CN102229245B - Photocuring rapid forming method adopting variable light spot process - Google Patents
Photocuring rapid forming method adopting variable light spot process Download PDFInfo
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- CN102229245B CN102229245B CN 201110107639 CN201110107639A CN102229245B CN 102229245 B CN102229245 B CN 102229245B CN 201110107639 CN201110107639 CN 201110107639 CN 201110107639 A CN201110107639 A CN 201110107639A CN 102229245 B CN102229245 B CN 102229245B
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Abstract
The invention relates to a photocuring rapid forming method adopting a variable light spot process, which comprises the following steps of: firstly, drawing a three-dimensional entity graph in a computer to obtain information of each section layer of a part entity; then controlling a mesh plate to lift and descend in a resin groove, so that a layer of resin is formed on the surface of the mesh plate; sequentially supporting a part, filling the part entity and scanning a profile of the part entity; descending the mesh plate; forming a new liquid resin layer on the surface of a cured layer; controlling a scanning vibration mirror to complete scanning a two-dimensional section graph of the part entity by an internal command so as to form a new cured layer; adhering the new cured layer to the cured layer; repeatedly scanning and curing until a model is totally formed; and finally lifting the mesh plate out of the resin groove, taking out a formed part and cleaning liquid resin on the surface of the formed part to obtain a rapid formed part. On the basis of original photocuring rapid forming equipment and on the premise of ensuring the accuracy and the mechanical property of the part, the photocuring rapid forming efficiency is improved by the variable light spot process, meanwhile, the product cost is saved.
Description
Technical field
The present invention relates to a kind of light-curing quick moulding method, be specifically related to a kind of light-curing quick moulding method that becomes light spot process that uses.
Background technology
Photocureable rapid shaping is as raw material take photosensitive resin, track while scan by the computer control Ultra-Violet Laser makes it solidify the accumulation moulding, laser instrument sends light beam makes the light beam vertical irradiation to operating fluid level through dynamic focusing mirror and scanning galvanometer, and it is the most concentrated to make the hot spot that arrives operating fluid level just in time be in its energy of focus place of dynamic focusing mirror, size is minimum, thereby makes part to guarantee the precision of profiled member with the hot spot at focus place.
Shaping efficiency is people's problems of concern always, and ultraviolet curing process is the principal element that affects efficient.In the process of photocuring rapid prototyping, 2 scanning processes of general existence: driving phase and entity stage, the shaping of part is mainly finished in the entity stage, the scanning of every one deck is divided into filling sweep phase and profile scan stage successively according to cad data file again in the entity stage, in order to guarantee the precision of product, existing technique adopts single small size hot spot to make part usually, thereby so just can not excessively cause finishing the round scanning of entity filling scanning needs many times so that fill spacing, so that product efficient is affected, and because the power density of hot spot can not be too high, otherwise can cause the overcuring phenomenon, hot spot power can not be too high in the certain situation of spot size, so high-power laser power can not be used to greatest extent.
Summary of the invention
In order to overcome the shortcoming of above-mentioned prior art, the object of the present invention is to provide a kind of light-curing quick moulding method that becomes light spot process that uses, take original light-curing rapid forming equipment as the basis, under the prerequisite that guarantees part accuracy and product mechanical property, improve the efficient of photocureable rapid shaping by becoming light spot process, saved simultaneously product cost.
In order to achieve the above object, the present invention takes following technical solution:
A kind of light-curing quick moulding method that becomes light spot process that uses comprises the following steps:
1) drawing three-dimensional solid pattern in computer at first carries out layering by software to 3D solid and processes, and obtains each cross-sectional layers information of material object parts;
2) lowering or hoisting gear of control in the formation system drives web plate lifting in resin storage tank, makes the web plate surface form the resin of thickness of one deck 0.05mm～o.20mm;
3) part is supported scanning, the UV laser instrument sends light beam, also pass through scanning galvanometer so that beam deflection vertically is mapped to operating fluid level by the dynamic focusing mirror, light beam is through scanning galvanometer and do the planar point scanning motion under the control of motion integrated circuit board, thereby makes resin solidification finish the support scanning of part;
4) according to each cross-sectional layers information of material object parts material object parts is filled scanning, adjust the focusing mode of dynamic focusing mirror by motion control card, make the hot spot that arrives operating fluid level realize that out of focus obtains large spot, its spot diameter is 2～6 times of original diameter, regulate simultaneously the parameter of laser instrument by built-in command, make laser power be increased to original 2～3 times, carry out material object parts with the large spot pattern and fill scanning;
5) according to each cross-sectional layers information of material object parts to the material object parts profile scan, by maneuvering board card control dynamic focusing mirror so that its focal plane overlap with operating fluid level, obtain the small light spot that diameter is 0.10～0.15mm at operating fluid level, and regulate simultaneously laser power and get back to initial value, carry out the material object parts profile scan with the small light spot pattern, thereby form a cured layer;
6) make web plate under the drive of lowering or hoisting gear, the distance of the bed thickness that descends forms the new liquid resin layer of one deck on cured layer surface, and guarantees new liquid resin layer surfacing with screeding device;
7) built-in command gated sweep galvanometer is finished the scanning of the two-dimensional section figure of material object parts, and namely material object parts is filled scanning and material object parts profile scan, forms the new cured layer of one deck, with cured layer is bonding;
8) repeat above-mentioned steps 4)～step 7), until the complete moulding of model;
9) lowering or hoisting gear drives web plate emersion resin storage tank, takes out profiled member and clean surface liquid resin, can obtain Quick formed part.
Because the present invention adopts different hot spots and different capacity to scan in the different production phases of part, under the prerequisite of guaranteeing element precision and mechanical property, has effectively improved the shaping efficiency of part.
Description of drawings
Fig. 1 is the schematic diagram of laser beam of the present invention when focus state.
Fig. 2 is the schematic diagram of laser beam of the present invention when out-of-focus appearance.
The specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
A kind of light-curing quick moulding method that becomes light spot process that uses comprises the following steps:
1) drawing three-dimensional solid pattern in computer at first carries out layering by software to 3D solid and processes, and obtains each cross-sectional layers information of material object parts;
2) with reference to Fig. 1, the lowering or hoisting gear of control in the formation system drives web plate 4 lifting in resin storage tank 5, makes web plate 4 surfaces form the resin of thickness of one deck 0.05mm～o.20mm;
3) with reference to Fig. 1, part is supported scanning, the UV laser instrument sends light beam, also pass through scanning galvanometer 2 so that beam deflection vertically is mapped to operating fluid level 3 by dynamic focusing mirror 1, scanning galvanometer 2 is done the planar point scanning motion of X-Y direction under the control of motion integrated circuit board, thereby makes resin solidification finish the support scanning of part;
4) with reference to Fig. 2, each cross-sectional layers information according to material object parts is filled scanning to material object parts, adjust the focusing mode of dynamic focusing mirror 1 by motion control card, thereby the elongated hot spot that arrives operating fluid level 3 that makes of the focal length that makes dynamic focusing mirror 1 realizes that out of focus obtains large spot, its spot diameter is 2～6 times of original diameter, regulate simultaneously the parameter of laser instrument by built-in command, make laser power be increased to original 2～3 times, carry out material object parts with the high-power pattern of large spot and fill scanning;
5) with reference to Fig. 1, according to each cross-sectional layers information of material object parts to the material object parts profile scan, by maneuvering board card control dynamic focusing mirror 1 so that its focal plane overlap with operating fluid level, make hot spot again focus on operating fluid level and obtain the small light spot that diameter is 0.10～0.15mm, and regulate simultaneously laser power and get back to initial value, carry out the material object parts profile scan with the small light spot pattern, thereby form a cured layer;
6) make web plate 4 under the drive of lowering or hoisting gear, the distance of the bed thickness that descends forms the new liquid resin layer of one deck on cured layer surface, and guarantees new liquid resin layer surfacing with screeding device;
7) built-in command gated sweep galvanometer 2 is finished the scanning of the two-dimensional section figure of material object parts, and namely material object parts is filled scanning and material object parts profile scan, forms the new cured layer of one deck, with cured layer is bonding;
8) repeat above-mentioned steps 4)～step 7), until the complete moulding of model;
9) with reference to Fig. 2, lowering or hoisting gear drives web plate 4 emersion resin storage tanks 5, takes out profiled member and clean surface liquid resin, can obtain Quick formed part.
Essence of the present invention is to become light spot process, and by built-in command control dynamic focusing mirror and laser power, material object parts fills the sweep phase spot diameter and laser power increases, thereby has improved shaping efficiency under the prerequisite that guarantees part quality; The material object parts profile scan stage still adopts the small light spot making pattern to guarantee the precision of part.
Claims (1)
1. one kind is used the light-curing quick moulding method that becomes light spot process, it is characterized in that, comprises the following steps:
1) drawing three-dimensional solid pattern in computer at first carries out layering by software to 3D solid and processes, and obtains each cross-sectional layers information of material object parts;
2) lowering or hoisting gear in the control formation system drives web plate lifting in resin storage tank, makes the web plate surface form the resin of one deck 0.05mm～0.20mm thickness;
3) part is supported scanning, the UV laser instrument sends light beam, also pass through scanning galvanometer so that beam deflection vertically is mapped to operating fluid level by the dynamic focusing mirror, light beam is through scanning galvanometer and do the planar point scanning motion under the control of motion integrated circuit board, thereby makes resin solidification finish the support scanning of part;
4) according to each cross-sectional layers information of material object parts material object parts is filled scanning, adjust the focusing mode of dynamic focusing mirror by motion control card, make the hot spot that arrives operating fluid level realize that out of focus obtains large spot, its spot diameter is 2～6 times of original diameter, regulate simultaneously the parameter of laser instrument by built-in command, making laser power is original 2～3 times, carries out material object parts with the large spot pattern and fills scanning;
5) according to each cross-sectional layers information of material object parts to the material object parts profile scan, by maneuvering board card control dynamic focusing mirror so that its focal plane overlap with operating fluid level, obtain the small light spot that diameter is 0.10～0.15mm at operating fluid level, and regulate simultaneously laser power and get back to initial value, carry out the material object parts profile scan with the small light spot pattern, thereby form a cured layer;
6) make web plate under the drive of lowering or hoisting gear, the distance of the bed thickness that descends forms the new liquid resin layer of one deck on cured layer surface, and guarantees new liquid resin layer surfacing with screeding device;
7) built-in command gated sweep galvanometer is finished the scanning of the two-dimensional section figure of material object parts, and namely material object parts is filled scanning and material object parts profile scan, forms the new cured layer of one deck, with cured layer is bonding;
8) repeat above-mentioned steps 4)～step 7), until the complete moulding of model;
9) lowering or hoisting gear drives web plate emersion resin storage tank, takes out profiled member and clean surface liquid resin, can obtain Quick formed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110107639 CN102229245B (en) | 2011-04-27 | 2011-04-27 | Photocuring rapid forming method adopting variable light spot process |
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| CN 201110107639 CN102229245B (en) | 2011-04-27 | 2011-04-27 | Photocuring rapid forming method adopting variable light spot process |
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| CN102229245A CN102229245A (en) | 2011-11-02 |
| CN102229245B true CN102229245B (en) | 2013-04-17 |
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Families Citing this family (16)
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|---|---|---|---|---|
| CN102517423B (en) * | 2011-12-29 | 2013-07-17 | 江苏大学 | Reinforcement method for small hole |
| CN102785027A (en) * | 2012-08-28 | 2012-11-21 | 西安科技大学 | Rapid forming method using sugar-based material as raw material |
| CN103231056B (en) * | 2013-05-13 | 2015-05-27 | 苏州大学 | Direct laser forming method for unequal-width member |
| CN103567441A (en) * | 2013-10-25 | 2014-02-12 | 招銮 | Laser powder sintering method for 3D printer |
| CN103639411B (en) * | 2013-12-25 | 2015-05-27 | 湖南华曙高科技有限责任公司 | Scanning method for manufacturing three-dimensional object layer by layer |
| CN103786346B (en) * | 2014-02-27 | 2016-04-27 | 西安交通大学 | A kind of zoomable face exposure projections 3D prints rapid prototyping system and method |
| CN104742376A (en) * | 2015-04-09 | 2015-07-01 | 深圳长朗三维科技有限公司 | Laser linear array type 3D printing equipment and molding method thereof |
| CN104924616A (en) * | 2015-06-12 | 2015-09-23 | 深圳市深思客科技有限公司 | 3D printing device and 3D printing method |
| CN105034373A (en) * | 2015-07-27 | 2015-11-11 | 北京工业大学 | 3D rapid prototyping device and method adopting moving one-dimensional laser scanning galvanometer |
| CN105642893B (en) * | 2015-10-14 | 2019-01-22 | 哈尔滨福沃德多维智能装备有限公司 | Precinct laser fusion system laser spot diameter exports tunable arrangement and method |
| CN106513676B (en) * | 2016-08-23 | 2019-01-22 | 西北工业大学 | A kind of hot spot cooperates with controllable laser metal increasing material manufacturing method with amyloid plaque automatically |
| CN106738908B (en) * | 2017-01-24 | 2023-08-18 | 广州恒锐电子技术有限公司 | Rapid multi-sintering additive manufacturing equipment and method |
| CN107234809A (en) * | 2017-06-22 | 2017-10-10 | 中山大简科技有限公司 | A kind of changeable optical path system based on dynamic focusing |
| EP3578363B1 (en) * | 2018-06-07 | 2022-09-14 | CL Schutzrechtsverwaltungs GmbH | Method for operating an apparatus for additively manufacturing three-dimensional objects |
| CN109532005B (en) * | 2018-11-20 | 2021-08-10 | 广州捷和电子科技有限公司 | 3D photocuring dynamic focusing self-adaptive light spot printing method |
| CN111745963B (en) * | 2019-03-26 | 2022-05-17 | 上海探真激光技术有限公司 | Defocusing distance adjusting method for laser printing, and laser printing method and system |
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