CN102208381B - 集成门极换向晶闸管三电平功率模块的循环冷却管路 - Google Patents
集成门极换向晶闸管三电平功率模块的循环冷却管路 Download PDFInfo
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- CN102208381B CN102208381B CN2011101414373A CN201110141437A CN102208381B CN 102208381 B CN102208381 B CN 102208381B CN 2011101414373 A CN2011101414373 A CN 2011101414373A CN 201110141437 A CN201110141437 A CN 201110141437A CN 102208381 B CN102208381 B CN 102208381B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011101414373A CN102208381B (zh) | 2011-03-31 | 2011-05-30 | 集成门极换向晶闸管三电平功率模块的循环冷却管路 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN201110079173 | 2011-03-31 | ||
CN201110079173.3 | 2011-03-31 | ||
CN2011101414373A CN102208381B (zh) | 2011-03-31 | 2011-05-30 | 集成门极换向晶闸管三电平功率模块的循环冷却管路 |
Publications (2)
Publication Number | Publication Date |
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CN102208381A CN102208381A (zh) | 2011-10-05 |
CN102208381B true CN102208381B (zh) | 2013-03-06 |
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Application Number | Title | Priority Date | Filing Date |
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CN2011101414373A Expired - Fee Related CN102208381B (zh) | 2011-03-31 | 2011-05-30 | 集成门极换向晶闸管三电平功率模块的循环冷却管路 |
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CN (1) | CN102208381B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105161471B (zh) * | 2015-07-28 | 2017-01-11 | 南京南瑞继保电气有限公司 | 换流阀晶闸管组件散热器 |
CN109121360B (zh) * | 2018-07-03 | 2019-12-20 | 安徽好润环保科技有限公司 | 一种改善水冷管冷却效率的电子产品冷却装置 |
CN109121359B (zh) * | 2018-07-03 | 2019-12-20 | 安徽好润环保科技有限公司 | 一种提高冷却水冷却效率的电子产品冷却设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2648605Y (zh) * | 2003-08-22 | 2004-10-13 | 北京金自天正智能控制股份有限公司 | 水冷平板型电力电子半导体器件组件 |
CN2842735Y (zh) * | 2005-10-24 | 2006-11-29 | 比亚迪股份有限公司 | 一种绝缘栅双极晶体管的平板式水冷散热器 |
CN101420168A (zh) * | 2008-11-29 | 2009-04-29 | 永济新时速电机电器有限责任公司 | 用于变流器功率模块的水冷却装置 |
CN101697448A (zh) * | 2009-10-24 | 2010-04-21 | 永济新时速电机电器有限责任公司 | 变流器功率模块双面水冷散热基板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6711017B2 (en) * | 2001-07-17 | 2004-03-23 | Hitachi Kokusai Electric Inc. | Cooling apparatus for electronic unit |
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2011
- 2011-05-30 CN CN2011101414373A patent/CN102208381B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2648605Y (zh) * | 2003-08-22 | 2004-10-13 | 北京金自天正智能控制股份有限公司 | 水冷平板型电力电子半导体器件组件 |
CN2842735Y (zh) * | 2005-10-24 | 2006-11-29 | 比亚迪股份有限公司 | 一种绝缘栅双极晶体管的平板式水冷散热器 |
CN101420168A (zh) * | 2008-11-29 | 2009-04-29 | 永济新时速电机电器有限责任公司 | 用于变流器功率模块的水冷却装置 |
CN101697448A (zh) * | 2009-10-24 | 2010-04-21 | 永济新时速电机电器有限责任公司 | 变流器功率模块双面水冷散热基板 |
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CN102208381A (zh) | 2011-10-05 |
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Owner name: TONGJI UNIVERSITY Free format text: FORMER OWNER: SHANGHAI MAGLEV TRANSPORTATION DEVELOPMENT CO., LTD. Effective date: 20150213 Free format text: FORMER OWNER: SHANGHAI MAGNETIC SUSPENSION COMMUNICATION ENGINEERING TECHNOLOGY RESEARCH CENTE Effective date: 20150213 |
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Effective date of registration: 20150213 Address after: 200092 Shanghai City, Yangpu District Siping Road No. 1239 Patentee after: Tongji University Address before: 201204 Pudong New Area, Longyang Road, No. 2520, Patentee before: Shanghai Maglev Transportation Development Co., Ltd. Patentee before: Shanghai Magnetic Suspension Communication Engineering Technology Research Cente |
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