap length that layer hard plate 1SOP chip pin foot is placed, indicates the peace of chip pin foot Put position.

SOP chip IC conversion seat is made of upper and lower two parts, and upper part is exactly fixed SOP chip, lower layer part Divide the circuit on connecting PCB board.In SOP chip IC conversion seat be achieve the purpose that unlocking by squeezing two lateral springs, then SOP chip is placed in SOP chip IC conversion seat corresponding position, so being respectively provided with a card on the vertical rod on lower layer's hard plate Structure (not shown) is closed, by snap-in structure by 1 clamping of upper layer hard plate to fixed place.The application preferably will Vertical rod is set as bolt, and snap-in structure is nut, and SOP chip IC conversion seat rule is arranged in lower layer's hard plate 2 in advance On, precession nut fixes SOP chip IC conversion seat by the clamping force between upper layer hard plate 1 and lower layer's hard plate 2.When need The installation of SOP chip is carried out, continues precession nut, the spring in SOP chip IC conversion seat is squeezed using upper layer hard plate 1 Achieve the purpose that unlocking, SOP chip is successively installed on SOP chip IC conversion seat at this time.When the hardness of upper layer hard plate is inadequate, It is that all SOP chip IC conversion seats can not be opened when pressure, so upper layer hard plate needs enough hardness depressing When all SOP chip IC conversion seats can be opened.

In another embodiment, the method for SOP chip being loaded according to above-mentioned mold, including following steps:

SOP chip IC is converted being placed on lower layer's hard plate for the uniform rule of SOP chip IC conversion seat by step S1 The through-hole alignment of the position of SOP chip to be installed and upper layer hard plate in seat;

Step S2 unlocks SOP chip IC conversion seat by clamping snap-in structure, on the SOP chip IC conversion seat of unlock Successively chip;

Step S3 unclamps snap-in structure, and all SOP chip IC conversion seats are locked, and completes the loading of SOP chip.

Since the color of SOP chip is Dark grey, the color of SOP chip IC conversion seat is black, the color of the two Approximation prevents neglected loading (as shown in Figure 4) during the installation process or accidentally fills, the hard plate on upper layer is painted and SOP chip IC The color of conversion seat color clear comparison, such as white.The size of the pin foot of SOP chip is very little, so in order to accurately pacify Dress is corresponded in through-hole using a hollow design at SOP chip pin foot, during the installation process in order not to occur accidentally filling, upper layer is hard Another color with SOP chip IC conversion seat color in sharp contrast is printed in the through-hole pin foot installation place of scutum, such as red.

It is not difficult to find that the present embodiment is based on the embodiment of the mold of above-mentioned quick load SOP chip, therefore above-mentioned fast The relevant technical details that the embodiment that quick-mounting carries the mold of SOP chip is mentioned are still effective in the present embodiment, in order to reduce It repeats, which is not described herein again.Correspondingly, the relevant technical details mentioned in present embodiment are also applicable in above-mentioned quick load In the embodiment of the mold of SOP chip.

By using above-mentioned loading mold, multiple chip conversion seats can be opened simultaneously, improve the efficiency of loading of chip; And in upper layer hard plate and through-hole pin foot position printing different colours, solve in this way identification chip whether correct placement and be The problem of no leakage is put, reduces error rate.

By description and accompanying drawings, the exemplary embodiments of the specific structure of specific embodiment are given, based on present invention essence Mind can also make other conversions.Although foregoing invention proposes existing preferred embodiment, however, these contents are not intended as Limitation.

For a person skilled in the art, after reading above description, various changes and modifications undoubtedly be will be evident. Therefore, appended claims should regard the whole variations and modifications for covering true intention and range of the invention as.It is weighing The range and content of any and all equivalences, are all considered as still belonging to the intent and scope of the invention within the scope of sharp claim.

Claims (8)

1. a kind of mold of quick load SOP chip, which is characterized in that the mold includes upper layer hard plate and lower layer's hard Plate, several vertical rods are fixedly installed on lower layer's hard plate, and the upper layer hard plate is sheathed on described by a snap-in structure On vertical rod;
Wherein, several through-holes identical with the SOP chip form are provided on the upper layer hard plate;Lower layer's hard plate On be provided with chip IC conversion seat;The color of chip IC conversion seat described in the colouring discrimination of the upper layer hard plate;
The mold is applied to load SOP chip on SOP chip IC conversion seat;
The hardness of the upper layer hard plate is greater than the hardness of the SOP chip IC conversion seat.
2. mold according to claim 1, which is characterized in that the SOP chip IC conversion seat is by upper and lower two part groups At, wherein upper part is for fixing the SOP chip, lower part connecting PCB board circuit.
3. mold according to claim 1, which is characterized in that the SOP chip is SOP8 chip, the SOP8 chip two Side pin foot respectively has 4.
4. mold according to claim 1, which is characterized in that the vertical rod is bolt, and the snap-in structure is nut.
5. mold according to claim 1, which is characterized in that the color of the upper layer hard plate is white.
6. a kind of method for loading SOP chip using mold as described in any one in claim 1-5, which is characterized in that
SOP chip IC conversion seat is placed on lower layer's hard plate, and SOP to be loaded in the SOP chip IC conversion seat The position of chip and the through-hole alignment;
And after unlocking the SOP chip IC conversion seat by snap-in structure described in clamping, SOP chip is installed to the SOP On chip IC conversion seat;
The snap-in structure is unclamped, the loading of the SOP chip is completed.
7. according to the method described in claim 6, it is characterized in that, the through-hole corresponds at the SOP chip pin foot using engraving Sky design.
8. the method according to the description of claim 7 is characterized in that the through-hole corresponds to the face of the SOP chip pin foot position Color is red.
CN201510003946.8A 2015-01-05 2015-01-05 A kind of mold of quick load SOP chip CN104576467B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510003946.8A CN104576467B (en) 2015-01-05 2015-01-05 A kind of mold of quick load SOP chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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CN104576467B true CN104576467B (en) 2019-02-15

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1198817A (en) * 1996-08-09 1998-11-11 株式会社爱德万测试 Semiconductor device testing apparatus
CN1309825A (en) * 1998-07-16 2001-08-22 昭英电机株式会社 IC socket
CN1588636A (en) * 2004-09-21 2005-03-02 威盛电子股份有限公司 Detecting clamp and its top cover
CN102236062A (en) * 2010-04-30 2011-11-09 英业达股份有限公司 Radiation module of laptop and insulation detecting method thereof
CN102451820A (en) * 2010-10-15 2012-05-16 王立民 Selecting method of electronic product

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2609179Y (en) * 2003-02-21 2004-03-31 陈恒懋 Improved structure of chip testing machine
CN1756465A (en) * 2004-09-28 2006-04-05 台湾暹劲股份有限公司 Device and method easy to put different specification size IC into test sheathing stand
CN101363873A (en) * 2007-08-08 2009-02-11 京元电子股份有限公司 Integrated circuit element test socket, socket substrate and test machine and method for making same
JP4550102B2 (en) * 2007-10-25 2010-09-22 スパンション エルエルシー Semiconductor package, manufacturing method thereof, and semiconductor device including semiconductor package
CN101384136B (en) * 2008-10-17 2014-04-02 林克治 Surface mounting process for flexible circuit board and used magnetic tool and steel mesh

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1198817A (en) * 1996-08-09 1998-11-11 株式会社爱德万测试 Semiconductor device testing apparatus
CN1309825A (en) * 1998-07-16 2001-08-22 昭英电机株式会社 IC socket
CN1588636A (en) * 2004-09-21 2005-03-02 威盛电子股份有限公司 Detecting clamp and its top cover
CN102236062A (en) * 2010-04-30 2011-11-09 英业达股份有限公司 Radiation module of laptop and insulation detecting method thereof
CN102451820A (en) * 2010-10-15 2012-05-16 王立民 Selecting method of electronic product

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