CN102223762A - High-precision jacquard glass fiber fabric - Google Patents
High-precision jacquard glass fiber fabric Download PDFInfo
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- CN102223762A CN102223762A CN 201010145425 CN201010145425A CN102223762A CN 102223762 A CN102223762 A CN 102223762A CN 201010145425 CN201010145425 CN 201010145425 CN 201010145425 A CN201010145425 A CN 201010145425A CN 102223762 A CN102223762 A CN 102223762A
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- jacquard
- circuit board
- printed circuit
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Abstract
The invention provides a manufacturing method of high-precision jacquard glass fiber fabric. The method comprises the following steps of: weaving a substrate of the high-precision jacquard glass fiber fabric by a jacquard technology; pre-cutting the substrate, soaking the substrate in an adhesive, and drying; after cooling, precisely cutting according to an actual circuit; and performing surface treatment on the substrate, electroplating and etching to obtain the high-precision printed circuit board provided by the invention. The high-precision printed circuit board can meet the requirements on miniaturization, high precision, large batch and high efficiency production and has wide market prospect.
Description
Technical field
The present invention relates to a kind of manufacture method of printed circuit board (PCB), it relates more specifically to a kind of is the method that base material is made printed circuit board (PCB) with the jacquard weave glass fabric, and it can be applicable to high density, the installation of high-precision electronic component.
Background technology
In recent years, along with the continuous development of electronic product to miniaturization, slimming, lightweight, high performance, printed circuit board (PCB) wherein but need be installed more electronic component on littler area when size constantly diminishes, and in the production method of present formation scale, consideration for production efficiency, generally adopt the method for the automatic inserting electronic components of streamline, for so automatic plug-in mounting technology, require the electronic component of each plug-in mounting to be accurately positioned on the printed circuit board (PCB).
Printed circuit board (PCB) of the prior art adopts the glass fabric of being made by glass fibre as base material usually, a large amount of plain weave glass fabrics that are made into by air-jet loom that use in the prior art, because warp thread and weft yarn can form the interlacing point of projection on its surface, therefore its surface smoothness is relatively poor can't satisfy high accuracy usually, the making demand of high density circuit board, simultaneously, because can producing in the follow-up resin-bonding and the pressing technology of heating, glass fibre expands and/or contraction, and the diagonal angle edge warping that the pilotaxitic texture of warp thread weft yarn can show as base material with this trickle expansion and/or contraction in the plain cloth, this especially is not suitable for high accuracy, high density circuit board.
Also use the glass mat of making by nonwovens process in the prior art, but for this non-woven fiberglass felt, though can guarantee its surface smoothness to a certain extent by laminating technology, but because process requirements, the thickness of this fibrofelt is thicker usually, this does not obviously meet the demand of miniaturization, high accuracy, high density circuit board, simultaneously, certain warpage also can take place in this fibrofelt after subsequent treatment, this can't satisfy the demand of high accuracy, high density inserting electronic components equally.
Therefore, along with the continuous development of circuit microminiaturization and circuit board component densification, the demand that solves high accuracy inserting electronic components on the printed circuit board (PCB) also becomes more urgent.
Summary of the invention
Defective at printed circuit board (PCB) in the prior art, the technical problem to be solved in the present invention is the problem of glass fabric substrate surface out-of-flatness in the prior art, easy warpage, and surfacing of a kind of electronic component plug-in mounting and the difficult print circuit plates making method that warpage takes place are provided.
For solving this technical problem, the present invention realizes by the following technical solutions:
A kind of manufacture method of high accuracy printed circuit board (PCB), comprise the steps: that jacquard process weaves high accuracy jacquard weave glass fabric base material: choose the individual glass fibers or the twist 1.4～2.0 low twist glass fibre between changeing/50 millimeters and carry out jacquard weaving as warp thread and weft yarn, wherein said warp thread and weft yarn form the roughly figured pattern of circuitry shapes; Pre-cut: carry out cutting according to default figured pattern; Dip bonding agent: with the glass fabric dip bonding agent after the cutting, adhesive comprises the raw material of following weight portion: 45～55 parts phenolic resins, 35～45 parts epoxy resin, 20～40 parts solvent, and 5～35 parts auxiliary agent, described solvent is selected from one or more in dimethyl formamide, glycol monoethyl ether, butanone, acetone, cyclohexanone, propylene glycol monomethyl ether, 1-Methoxy-2-propyl acetate and the toluene, and described auxiliary agent comprises epoxide diluent, silicon dioxide, fire retardant, curing initiator and crosslinking coagent; Add particulate filler in the adhesive in addition, described particulate filler comprises inorganic filler and/or organic filler, inorganic filler is selected from one or more among SiC, SiO2, TiO2, Al2O3, MgO and the AlN, and organic filler is selected from one or more in benzo diaminourea triazine, polyamide, polyimides, melamine resin, the epoxy resin; Oven dry: dried 0.5～1.5 hour for 180～250 ℃; Carry out accurate cutting according to side circuit plate size more after cooling, and after it is carried out surface treatment, plating and etching, promptly can obtain high accuracy printed circuit board (PCB) of the present invention.
By in the zone of glass fabric surface, forming figured pattern corresponding to circuit, and warp thread and weft yarn be made into roughly circuitry shapes, can be so that even trickle expansion and/or contraction take place in glass fibre, also can guarantee basicly stable at the entire circuit relative position, thereby guarantee that the relative position between each plug-in mounting position uncertain variation can not take place; Adopt the combination of adhesive and filler as described in the present invention, can guarantee that the dielectric constant of printed circuit board (PCB) is lower, dielectric loss is less.
According to the manufacture method of high accuracy printed circuit board (PCB) as described in the present invention, it is higher to obtain surface smoothness, and work tolerable temperature is higher, frequency is higher, dielectric constant is lower, dielectric loss is less printed circuit board (PCB) has satisfied the demand of industry well.
Description of drawings
Fig. 1 is the partial schematic diagram of high-accuracy glass fiber cloth first embodiment of the present invention;
Fig. 2 is the partial schematic diagram of high-accuracy glass fiber cloth second embodiment of the present invention;
Specific embodiments
Describe concrete technical scheme of the present invention in detail below by several preferred embodiments
Embodiment 1
Jacquard weaving: the glass fibre of choosing diameter 0.009～0.05mm, be made into as shown in Figure 1 circuit region by loop selection technology, because the jacquard fabric width is usually about 190～350 centimetres, therefore on the width of whole glass fabric, can form a plurality of identical circuit regions as shown in Figure 1 as required, to satisfy the demand that modernization is produced in batches, Fig. 1 central circuit zone is exactly the zone that default needs form circuit, in this embodiment, warp thread 1 only can be seen in the front of this fabric, and the one side of carrying electronic component only has warp thread 1 or weft yarn 2 when promptly forming printed circuit board (PCB) at last.Other parts beyond the middle section are transitional regions on every side, warp thread 1 and the weft yarn 2 formation plain weave that normally interweaves, thus form firm braiding structure.
Pre-cut: according to the jacquard weave shape that forms the central circuit zone, carry out cutting, transitional region around the reserve part can keep basic shape to guarantee the glass fabric that cutting obtains.
The dip bonding agent: the high-accuracy glass fiber cloth that cutting is obtained is immersed in the adhesive, described adhesive comprises the raw material of following weight portion: 45～55 parts phenolic resins, 35～45 parts epoxy resin, 20～40 parts solvent, and 5～35 parts auxiliary agent, described solvent is selected from one or more in dimethyl formamide, glycol monoethyl ether, butanone, acetone, cyclohexanone, propylene glycol monomethyl ether, 1-Methoxy-2-propyl acetate and the toluene, and described auxiliary agent comprises epoxide diluent, silicon dioxide, fire retardant, curing initiator and crosslinking coagent.Add particulate filler in the adhesive in addition, described particulate filler comprises inorganic filler and/or organic filler, inorganic filler is selected from one or more among SiC, SiO2, TiO2, Al2O3, MgO and the AlN, and organic filler is selected from one or more in benzo diaminourea triazine, polyamide, polyimides, melamine resin, the epoxy resin
As preferred implementation of the present invention, the solvent in the adhesive that printed circuit board (PCB) uses is preferably dimethyl formamide and butanone, also can comprise other one or more mixed solvents, can mix by arbitrary proportion.
Oven dry: the glass fabric of dip bonding agent is taken out, 180～250 ℃ of oven dry of temperature 1 hour.
Carry out accurate cutting according to side circuit plate size again after the cooling, and after it is carried out surface treatment, plating and etching, promptly can obtain high accuracy printed circuit board (PCB) of the present invention.
In addition, according to the application scenario difference of printed circuit board (PCB), can select the stacked dipping again of the high-accuracy glass fiber cloth of polylith dip bonding agent, the multilayer high accuracy substrate for printed circuit board of satisfying the demand by stacked acquisition thickness, hardness etc.
Compare with embodiment 1, the central circuit zone had the zone that several warp thread 1 and weft yarn 2 interweave when difference was that jacquard is weaved, this woven areas can design according to the needs of wiring, the Stability Analysis of Structures that it not only can guarantee circuit region in the whole glass fabric in early stage can also be used for last circuit boring etc.
Other steps are with embodiment 1.
In addition, only show the situation that middle section has several point-like woven areas in the present embodiment 2, in fact can design continuous woven areas according to the wiring needs, thereby make the shape of non-woven areas corresponding with the circuitry shapes that needs at last to form, by such design high-accuracy glass fiber cloth, even because glass fibre shrinks in processing procedure or stretches, in the entire circuit zone, the amount basically identical that shrinks or stretch, and its deformation direction is also identical, even therefore certain buckling deformation takes place in the entire circuit plate, uncertain variation can't take place in the relative position relation of entire circuit, and design and the plug-in mounting for high-precision circuit also is very favorable like this.
Embodiment 3
Compare with 2 with embodiment 1, difference is that jacquard weaves the base cloth surface and have a plurality of different circuit regions, i.e. circuitry shapes that can be different according to design on the continuous woven glass fabric of not coexisting of customer demand quantity.
Other steps are with embodiment 1 and 2.
By different circuit regions is set on Width, can satisfy the demand that some small lots can be permitted, can reduce the whole cost of weaving simultaneously.
Claims (1)
1. the manufacture method of a high accuracy printed circuit board (PCB) comprises the steps:
Jacquard process is weaved high accuracy jacquard weave glass fabric base material: choose the low twist glass fibre of individual glass fibers or the twist 1.4～2.0 between changeing/50 millimeters and carry out jacquard weaving as warp thread and weft yarn, wherein said warp thread and weft yarn form the roughly figured pattern of circuitry shapes;
Pre-cut: carry out cutting according to default figured pattern;
Dip bonding agent: with the glass fabric dip bonding agent after the cutting, adhesive comprises the raw material of following weight portion: 45～55 parts phenolic resins, 35～45 parts epoxy resin, 20～40 parts solvent, and 5～35 parts auxiliary agent, described solvent is selected from one or more in dimethyl formamide, glycol monoethyl ether, butanone, acetone, cyclohexanone, propylene glycol monomethyl ether, 1-Methoxy-2-propyl acetate and the toluene, and described auxiliary agent comprises epoxide diluent, silicon dioxide, fire retardant, curing initiator and crosslinking coagent; Add particulate filler in the adhesive in addition, described particulate filler comprises inorganic filler and/or organic filler, inorganic filler is selected from one or more among SiC, SiO2, TiO2, Al2O3, MgO and the AlN, and organic filler is selected from one or more in benzo diaminourea triazine, polyamide, polyimides, melamine resin, the epoxy resin;
Oven dry: dried 0.5～1.5 hour for 180～250 ℃;
Carry out accurate cutting according to side circuit plate size more after cooling, and after it is carried out surface treatment, plating and etching, promptly obtain the high accuracy printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101454253A CN102223762B (en) | 2010-04-13 | 2010-04-13 | High-precision jacquard glass fiber fabric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101454253A CN102223762B (en) | 2010-04-13 | 2010-04-13 | High-precision jacquard glass fiber fabric |
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| CN102223762A true CN102223762A (en) | 2011-10-19 |
| CN102223762B CN102223762B (en) | 2012-09-12 |
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| CN2010101454253A Expired - Fee Related CN102223762B (en) | 2010-04-13 | 2010-04-13 | High-precision jacquard glass fiber fabric |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762726A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Production technology for combined glass fiber cloth |
| CN104761139A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Manufacturing method of alkali-free glass cloth |
| CN108978224A (en) * | 2018-06-30 | 2018-12-11 | 江南大学 | A kind of preparation method and method for sorting assigning the multi-functional finishing agent of textile |
| CN116288947A (en) * | 2023-03-21 | 2023-06-23 | 无锡爱勒普科技有限公司 | Composite non-woven fabric for screen printing and preparation method thereof |
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| US6599561B2 (en) * | 2001-11-30 | 2003-07-29 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate |
| US20040012937A1 (en) * | 2002-07-18 | 2004-01-22 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate with passive electrical components |
| CN1498421A (en) * | 2002-01-25 | 2004-05-19 | ���ṫ˾ | Substrate for high-frequency module and high-frequency module |
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
| CN101147432A (en) * | 2003-08-15 | 2008-03-19 | 英特尔公司 | Circuit board design |
-
2010
- 2010-04-13 CN CN2010101454253A patent/CN102223762B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6599561B2 (en) * | 2001-11-30 | 2003-07-29 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate |
| CN1498421A (en) * | 2002-01-25 | 2004-05-19 | ���ṫ˾ | Substrate for high-frequency module and high-frequency module |
| US20040012937A1 (en) * | 2002-07-18 | 2004-01-22 | Kulicke & Soffa Investments, Inc. | Method for manufacturing a printed circuit board substrate with passive electrical components |
| CN101147432A (en) * | 2003-08-15 | 2008-03-19 | 英特尔公司 | Circuit board design |
| CN101039546A (en) * | 2007-03-16 | 2007-09-19 | 广东生益科技股份有限公司 | Lead-free compatible high frequency copper clad laminate and its preparing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762726A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Production technology for combined glass fiber cloth |
| CN104761139A (en) * | 2015-03-30 | 2015-07-08 | 安徽丹凤电子材料股份有限公司 | Manufacturing method of alkali-free glass cloth |
| CN108978224A (en) * | 2018-06-30 | 2018-12-11 | 江南大学 | A kind of preparation method and method for sorting assigning the multi-functional finishing agent of textile |
| CN116288947A (en) * | 2023-03-21 | 2023-06-23 | 无锡爱勒普科技有限公司 | Composite non-woven fabric for screen printing and preparation method thereof |
| CN116288947B (en) * | 2023-03-21 | 2024-01-19 | 无锡爱勒普科技有限公司 | Composite non-woven fabric for screen printing and preparation method thereof |
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| CN102223762B (en) | 2012-09-12 |
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Granted publication date: 20120912 Termination date: 20140413 |