CN102203928A - Wire bonding method and semiconductor device - Google Patents

Wire bonding method and semiconductor device Download PDF

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Publication number
CN102203928A
CN102203928A CN2008801316057A CN200880131605A CN102203928A CN 102203928 A CN102203928 A CN 102203928A CN 2008801316057 A CN2008801316057 A CN 2008801316057A CN 200880131605 A CN200880131605 A CN 200880131605A CN 102203928 A CN102203928 A CN 102203928A
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capillary
lead
wire
pad
towards
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CN102203928B (en
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三井竜成
鄭森介
木内逸人
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Shinkawa Ltd
Arakawa Co Ltd
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Arakawa Co Ltd
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

A wire bonding method includes a first bonding step, a wire press-in step and a second bonding step. In the first bonding step, an initial ball formed at the leading end of a wire is bonded to a first bonding point (11) by a capillary to form a pressure bonding ball (12). In the wire press-in step, continuous operation of bringing up the capillary substantially vertical and then diagonally bringing down the capillary toward a second bonding point (19) by a quantity smaller than the quantity the capillary is brought up is repeated a plurality of times to press-in the wire at a plurality of positions toward the second bonding point (19). In the second bonding step, the capillary is brought up, then moved toward the second bonding point (19), and the wire is bonded to the second bonding point (19) with pressure. Thus, in bonding the wire to the first bonding point and the second bonding point, height of wire loop is reduced, while suppressing deterioration of wire strength.

Description

Lead welding method and semiconductor device
Technical field
The present invention relates to connect the lead welding method of first pad and second pad, and have the annular semiconductor device of lead-in wire that connects first pad and second pad with lead-in wire with lead-in wire.
Background technology
In the assembling of semiconductor device, use by metal fine and be mounted on wire bonds between the pin of the pad (pad) of the semiconductor chip of leadframe and leadframe.Wire bonds can be used lead bonding device, adopts following method: form original ball at the lead-in wire front end at first, make by capillary the pad crimping of this original ball and semiconductor chip to form the pressure welding ball.Then, make capillary rise, towards the opposition side of second pad, after the reverse action, make that further capillary rises to institute's take the altitude after, make capillary move towards the second pad direction, lead-in wire is connected on second pad (for example, with reference to patent documentation 1 Fig. 4 to Fig. 6).
Like this, if make the capillary action, welding lead, shape with feed-through collar is made as triangle or trapezoidal shape mostly, described triangle comprises the lead-in wire neck that extends at the pressure welding ball of the pad of semiconductor chip from pressure welding up, and the sloping portion from the lead-in wire neck towards the second pad bending, described trapezoidal shape comprises the horizontal component that extends towards the second pad approximate horizontal from the lead-in wire neck, and the sloping portion that extends from horizontal component towards second pad.This is owing to if make the part near the pressure welding ball move towards horizontal direction capillaceous towards second pad, then produce friction sometimes in moving between capillary and metal fine, can give and the cause of damage neck portion.
But this feed-through collar shape comprises the lead-in wire neck that erects towards the top from the pressure welding ball, and therefore, the feed-through collar height uprises, and existence can not reduce by the height of the semiconductor device integral body of wire bonds assembling or the problem of thickness.
So, following welding method has been proposed: after being welded on first pad, it is some that implementation makes that capillary rises, towards the reverse action of moving with the second pad opposition side, it is some to make that further capillary rises, after the forward motion of the second pad side shifting, make capillary descend, the neck portion that will go between is turned back and is crimped on the pressure welding ball, after bearing of trend is made as level or the position than the some tops of level with lead-in wire, from capillary front end output lead,, follow on one side Yi Bian make capillary rise, make capillary move to second pad, lead-in wire is connected second pad (for example, with reference to Fig. 1 to Fig. 3 of patent documentation 1, or Fig. 1 to Fig. 3 of patent documentation 2).
In addition, following welding method has been proposed: in the welding method of welding first pad and second pad, after first pad forms the pressure welding ball, make capillary rise slightly, move towards second pad, make the few amount of capillary suppression ratio capillary ascending amount, pushing down goes between, then, make capillary rise, on one side output lead, make capillary move on one side towards the second pad direction, lead-in wire is connected second pad (for example, with reference to patent documentation 3 Fig. 1 and Fig. 2).
Again, form the lead welding method of the low ring of about 100 μ m as the dome height of feed-through collar, following welding method has been proposed: after the welding of first pad forms the pressure welding ball, carry out first rising, first descend and parallelly move, second rise, second descend and parallel moving after, be welded on second pad.In the method, proposed in first rises, after rising to the several times height of necessary feed-through collar dome height, in second rises, only press the action of feed-through collar length again, simultaneously, descend and parallelly move, second descend and parallel moving is made as arcuation (for example, with reference to patent documentation 4 Fig. 3) first.
Again, following welding method has been proposed: in the welding method of welding first pad and second pad, after the welding of first pad forms pressure welding ball and ball neck, make capillary just move obliquely, make after the oblique inclination of ball neck, repeatedly carry out by after the capillary rising, moving horizontally the crooked bending operation of feasible lead-in wire towards second pad, make capillary rise, Cheng Huan is at second pad, is welded on second pad (for example, with reference to patent documentation 5 Fig. 1 to Fig. 4).
[patent documentation 1] TOHKEMY 2004-172477 communique
[patent documentation 2] Japanese kokai publication hei 9-51011 communique
[patent documentation 3] TOHKEMY 2005-39192 communique
[patent documentation 4] Japanese kokai publication hei 8-316260 communique
No. 4137061 specification of [patent documentation 5] Japan Patent
In the welding method of the conventional art of patent documentation 1 or patent documentation 2 records, lead-in wire is turned back on the pressure welding ball, form head part, therefore, there is near the pin problem of damaging sometimes first pad.Again, the height of head part is so not low, and sometimes can not be lower with the feed-through collar height of feasible integral body require is corresponding.
On the other hand, the welding method of the conventional art of patent documentation 3 records, do not have as the method that patent documentation 1 or patent documentation 2 are put down in writing, lead-in wire turned back forms head part on the pressure welding ball, but makes the lead-in wire of the part that is connected with the pressure welding ball, towards the second pad bending, lead-in wire is connected on second pad, therefore, compare, can reduce the feed-through collar whole height with the method for patent documentation 1 or patent documentation 2 records.Again, the welding method as conventional art of patent documentation 5 record, can suppress to first pad near the damage that goes between, reduction feed-through collar height.
But, the welding method of the conventional art of patent documentation 3 records, after will pushing towards second pad towards horizontal direction with the lead-in wire of pressure welding ball coupling part by capillary, pushing down, make the few amount of capillary suppression ratio capillary ascending amount, therefore, make when horizontal with capillary tube moves, sometimes because of the frictional force of capillary and lead-in wire will with the lead-in wire of pressure welding ball coupling part towards the axial drawing of lead-in wire.And if such drawing lead-in wire, then the sectional area with the lead-in wire of pressure welding ball coupling part diminishes, and lead-in wire intensity reduces, and causes the problem of lead-in wire broken string when having.Equally, the welding method of the conventional art of patent documentation 5 records makes that also lead-in wire moves horizontally towards the second pad direction, therefore, because of the frictional force of capillary and lead-in wire, the lead-in wire of drawing and pressure welding ball coupling part, the problem that exists lead-in wire intensity to reduce.
In addition, the welding method of the conventional art of patent documentation 4 records makes the capillary that rises descend with the arcuation track and parallel moving, therefore, the lead-in wire intensity that can suppress as the conventional art of patent documentation 3 and patent documentation 5 records is low, but, the height of feed-through collar can only form the low ring about about 100 μ m, has the problem that is difficult to form lower feed-through collar.
Summary of the invention
So, the objective of the invention is to, in being connected of first pad and second pad, on one side to suppress lead-in wire intensity low, can make that the feed-through collar height is lower on one side.
For the means that solve above-mentioned problem as follows.
Lead welding method of the present invention is for connecting between first pad and second pad with lead-in wire, and this lead welding method comprises:
First welding sequence makes the original ball that is formed on the lead-in wire front end be bonded on first pad by capillary, forms the pressure welding ball;
Lead-in wire pushing operation, behind first welding sequence, repeatedly carry out repeatedly make capillary generally perpendicularly rise the back, make capillary towards of the continuous action of the second pad direction towards the few amount of oblique below suppression ratio capillary ascending amount, in a plurality of positions below tiltedly the pushing lead-in wire;
Second welding sequence after the lead-in wire pushing operation, makes capillary rise, and then, makes capillary move towards the second pad direction, by wire bonding is engaged on second pad.
In lead welding method of the present invention, suitable is that the ascending amount primary capillaceous of continuous action is bigger than secondary ascending amount capillaceous.Again, suitable is that continuous action is behind first welding sequence, makes capillary generally perpendicularly rise, and then, is radius with ascending amount capillaceous, makes capillary do the circular-arc action of circular-arc mobile rising towards the second pad direction.
In addition, in lead welding method of the present invention, suitable is, continuous action capillaceous circular-arc moved to the circular arc action as the center of the capillaceous circular-arc mobile end point of continuous action last time.Again, suitable is, the move angle during continuous action primary capillaceous circular-arc mobile is bigger than secondary circular-arc move angle when mobile capillaceous.
Again, in lead welding method of the present invention, suitable is that circular-arc the moving of the circular-arc action of rising is that capillary moves along the approximate broken line with the approximate circular arc of many straight lines.Again, suitable is, continuous action for the third time after the ascending amount capillaceous of (comprising for the third time) than for the first time, secondary ascending amount capillaceous is big.
Again, in lead welding method of the present invention, suitable is, between the lead-in wire pushing operation and second welding sequence, comprise that kinking forms operation, this kinking forms operation makes capillary rise, then, at least carry out the reverse action that makes that once the capillary court and the second pad rightabout move, on lead-in wire, form kinking.
Semiconductor device of the present invention has with the feed-through collar between lead-in wire connection first pad and second pad, has the feed-through collar shape that forms by following operation:
First welding sequence makes the original ball that is formed on the lead-in wire front end be bonded on first pad by capillary, forms the pressure welding ball;
Lead-in wire pushing operation, behind first welding sequence, repeatedly carry out repeatedly make capillary generally perpendicularly rise the back, make capillary towards of the continuous action of the second pad direction towards the few amount of oblique below suppression ratio capillary ascending amount, in a plurality of positions below tiltedly the pushing lead-in wire;
Second welding sequence after the lead-in wire pushing operation, makes capillary rise, and then, makes capillary move towards the second pad direction, by wire bonding is engaged on second pad.
In semiconductor device of the present invention, suitable is that the ascending amount primary capillaceous of continuous action is bigger than secondary ascending amount capillaceous.Again, suitable is that continuous action is behind first welding sequence, makes capillary generally perpendicularly rise, and then, is radius with ascending amount capillaceous, makes capillary do the circular-arc action of circular-arc mobile rising towards the second pad direction.
The following describes effect of the present invention.
The present invention had in being connected of first pad and second pad, on one side to suppress lead-in wire intensity low, can make the effect that the feed-through collar height is lower on one side.
Description of drawings
Fig. 1 is the key diagram of first welding sequence of the lead welding method of expression the invention process form.
Fig. 2 is the key diagram of the continuous action first time of pushing operation of the lead welding method of expression the invention process form.
Fig. 3 is the key diagram of the continuous action first time of pushing operation of the lead welding method of expression the invention process form.
Fig. 3 A be expression in the action shown in Figure 3 capillary and the enlarged drawing of lead-in wire.
Fig. 4 is the key diagram of the continuous action second time of pushing operation of the lead welding method of expression the invention process form.
Fig. 5 is the key diagram of the continuous action second time of pushing operation of the lead welding method of expression the invention process form.
Fig. 5 A be expression in the action shown in Figure 5 capillary and the enlarged drawing of lead-in wire.
Fig. 6 is the key diagram of continuous action for the third time of pushing operation of the lead welding method of expression the invention process form.
Fig. 7 is the key diagram of continuous action for the third time of pushing operation of the lead welding method of expression the invention process form.
Fig. 8 is the key diagram of second welding sequence of the lead welding method of expression the invention process form.
Fig. 9 is the key diagram of the feed-through collar of second welding sequence of lead welding method of expression the invention process form and the invention process form.
Figure 10 is the key diagram that the kinking (kink) of the lead welding method of another example of expression the present invention forms operation.
Figure 11 is the key diagram of the feed-through collar of second welding sequence of lead welding method of expression the present invention another example and another example of the present invention.
Figure 12 is the key diagram that the capillary front end of the lead welding method of expression the invention process form moves.
Figure 13 is the key diagram that the capillary front end of the lead welding method of expression the invention process form moves.
Figure 14 is the key diagram that the capillary front end of the lead welding method of another example of expression the present invention moves.
Figure 15 is the key diagram that the capillary front end of the lead welding method of another example of expression the present invention moves.
Figure 16 is the lead-in wire annular key diagram of expression with the lead welding method formation of another example of the present invention.
Figure 17 is the key diagram that the capillary front end of the lead welding method of another example of expression the present invention moves.
Figure 18 is the key diagram that the capillary front end of the lead welding method of another example of expression the present invention moves.
Symbol description is as follows:
10 center lines
11 first pads
12 pressure welding balls
13 lead-in wires
14 capillaries
Chamfering in 15
16 faces
19 second pads
21 feed-through collars
22 original balls
23 necks lead-in wires (neck wire)
24 bends
31 circular arcs
32 approximate broken lines
Embodiment
Below, with reference to description of drawings welding method of the present invention and suitable example with semiconductor device of the feed-through collar that forms by this welding method.In semiconductor device, form the feed-through collar that connects a plurality of first pads and second pad, but in the following description, be described being connected of one first pad and one second pad.As shown in Figure 1, by not having illustrated welding gun etc. after the front end of the lead-in wire 13 that inserts break-through capillary 14 forms original ball 22, shown in Fig. 1 arrow,, make capillary 14 descend along the center line 10 of first pad 11.Then, the face 16 and the interior chamfered section 15 of the front end by capillary 14 are pressed to original ball 22 on first pad 11 and engage, and form pressure welding ball 12 on first pad 11.Pressure welding ball 12 is because of the pushing of capillary 14, and pressure welding is (first welding sequence) on first pad 11.
As Fig. 2 and shown in Figure 12, make capillary 14 along center line 10 vertical lifting height H only 1, begin primary continuous action.If capillary 14 rises finish, then the front end of capillary 14 is positioned at height H above pressure welding ball 12 1Some U 1
As Fig. 3 and shown in Figure 12, some C 1Be in the intersection point of the top and center line 10 of pressure welding ball 12, along with this C 1Be the center, with height H shown in Figure 2 1Be radius r 1Circular arc, make the direction of capillary 14 towards second pads 19, make angle θ 1Circular-arc move.Angle θ 1Ratio 90 degree are little, for example the angle about 45 degree.If the primary circular arc mobile end of capillary 14, the then front end of capillary 14 and some U 1Compare,, be positioned at and be in a U in second pad, 19 sides 1With a C 1Between the height some C 2That is, capillary 14 moves by circular arc, from a U 1Drop point U only 1With a C 2Difference in height, from a U 1Direction towards second pad 19 moves.Point U 1With a C 2Difference in height than the lifting height H of capillary 14 shown in Figure 2 1Little, therefore, the front end of capillary 14 moves by primary circular arc, the ascending amount H of suppression ratio capillary 14 1Few amount simultaneously, moves towards the oblique below of the direction of second pad 19.By this action, make that neck lead-in wire 23 towards second pads 19 are crooked lentamente, simultaneously, neck lead-in wire 23 towards the pushing of oblique below, is formed for into first waveform (lead-in wire pushing operation) of ring towards horizontal direction.
When capillary 14 was carried out circular arc action for the first time, as shown in Figure 3A, neck lead-in wire 23 simultaneously, was pushed by the face 16 of capillary 14 down because of the wimble fraction of the interior chamfered section 15 of capillary 14 moves towards horizontal.At this moment, capillary 14 is with a C 1For doing circular-arc moving in the center, therefore, some C 1And the distance between capillary 14 front ends changes hardly, keeps certain.Therefore, when making capillary 14 from a U 1Towards a C 2Towards oblique below when mobile, can not produce because of capillary 14 neck lead-in wire 23 towards its axial drawing, suppress neck lead-in wire 23 shown in Figure 2 is applied drawing load.And 23 intensity reduce because of drawing load attenuates, neck goes between to suppress neck lead-in wire 23.
In addition, when when lead-in wire 13 front ends form original ball 22, by discharge heating lead-in wire 13 front ends such as welding guns, therefore, lead-in wire 13 causes thermmohardening because of this heat mostly, mostly in neck 23 remaining these thermmohardenings that go between.Thermmohardening length is different because of go between 13 diameters and original ball 22 diameters etc. mostly, mostly above pressure welding ball 12 about 50 to 100 μ m.By primary circular arc action, when carrying out 23 pushings of neck lead-in wire by capillary 14, if the thermmohardening part of pushing neck lead-in wire 23 if the pushing degree of depth is excessive, can be damaged in the sclerosis part of neck lead-in wire 23 sometimes, in contrast, if the pushing degree of depth is too small, even the pushing neck goes between 23 sometimes, the sclerosis part is not towards horizontal direction, but, can not reduce the height of feed-through collar integral body towards last direction rebound.So, the lifting height H of the capillary 14 in the time of can be with first time continuous action 1Be made as than the thermmohardening part of neck lead-in wire 23 top slightly, increase the radius r of circular arc action 1, make neck lead-in wire 23 slowly crooked, suppress damage, simultaneously, by the primary circular arc action of capillary 14, the not sclerosis part of the sclerosis part top of neck lead-in wire 23 is extended towards horizontal direction.Thus, can suppress the damage of neck lead-in wire 23, simultaneously, reduce the height of feed-through collar integral body.
If the continuous action of the vertical motion of Fig. 2, primary capillary 14 shown in Figure 3 and circular arc action finishes,, begin secondary continuous action then as Fig. 4, shown in Figure 5.As shown in Figure 4, make the front end of capillary 14 from the some C of the circular arc release of primary capillary 14 2Lifting height H generally perpendicularly 2If capillary 14 rises finish, then the axial centre front end of capillary 14 is from a C 2Rise to and be positioned at height H 2Some U 2At this moment, the lifting height H of capillary 14 2Can be than the lifting height H of primary capillary 14 1Little.
As Fig. 5 and shown in Figure 12, along circular arc release point C with primary capillary 14 2Be the center, with height H shown in Figure 4 2Be radius r 2Circular arc, make the direction of capillary 14 towards second pads 19, make angle θ 2Circular-arc move.Angle θ 2Ratio 90 degree are little, for example the angle about 45 degree.Again, angle θ 2Can be than angle θ 1Little angle.If secondary circular arc mobile end of capillary 14, then the axial centre front end of capillary 14 and some U 2Compare,, be positioned at and be in a U in second pad, 19 sides 2With a C 2Between the height some C 3That is, capillary 14 moves by circular arc, from a U 2Drop point U only 2With a C 3Difference in height, from a U 2Direction towards second pad 19 moves.Point U 2With a C 3Difference in height than the lifting height H of capillary 14 shown in Figure 4 2Little, therefore, the front end of capillary 14 moves by circular arc, the ascending amount H of suppression ratio capillary 14 2Few amount simultaneously, moves towards oblique below towards the direction of second pad 19.By this action, make lead-in wire 13 once more towards 19 bendings of second pad, simultaneously, will go between 13 towards the below pushing, be formed for into second waveform of ring towards horizontal direction.When making the lifting height H of capillary 14 2Lifting height H than primary capillary 14 1Little occasion, bending radius r 2Also diminish, can increase going between 13 pushing force.In secondary circular arc action, lead-in wire 13 makes not sclerosis part towards 19 bendings of second pad, simultaneously, towards oblique below pushing lead-in wire 13, therefore, reduces bending radius r 2, increase pushing force, can form the waveform (lead-in wire pushing operation) that along continuous straight runs extends at lead-in wire 13 effectively.
When capillary 14 was carried out circular arc action for the second time, shown in Fig. 5 A, lead-in wire 13 simultaneously, was pushed down because of the wimble fraction of the interior chamfered section 15 of capillary 14 moves towards horizontal.Identical with the circular arc action first time, capillary 14 is with a C 2For doing circular-arc moving in the center, therefore, some C 2And the distance between the capillary 14 axial centre front ends changes hardly, keeps certain.Therefore, when making capillary 14 from a U 2Towards a C 3, can not produce when mobile towards oblique below, can suppress lead-in wire 13 because of drawing load attenuates, its intensity reduces because of capillary 14 will go between 13 towards its axial drawing.
If the continuous action of the vertical motion of Fig. 4, secondary capillary 14 shown in Figure 5 and circular arc action finishes,, begin continuous action for the third time then as Fig. 6, shown in Figure 7.As shown in Figure 6, make the front end of capillary 14 from the some C of the circular arc release of secondary capillary 14 3Lifting height H generally perpendicularly 3If capillary 14 rises finish, then the axial centre front end of capillary 14 is from a C 3Rise to and be positioned at height H 3Some U 3Continuous action for the third time can will go between 13 towards the pushing of oblique below slightly in the position of leaving pressure welding ball 12, therefore, and the lifting height H of capillary 14 3Though be length by the global shape decision of feed-through collar 21,, can be than the lifting height H of primary capillary 14 1, secondary lifting height H 2Greatly.
As Fig. 7 and shown in Figure 12, along circular arc release point C with secondary capillary 14 3Be the center, with height H shown in Figure 6 3Be radius r 3Circular arc, make the direction of capillary 14 towards second pads 19, make angle θ 3Circular-arc move.Angle θ 3Ratio 90 degree are little, for example the angle about 45 degree.Again, angle θ 3Can be than angle θ 1, angle θ 2Little angle.If the circular arc mobile end for the third time of capillary 14, then the axial centre front end of capillary 14 and some U 3Compare,, be positioned at and be in a U in second pad, 19 sides 3With a C 3Between the height some C 4Capillary 14 moves by circular arc, from a U 3Drop point U only 3With a C 4Difference in height, from a U 3Direction towards second pad 19 moves.Point U 3With a C 4Difference in height than the lifting height H of capillary 14 shown in Figure 6 3Little, therefore, the front end of capillary 14 moves by circular arc, the ascending amount H of suppression ratio capillary 14 3Few amount simultaneously, moves towards oblique below towards the direction of second pad 19.By this action, make lead-in wire 13 crooked lentamente towards second pad 19 once more, simultaneously, will go between 13 towards the pushing of oblique below, be formed for into the 3rd waveform of ring towards horizontal direction.The 3rd waveform can be than first waveform, second waveform (lead-in wire pushing operation) that waveform is little.
When capillary 14 was carried out circular arc action for the third time, identical with the circular arc action second time, lead-in wire 13 simultaneously, was pushed down because of the wimble fraction of the interior chamfered section 15 of capillary 14 moves towards horizontal.With for the first time, circular arc action for the second time is identical, capillary 14 is with a C 3Do circular-arc moving for the center, therefore, can not produce, can suppress lead-in wire 13 because of drawing load attenuates, its intensity reduces because of capillary 14 will go between 13 towards its axial drawing.
As mentioned above, if finish, then as shown in Figure 8, make the front end of capillary 14 from a C from primary continuous action to for the third time continuous action 4The position generally perpendicularly rise.Finish if rise, then the front position of capillary 14 rises to a U 4Then, as shown in Figure 9, make the front end of capillary 14 from a U 4Move towards second pad 19, the face 16 by capillary 14 makes lead-in wire 13 pressure weldings engage at second pad 19.Then,, cut off lead-in wire 13, form the feed-through collar 21 (second welding sequence) that connects first pad 11 and second pad 19 at second pad 19 by promoting lead-in wire 13 with capillary 14.If a plurality of first pads 11 were all over second being connected of pad 19, form the feed-through collar 21 between each first pad 11 and second pad 19, then finish the assembling of semiconductor device.
As shown in Figure 9, the feed-through collar 21 of the semiconductor device that the lead welding method by this example forms, the part of neck lead-in wire 23 above pressure welding ball 12 towards second pad 19 towards than horizontal direction decurvation slightly, from the position P of the waveform by primary continuous action formation 1After extending, arrive the position P of the waveform that forms by secondary continuous action slightly up 2Before, extend slightly down, from the position P of the waveform by secondary continuous action formation 2After extending, arrive the position P of the waveform of the continuous action formation of passing through for the third time slightly up 3Before, extend slightly down, be connected with second pad 19.Like this, in the lead welding method of this example, make and the continuous neck lead-in wire 23 or 13 towards second pads, 19 bendings that go between of pressure welding ball 12, simultaneously, towards oblique below pushing lead-in wire, the lead-in wire after the inhibition bending takeoffs, and can reduce the height of feed-through collar 21 integral body.In addition, as previously mentioned, when making capillary 14 towards second pads 19 towards oblique below when mobile, make capillary 14 move, therefore, can suppress stretching neck lead-in wire 23 or go between 13 it to be attenuated as circular arc, therefore, the intensity that can suppress the feed-through collar 21 of semiconductor device reduces.
Again, in this example, illustrated that continuous action is made as three times, still, continuous action so long as repeatedly is not limited to three times, also can be secondary or more than four times or four times.
With reference to Figure 13, illustrate that continuous action is the example of secondary occasion.With referring to figs. 1 through Fig. 9, the example same section of Figure 12 explanation is marked with same-sign, and omission is described.As shown in figure 13, identical with the example that illustrates previously in this example, after first pad 11 forms pressure welding balls 12, make the front end of capillary 14 from a C 1Move to a U 1, the some C 2, the some U 2, the some C 3After, from a C 3Towards a U 3', after making capillary 14 towards second pads 19 side moving obliquely, from a U 3' towards a U 4, make capillary 14 generally perpendicularly rise, towards 19 one-tenth rings of second pad, weld at second pad 19.
In this example, continuous action is made as secondary, after the end continuous action for the second time, make capillary 14 move the side obliquely.In front in Shuo Ming the example, continuous action is carried out three times, three pushing lead-in wires 13, still, as this example, after the continuous action second time, make capillary 14 move the side obliquely, after this, it is generally perpendicularly risen, on lead-in wire 13, also can form the 3rd waveform in a way, therefore, can form the ring of same shape according to the length of the feed-through collar 21 of semiconductor device.Again, the occasions that the entire length of the feed-through collar 21 of semiconductor device is short etc. can make capillary 14 move the side obliquely as this example, but after the continuous action second time, after it is generally perpendicularly risen at once, towards 19 one-tenth rings of second pad.
With reference to Figure 10, Figure 11, Figure 14, another example is described.Example same section with illustrating previously is marked with same-sign, and omission is described.As Figure 10, shown in Figure 14, the lead welding method of this example is identical with the example that illustrates previously, carries out the first time to continuous action for the third time, as Figure 10 and shown in Figure 14, makes the front end of capillary 14 generally perpendicularly rise to a U 4' after, make capillary 14 reverse actions, up to the center line 10 and some U second pad, 19 opposition sides of relative first pad 11 5(kinking formation operation).Then, make the front end of capillary 14 rise to a U once more 6And, after this make capillary 14 towards second pads 19 move, 13 pressure weldings that will go between engage at second pad 19.
This example is identical with the example that illustrates previously, and the intensity that can suppress the feed-through collar 21 of semiconductor device reduces, and simultaneously, can reduce the height of the feed-through collar integral body of semiconductor device, and, can on lead-in wire 13, form kinking K by reverse action.13 be welded on second pad 19 when forming feed-through collars 21 when going between, as shown in figure 11, this kinking K forms and makes from position P 3Lead-in wire 13 towards second pads 19 that approximate horizontal is extended are towards the bend 24 of oblique below bending.This bend 24 is made as trapezoidal shape with the shape of feed-through collar 21, between first pad 11 and second pad 19, there is ladder difference occasion, make feed-through collar 21 not touch and be short-circuited with the ladder differential, simultaneously, can increase the intensity of feed-through collar 21, therefore, can for example suppress for distortion, the distortion of the feed-through collar 21 that causes because of cooling air when the distortion of the feed-through collar 21 when injecting resin, cut-out or wire bonds, short circuit etc. can improve welding quality.In this example, illustrate to form a kinking K, still, also can repeatedly carry out rising, reverse action, be provided with a plurality of kinking K, on feed-through collar 21, form a plurality of bends 24.
With reference to Figure 15, Figure 16, another example is described.This example forms the feed-through collar 21 longer than the example that illustrates previously.Example same section with illustrating previously is marked with same-sign, and omission is described.As shown in figure 15, the lead welding method of this example is identical with the example that illustrates previously, carries out for the first time to continuous action for the third time, and then carries out the 4th continuous action, makes the front end of capillary 14 from a C 4Move to a U 4, from a U 4To a C 5Make angle θ 4Circular-arc move, behind four pushing lead-in wires 13, as shown in figure 15, make the front end of capillary 14 generally perpendicularly rise to a U 5After, make capillary 14 reverse actions, up to the center line 10 and some U second pad, 19 opposition sides of relative first pad 11 6(kinking formation operation).Then, make the front end of capillary 14 move into place towards oblique upper towards second pad 19 once more in the some U that welds on the central shaft 10 7After, make capillary 14 from a U 7Move towards second pad 19,13 pressure weldings that will go between engage at second pad 19.
In example shown in Figure 15, illustrated to make the front end of capillary 14 from a U 6Move to a U towards oblique upper 7After, from a U 7Move towards second pad 19, still, also can be shown in Figure 15 dotted line, make the front end of capillary 14 from a U 6Generally perpendicularly rise to a U 6', after this, make capillary 14 towards second pads 19 move, 13 pressure weldings that will go between engage at second pad 19.
As shown in figure 16, the feed-through collar 21 of the semiconductor device that is formed by this example is identical with the example that illustrates previously, forms from position P 1To position P 3The waveform of three positions, and bend 24, in addition, also at P 3And second the position P between the pad 19 4, be provided with the waveform that forms by the 4th continuous action.As shown in figure 16, even the occasion that the length of feed-through collar 21 is long is sometimes at position P 3Form the 3rd waveform,, can not reduce the whole height of feed-through collar 21, still, cause the position P that ring highly uprises because of takeofing in imagination because of lead-in wire takeoffs upward 4Form the 4th waveform, can suppress to be formed on position P 3The lead-in wire that is positioned at second pad, 19 sides of the 3rd waveform takeoff upward, therefore, even the long occasion of feed-through collar 21 length also can reduce the whole height of feed-through collar 21 equably.
With reference to Figure 17 another example of the present invention is described.In front in the example referring to figs. 1 through Fig. 9, Figure 12 explanation, illustrated that it is circular-arc mobile to make the front end of capillary 14 do when making capillary 14 towards second pads 19 towards oblique below when mobile, still, the lifting height H of capillary 14 1～H 3Not too big occasion, the angle of revolution θ when perhaps circular arc moves 1～θ 3Not too big occasion can not make the front end of capillary 14 do circular-arc action, but as shown in figure 17, from a U 1To a C 2, carry out linearly operating.This is owing to work as the lifting height H of capillary 14 1～H 3Little, the angle of revolution θ when circular arc moves 1～θ 3Little occasion, oblique some C when mobile 1Little with the difference of the distance of the front end of capillary 14, because of capillary 14 is applied to neck lead-in wire 23 or the axial force that goes between on 13 can not become greatly, the also little cause of intensity reduction that causes because of its distortion.This example can not make the front end of capillary 14 do circular-arc moving as the example that illustrates previously, therefore, can simplify the control of welder.
Again, as shown in figure 18, when making the front end of capillary 14 from a U 1Move to a C 2Occasion can be so that the front end of capillary 14 moves along approximate broken line 32, and this approximate broken line 32 is the lifting height H that connects with capillary 14 1Identical radius r 1The string of circular arc 31.At this moment, the front end of capillary 14 is from a U 1To a Q 1, arrive some C again 2, the order straight line moves.This example is also identical with the example that illustrates previously, can simplify welder.

Claims (11)

1. a lead welding method connects between first pad and second pad with lead-in wire, it is characterized in that this lead welding method comprises:
First welding sequence makes the original ball that is formed on the lead-in wire front end be bonded on first pad by capillary, forms the pressure welding ball;
Lead-in wire pushing operation, behind first welding sequence, repeatedly carry out repeatedly make capillary generally perpendicularly rise the back, make capillary towards of the continuous action of the second pad direction towards the few amount of oblique below suppression ratio capillary ascending amount, in a plurality of positions below tiltedly the pushing lead-in wire;
Second welding sequence after the lead-in wire pushing operation, makes capillary rise, and then, makes capillary move towards the second pad direction, by wire bonding is engaged on second pad.
2. lead welding method according to claim 1 is characterized in that:
The ascending amount primary capillaceous of continuous action is bigger than secondary ascending amount capillaceous.
3. lead welding method according to claim 2 is characterized in that:
Continuous action is behind first welding sequence, makes capillary generally perpendicularly rise, and then, is radius with ascending amount capillaceous, makes capillary do the circular-arc action of circular-arc mobile rising towards the second pad direction.
4. lead welding method according to claim 3 is characterized in that:
Continuous action capillaceous circular-arc moved to the circular arc action as the center of the capillaceous circular-arc mobile end point of continuous action last time.
5. lead welding method according to claim 4 is characterized in that:
Move angle during continuous action primary capillaceous circular-arc mobile is bigger than secondary circular-arc move angle when mobile capillaceous.
6. lead welding method according to claim 2 is characterized in that:
The circular-arc mobile of circular-arc action that rise is that capillary moves along the approximate broken line with the approximate circular arc of many straight lines.
7. lead welding method according to claim 2 is characterized in that:
The later for the third time ascending amount capillaceous of continuous action is bigger than the first time, secondary ascending amount capillaceous.
8. lead welding method according to claim 2 is characterized in that:
Between the lead-in wire pushing operation and second welding sequence, comprise that kinking forms operation, this kinking forms operation makes capillary rise, then, at least carry out the reverse action that makes that once the capillary court and the second pad rightabout move, on lead-in wire, form kinking.
9. a semiconductor device has with the feed-through collar between lead-in wire connection first pad and second pad, it is characterized in that having the feed-through collar shape that forms by following operation:
First welding sequence makes the original ball that is formed on the lead-in wire front end be bonded on first pad by capillary, forms the pressure welding ball;
Lead-in wire pushing operation, behind first welding sequence, repeatedly carry out repeatedly make capillary generally perpendicularly rise the back, make capillary towards of the continuous action of the second pad direction towards the few amount of oblique below suppression ratio capillary ascending amount, in a plurality of positions below tiltedly the pushing lead-in wire;
Second welding sequence after the lead-in wire pushing operation, makes capillary rise, and then, makes capillary move towards the second pad direction, by wire bonding is engaged on second pad.
10. semiconductor device according to claim 9 is characterized in that:
The ascending amount primary capillaceous of continuous action is bigger than secondary ascending amount capillaceous.
11. lead welding method according to claim 10 is characterized in that:
Continuous action is behind first welding sequence, makes capillary generally perpendicularly rise, and then, is radius with ascending amount capillaceous, makes capillary do the circular-arc action of circular-arc mobile rising towards the second pad direction.
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US20100148369A1 (en) 2010-06-17
JP4361593B1 (en) 2009-11-11
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US20110079904A1 (en) 2011-04-07
CN102203928B (en) 2013-09-25
JP2010103157A (en) 2010-05-06
KR101076651B1 (en) 2011-10-26
US7851347B2 (en) 2010-12-14
KR20110051274A (en) 2011-05-17
US8232656B2 (en) 2012-07-31

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