CN102194957A - Bearing seat of light-emitting diode chip - Google Patents
Bearing seat of light-emitting diode chip Download PDFInfo
- Publication number
- CN102194957A CN102194957A CN2010105175127A CN201010517512A CN102194957A CN 102194957 A CN102194957 A CN 102194957A CN 2010105175127 A CN2010105175127 A CN 2010105175127A CN 201010517512 A CN201010517512 A CN 201010517512A CN 102194957 A CN102194957 A CN 102194957A
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- diode chip
- bearing seat
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention discloses a bearing seat of a light-emitting diode chip. The bearing seat comprises pins and a base for encapsulating at least one part of the pins, wherein the base is provided with a recess, and a coating containing an ultraviolet ray scattering diluent is coated on the inner surface of the recess. Because the coating on the inner surface of the recess contains the ultraviolet ray scattering diluent, ultraviolet rays can be effectively scattered, and the base can be prevented from yellowing and deteriorating due to irradiation of the ultraviolet rays.
Description
[technical field]
The present invention relates to a kind of light-emitting diode chip for backlight unit load bearing seat, refer to a kind of light-emitting diode chip for backlight unit load bearing seat of inner surface seal coat of depression of pedestal especially.
[background technology]
Existing light-emitting diode chip for backlight unit load bearing seat comprises pin and seals the pedestal of pin at least a portion, and pin is in order to couple light-emitting diode chip for backlight unit, and pedestal is in order to the carrying light-emitting diode chip for backlight unit.Pedestal is provided with depression, and the sidewall of depression can reflect the light that light-emitting diode chip for backlight unit sends.For the phenomenon that improves reflection efficiency and prevent the pedestal flavescence deterioration that illumination causes, general inner surface applying coating in depression.For example Japan's special permission discloses 2005-136378 number and speciallys permit the coating that discloses 2005-136379 number announcement, and these coatings are the hardening compositions that include organic compounds and catalyst, can reflect the light that light-emitting diode chip for backlight unit sends.Yet indifferent for the ultraviolet reflection that light-emitting diode chip for backlight unit sends, ultraviolet ray is very big to the plastic damage of pedestal, easily makes pedestal rotten.
So, be necessary to design a kind of light-emitting diode chip for backlight unit load bearing seat, to overcome above-mentioned defective of the prior art.
[summary of the invention]
The technical problem to be solved in the present invention is: the light-emitting diode chip for backlight unit load bearing seat that a kind of effective scatters ultraviolet is provided.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of light-emitting diode chip for backlight unit load bearing seat, it comprises pin and seals the pedestal of pin at least a portion that this pedestal has depression, is coated with the coating that contains ultraviolet scattering diluent at the inner surface that caves in.
Compared with prior art, the coating of the concave inner surface of pedestal of the present invention contains ultraviolet scattering diluent, and effectively scatters ultraviolet prevents that pedestal is because of ultraviolet irradiation flavescence deterioration.
[description of drawings]
Fig. 1 is the three-dimensional combination figure of light-emitting diode chip for backlight unit load bearing seat of the present invention.
Fig. 2 is the cutaway view along the A-A line of Fig. 1.
[embodiment]
See also Fig. 1 and Fig. 2, light-emitting diode chip for backlight unit load bearing seat 100 of the present invention comprises pin 1 and seals the pedestal 2 of pin 1 at least a portion.
Pin 1 is in order to coupling light-emitting diode chip for backlight unit (not shown), and it comprises separating on first pin 11 that is provided with and second pin, 12, the first pins 11 installs light-emitting diode chip for backlight unit (not shown).Pedestal 2 is in order to carrying light-emitting diode chip for backlight unit (not shown), and it is in conjunction with pin 1 and have depression 21.One end of first pin 11 and second pin 12 is exposed to the bottom surface of depression 21, and the other end is stretched on outside the pedestal 2 and along the bending of pedestal 2 lateral walls and extends, and can be welded on the printed circuit board (PCB) (not icon).Pin 1 connects strip 3, separates strip 3 and pin 1 when using light-emitting diode chip for backlight unit load bearing seat 100.
Inner surface in the depression 21 of pedestal 2 covers the coating 22 that contains ultraviolet scattering diluent 23.Coating 22 is a resinous coat, only the cave in material character of 21 light-transmissive resin (not shown) of this resin material and envelope is close, good bonding force between depression 21 inner surface, coating 22 and the light-transmissive resin (not shown) can be provided, guarantee sealing, wherein adopt silicone material in the present embodiment.Ultraviolet ray scattering diluent 23 is distributed in the resinous coat 22, and it comprises mineral microparticle.Mineral microparticle comprises titanium oxide microparticle or zinc oxide fine particles, and the particle diameter of titanium oxide microparticle and zinc oxide fine particles is 0.05 micron～0.1 micron.Ultraviolet ray scattering diluent 23 is the ultraviolet light that sends of scattering light-emitting diode chip for backlight unit (not icon) effectively, prevents that pedestal 2 is because of UV-irradiation flavescence deterioration.
In sum, it below only is preferred embodiment of the present invention, should not limit the scope of the invention with this, promptly every simple equivalent of being done according to claims of the present invention and description of the invention content changes and modifies, and all should still belong in the scope that patent of the present invention contains.
Claims (7)
1. light-emitting diode chip for backlight unit load bearing seat, it comprises pin and seal the pedestal of pin at least a portion that this pedestal has depression, it is characterized in that: the inner surface in depression is coated with the coating that contains ultraviolet scattering diluent.
2. light-emitting diode chip for backlight unit load bearing seat as claimed in claim 1 is characterized in that: described ultraviolet scattering diluent comprises mineral microparticle.
3. light-emitting diode chip for backlight unit load bearing seat as claimed in claim 2 is characterized in that: described mineral microparticle comprises titanium oxide microparticle or zinc oxide fine particles.
4. light-emitting diode chip for backlight unit load bearing seat as claimed in claim 3 is characterized in that: the particle diameter of described mineral microparticle is 0.05 micron～0.1 micron.
5. light-emitting diode chip for backlight unit load bearing seat as claimed in claim 1 is characterized in that: described coating is a resinous coat, and ultraviolet scattering diluent is distributed in the resinous coat.
6. light-emitting diode chip for backlight unit load bearing seat as claimed in claim 5 is characterized in that: described resinous coat is a silicone material.
7. light-emitting diode chip for backlight unit load bearing seat as claimed in claim 1 is characterized in that: described pin comprises two pins that separate setting, and an end of each pin is exposed to the bottom surface of the depression of pedestal, and the other end of each pin is stretched on outside the pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105175127A CN102194957A (en) | 2010-03-19 | 2010-10-23 | Bearing seat of light-emitting diode chip |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020135262 | 2010-03-19 | ||
| CN201020135262.6 | 2010-03-19 | ||
| CN2010105175127A CN102194957A (en) | 2010-03-19 | 2010-10-23 | Bearing seat of light-emitting diode chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102194957A true CN102194957A (en) | 2011-09-21 |
Family
ID=44602687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105175127A Pending CN102194957A (en) | 2010-03-19 | 2010-10-23 | Bearing seat of light-emitting diode chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102194957A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456728A (en) * | 2012-05-29 | 2013-12-18 | 璨圆光电股份有限公司 | Light-emitting component and light-emitting device thereof |
| CN104821366A (en) * | 2015-04-09 | 2015-08-05 | 苏州君耀光电有限公司 | LED packaging structure and LED packaging material thereof |
| CN104900791A (en) * | 2015-04-09 | 2015-09-09 | 苏州君耀光电有限公司 | LED encapsulation structure |
-
2010
- 2010-10-23 CN CN2010105175127A patent/CN102194957A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456728A (en) * | 2012-05-29 | 2013-12-18 | 璨圆光电股份有限公司 | Light-emitting component and light-emitting device thereof |
| CN103456728B (en) * | 2012-05-29 | 2016-09-21 | 璨圆光电股份有限公司 | Light-emitting component and light-emitting device thereof |
| CN104821366A (en) * | 2015-04-09 | 2015-08-05 | 苏州君耀光电有限公司 | LED packaging structure and LED packaging material thereof |
| CN104900791A (en) * | 2015-04-09 | 2015-09-09 | 苏州君耀光电有限公司 | LED encapsulation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110921 |