CN102209441B - Quality control method for solder joint portion and quality control device - Google Patents
Quality control method for solder joint portion and quality control device Download PDFInfo
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- CN102209441B CN102209441B CN2010102457460A CN201010245746A CN102209441B CN 102209441 B CN102209441 B CN 102209441B CN 2010102457460 A CN2010102457460 A CN 2010102457460A CN 201010245746 A CN201010245746 A CN 201010245746A CN 102209441 B CN102209441 B CN 102209441B
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Abstract
The invention provides a quality control method for solder a joint portion, enabling highly accurate quality inspection in a non-damaged manner at a real time bases without an extra inspection process. The quality control method for a joint portion formed when solder and partial heat energy are supplied to a resin substrate, includes measuring temperature of the joint portion varying with time during jointing process, calculating a plurality of characteristic values based on the measured values, obtaining a single value index based on the plurality of characteristic values, and determining whether the joint portion is qualified or not by comparing the value index with the predetermined threshold, wherein the characteristic values includes time t1 indicating the time when the temperature of the joint portion is higher or equal to the predetermined time T1 which satisfied the conditions of (substrate vitrification temperature- 50 DEG C) <= T1<= (substrate vitrification temperature+250 DEG C), and time t2 indicating the time from utilizing heat energy to the temperature of the joint portion reaching the predetermined time T2 which satisfied the conditions of (substrate vitrification temperature-50 DEG C) <= T2<= (substrate vitrification temperature+250 DEG C).
Description
Technical field
The present invention relates to a kind of technology of quality management of the solder bonds section that carries out resin substrate terminal and electronic unit terminal.
Background technology
As printing (print) substrate being formed by metal wirings such as the resin mother metals such as epoxy resin and copper or lamination (build up) substrate (below, be generically and collectively referred to as resin substrate) terminal on engage the technology of electronic unit terminal, be widely used solder.Usually be widely used reflux type, that is, silk screen printing soldering paste on the terminal of resin substrate, in location, carry the electrode of electronic unit after, in stove, substrate integral body is heated and is carried out solder.
But, because reflux type is heated substrate integral body, so also carried electronic unit is exposed in the heat load of same degree.Therefore, for the package parts that comprise the key element that thermal endurance is lower (such as light-emitting diode, resin forming part etc.), can't utilize becomes the processing of the high temperature that is more than or equal to its heat resisting temperature upper limit stove and is processed.For this low heat resistant parts, take following method, that is, supply with partly heat and scolder and realize electrical engagement to the junction surface of base-plate terminal and component terminal, so that package temperature does not rise to the method (below, be called the localized heating mounting means) of the heat resisting temperature upper limit.
Typical example as this localized heating mounting means, be widely used the scolder flatiron mode that the flatiron of welding wire and high temperature is supplied with and engaged to above-mentioned junction surface, but productivity is low and exist the fluctuation of manual work to become problem, is not suitable for many pins, thin space, mass-produced parts solder.
As the localized heating mounting means that is applicable to the above-mentioned mode of production, known following method, replaces the flatiron heat supply that utilizes high temperature that is, and utilizes beam by the control device precision positioning to the junction surface heat supply.As beam, more use semiconductor laser, but be not limited thereto (below, be called laser scolder mode as representative) (reference example is as non-patent literature 1).
In laser scolder mode, due to can be at introversive atomic little junction surface of short time (roughly 1 second in) (beam spot diameter, is for being less than or equal to roughly 1mm) with high position precision heat supply, so be easy to automatic high-speed, be suitable for many pins, thin space, mass-produced parts solder.
In addition, except the method for simultaneously supplying with welding wire and heat energy, even in advance at parts electrode or electrode of substrate or form the method for preparation scolder on the two, laser scolder mode is favourable too.
Non-patent literature 1: in village, happiness is done, and " half Guide body レ mono-ザ は ん だ pays the け dress
, light ア ラ イ ア Application ス, in March, 2003 number ", p.32-36
Summary of the invention
But the present inventor finds following problems,, in laser scolder mode, the characteristic that the transitional temperature in the short time at place, junction surface-time changes (below, referred to as temperature characterisitic), easily along with each joint, produce fluctuation, it affects greatly engaging quality.Its reason is, carry out the supply of material (scolder) and heat energy (laser beam), and the infiltrated with molten metal expansion that scolder occurs continuously in the process of short time simultaneously such as solidifies at a plurality of phenomenons, correspondingly, temperature characterisitic is with respect to the fluctuation of the thermal capacity (amount of thickness of electrode, preparation scolder, the thickness of substrate etc.) at the fluctuation of the feed speed of scolder, preparation amount of solder and laser power, the wettability fluctuation caused by the difference of electrode surface state, junction surface etc., and changes sensitively.
Above-mentioned phenomenon is peculiar phenomenon in the localized heating mounting means, in the resistance welded that only applies heat energy, engaging time, in longer welding and solder brazing, does not produce.In addition, so-called joint quality here, refer to usually: expansion, by scolder is transferred on junction surface with suitable amount, occurs to infiltrate and formation leg (fillet) in (1) more, thereby form good metal bond interface, can guarantee thus the reliability engaged.
But (2) also require not can be due to the excessive heat absorption at junction surface on the interface of the metal of the terminal bottom of resin substrate and resin mother metal, to produce heat ageing.Although the resin at this interface is aging, can not to show quality at the goods initial stage of dispatching from the factory bad, may cause that peel off at interface and the broken string of the metal wiring that accompanies with it due to the thermal shock in market and moisture absorption.
Heat ageing state due to the interface of the metal of the substrate as shown in above-mentioned (2) and resin mother metal, be difficult to by the electrical test for obtaining electrically conducting and outward appearance test, be differentiated when goods dispatch from the factory, and, above-mentioned interface is not to peel off fully, so there is the following problems point, that is, be difficult to apply the disclosed method of being differentiated according to the heat conducting difference in interface in TOHKEMY 2000-261137 communique.
In addition, problem in the joint quality that above-mentioned (2) are recorded and narrated is relevant to the installation on the resin substrate of low heat resistant, be peculiar problem in being applied to the localized heating mounting means of resin substrate, and do not produce this problem in the resistance welded of mainly carrying out the joint between metal, welding, solder brazing.
And there is the following problems point in the disclosed technology of TOHKEMY 2000-261137 communique, that is, also need the operation of appending in addition except the solder operation, make time elongated.In addition, in the inspection operation by back segment, find continuously in underproof situation, have the following problems point, that is, owing to postponing on opportunity of the solder operation to leading portion and the more causal investigation of the operation of leading portion and operation correction, and produced a large amount of defective productss.And, owing in checking operation, applying the heat energy appended, so the problem points of the heat ageing at the interface of the metal of existence promotion substrate and resin mother metal.
The present invention proposes in view of the above problems, its purpose is, obtain quality control method and the quality management device of a kind of solder bonds section, it can be for supply with the two solder bonds technology of scolder and heat energy to junction surface, do not appending under the state that checks operation, in real time, non-destructive the and accurately heat ageing at the interface of the metal that comprises substrate and resin mother metal being checked in interior joint quality.
In order to solve above-mentioned problem, achieve the goal, the invention provides a kind of quality control method of the solder bonds section formed to supplying with scolder and local heat energy on resin substrate, it is characterized in that, there is following step, that is: the step of in joint, the temperature data over time at described junction surface being measured; Obtain the step of a plurality of characteristic quantities according to measured described data; Obtain the step of single numerical value index according to a plurality of described characteristic quantities; And described numerical value index and predetermined threshold value are compared, judge the qualified or underproof step in described junction surface, a plurality of described characteristic quantities comprise: time t
1, it is that the temperature at described junction surface is more than or equal to satisfied (vitrification point of described substrate-50 ℃)≤T
1The predetermined temperature T of this condition of≤(vitrification point of described substrate+250 ℃)
1Time; And time t
2, it is the moment from utilizing described heat energy to start heating, extremely the temperature at described junction surface reaches satisfied (vitrification point of described substrate-50 ℃)≤T
2The predetermined temperature T of this condition of≤(vitrification point of described substrate+250 ℃)
2Till time.
The effect of invention
According to the present invention, can realize following effect,, quality control method and the quality management device of a kind of solder bonds section can be provided, it, can be in real time, non-destructive and check accurately the joint quality that comprises the interfacial aging in solder bonds under the state of the inspection operation of not appending.
The accompanying drawing explanation
Fig. 1 means the figure of the state in the joint of laser soldering of execution mode involved in the present invention 1.
Fig. 2 is that the engaging condition of explanation in execution mode 1 is the figure of an example of the curve of laser power and scolder feed speed.
Fig. 3 means and utilizes the figure of temperature characteristic measuring unit to the junction surface temperature result that situation is measured over time of the qualified product in execution mode 1.
Fig. 4 means and utilizes the figure of temperature characteristic measuring unit to the junction surface temperature result that situation is measured over time of the defective item in execution mode 1.
Fig. 5 mean with execution mode 1 in characteristic quantity t
1The figure of generation frequency of the corresponding qualified product of value, defective item.
Fig. 6 mean with execution mode 1 in characteristic quantity t
2The figure of generation frequency of the corresponding qualified product of value, defective item.
Fig. 7 mean with execution mode 1 in characteristic quantity t
1, t
2Corresponding qualified product, the generation distribution of defective item and the figure in threshold value boundary line of value.
Fig. 8 means the figure of the generation frequency of the qualified product corresponding with the value of single index D in execution mode 1, defective item.
Fig. 9 means the flow chart of the quality control method of the solder bonds section in execution mode 1.
Embodiment
Below, based on accompanying drawing, describe the execution mode of quality control method involved in the present invention and quality management device in detail.In addition, the present invention is not limited to present embodiment.
Execution mode 1
Fig. 1 means the figure of the state in the joint of laser soldering of execution mode involved in the present invention 1.The component terminal 101 of electronic unit 100 engages with the base-plate terminal 201 of resin substrate 200 via scolder 401.Timing in regulation, supply with the welding wire 400 (feed mechanism of welding wire 400 is not shown) of solid to junction surface with speed v (function of time), the power p (function of time) of usining supplies with the laser beam 300 (laser beam irradiation source, detent mechanism etc. are not shown) as the heat energy supply source simultaneously.As shown in Figure 1, by heat supply partly, the temperature that can suppress electronic unit 100 rises.
Fig. 2 means the figure of an example of engaging condition curve of the power p of welding wire feed speed v and laser.This engaging condition is according to the thermal capacity of distribution in the substrate of the bottom of the component terminal 101, base-plate terminal 201 and the base-plate terminal 201 that form junction surface, reaches the needed amount of solder of joint etc., suitable definite Design Designation to meet two kinds of modes that engage qualities shown below, be not limited to the curve of Fig. 2.
Expansion, by scolder is transferred on junction surface with suitable amount, occurs to infiltrate and the formation leg, thereby forms good metal bond interface in (engaging quality 1), can guarantee thus the reliability engaged.
(engage quality 2) can be due to the excessive heat absorption at junction surface do not produce heat ageing (hereinafter referred to as interfacial aging) on the interface of the metal of the terminal bottom of resin substrate and resin mother metal.
In addition, also can replace and supply with welding wire 400, and in advance to component terminal 101 or base-plate terminal 201 or the two supply preparation scolder.The preparation scolder can form the scolder of paste by known methods such as dispenser (dispenser), silk screen printing, platings.In addition, also can and use preparation scolder and welding wire.All produce in either event same problem as follows.
In the situation that supply with welding wire, the laser power p in Fig. 2 and welding wire feed speed v fluctuate, as laser power p, rising to p
1, scolder feed speed v is from v
1Be changed to v
2Moment t
0Such change point place, the transitional temperature characterisitic that may produce the short time on the junction surface corresponding with each joint fluctuates.
In addition, in the situation that supply with in advance the preparation scolder, also due to preparation amount of solder and electrode, fluctuate accordingly, thermal capacity and electrode change accordingly and produce same problem.
Except the fluctuation of above-mentioned engaging condition, the fluctuation of the thermal capacity (thickness of thickness of electrode, preparation amount of solder, substrate etc.) at certain infiltrating fluctuation that exists the difference by electrode surface state to cause, junction surface, especially, in the situation that localized heating mode as in this embodiment, because phenomenon develops at short notice, so its impact significantly.
Due to the fluctuation existed in above-mentioned manufacture, so, even suitably determine the engaging condition that meets above-mentioned (engaging quality 1), also may produce defective (below, referred to as defective) that do not meet randomly above-mentioned (engaging quality 2).Especially, in the situation that produce interfacial aging 202 as shown in Figure 1, can't they be detected by visual examination and electric checking, the state that may exist reliability to reduce with inside dispatches from the factory.
Underproof existence can be known by following method,, for example, solder portion 401 after engaging is heated again, apply shearing force (with respect to the direction of real estate level) to base-plate terminal 201, know this underproof existence according to the reduction of the fracture strength of the substrate interface 203 of base-plate terminal 201 and resin substrate 200, but owing to being failure test, so be difficult to utilize this method to all being checked.
In addition, also can consider shearing force is arranged to higher limit, according to the method that whether ruptures and checked, but, owing to again being heated, so it is defective to make original qualified product become, or excessively applies shearing force and qualified product are destroyed.Therefore, expect a kind of load that does not apply again heating etc., the method checked in nondestructive mode.
Fig. 3 and Fig. 4 utilize 500 pairs of the temperature characteristic measuring unit shown in Fig. 1 in the situation that carry out the result that the temperature situation over time at the junction surface (surface of the scolder 401 be transferred) of solder is measured under the engaging condition of Fig. 2.The result of above-mentioned failure test is, illustrate Fig. 3 temperature-time response be qualified product, illustrate Fig. 4 temperature-time response be defective item.
If roughly observe temperature-time response of Fig. 3, Fig. 4, can find: for becoming the underproof junction surface corresponding with Fig. 4, exist bulk temperature higher, and long etc. tendency of the time in high temperature.Therefore, collect in a large number the temperature characterisitic data of qualified product and defective item, utilize statistical method to verify its difference, consequently, know that differentiation qualified product and defective item need two kinds of at least following characteristic quantities.
(characteristic quantity 1) t
1: the temperature at junction surface is more than or equal to temperature T
1Time.Wherein, (vitrification point of substrate-50 ℃)≤T
1≤ (vitrification point of substrate+250 ℃)
(characteristic quantity 2) t
2: (moment t while starting from heating
0) reach temperature T to the temperature at junction surface
2Till time.Wherein, (vitrification point of substrate-50 ℃)≤T
2≤ (vitrification point of substrate+250 ℃)
In addition, in the present embodiment, owing to using glass epoxide resin substrate 200 processed (150 ℃ of vitrification points), so specifically, t
1(characteristic quantity 1) drops on 100 ℃≤T for the temperature at junction surface is more than or equal to
1Certain temperature in≤400 ℃ of scopes (T for example
1=300 ℃) time.In the same manner, t
2(moment t when (characteristic quantity 2) means starting from heating of junction surface
0) to temperature, reach and drop on 100 ℃≤T
2Certain temperature in≤400 ℃ of scopes (T for example
2=200 ℃) till time.
Characteristic quantity t
1And t
2Be based on the measurement result of the temperature characteristic measuring unit 500 of Fig. 1, and calculate by quality management unit 600.Below, illustrate for determining above-mentioned characteristic quantity 1 (t
1), characteristic quantity 2 (t
2) temperature T
1And T
2Preferable range.
Characteristic quantity 1 is that junction surface is exposed to and is more than or equal to predefined temperature T
1Under time t
1, mean to be present in resin mother metal 200 on substrate interface 203 due to heat aging degree.Resin is softening under vitrification point, if be exposed to for a long time near this temperature or be more than or equal at the temperature of this temperature, produces heat ageing, and metal on substrate interface 203 and the adhesive strength of resin are reduced.
Now, by T
1Be set as comparing with (vitrification point of substrate-50 ℃) in little situation, for nearly all junction surface, be difficult to make t
1Produce difference, the discrimination precision of qualified product and defective item is reduced.In addition, by T
1Be set as comparing with (vitrification point of substrate+250 ℃) in large situation, t
1Be that 0 junction surface accounts for most, in the same manner, the discrimination precision of qualified product and defective item reduced.
Now, due to by T
2Being set as comparing with (vitrification point of substrate-50 ℃) in little situation, is the impact that base plate resin does not have softening state, to engaging quality, exerts an influence hardly, and institute is so that the discrimination precision reduction of qualified product and defective item.In addition, by T
2Be set as comparing with (vitrification point of substrate+250 ℃) in large situation, for nearly all junction surface, be difficult to make t
2Produce difference, in the same manner, the discrimination precision of qualified product and defective item is reduced.
In addition, T
1And T
2More preferably value, can utilize such as statistical methods such as known multiple regression analysis the experimental data based on actual and setting.In the present embodiment, T
1=300 ℃, T
2=200 ℃ are preferred value, but are not limited thereto.
Fig. 5 and Fig. 6 mean respectively characteristic quantity 1 (t
1) value and characteristic quantity 2 (t
2) value and the figure of the generation frequency of qualified product defective item.With respect to any characteristic quantity, all can be by setting preferred T
1And T
2Thereby, respectively at decision threshold t
Th1And t
Th2Qualified product and defective item are roughly differentiated in front and back.
But, sometimes can't utilize some characteristic quantities and fully differentiate qualified product and defective item.In Fig. 5 and Fig. 6, if definite threshold t
Th1And t
Th2, not make defective item outflow, some in qualified product also are considered as to defective item, and the qualified product that should dispatch from the factory are scrapped, and fraction defective is increased together with manufacturing cost.For this problem, even append characteristic quantity beyond above-mentioned 2 characteristic quantities (such as maximum temperature etc.), can not change.
Therefore, below, illustrate that by above-mentioned 2 characteristic quantities be comprehensively 1 single index D, further improve the situation of the precision that qualified product and defective item are differentiated by using this single index D.Carrying out characteristic quantity t for a large amount of qualified product and defective item
1And t
2Between the investigation of relation after, obtain distribution as shown in Figure 7.
Qualified product and defective item can't be by only being used t
1Or t
2In some independent characteristic quantities differentiation or the t that carry out
1Threshold determination and t
2The logic multiply (t of threshold determination
1>t
Th1And t
2<t
Th2) and fully differentiated.But, can be differentiated in the front and back of the line threshold boundary 900 shown in Fig. 7.That is, if make threshold value t
Th1And t
Th2Become function each other, can carry out the differentiation of qualified product and defective item.
If a plurality of characteristic quantities can be transformed to, mean with boundary line with respect to above-mentioned a plurality of (being 2 here) characteristic quantity (in the situation that be more than or equal to 3, for bounding hyperplane) numerical value of the position of the direction of quadrature, can utilize 1 scalar to be differentiated.As the method that be comprehensively above-mentioned single numerical value index D, the Mahalanobis generalised distance in known for example MT method (Ma Shi-field mouth method) or the overall merit standard in T method (field mouth method) (be called field mouth apart from).Because wherein the latter is easier, thus aspect the memory capacity of computational speed and software for calculation, the real-time judgment that is more suitable for the solder in-process process (with reference to " the profound Pin Quality engineering Bian list of field mouth; the new Wen of daily magazine industry society, (2007), p.143-147 ").
Here, in the process of utilizing field mouth single numerical value index D apart from calculating, need to be by the standard of the status number value of qualified product, defective item.Therefore, for example, if as in the situation that qualified product be 0, in the situation that defective item is in the of 1, give different value arbitrarily and get final product (this value being called to the true value in the situation of true value in the situation of qualified product, defective item).Therefore, in the situation that setting true value as noted above, numerical value index D is in the situation that qualified product become the value that approaches 0, in the situation that defective item becomes the value that approaches 1 or the large value than 1.
If use the numerical value index D calculated in the manner described above to be investigated the distribution of qualified product and defective item, become the situation shown in Fig. 8.From Fig. 8 clearly, if with respect to numerical value index D, threshold value D is set
Th, can determine qualified product and defective item.
As the computational methods of concrete numerical value index D, can consider for example to be defined as characteristic quantity t
1And t
2The method etc. of weighting summation value.That is, as t
1And t
2The weighting summation value, if be chosen in this weighting summation value on the parallel line of the line threshold boundary 900 of Fig. 7 and always get the coefficient of identical value,, by using this weighting summation value as single numerical value index D, can realize thus the above-mentioned qualified product that carry out according to threshold determination and the differentiation of defective item.
In the above-described embodiment, for 2 characteristic quantities, be illustrated, but carry out comprehensively in the situation that increase wherein other characteristic quantity, also can utilize identical computational methods to calculate single index D.This single index D is calculated by quality management unit 600, by D and the threshold value D calculated
ThBetween comparison carry out, judge for qualified product or the whether qualified of defective item, also by quality management unit 600, undertaken.
That is, in the present embodiment, illustrated that quality management unit 600 doubles as the situation of feature amount calculation unit, single index computing unit, whether qualified identifying unit, but characteristic quantity t
1And t
2Calculating, the calculating of single index D, whether qualified the said goods is judges, also can utilize different device respectively and carry out.
If operation described above is summarized as to flow chart, as shown in Figure 9.That is, as shown in Figure 1, supply with scolder 400 and heat energy 300 (step S0) to junction surface.Then, utilize temperature characteristic measuring unit 500 to measure " temperature-time response " (the step S1) that supplies with the junction surface (surface of scolder 401) till starting extremely to have engaged from heat energy 300.Then, " temperature-time response " that quality management unit 600 is measured according to temperature characteristic measuring unit 500, calculate and comprise t
1, t
2At interior characteristic quantity (step S2).
Then, quality management unit 600 is according to a plurality of characteristic quantity (t that obtain in step S2
1, t
2, x
1, x
2..., x
k), utilize above-mentioned known method, calculate overall merit standard (field mouth distance), obtain single index D=f (t
1, t
2, x
1, x
2..., x
k) (step S3).As the computational methods of single index D, can t described above
1And t
2The weighting summation value such, calculate the weighting summation value of a plurality of characteristic quantities and obtain.
Finally, quality management unit 600 is by the single index D and the threshold value D that obtain in step S3
ThCompare (step S4), at D<D
ThSituation under, be judged to be qualified product (step S5), at D>=D
ThSituation under, be judged to be defective item (step S6).
The quality control method of the solder bonds section of being moved by the flow process based on above-mentioned steps S0～S6 and quality management device, can realize under the state of the inspection operation of not appending, can be in real time and non-destructive, check accurately the quality management of the quality of solder bonds section.
But, in the size due to electrode of substrate, have or not the difference towards via hole of electrode lower floor etc., and, in the different situation of the thermal capacity that makes each electrode in a substrate, in the curve of the solder engaging condition shown in Fig. 2, set separately the value that is applicable to its thermal capacity.In the case, use the temperature characterisitic data that gather for each electrode, determine respectively calculating formula and the threshold value D thereof of single numerical value index for each electrode
Th.
In addition, more preferably sampling period during temperature characteristic measuring unit 500 collecting temperatures-time response is less than or equal to 10ms for being more than or equal to 0.1ms.If it is short that the sampling period compares with 0.1ms, the data bulk that should be processed becomes huge, and computational speed is slack-off, needs a large amount of memory capacity, therefore not preferred.
On the other hand, the length if the sampling period compares with 10ms, the certainty of measurement step-down of characteristic quantity 1, characteristic quantity 2, thus qualified, underproof discrimination precision is reduced, therefore not preferred.In addition, in the present embodiment, select 1ms (being 1 second in the situation that engage needed total time, is 1000 data) as the sampling period, but be not limited thereto.
In addition, as for measuring the unit of temperature-time response, preferred radiation thermometer.With the situation of for example thermocouple, compare, the measurement response of this radiation thermometer is good, can be with the temperature of non-contact mode measuring solder surface.In addition, owing to can being positioned on less electrode position, measured, so be suitable for using in the localized heating mounting means.
In addition, the present invention is not limited to above-mentioned execution mode, the implementation phase, can in the scope that does not break away from its purport, carry out various distortion.In addition, in the above-described embodiment, the invention that comprises the various stages, by by disclosed a plurality of constitutive requirements appropriate combination, can obtain various inventions.Even for example from all constitutive requirements shown in execution mode, deleting some constitutive requirements, also can solve the problem that " summary of the invention " part is recorded and narrated, obtain in the situation of the effect recorded and narrated of " effect of invention " part, can the structure after deleting these constitutive requirements extract as invention.And, also can be by the inscape appropriate combination in different execution modes.
Industrial applicibility
As noted above, the quality control method of solder bonds section involved in the present invention and quality management device, the quality management at the junction surface during for the solder bonds of resin substrate terminal and electronic unit terminal is useful, especially, being applicable to the goods that the quality based on solder bonds section carries out is that the whether qualified of qualified product or defective item judged.
Claims (9)
1. the quality control method of a solder bonds section, it carries out quality management for the solder bonds section formed for supply with scolder and local heat energy on resin substrate,
It is characterized in that,
There is following step, that is:
The step of in joint, the temperature data over time at described junction surface being measured;
Obtain the step of a plurality of characteristic quantities according to measured described data;
Obtain the step of single numerical value index according to a plurality of described characteristic quantities; And
Described numerical value index and predetermined threshold value are compared, judge the qualified or underproof step in described junction surface,
A plurality of described characteristic quantities comprise:
Time t
1, it is that the temperature at described junction surface is more than or equal to the vitrification point-50 ℃ that meets described substrate≤T
1The predetermined temperature T of the vitrification point of≤described substrate+250 ℃ this condition
1Time; And
Time t
2, it is the moment from utilizing described heat energy to start heating, reaches the vitrification point-50 ℃ that meets described substrate≤T to the temperature at described junction surface
2The predetermined temperature T of the vitrification point of≤described substrate+250 ℃ this condition
2Time.
2. the quality control method of solder bonds according to claim 1 section, is characterized in that,
Described numerical value index is based on time t
1And time t
2The T method be the overall merit standard in the mouth method of field.
3. the quality control method of solder bonds according to claim 1 section, is characterized in that,
Described numerical value index is time t
1And time t
2The weighting summation value.
4. according to the quality control method of claim 1,2 or 3 described solder bonds sections, it is characterized in that,
The sampling period that the temperature data over time at described junction surface are measured is be more than or equal to 0.1ms and be less than or equal to 10ms.
5. the quality management device of a solder bonds section, it carries out quality management for the solder bonds section formed for supply with scolder and local heat energy on resin substrate,
It is characterized in that,
Have:
The temperature characteristic measuring unit, it measures the temperature data over time at described junction surface in joint;
Feature amount calculation unit, it obtains a plurality of characteristic quantities according to measured described data;
Numerical value index computing unit, it obtains single numerical value index according to a plurality of described characteristic quantities; And
Identifying unit, it compares described numerical value index and predetermined threshold value, judges that described junction surface is qualified or defective,
A plurality of described characteristic quantities comprise:
Time t
1, it is that the temperature at described junction surface is more than or equal to the vitrification point-50 ℃ that meets described substrate≤T
1The predetermined temperature T of the vitrification point of≤described substrate+250 ℃ this condition
1Time; And
Time t
2, it is the moment from utilizing described heat energy to start heating, reaches the vitrification point-50 ℃ that meets described substrate≤T to the temperature at described junction surface
2The predetermined temperature T of the vitrification point of≤described substrate+250 ℃ this condition
2Time.
6. the quality management device of solder bonds according to claim 5 section, is characterized in that,
Described numerical value index is based on time t
1And time t
2The T method be the overall merit standard in the mouth method of field.
7. the quality management device of solder bonds according to claim 5 section, is characterized in that,
Described numerical value index is time t
1And time t
2The weighting summation value.
8. according to the quality management device of claim 5,6 or 7 described solder bonds sections, it is characterized in that,
The sampling period that the temperature data over time at described junction surface are measured is be more than or equal to 0.1ms and be less than or equal to 10ms.
9. according to the quality management device of claim 5,6 or 7 described solder bonds sections, it is characterized in that,
Described temperature characteristic measuring unit is radiation thermometer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010076100A JP5328707B2 (en) | 2010-03-29 | 2010-03-29 | Quality control method and quality control apparatus for solder joints |
| JP2010-076100 | 2010-03-29 |
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| Publication Number | Publication Date |
|---|---|
| CN102209441A CN102209441A (en) | 2011-10-05 |
| CN102209441B true CN102209441B (en) | 2013-12-04 |
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|---|---|---|---|
| CN2010102457460A Expired - Fee Related CN102209441B (en) | 2010-03-29 | 2010-08-03 | Quality control method for solder joint portion and quality control device |
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| CN (1) | CN102209441B (en) |
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| US10716220B2 (en) | 2014-08-04 | 2020-07-14 | Ok International, Inc. | Variable temperature controlled soldering iron |
| US9516762B2 (en) * | 2014-08-04 | 2016-12-06 | Ok International Inc. | Soldering iron with automatic soldering connection validation |
| US10688578B2 (en) | 2014-08-04 | 2020-06-23 | OK International, Inc | Variable temperature controlled soldering iron |
| CN110849929B (en) * | 2019-11-29 | 2020-08-14 | 无锡物联网创新中心有限公司 | Method for monitoring release state of sensor with suspension structure |
| US20220395941A1 (en) * | 2020-01-27 | 2022-12-15 | Mitsubishi Electric Corporation | Automatic screw tightening method and automatic screw tightening apparatus |
| CN112101458B (en) * | 2020-09-16 | 2024-04-19 | 河海大学常州校区 | Characteristic measurement method and device based on field function-signal-to-noise ratio |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237346A (en) * | 1986-04-08 | 1987-10-17 | Olympus Optical Co Ltd | Soldering inspection device for surface packaging component |
| JPS62297750A (en) * | 1986-06-17 | 1987-12-24 | Matsushita Electric Ind Co Ltd | Inspecting device for soldering |
| JPH01195356A (en) * | 1988-01-29 | 1989-08-07 | Toshiba Corp | Inspecting device for soldering by laser |
| JPH02201148A (en) * | 1989-01-30 | 1990-08-09 | Nec Corp | Method of inspecting solder joining part |
| JPH0758448A (en) * | 1993-08-09 | 1995-03-03 | Mitsubishi Electric Corp | Device and method for laser bonding |
| JPH0856074A (en) * | 1994-08-09 | 1996-02-27 | Matsushita Electric Ind Co Ltd | Operation condition control method and device of soldering device |
| JP3570647B2 (en) * | 1996-02-02 | 2004-09-29 | 日置電機株式会社 | Non-contact type foot lifting detecting device and foot lifting detecting device of XY type in-circuit tester |
| JPH11138291A (en) * | 1997-11-06 | 1999-05-25 | Honda Motor Co Ltd | Welding quality judging device in welding equipment |
| JP2000261137A (en) * | 1999-03-12 | 2000-09-22 | Nec Corp | Connection inspection system of electronic component and its method |
| JP4223159B2 (en) * | 1999-09-20 | 2009-02-12 | パナソニック株式会社 | Electronic component mounting equipment |
| US6585146B2 (en) * | 2000-01-06 | 2003-07-01 | Thermal Wave Imaging, Inc. | Automated non-destructive weld evaluation method and apparatus |
| JP5034120B2 (en) * | 2009-01-29 | 2012-09-26 | 三菱電機株式会社 | Product assembly adjustment method and assembly adjustment apparatus |
-
2010
- 2010-03-29 JP JP2010076100A patent/JP5328707B2/en active Active
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| Publication number | Publication date |
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| JP2011210884A (en) | 2011-10-20 |
| JP5328707B2 (en) | 2013-10-30 |
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