CN102233594B

CN102233594B - Cutter

Info

Publication number: CN102233594B
Application number: CN 201010172558
Authority: CN
Inventors: 黄俊钦; 朱青松; 黄明玉
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2010-05-07
Filing date: 2010-05-07
Publication date: 2013-12-25
Anticipated expiration: 2030-05-07
Also published as: CN102233594A

Abstract

The invention provides a cutter which is suitable for cutting work-pieces put on a photo-curing glue layer. The cutter comprises a main body, a cutting layer and light radiation material, wherein the cutting layer is configured on the surface of the main body and used for cutting the work-pieces; the light radiation material is arranged in the cutting layer or between the cutting layer and the main body and used for releasing light when the cutting layer cuts the work-pieces, so that the photo-curing glue layer close to a cutting path is cured by the light. The cutter provided by the invention can be used for lowering probability of reduction of cutting ability because viscous substances are adhered on the surface of the cutter.

Description

Cutter

Technical field

The present invention relates to a kind of cutter, and particularly relate to a kind of cutter that cutting is placed in the workpiece on the photocuring glue-line that is suitable for.

Background technology

In known tube core bonding process, the tube core after cutting utilizes the epoxy resin cement to be fixedly arranged on base plate for packaging.Yet along with die thickness and base plate for packaging more and more thinner, the epoxy resin cement is replaced by diaphragm type sticker (adhesive film).The diaphragm type cement has frivolous uniform characteristic, can improve the shortcoming such as the contingent tube core inclination of institute and the glue that overflows in known tube core bonding process.

Particularly, shape and the size adhesion coating identical with wafer can be pasted on to the back side of wafer, wherein wafer is milled in advance and has expection thickness, and afterwards, adhesion coating can be together cut with wafer.

When adhesion coating and wafer are together cut, the chip produced from adhesion coating easily is built-up in cutter, and the smear metal meeting is attached to the adhesion coating surface, therefore causes follow-up chip laminating not exclusively.

Summary of the invention

The invention provides a kind of cutter, can reduce that tool surface attaches stickum and the probability that causes cutting power to descend.

The present invention proposes a kind of cutter, is suitable for cutting and is placed in the workpiece on the photocuring glue-line.Cutter comprises main body, cutting lay and light radioactive material.Cutting lay is disposed at body surfaces, in order to cut workpiece.The light radioactive material is disposed in cutting lay or is disposed between cutting lay and main body, in order to discharge light when the cutting lay cut workpiece, to solidify the photocuring glue-line that is close to cutting path by light.

In an embodiment of the present invention, above-mentioned light radioactive material sends ultraviolet light.

In an embodiment of the present invention, above-mentioned light radioactive material comprises zinc-oxide nano coating.

In an embodiment of the present invention, above-mentioned light radioactive material separately comprises gold or platinum.

In an embodiment of the present invention, above-mentioned light radioactive material is disposed between main body and cutting lay.

In an embodiment of the present invention, above-mentioned cutting lay comprises diamond grains.

In an embodiment of the present invention, above-mentioned main body is discoid, and light radioactive material and cutting lay are disposed on the circumference of disk-shaped main body.

In an embodiment of the present invention, above-mentioned light radioactive material is doped in this cutting lay.

Based on above-mentioned, cutter of the present invention disposes the light radioactive material, and when the cutting lay of cutter is cut being placed in workpiece on the optic-solidified adhesive layer, the light that the photocuring glue-line of contiguous cutting path can be radiated by the light radioactive material solidifies.Thus, the stickum that can reduce the photocuring glue-line is built-up in the probability of cutter, to maintain the cutting power of cutter.

For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.

The accompanying drawing explanation

The schematic diagram of the cutter that Fig. 1 is the embodiment of the present invention.

The partial schematic diagram of the cutter cut workpiece that Fig. 2 A is Fig. 1.

The cutter that Fig. 2 B is Fig. 2 A is along the partial side view of visual angle A.

The making flow chart of the cutter that Fig. 3 A to Fig. 3 C is Fig. 1.

The schematic diagram of the cutter that Fig. 4 A is another embodiment of the present invention.

The schematic diagram of the cutter cut workpiece that Fig. 4 B is Fig. 4 A.

The making flow chart of the cutter that Fig. 5 A to Fig. 5 B is Fig. 4.

Description of reference numerals

50: photocurable layers

60: workpiece

70: bearing part

100,200: cutter

110,210: main body

120,220: cutting lay

140: the light radioactive material

230: the light radioactive material

A: visual angle

D: direction

L, L ': light

P: cutting path

The specific embodiment

The schematic diagram of the cutter that Fig. 1 is the embodiment of the present invention.Please refer to Fig. 1, the cutter 100 of the present embodiment comprises main body 110, cutting lay 120, light radioactive material 140.Cutting lay 120 is disposed at main body 110 surfaces, in order to cutting, is placed in the workpiece 60 on photocuring glue-line 50.Light radioactive material 140 is disposed between main body 110 and cutting lay 120, and light radioactive material 140 for example comprises nano-deposit.In certain embodiments, nano-deposit can separately comprise gold or platinum, improves thus the efficiency of nano-deposit emitting ultraviolet light.Photocuring glue-line 50 is for example to be disposed at bearing part 70 (being for example the adhesive tape (blue tape) be positioned on steel framework (not being shown in figure)) above, and workpiece 60 is for example wafer to be cut.In the present embodiment, the material of photocuring glue-line 50 is for example epoxy resin or other photo-curing materials.

The main body 110 of the present embodiment is for example discoid, and light radioactive material 140 and cutting lay 120 are disposed on the circumference of disk-shaped main body 110.In addition, cutting lay 120 for example is comprised of diamond grains, however the present invention not as limit, the material that cutting lay 120 also can be suitable by other in other embodiments forms.

The partial schematic diagram of the cutter cut workpiece that Fig. 2 A is Fig. 1.The cutter that Fig. 2 B is Fig. 2 A is along the partial side view of visual angle A.Please refer to Fig. 2 A and Fig. 2 B, cutter 100 can, along direction D fast rotational, be cut with 120 pairs of workpiece 60 of mat cutting lay.Be cut to state as shown in Fig. 2 B when workpiece 60 by cutter 100 and while making cutter 100 approach photocuring glue-line 50, the light L that light radioactive material 140 discharges can solidify the photocuring glue-line 50 of contiguous cutting path P.Thus, the stickum that can reduce photocuring glue-line 50 is built-up in the probability of the cutting lay 120 of cutter 100 in cutting process, to maintain the cutting power of cutter 100.

It should be noted that the material character of intensity, wavelength and the photocuring glue-line 50 of the state of cure of photocuring glue-line 50 and the light that solidification range discharges depending on light radioactive material 140.Therefore, visual demand is selected suitable photocuring glue-line 50 and light radioactive material 140, and the light that photocuring glue-line 50 is discharged by light radioactive material 140 has suitable state of cure and solidification range while irradiating.

Specifically, the included nano-deposit of the light radioactive material 140 of the present embodiment is for example Nano-class zinc oxide (ZnO) coating, its fermi level (Fermi level) is between 60meV, and its bandwidth (energy bandgap) is about between 3.3eV, therefore can under room temperature environment, radiate ultraviolet light, be for example the photocuring glue-line 50 of ultraviolet light polymerization glue-line in order to solidify.

Below pass through the preparation method of the cutter of Fig. 3 A to Fig. 3 C key diagram 1.

The making flow chart of the cutter that Fig. 3 A to Fig. 3 C is Fig. 1.Please refer to Fig. 3 A, at first, provide discoid main body 110.Then, please refer to Fig. 3 B, at main body 110 surface-coated zinc-oxide nano coating, as light radioactive material 140, for example see through electrochemical deposition (electrochemical deposition) technique.In certain embodiments, gold or platinum can be deposited on to main body 110 surfaces simultaneously and form gold-zinc oxide or platinum-zinc-oxide nano coating, in order to improve the ultraviolet light emission efficiency.Afterwards, please refer to Fig. 3 C, at main body 110 surface configuration cutting lays 120, make light radioactive material 140 between main body 110 and cutting lay 120, and complete the making of cutter 100.Referring to the thesis for the doctorate " with the characteristic research of electrochemical process depositing zinc oxide " of Du Huaifu, it is incorporated to this case as a reference at this.

The schematic diagram of the cutter that Fig. 4 A is another embodiment of the present invention.The schematic diagram of the cutter cut workpiece that Fig. 4 B is Fig. 4 A.Please refer to Fig. 4 A and Fig. 4 B, compared to Fig. 1, light radioactive material 140 is disposed between main body 110 and cutting lay 120, the light radioactive material 230 of the cutter 200 of the present embodiment is to be doped in cutting lay 220.When 220 pairs of workpiece 60 of the cutting lay that is disposed at main body 210 surfaces are cut, but light radioactive material 230 ray L ' are to solidify the photocuring glue-line 50 of contiguous Cutting Road, and the stickum that reduces photocuring glue-line 50 is built-up in the probability of cutting lay 220 in cutting process, to maintain the cutting power of cutter 200.Below pass through the preparation method of the cutter of Fig. 5 A to Fig. 5 C key diagram 4.

The making flow chart of the cutter that Fig. 5 A to Fig. 5 B is Fig. 4.Please refer to Fig. 5 A, at first, provide discoid main body 210.Then, please refer to Fig. 5 B, form cutting lay 220 on the circumference of disk-shaped main body 210, and when forming cutting lay 220, at the interior doping light of cutting lay 220 radioactive material 230.Wherein, light radioactive material 230 is doped in to the method for cutting lay 220, for example, for when the cutting particles that will form cutting lay 220 is coated main body 210 surfaces, see through electrochemical deposition (electrochemical deposition) technique light radioactive material 230 (for example zinc-oxide nano coating) is coated between cutting particles.Described cutting particles is for example diamond grains.

In sum, cutter of the present invention disposes the light radioactive material, and when the cutting lay of cutter is cut being placed in workpiece on the optic-solidified adhesive layer, the light that the photocuring glue-line of contiguous cutting path can be radiated by the light radioactive material solidifies.Thus, the stickum that can reduce the photocuring glue-line is built-up in the probability of cutter, to maintain the cutting power of cutter.In addition, can adulterate gold or platinum in the nano-deposit of light radioactive material, to improve the beamy efficiency of light radioactive material.

Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; those of ordinary skill in technical field under any; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention defines and is as the criterion when looking appended claim.

Claims

1. a cutter, be suitable for cutting and be placed in the workpiece on the photocuring glue-line, and this cutter comprises main body, and cutting lay, and this cutting lay is disposed at this body surfaces, in order to cut this workpiece, it is characterized in that, this cutter comprises:

The light radioactive material, be disposed in this cutting lay or be disposed between this cutting lay and this main body, in order to discharge light when this cutting lay cuts this workpiece, to solidify this photocuring glue-line of contiguous cutting path by this light.

2. cutter as claimed in claim 1, wherein this light radioactive material sends ultraviolet light.

3. cutter as claimed in claim 1, wherein this light radioactive material comprises zinc-oxide nano coating.

4. cutter as claimed in claim 3, wherein this light radioactive material separately comprises gold or platinum.

5. cutter as claimed in claim 1, wherein this light radioactive material is disposed between this main body and this cutting lay.

6. cutter as claimed in claim 1, wherein this cutting lay comprises diamond grains.

7. cutter as claimed in claim 1, wherein this main body is discoid, and this light radioactive material and this cutting lay are disposed on the circumference of this disk-shaped main body.

8. cutter as claimed in claim 7, wherein this light radioactive material is doped in this cutting lay.