CN102213850B - Integrated touch panel - Google Patents
Integrated touch panel Download PDFInfo
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- CN102213850B CN102213850B CN 201010137550 CN201010137550A CN102213850B CN 102213850 B CN102213850 B CN 102213850B CN 201010137550 CN201010137550 CN 201010137550 CN 201010137550 A CN201010137550 A CN 201010137550A CN 102213850 B CN102213850 B CN 102213850B
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Abstract
The invention relates to an integrated touch panel and a manufacturing method thereof, the integrated touch panel comprises a transparent base plate, an image layer, a first optical membrane and a first induction layer, wherein the image layer is coated at one side periphery of the transparent base plate; the inner periphery of the image layer and the abutting line of the transparent base plate are arranged in a non-right-angle mode; the first optical membrane is overlapped on the image layer and a transparent base plate region which is not covered by the image layer; and the first induction layer is in sputtering overlapping on the first optical membrane. Or the structural positions of the first optical membrane and the first induction layer are exchanged and contained by the right range of the integrated touch panel provided by the invention. Because the image layer and the abutting line of the transparent base plate are arranged in a non-right-angle mode, the subsequent structure is completely covered when being overlapped in a sputtering mode or other modes.
Description
Technical field
The present invention is and the contact panel domain-specific particularly about a kind of technique of being simplified, to promote the integrated touch panel of panel reinforcement degree and yield.
Background technology
The contact panel frequent species has resistance-type, condenser type, ultrasonic formula, optics (infrared ray) formula etc., and wherein, widespread use person is resistance-type, is secondly condenser type.Again its advantage of capacitance type touch-control panel be waterproof, scratch resistant, that penetrability is high is large etc. with the Applicable temperature scope.Therefore, although the price of capacitance type touch-control panel own is higher, along with the maturation of technology, also stride into gradually in the contact panel market of small-size display.
Having now touch panel structure provided is usually to use a hardened glass substrate with outermost layer environmental exposure, then a bonding inductive layer, commonly using for example uses tin indium oxide (ITO) as its conductive material, be a combination with display panel (being backlight module) again after contact panel is partly integrated, form complete touch control display apparatus.As mentioned above, between described glass substrate and described inductive layer, the past is to utilize an optical cement with both bonding settings.In addition, at described glass substrate surrounding edge, also how can print an image layer black surround, in order to cover circuit.Yet, all be rendered as contacting of a right angle after existing image layer printing with between described glass substrate, when the described glass substrate of follow-up adhesion and described inductive layer, the coating degree often appears not good therefore, even cause the problem of height fall.Add the above ITO inductive layer after the etching induction line, using has often because the high low head of described circuit etching fluting causes impact on Picture Showing, and its yield is reduced.
In view of this, the inventor proposes a kind of integrated touch panel, in order to improve the existing bonding disappearance of optical cement of using, adopt low temperature sputtering way plated film and change, with effective reduction contact panel thickness, and the thickness minimizing can directly improve light transmission efficiency with respect on transmittance.Simultaneously for the setting of blooming sputter on inductive layer, can effectively improve high low head because of the circuit etching fluting and cause impact on Picture Showing.Setting for image layer also is different from existing configuration in addition, and the coating degree of follow-up plated film is significantly promoted, and the problem of unlikely generation height fall, the hardness for integral panels also can significantly promote simultaneously.
Summary of the invention
In view of the above problems, when the object of the present invention is to provide a kind of utilization that image layer is coated the transparency carrier periphery, with the abutment line of described transparency carrier be to be rendered as an on-right angle setting, then recycle folded blooming or the inductive layer established of sputter technology in upper.Due to the on-right angle setting of described image layer, be to make described blooming or described inductive layer be able to complete being coated in, also promoted on yield again.
For reaching above-mentioned purpose, the present invention proposes a kind of integrated touch panel, comprises: a transparency carrier, an image layer, one first blooming and one first inductive layer.Described image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again; Described the first blooming is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer; And described the first inductive layer, be that sputter is stacked at described the first blooming.
Described transparency carrier of the present invention be can be selected from glass or high molecular weight plastic one of them.Its structure more can comprise a diaphragm, is to be stacked at described the first inductive layer.
Described integrated touch panel more can comprise one second blooming, is be stacked at described the first inductive layer and more can comprise a diaphragm, and be to be stacked at described the second blooming.Or more can comprise one first separation layer, be to be stacked at described the second blooming; Then more can comprise one the 3rd blooming, be to be stacked at described the first separation layer; And one second inductive layer, be to be stacked at described the 3rd blooming; Continuing more can comprise a diaphragm, is to be stacked at described the second inductive layer.Or more comprise: a screen layer is to be stacked at described the second inductive layer; Continue and more comprise: a diaphragm is to be stacked at described screen layer.
The present invention more comprises described the first separation layer, is after being stacked at described the second blooming, and more folded one second inductive layer of establishing is in described the first separation layer; And a diaphragm, be to be stacked at described the second inductive layer; Or more can comprise one second inductive layer, be to be stacked at described the first separation layer; One second separation layer is to be stacked at described the second inductive layer; And a screen layer, be to be stacked at described the second separation layer; And more comprise a diaphragm, be to be stacked at described screen layer.
For reaching above-mentioned purpose, the present invention also proposes a kind of integrated touch panel, comprises: a transparency carrier; One image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again; One first inductive layer is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer; And one first blooming, be that sputter is stacked at described the first inductive layer.Its structure more can comprise a diaphragm, is to be stacked at described the first blooming; Or more comprise one first separation layer, be to be stacked at described the first blooming; One second inductive layer is to be stacked at described the first separation layer; And one second blooming, be to be stacked at described the second inductive layer.Then more can comprise a diaphragm, be to be stacked at described the second blooming; Or more can comprise one second separation layer, be to be stacked at described the second blooming; And a screen layer, be to be stacked at described the second separation layer.Then more can comprise: a diaphragm is to be stacked at described screen layer.
For reaching above-mentioned purpose, the present invention also proposes a kind of integrated touch panel, comprises: a kind of integrated touch panel comprises: a transparency carrier; One image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again; One first blooming is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer; One first inductive layer is that sputter is stacked at described the first blooming; One second blooming is to be stacked at described the first inductive layer; One first separation layer is to be stacked at described the second blooming; One the 3rd blooming is to be stacked at described the first separation layer; One second inductive layer is that sputter is stacked at described the 3rd blooming; One the 4th blooming is to be stacked at described the second inductive layer; And a diaphragm, be to be stacked at described the 4th blooming.
For reaching above-mentioned purpose, the present invention also proposes a kind of integrated touch panel, comprises: a kind of integrated touch panel comprises: a transparency carrier; One image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again; One first blooming is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer; One first inductive layer is that sputter is stacked at described the first blooming; One second blooming is to be stacked at described the first inductive layer; One first separation layer is to be stacked at described the second blooming; One the 3rd blooming is to be stacked at described the first separation layer; One second inductive layer is that sputter is stacked at described the 3rd blooming; One the 4th blooming is to be stacked at described the second inductive layer; One screen layer is to be stacked at described the 4th blooming; And a diaphragm, be to be stacked at described screen layer.
Another object of the present invention is for the manufacture method of integrated touch panel as the aforementioned is provided, its omnidistance temperature is to be controlled at lower than below 200 ℃, and make its intensity of integrated touch panel of the present invention and stable degree significantly promote, and its processing step comprises: a plurality of transparency carriers of cutting forming; Be coated with an image layer in a side periphery of described a plurality of transparency carriers, and to make the abutment line of each described image layer inner peripheral and each described transparency carrier be to be rendered as an on-right angle setting; And sputter one inductive layer is in each described image layer and the described transparency carrier zone that not covered by described image layer.In addition, at the described inductive layer of sputter before each described image layer and the described transparency carrier zone step that not covered by described image layer and/or after, more comprise: at least one blooming that is shaped, and make described blooming be placed in the one or both sides face of described inductive layer.
Effect of the present invention is to omit the existing optical cement that uses in order to the mode of bonding described transparency carrier and described inductive layer, changing the abutment line of utilizing described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting, utilize that the sputter technology is folded establishes blooming or inductive layer was able to complete coating when upper and make, the yield of structure is promoted.Simultaneously on each inductive layer or be attached with separately or respectively down one or two layer of blooming, in order to cover resolution and the visual impression of the unlikely impact of the slotted metal that causes because of circuit etching when using.
Description of drawings
Fig. 1 is the first embodiment of the invention cut-open view;
Fig. 2 is another additional form cut-open view (one) of first embodiment of the invention;
Fig. 3 is another additional form cut-open view (two) of first embodiment of the invention;
Fig. 4 is another additional form cut-open view (three) of first embodiment of the invention;
Fig. 5 is another additional form cut-open view (four) of first embodiment of the invention;
Fig. 6 is another additional form cut-open view (five) of first embodiment of the invention;
Fig. 7 is another additional form cut-open view (six) of first embodiment of the invention;
Fig. 8 is another additional form cut-open view (seven) of first embodiment of the invention;
Fig. 9 is another additional form cut-open view (eight) of first embodiment of the invention;
Figure 10 is another additional form cut-open view (nine) of first embodiment of the invention;
Figure 11 is another additional form cut-open view (ten) of first embodiment of the invention;
Figure 12 is another additional form cut-open view (11) of first embodiment of the invention;
Figure 13 is the second embodiment of the invention cut-open view;
Figure 14 is another additional form cut-open view (one) of second embodiment of the invention;
Figure 15 is another additional form cut-open view (two) of second embodiment of the invention;
Figure 16 is another additional form cut-open view (three) of second embodiment of the invention;
Figure 17 is another additional form cut-open view (four) of second embodiment of the invention;
Figure 18 is another additional form cut-open view (five) of second embodiment of the invention;
Figure 19 is the third embodiment of the invention cut-open view;
Figure 20 is the fourth embodiment of the invention cut-open view;
Figure 21 is preferred embodiment manufacture method process flow diagram of the present invention ();
Figure 22 is preferred embodiment manufacture method process flow diagram of the present invention (two).
Description of reference numerals: 1-transparency carrier; The 2-image layer; 3a-the first blooming; 3b-the second blooming; 3c-the 3rd blooming; 3d-the 4th blooming; 4a-the first inductive layer; 4b-the second inductive layer; The 5-diaphragm; 6a-the first separation layer; 6b-the second separation layer; The 7-screen layer; S80～S85-step.
Embodiment
Understand content of the present invention for your juror can be known, sincerely arrange in pairs or groups in the following instructions graphic, please consult.
See also Fig. 1, be the first embodiment of the invention cut-open view.By figure sights, the present embodiment is an integrated touch panel structure, then a more additional display panel (figure is demonstration) and combination after be a complete panel.Described integrated touch panel comprises: a transparency carrier 1, an image layer 2, one first blooming 3a and one first inductive layer 4a.
Described transparency carrier 1 is contact panel and the extraneous surface that directly contact, therefore can increase its reinforcement degree more than on its characteristic, protects and the purpose such as scratch resistant to reach.In this described transparency carrier 1 be can be selected from glass or high molecular weight plastic one of them.When for example adopting glass material, can first be cut to shape is a plurality of little sheet glass, and its thickness approximately can be 0.5～1.8mm, is then strengthened it again.Mode such as other chemical agents such as can using potassium nitrate of strengthening soak.
Described image layer 2 is mainly the Communication signal wire part of covering the contact panel edge, is the side periphery that the mode that can be coated with printing ink is located at described transparency carrier in this, and its thickness is about 2-15 μ m.The abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again, and purpose is that to make follow-up folded other structures of establishing be intactly to be coated in.And the condition of controlling wire mark formation on-right angle is can use for example with ink viscosity: 10～300dPa.s; Half tone condition 50～400mesh tetron screen; Tension force: the environmental parameter of min 15N is implemented.
Then folded establish described the first inductive layer 4a before, foldedly in advance establish described the first blooming 3a in described image layer 2 and described transparency carrier 1 zone that not covered by described image layer 2.Its fundamental purpose is to be the electric circuit metal fluting that the first follow-up inductive layer 4a is caused because of etching, and the visual impact that forms in use the height fluctuating drops to minimum.And the mode that realizes described the first blooming 3a is to use sputter, spraying or coating method to realize optical thin film, approximately＜200nm on its THICKNESS CONTROL.
From the above, then just foldedly establishing described the first inductive layer 4a and be located on described the first blooming 3a with sputtering way, is for example the ITO nesa coating, and its thickness is about 10-100nm.And the mode of preparation for example can vacuum DC and RF magnetic control sputtering plating coated film deposition technology be main, other stratiform sputter, spray pyrolysis, pulse laser plated film, Arc Discharge Ion Plating film, reactive evaporation, ion beam sputter, the CVD etc. of also can adopting.
Please consult again Fig. 2, be another additional form cut-open view (one) of first embodiment of the invention.The present embodiment form is again many additional one second blooming 3b and be stacked at described the first inductive layer 4a.Purpose and technology mode are all identical with aforesaid described the first blooming 3a with thickness, repeat no more in this.
Please consult again Fig. 3, be another additional form cut-open view (two) of first embodiment of the invention.The present embodiment compared to aforementioned additional form cut-open view () structure, is again that many additional diaphragms 5 are stacked at described the second blooming 3b.Its objective is that avoiding scratch when protecting described integrated touch panel to be incorporated into described display panel damages.Its technology mode is to adopt printing, spraying or coating method to realize, and the thickness of its diaphragm 5 is about＜20um.
Please consult again Fig. 4, be another additional form cut-open view (three) of first embodiment of the invention.The present embodiment compared to aforementioned additional form cut-open view () structure, is more to comprise one first separation layer 6a to be stacked at described the first inductive layer 4a.Described the first separation layer 6a makes to be provided with described the first separation layer 6a (as shown in Figure 5) between follow-up formation one second inductive layer 4b and described the first inductive layer 4a, namely in order to when the touch-control, because of described the first inductive layer 4a and described the second inductive layer 4b generation capacity effect, and then acquisition sensor signal, and be sent to a processor to carry out the calculating of sensed position, to reach the purpose of touch-control.
Please consult again Fig. 5, be another additional form cut-open view (four) of first embodiment of the invention.The present embodiment is compared to aforementioned additional form cut-open view (three) structure, be more comprise one the 3rd blooming 3c be in folded establish described the second inductive layer 4b before, be stacked in advance described the first separation layer 6a.It is identical with the purpose of aforesaid described the first blooming 3a and described the second blooming 3b that the additional of the 3rd blooming 3c stated in this place, repeats no more in this.
Please consult again Fig. 6, be another additional form cut-open view (five) of first embodiment of the invention.The present embodiment compared to aforementioned additional form cut-open view (four) structure, is more to comprise a diaphragm 5 to be stacked at described the second inductive layer 4b.Diaphragm 5 as hereinbefore, is to avoid scratch when protecting described integrated touch panel to be incorporated into described display panel to damage.Its technology mode is to adopt printing, spraying or coating method to realize, and its diaphragm 5 its thickness are about＜20um.
Please consult again Fig. 7, be another additional form cut-open view (six) of first embodiment of the invention.The present embodiment compared to aforementioned additional form cut-open view (four) structure, is more to comprise a screen layer 7 to be stacked at described the second inductive layer 4b.Described screen layer 7 is the interference that stop other electromagnetic riveting machine signals.Be that mode with sputter realizes on technique, its thickness is about 10-100nm.
Please consult again Fig. 8, be another additional form cut-open view (seven) of first embodiment of the invention.The present embodiment is compared to aforementioned additional form cut-open view (six) structure; more to comprise a diaphragm 5 to be stacked at described screen layer 7; its diaphragm 5 is identical with aforementioned purpose, is to avoid scratch when protecting described integrated touch panel to be incorporated into described display panel to damage.Its technology mode is to adopt printing, spraying or coating method to realize, and its diaphragm 5 its thickness are about＜20um.
Please consult again Fig. 9, be another additional form cut-open view (eight) of first embodiment of the invention.The present embodiment is compared to aforementioned additional form cut-open view (three) structure, is two layers of inductive layer structure and more comprise one second inductive layer 4b and be stacked at described the first separation layer 6a; And a diaphragm 5 is stacked at described the second inductive layer 4b.And the purpose of its diaphragm 5 as hereinbefore, do not repeat them here.
Please consult again Figure 10, be another additional form cut-open view (nine) of first embodiment of the invention.The present embodiment is compared to aforementioned additional form cut-open view (three) structure, is two layers of inductive layer structure and more comprise one second inductive layer 4b and be stacked at described the first separation layer 6a; One second separation layer 6b is to be stacked at described the second inductive layer 4b; And a screen layer 7, be to be stacked at described the second separation layer 6b.Its described second separation layer 6b is the use that makes described the second inductive layer 4b and 7 mutually insulateds of described screen layer, and described screen layer 7 is one can stop the transparent protective layer of noise, is that the mode with sputter realizes, its thickness is about 10-100nm.
Please consult again Figure 11, be another additional form cut-open view (ten) of first embodiment of the invention.The present embodiment compared to aforementioned additional form cut-open view (nine) structure, is more to comprise a diaphragm 5 to be stacked at described screen layer 7, and the purpose of its diaphragm 5 repeats no more in this as hereinbefore.
Please consult again Figure 12, be another additional form cut-open view (11) of first embodiment of the invention.The present embodiment compared to the first example structure, is more to comprise a diaphragm 5 to be stacked at described the first inductive layer 4a, and the purpose of its diaphragm 5 repeats no more in this as hereinbefore.
Please consult again Figure 13, be the second embodiment of the invention cut-open view.This second embodiment and the first embodiment are roughly the same, only different with the first embodiment from described the first blooming 3a locations of structures intermodulation in described the first inductive layer 4a, structure purpose as for its each layer is all identical with the first embodiment with technology mode, repeats no more in this.
Please consult again Figure 14, be another additional form cut-open view (one) of second embodiment of the invention.The present embodiment compared to the second example structure, is more to comprise a diaphragm 5 to be stacked at described the first blooming 3a.Its objective is that avoiding scratch when protecting described integrated touch panel to be incorporated into described display panel damages.Its technology mode is to adopt printing, spraying or coating method to realize, and the thickness of its diaphragm 5 is about＜20um.
Please consult again Figure 15, be another additional form cut-open view (two) of second embodiment of the invention.The present embodiment compared to the second example structure, is more to comprise one first separation layer 6a, is to be stacked at described the first blooming 3a; One second inductive layer 4b is to be stacked at described the first separation layer 6a; And one second blooming 3b, be to be stacked at described the second inductive layer 4b.Form described the second inductive layer 4b and and described the first inductive layer 4a between be provided with described the first separation layer 6a, namely in order to when the touch-control, because of described the first inductive layer 4a and described the second inductive layer 4b generation capacity effect, and then acquisition sensor signal, and be sent to a processor to carry out the calculating of sensed position, to reach the purpose of touch-control.The purpose of described the first blooming 4a and described the second blooming 3b is that forming when using just rises and falls affects its visual impression for the electric circuit metal that reduction causes because of etching is slotted in addition, makes the user better on Picture Showing when use.
Please consult again Figure 16, be another additional form cut-open view (three) of second embodiment of the invention.The present embodiment compared to another additional form cut-open view (two) of the second embodiment, is more to comprise a diaphragm 5 to be stacked at described the second blooming 3b, and the purpose of its diaphragm 5 repeats no more in this as hereinbefore.
Please consult again Figure 17, be another additional form cut-open view (four) of second embodiment of the invention.The present embodiment compared to another additional form cut-open view (two) of the second embodiment, is more to comprise one second separation layer 6b, is to be stacked at described the second blooming 3b; And a screen layer 7, be to be stacked at described the second separation layer 6b.Its described second separation layer 6b is the use that makes described the second inductive layer 4b and 7 mutually insulateds of described screen layer, and described screen layer 7 is one can stop the transparent protective layer of noise, is that the mode with sputter realizes, its thickness is about 10-100nm.
Please consult again Figure 18, be another additional form cut-open view (five) of second embodiment of the invention.The present embodiment compared to another additional form cut-open view (four) of the second embodiment, is more to comprise a diaphragm 5 to be stacked at described screen layer 7, and the purpose of its diaphragm 5 repeats no more in this as hereinbefore.
See also Figure 19, be the third embodiment of the invention cut-open view.By figure sights, the present embodiment is an integrated touch panel structure, then a more additional display panel (figure is demonstration) and combination after be a complete panel.Described integrated touch panel comprises: a transparency carrier 1; One image layer 2 is to be coated with a side periphery that is laid in described transparency carrier 1, and the abutment line of described image layer 2 inner peripherals and described transparency carrier 1 is to be rendered as an on-right angle setting again; One first blooming 3a is to be stacked at described image layer 2 and described transparency carrier 1 zone that not covered by described image layer 2; One first inductive layer 4a is that sputter is stacked at described the first blooming 3a; One second blooming 3b is to be stacked at described the first inductive layer 4b; One first separation layer 6a is to be stacked at described the second blooming 3b; One the 3rd blooming 3c is to be stacked at described the first separation layer 6a; One second inductive layer 4b is that sputter is stacked at described the 3rd blooming 3c; One the 4th blooming 3d is to be stacked at described the second inductive layer 4b; And a diaphragm 5, be to be stacked at described the 4th blooming 3d.The present embodiment is to include two layers of inductive layer, and described two layers of inductive layer are all to be covered with up and down respectively blooming, and namely described the first inductive layer 4a is covered with respectively described the first blooming 3a and described the second blooming 3b up and down; Described the second inductive layer 4b is covered with respectively described the 3rd blooming 3c and described the 4th blooming 3d up and down.Be that then this two is covered with up and down between the inductive layer of blooming and described the first separation layer 6a is set with isolation insulated from each other, at last again coated with a diaphragm 5 in order to and described display panel between protected in conjunction with rear described circuit of touch panel.Function as for each layer is all identical with above-mentioned mentioned embodiment with technology mode, repeats no more in this.
See also Figure 20, be the fourth embodiment of the invention cut-open view.By figure sights, the present embodiment and the 3rd embodiment are roughly the same, only before described diaphragm 5 is set, elder generation coated with a screen layer 7 on described the 4th blooming 3d, then again coated with described diaphragm 5.Function as for each layer is all identical with above-mentioned mentioned embodiment with technology mode, repeats no more in this.
Figure 21 is preferred embodiment manufacture method process flow diagram of the present invention ().This flow process is for realizing the manufacture method of integrated touch panel structure as shown in Figure 1.At first the control temperature at production environment is that whole process maintains below 200 ℃.And utilize large stretch of transparency carrier, and for example a glass material cuts, and is configured as a plurality of transparency carrier S80, and cutting mode herein is to utilize CNC cutting machine, copying cutting machine, laser cutting machine etc., cuts moulding.And usually can strengthen its hardness again after cutting forming, such as carrying out chemical immersion with potassium nitrate etc., promote its hardness.
Continue coating one image layer in a side periphery of described a plurality of transparency carriers, and make the abutment line of each described image layer inner peripheral and each described transparency carrier be rendered as an on-right angle S82 is set.And in order to form the setting of on-right angle, can be set as follows for its controlled condition, for example with ink viscosity: 10～30dPa.s; Half tone condition 50～400mesh tetron screen; Tension force: the environmental parameter of min 15N.And after its technique thickness greatly to being about 2～15um.
Sputter one inductive layer is in each described image layer and the described transparency carrier zone S84 that not covered by described image layer, and its thickness is about 10-100nm.Inductive layer herein for example forms electrode for ITO electrically conducting transparent membrane material, be main and technique also can adopt vacuum DC and RF magnetic control sputtering plating coated film deposition technology, alternate manner has the modes such as common sputter, stratiform sputter, spray pyrolysis, pulse laser plated film, Arc Discharge Ion Plating film, reactive evaporation, ion beam sputter, CVD for it.
In addition for described inductive layer is slotted because of the electric circuit metal that etching causes, the visual impact that forms in use the height fluctuating drops to minimum, can be at the described inductive layer of sputter before each described image layer and the described transparency carrier zone step that not covered by described image layer and/or after, more comprise: at least one blooming that is shaped, and make described blooming be placed in one or both sides face S83, the S85 of described inductive layer.
Therefore, to omit the existing optical cement that uses in order to the mode of bonding described transparency carrier and described inductive layer on overall efficacy of the present invention, changing the abutment line of utilizing described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting, utilize that the sputter technology is folded establishes blooming or inductive layer was able to complete coating when upper and make, first print the black surround image layer height fall problem of plated film again and overcome, make the one-piece construction yield be promoted.And utilize the printing ink of the described image layer of plated film mode to undergo no deterioration, the resistance of ITO inductive layer is also unaffected.While is on each inductive layer or be attached with separately or respectively down one or two layer of blooming, in order to cover resolution and the visual impression of the unlikely user of impact of the slotted metal that causes because of circuit etching picture when using.
The above person, it is only preferred embodiment of the present invention, be not to limit scope of the invention process, so done equivalence or variation person easily Deng haveing the knack of this technology, not breaking away from the equalization variation and modification of doing under spirit of the present invention and scope, all should be covered by in the scope of the claims of the present invention.
Claims (22)
1. an integrated touch panel, is characterized in that, comprises:
One transparency carrier;
One image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again;
One first blooming is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer; And
One first inductive layer is that sputter is stacked at described the first blooming.
2. integrated touch panel according to claim 1, is characterized in that, described transparency carrier be selected from glass or high molecular weight plastic one of them.
3. integrated touch panel according to claim 2, is characterized in that, more comprises: one second blooming is to be stacked at described the first inductive layer.
4. integrated touch panel according to claim 3, is characterized in that, more comprises: a diaphragm is to be stacked at described the second blooming.
5. integrated touch panel according to claim 3, is characterized in that, more comprises: one first separation layer is to be stacked at described the second blooming.
6. integrated touch panel according to claim 5, is characterized in that, more comprises: one the 3rd blooming is to be stacked at described the first separation layer; And one second inductive layer, be to be stacked at described the 3rd blooming.
7. integrated touch panel according to claim 6, is characterized in that, more comprises: a diaphragm is to be stacked at described the second inductive layer.
8. integrated touch panel according to claim 6, is characterized in that, more comprises: a screen layer is to be stacked at described the second inductive layer.
9. integrated touch panel according to claim 8, is characterized in that, more comprises: a diaphragm is to be stacked at described screen layer.
10. integrated touch panel according to claim 5, is characterized in that, more comprises: one second inductive layer is to be stacked at described the first separation layer; And a diaphragm, be to be stacked at described the second inductive layer.
11. integrated touch panel according to claim 5 is characterized in that, more comprises: one second inductive layer is to be stacked at described the first separation layer; One second separation layer is to be stacked at described the second inductive layer; And a screen layer, be to be stacked at described the second separation layer.
12. integrated touch panel according to claim 11 is characterized in that, more comprises: a diaphragm is to be stacked at described screen layer.
13. integrated touch panel according to claim 2 is characterized in that, more comprises: a diaphragm is to be stacked at described the first inductive layer.
14. an integrated touch panel is characterized in that, comprises:
One transparency carrier;
One image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again;
One first inductive layer is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer; And
One first blooming is that sputter is stacked at described the first inductive layer.
15. integrated touch panel according to claim 14 is characterized in that, more comprises: a diaphragm is to be stacked at described the first blooming.
16. integrated touch panel according to claim 14 is characterized in that, more comprises:
One first separation layer is to be stacked at described the first blooming;
One second inductive layer is to be stacked at described the first separation layer; And
One second blooming is to be stacked at described the second inductive layer.
17. integrated touch panel according to claim 16 is characterized in that, more comprises: a diaphragm is to be stacked at described the second blooming.
18. integrated touch panel according to claim 16 is characterized in that, more comprises:
One second separation layer is to be stacked at described the second blooming; And
One screen layer is to be stacked at described the second separation layer.
19. integrated touch panel according to claim 18 is characterized in that, more comprises: a diaphragm is to be stacked at described screen layer.
20. an integrated touch panel is characterized in that, comprises:
One transparency carrier;
One image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again;
One first blooming is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer;
One first inductive layer is that sputter is stacked at described the first blooming;
One second blooming is to be stacked at described the first inductive layer;
One first separation layer is to be stacked at described the second blooming;
One the 3rd blooming is to be stacked at described the first separation layer;
One second inductive layer is that sputter is stacked at described the 3rd blooming;
One the 4th blooming is to be stacked at described the second inductive layer; And
One diaphragm is to be stacked at described the 4th blooming.
21. an integrated touch panel is characterized in that, comprises:
One transparency carrier;
One image layer is to be coated with a side periphery that is laid in described transparency carrier, and the abutment line of described image layer inner peripheral and described transparency carrier is to be rendered as an on-right angle setting again;
One first blooming is to be stacked at described image layer and the described transparency carrier zone that not covered by described image layer;
One first inductive layer is that sputter is stacked at described the first blooming;
One second blooming is to be stacked at described the first inductive layer;
One first separation layer is to be stacked at described the second blooming;
One the 3rd blooming is to be stacked at described the first separation layer;
One second inductive layer is that sputter is stacked at described the 3rd blooming;
One the 4th blooming is to be stacked at described the second inductive layer;
One screen layer is to be stacked at described the 4th blooming; And
One diaphragm is to be stacked at described screen layer.
22. the manufacture method of an integrated touch panel according to claim 1 is characterized in that, its omnidistance technological temperature is to be controlled at lower than below 200 ℃, and its step comprises:
A plurality of transparency carriers of cutting forming;
Be coated with an image layer in a side periphery of described a plurality of transparency carriers, and to make the abutment line of each described image layer inner peripheral and each described transparency carrier be to be rendered as an on-right angle setting; And
Sputter one inductive layer is in each described image layer and the described transparency carrier zone that not covered by described image layer, wherein, in the described inductive layer of sputter in each described image layer with the described transparency carrier zone step that not covered by described image layer before and/or after, more comprise: at least one blooming that is shaped, and make described blooming be placed in the one or both sides face of described inductive layer.
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| CN 201010137550 CN102213850B (en) | 2010-04-01 | 2010-04-01 | Integrated touch panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010137550 CN102213850B (en) | 2010-04-01 | 2010-04-01 | Integrated touch panel |
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| CN102213850A CN102213850A (en) | 2011-10-12 |
| CN102213850B true CN102213850B (en) | 2013-06-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794038A (en) * | 2009-01-28 | 2010-08-04 | 株式会社半导体能源研究所 | Display device |
| CN201583762U (en) * | 2009-11-12 | 2010-09-15 | 天马微电子股份有限公司 | Touch liquid crystal display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101794038A (en) * | 2009-01-28 | 2010-08-04 | 株式会社半导体能源研究所 | Display device |
| CN201583762U (en) * | 2009-11-12 | 2010-09-15 | 天马微电子股份有限公司 | Touch liquid crystal display device |
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