CN102230168A - Film deposition device - Google Patents
Film deposition device Download PDFInfo
- Publication number
- CN102230168A CN102230168A CN2011101687262A CN201110168726A CN102230168A CN 102230168 A CN102230168 A CN 102230168A CN 2011101687262 A CN2011101687262 A CN 2011101687262A CN 201110168726 A CN201110168726 A CN 201110168726A CN 102230168 A CN102230168 A CN 102230168A
- Authority
- CN
- China
- Prior art keywords
- piggybacking
- dish
- driver module
- film deposition
- deposition apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
The invention discloses a film deposition device mainly comprising a main bearing plate, at least one satellite bearing plate, a first driving module and at least one second driving module, wherein the satellite bearing plate is arranged on the main bearing plate and can be used for bearing one or more wafers. The first driving module is used for driving the main bearing plate to rotate in a direct or indirect way; and the second driving module can be in contact with one or partial satellite bearing plate on the main bearing plate and drive the satellite bearing plate in contact with the second driving module to rotate while the main bearing plate rotates.
Description
Technical field
The present invention relates to a kind of film deposition apparatus, mainly in main carrier rotating process, the Piggybacking dish that drives contact with it by second driver module carries out rotation.
Background technology
Thin film deposition (Thin Film Deposition) mainly is meant on the surface of various metallic substance, superhard alloy, stupalith and wafer (Wafer) substrate, the technology of growth one deck homogeneity or dissimilar materials film, and can be applicable to the surface treatment of ornament, tableware, cutter, instrument, mould and semiconductor element etc., in the hope of obtaining characteristic such as wear-resisting, heat-resisting and anti-corrosion attractive in appearance.
Thin film deposition can be according to the mechanism that whether contains chemical reaction in the deposition process, and divide into physical vapor deposition (Physical Vapor Deposition, be called for short PVD, be commonly referred to physical vapor deposition) and chemical vapour deposition (Chemical Vapor Deposition, be called for short CVD, be commonly referred to chemical vapor deposition).
Metal organic chemical vapor deposition (Metal-Organic Chemical Vapor Deposition, be called for short MOCVD), its principle is that process gas is sent in the cavity that wafer is housed, the carrier (susceptor) of wafer below can be by specific type of heating (high frequency induction or resistance), the gas that wafer is reached near wafer heats, because of high temperature triggers single or multiple gases generation chemical reaction, and then reactant (being generally gas) is converted to a kind of film deposition techniques that solid-state resultant is deposited on crystal column surface.
MOCVD can be in order to form semiconductor element, and the quality of its technology depends on the factors such as mode of stability, temperature controlling and the importing reactant gases of reaction chamber (reactor) interior flow field, and each parameter is great for the influence of sedimental homogeneity (uniformity).
See also Fig. 1, be the organigram of existing film deposition apparatus.Film deposition apparatus 10 includes a reaction chamber 11, a carrier 13 and a driver module 15, and includes an inlet mouth 111 and a venting port 113, and carrier 13 then is arranged at reaction chamber 11 inside.
One process gas 12 imports reaction chamber 11 by inlet mouth 111, and reacted waste gas is derived by venting port 113.Main carrier 13 tops are provided with Piggybacking dish 14, and main carrier 13 is connected with driver module 15, drive main carrier 13 by driver module 15 and rotate; The single one or more wafers 16 of Piggybacking dish 14 carryings also carry out rotation.Existing film deposition apparatus only provides whole Piggybacking dishes while rotation functions usually or closes rotation function simultaneously, and the function that drives the particular satellite carrier is not provided.
Summary of the invention
A purpose of the present invention, be to provide a kind of film deposition apparatus, when wherein first driver module drives main carrier, Piggybacking dish and/or wafer rotation, second driver module will contact or part Piggybacking dish on the main carrier, and drive with the Piggybacking dish that contacts carry out rotation.
Another purpose of the present invention, be to provide a kind of film deposition apparatus, wherein second driver module is provided with the position than the venting port near reaction chamber, and can carry out rotation in order to the one or more Piggybacking dishes that drive near venting port, remaining Piggybacking dish is kept not autorotation, by this avoiding influencing the flow field uniformity of reaction chamber, and help improving the quality of thin film deposition.
Another purpose of the present invention, be to provide a kind of film deposition apparatus, wherein the material hardness of second driver module is less than the Piggybacking dish, can avoid second driver module structure to the Piggybacking dish in driving Piggybacking dish rotating process to cause damage, and help increasing the work-ing life of film deposition apparatus.
Another purpose of the present invention, be to provide a kind of film deposition apparatus, frictional rotation (rotate by friction), collision retraction (rebound by collision) or low-angle rotation displacement (angular displacement) will be carried out when wherein second driver module contacts with the Piggybacking dish, the work-ing life of second driver module and/or Piggybacking dish can be effectively increased by this.
For achieving the above object, the invention provides a kind of film deposition apparatus, include: a main carrier; One or more Piggybacking dishes are arranged on the main carrier, and each Piggybacking dish is in order to carry one or more wafers; One first driver module rotates in order to the main carrier of direct or indirect driving; And at least one second driver module, when main carrier rotated, second driver module will contact one or part Piggybacking dish, and the Piggybacking dish that driving is touched carries out rotation.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the organigram of existing film deposition apparatus;
Fig. 2 is the organigram of film deposition apparatus one embodiment of the present invention;
Fig. 3 is the structure decomposing schematic representation of film deposition apparatus one embodiment of the present invention;
Fig. 4 A and Fig. 4 B are respectively the enlarged diagram of the section construction of film deposition apparatus of the present invention;
Fig. 5 is the organigram of the another embodiment of film deposition apparatus of the present invention;
Fig. 6 is the organigram of the another embodiment of film deposition apparatus of the present invention;
Fig. 7 is the organigram of the another embodiment of film deposition apparatus of the present invention; And
Fig. 8 is the organigram of the another embodiment of film deposition apparatus of the present invention.
Wherein, Reference numeral
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and principle of work are done concrete description:
See also Fig. 2 and Fig. 3, be respectively organigram and the structure decomposing schematic representation of film deposition apparatus one embodiment of the present invention.As shown in the figure, film deposition apparatus 20 mainly includes a main carrier (susceptor) 21, one or more Piggybacking dish (satellite wafer holder) 23,1 first driver module 25 and at least one second driver module 27, wherein Piggybacking dish 23 is arranged on the main carrier 21, and each Piggybacking dish 23 all can be in order to carry one or more wafers 22.
When main carrier 21 drive Piggybacking dishes 23 rotate (revolution), second driver module 27 will contact with one or part Piggybacking dish 23 in regular turn, and can drive the Piggybacking dish 23 that contacts with second driver module 27 and rotate (rotation) by the friction effect between second driver module 27 and Piggybacking dish 23.In addition, be placed with one or more wafers 22 on the Piggybacking dish 23, also can drive wafer 22 rotations when Piggybacking dish 23 carries out time rotational.
Described second driver module 27 of the embodiment of the invention is the plectrum shape, shown in Fig. 3, Fig. 4 A and Fig. 4 B, and the edge that the close main carrier 21 in position is set of second driver module 27.Low-angle rotation displacement (angular displacement) will be carried out when second driver module 27 contacts with Piggybacking dish 23, and original position will be replied at back second driver module 27 that Piggybacking dish 23 passes through.For example can make second driver module 27 in the original position of back answer of carrying out low-angle rotation displacement by a motivating force, in addition, after second driver module 27 is passing through wearing and tearing or knock-on displacement, also can second driver module 27 be returned to and Piggybacking dish 23 state of contact by this motivating force, second driver module 27 rotates sustainable driving Piggybacking dish 23 by this, and wherein this motivating force can provide by gas promotion, gravity, elastic force or motor.Not only can drive Piggybacking dish 23 rotations of contact by this by second driver module 27, impact strength in the time of also can effectively slowing down second driver module 27 and contact, and can effectively prolong the work-ing life of second driver module 27 and Piggybacking dish 23 with Piggybacking dish 23.
In addition, the material hardness of second driver module 27 can be less than Piggybacking dish 23, through after the contacting repeatedly, has only second driver module 27 can produce wearing and tearing at second driver module 27 and Piggybacking dish 23, and can keep structure complete of Piggybacking dish 23.After use after a while, the user only needs to change second driver module 27, and does not need to change Piggybacking dish 23 and/or main carrier 21, can effectively reduce the maintenance cost of film deposition apparatus 20 by this.When practical application, also the material with deformation behavior can be coated on the outside of second driver module 27, for example rubber more can further be avoided the wearing and tearing of Piggybacking dish 23.
In an embodiment of the present invention, main carrier 21 includes a pedestal 211 and a cover plate 213, and the pedestal 211 of main carrier 21 and cover plate 213 are provided with the opening 215 of equal amts, and Piggybacking dish 23 can be arranged in the opening 215 of pedestal 211 and cover plate 213.When cover plate 213 is arranged on the pedestal 211, will have an interval 212 (please refer to Fig. 2) between the two, make second driver module 27 can stretch in the interval 212 and and contact with Piggybacking dish 23, rotate to drive Piggybacking dish 23 by this.
Also can be provided with one or more heating units 217 in the pedestal 211 of main carrier 21, for example heating unit 217 can be arranged in the opening 215 of pedestal 211, when Piggybacking dish 23 is placed in the opening 215 of pedestal 211, heating unit 217 in the pedestal 211 will be positioned at Piggybacking dish 23 belows, and can heat by 217 pairs of Piggybacking dishes 23 of heating unit.
See also Fig. 5, be the organigram of the another embodiment of film deposition apparatus of the present invention.As shown in the figure, film deposition apparatus 30 includes a reaction chamber 39, one main carrier 21, one or more Piggybacking dish 23, one first driver module 25 and one second driver module 27, and wherein main carrier 21, Piggybacking dish 23, part first driver module 25 and second driver module 27 all are arranged at reaction chamber 31 inside.
The main carrier 21 that first driver module 25 can directly or indirectly drive in the reaction chamber 39 rotates, and main carrier 21 can drive Piggybacking dish 23 when rotating and wafer 22 rotates.In main carrier 21 rotating process, second driver module 27 will contact with one or part Piggybacking dish 23 in regular turn, and drive with the Piggybacking dish that contacts 23 carry out rotation.
In the present invention's one actual example, second driver module 27 the position is set near venting port 393, and carrying out rotation (rotation) in order to the one or more Piggybacking dishes 23 that drive near venting port 393,23 on the Piggybacking dish that all the other do not contact with second driver module 27 can not be driven.Therefore, the present invention can provide the function that drives the rotation of particular satellite carrier, by this to avoid influencing the flow field uniformity of reaction chamber 39.
In addition, in the process of film deposition apparatus 30 running, second driver module 27 will contact with each Piggybacking dish 23, may cause the wearing and tearing of second driver module 27 and/or Piggybacking dish 23 and produce dust in the process that both contact.Because the venting port 393 of second driver module, 27 close reaction chambers 39, the dust that makes second driver module 27 and/or Piggybacking dish 23 produce because of wearing and tearing can directly be discharged by venting port 393, has influenced the depositing of thin film quality on the wafer 22 to avoid dust to remain in the reaction chamber 39.
See also Fig. 6, be the organigram of the another embodiment of film deposition apparatus of the present invention.As shown in the figure, as shown in the figure, film deposition apparatus 40 mainly includes a main carrier (susceptor) 21, one or more Piggybacking dish (satellite wafer holder) 23,1 first driver module 25 and at least one second driver module 47, wherein Piggybacking dish 23 is arranged on the main carrier 21, and each Piggybacking dish 23 all can be in order to carry one or more wafers 22.
Second driver module 47 is discoid in embodiments of the present invention, and will carry out frictional rotation (rotate by friction) or collision retraction (rebound by collision) when second driver module 47 contacts with Piggybacking dish 23.Not only can drive Piggybacking dish 23 rotations of contact by this by second driver module 47, also can effectively slow down second driver module 47 and when contacting, impact power, and then can prolong the work-ing life of second driver module 47 and Piggybacking dish 23 with Piggybacking dish 23.
See also Fig. 7 and Fig. 8, be respectively the organigram of the another embodiment of film deposition apparatus of the present invention.As shown in the figure, the axle center that the close main carrier 21 in position is set of this second driver module 27/47, and second driver module 27/47 can drive Piggybacking dish 23 by main carrier 21 tops.Second driver module 27 can be the plectrum shape, and as shown in Figure 7, second driver module 47 also can be discoid, as shown in Figure 8.When the main carrier 21 of first driver module, 25 drives rotated, second driver module 27/47 will contact the part of Piggybacking dish 23 towards main carrier 21 axle center, and drive Piggybacking dish 23 rotates.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1. a film deposition apparatus is characterized in that, includes:
One main carrier;
One or more Piggybacking dishes are arranged on this main carrier, and each Piggybacking dish is in order to carry one or more wafers;
One first driver module rotates in order to this main carrier of direct or indirect driving; And
At least one second driver module, when this main carrier rotated, this second driver module will contact one or part Piggybacking dish, and the Piggybacking dish that driving is touched carries out rotation.
2. film deposition apparatus according to claim 1 is characterized in that, the axle center that close this main carrier in position is set of this second driver module.
3. film deposition apparatus according to claim 2 is characterized in that, this second driver module drives this Piggybacking dish by this main carrier top.
4. film deposition apparatus according to claim 1 is characterized in that, this second driver module is discoid, and this second driver module can carry out frictional rotation or collision retraction when contacting with this Piggybacking dish.
5. film deposition apparatus according to claim 1, it is characterized in that, this second driver module is the plectrum shape, and this second driver module will carry out low-angle rotation displacement when contacting with this Piggybacking dish, and in this Piggybacking dish by after reply original position.
6. film deposition apparatus according to claim 1 is characterized in that, the material hardness of this second driver module is less than this Piggybacking dish.
7. film deposition apparatus according to claim 1 is characterized in that, the edge that close this main carrier in position is set of this second driver module.
8. film deposition apparatus according to claim 1, it is characterized in that, also include a reaction chamber, this reaction chamber includes an inlet mouth and a venting port, and process gas imported by this inlet mouth, reacted waste gas is derived by this venting port, and wherein when this main carrier rotated, one or more these Piggybacking dishes that this second driver module will drive near this venting port carried out rotation.
9. film deposition apparatus according to claim 8 is characterized in that, this second driver module the position is set near this venting port.
10. film deposition apparatus according to claim 1 is characterized in that, this main carrier is provided with a plurality of openings, and this Piggybacking dish is arranged on the opening of this main carrier.
11. film deposition apparatus according to claim 10 is characterized in that, also comprises one or more heating units, and this heating unit is positioned at this Piggybacking dish below, and with this heating unit to this Piggybacking dish heating.
12. film deposition apparatus according to claim 1, it is characterized in that, this main carrier includes a pedestal and a cover plate, this pedestal and this cover plate are provided with the opening of equal amts, and this Piggybacking dish is arranged in the opening of this pedestal and this cover plate, when this cover plate is arranged on this pedestal, will have one between the two at interval, and this second driver module contacts with this Piggybacking dish at interval via this, and drives this Piggybacking dish rotation.
13. film deposition apparatus according to claim 1 is characterized in that, after wearing and tearing of this second driver module or knock-on displacement, by a motivating force with the location restore of this second driver module to this Piggybacking dish state of contact.
14. film deposition apparatus according to claim 13 is characterized in that, this motivating force is for to drive by gas promotion, gravity, elastic force or motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101687262A CN102230168A (en) | 2011-06-17 | 2011-06-17 | Film deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101687262A CN102230168A (en) | 2011-06-17 | 2011-06-17 | Film deposition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102230168A true CN102230168A (en) | 2011-11-02 |
Family
ID=44842768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101687262A Pending CN102230168A (en) | 2011-06-17 | 2011-06-17 | Film deposition device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102230168A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690159A (en) * | 2018-07-04 | 2020-01-14 | 环球晶圆股份有限公司 | Manufacturing equipment and wafer bearing disc thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6203619B1 (en) * | 1998-10-26 | 2001-03-20 | Symetrix Corporation | Multiple station apparatus for liquid source fabrication of thin films |
| WO2004030063A1 (en) * | 2002-09-24 | 2004-04-08 | Tokyo Electron Limited | Substrate processing apparatus |
| CN1865495A (en) * | 2005-05-20 | 2006-11-22 | 中国科学院半导体研究所 | Revolution and rotation arrangement in reaction chamber of metallorganics chemical vapor deposition device |
| CN102199761A (en) * | 2011-05-10 | 2011-09-28 | 绿种子能源科技股份有限公司 | Thin film deposition apparatus |
-
2011
- 2011-06-17 CN CN2011101687262A patent/CN102230168A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6203619B1 (en) * | 1998-10-26 | 2001-03-20 | Symetrix Corporation | Multiple station apparatus for liquid source fabrication of thin films |
| WO2004030063A1 (en) * | 2002-09-24 | 2004-04-08 | Tokyo Electron Limited | Substrate processing apparatus |
| CN1865495A (en) * | 2005-05-20 | 2006-11-22 | 中国科学院半导体研究所 | Revolution and rotation arrangement in reaction chamber of metallorganics chemical vapor deposition device |
| CN102199761A (en) * | 2011-05-10 | 2011-09-28 | 绿种子能源科技股份有限公司 | Thin film deposition apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110690159A (en) * | 2018-07-04 | 2020-01-14 | 环球晶圆股份有限公司 | Manufacturing equipment and wafer bearing disc thereof |
| CN110690159B (en) * | 2018-07-04 | 2021-11-23 | 环球晶圆股份有限公司 | Manufacturing equipment and wafer bearing disc thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106133873B (en) | Afer rotates in semiconductor chamber | |
| KR100895913B1 (en) | Method and apparatus for treating a surface of at least one substrate | |
| CN101298656B (en) | Preparation of high-hardness diamond-like multi-layer film | |
| KR101292399B1 (en) | Atomic layer deposition apparatus having susceptor capable of rotation and revolution | |
| TW200613577A (en) | Vacuum treatment device and method for producing optical disk | |
| KR20080035695A (en) | Batch deposition tool and compressed boat | |
| JP2014125651A (en) | Inline-type plasma CVD apparatus | |
| TW200632881A (en) | Sputtering apparatus and film deposition method | |
| KR20100003536A (en) | Atomic layer deposition apparatus | |
| CN102230168A (en) | Film deposition device | |
| JPWO2007148536A1 (en) | Film forming apparatus and film forming method | |
| JP2007210875A (en) | Vapor phase deposition apparatus and vapor phase deposition method | |
| KR20130061802A (en) | Deposition apparatus equipped with a rotating susceptor pocket | |
| US8614012B2 (en) | Coated article and method for making same | |
| CN102899719A (en) | Thin-film deposition system | |
| CN102766850A (en) | Film deposition device | |
| CN102828170A (en) | Rotation system for thin film formation and method thereof | |
| CN108070841A (en) | Continuous coating system and method | |
| TW201300553A (en) | Thin film deposition apparatus | |
| JP2002280441A (en) | Film-forming device | |
| CN103614708B (en) | A kind of graphite boat of gradual change type spacing | |
| JP5923276B2 (en) | Surface coating method and apparatus | |
| KR20160146365A (en) | Atomic layer deposition apparatus | |
| KR20120001661U (en) | Susceptor and Atomic Layer Deposition Apparatus Having the Same | |
| JP5692373B2 (en) | Film forming apparatus and film forming method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111102 |