CN102189346A - Traceless welding machine and traceless welding method suitable for sheet metal plate - Google Patents

Traceless welding machine and traceless welding method suitable for sheet metal plate Download PDF

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Publication number
CN102189346A
CN102189346A CN2011101110058A CN201110111005A CN102189346A CN 102189346 A CN102189346 A CN 102189346A CN 2011101110058 A CN2011101110058 A CN 2011101110058A CN 201110111005 A CN201110111005 A CN 201110111005A CN 102189346 A CN102189346 A CN 102189346A
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welding
mentioned
electrode
bonding machine
plane
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CN102189346B (en
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杜西均
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Wai Wei Computer (kunshan) Co Ltd
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Wai Wei Computer (kunshan) Co Ltd
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Abstract

The invention discloses a traceless welding machine and a traceless welding method suitable for a sheet metal plate. The traceless welding machine suitable for a sheet metal plate comprises a welding machine body, a welding upper electrode and a welding lower electrode, wherein the welding upper electrode and the welding lower electrode are connected with the welding body and are respectively provided with an upper welding plane and a lower welding plane which are parallel to each other; the traceless welding method is mainly characterized in that a welding bump is processed on a processing accessory before welding; the traceless welding machine is used to concentrate the resistance heat on the bump preferentially to form a weld pool; and the welding is finished after cooling. The traceless welding machine and method disclosed by the invention have the beneficial effects of ensuring the appearance of the welded sheet metal piece, saving the subsequent processing cost and relatively reducing the energy consumption.

Description

Be applicable to the seamless bonding machine and the seamless welding method of panel beating thin plate
Technical field
The present invention relates to a kind of process equipment and processing method that is applicable to the panel beating thin plate, be specifically related to a kind of seamless bonding machine and seamless welding method that is applicable to the panel beating thin plate.
Background technology
At present, in the panel beating manufacturing industry, welding is widely used as a kind of method of attachment commonly used, adopts the method for electric current spot welding now, two panel beating sheet materials with material is placed between two welding electrodes welds.The most advanced and sophisticated area of the welding electrode of spot welding is less, generally be similar to the size of desired solder joint, after the welding electrode energising of both sides, pass through enough big electric current, contact position at welding electrode and sheet material produces a large amount of resistance heats, thereby the zone of aiming at welding electrode with two sheet materials is that the center produces the molten bath, by the time outage cooling when spot size is satisfied in the molten bath, thereby the solder joint of the certain area of zone, molten bath formation fuses together two workpiece before.But existing bonding machine and welding procedure are after welding, because electrode needs workpiece pressing and two sheet materials part except that the welding position also to fit mutually, therefore need bigger electric current, and can stay indenture at the positive and negative of workpiece, moreover, because sheet material is thinner relatively, when the molten bath size satisfies, the bad control of the fusion penetration of sheet metal thickness direction, even the phenomenon of burn through appears, cooling back solder joint outward appearance is difficult to be guaranteed, and considers for exterior quality, indenture at the front all is to adopt the benefit soil in road, back to overcome, and therefore causes processing cost to increase.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of seamless bonding machine that is applicable to the panel beating thin plate and seamless welding method that can improve weld appearance.
To achieve these goals, the present invention adopts following scheme:
Be applicable to the seamless bonding machine of panel beating thin plate, comprise the bonding machine main body, it is characterized in that, also comprise: welding top electrode that the upright position that is connected with above-mentioned bonding machine main body is adjustable and welding bottom electrode, above-mentioned welding top electrode lower end is formed with upward welding plane down, and the upper end of above-mentioned welding bottom electrode is formed with following welding plane up; The above-mentioned welding plane of going up is parallel to each other with following welding plane.
The aforesaid seamless bonding machine that is applicable to the panel beating thin plate is characterized in that, the area on above-mentioned welding down plane is greater than the above-mentioned area of going up the welding plane.
The aforesaid seamless bonding machine that is applicable to the panel beating thin plate is characterized in that, the above-mentioned welding very block electrode that powers on, and above-mentioned welding bottom electrode is tabular electrode.
The aforesaid seamless bonding machine that is applicable to the panel beating thin plate is characterized in that, above-mentioned welding top electrode and welding bottom electrode and above-mentioned welding main body adopt and flexibly connect.
Utilize the aforesaid seamless welding method that is applicable to the seamless bonding machine of panel beating thin plate, it is characterized in that, comprise the steps:
A, on welded attachment according to the pedestal of design at corresponding welding spots position processing certain size;
B, with the pedestal on the welded attachment with the welding main part the welding position align, then with welded attachment and the welding main part be stacked together;
C, the welding main part that above-mentioned alignment is stacked and welded attachment are installed between the welding top electrode and welding bottom electrode of the above-mentioned seamless bonding machine that is applicable to the panel beating thin plate;
D, to above-mentioned welding top electrode and welding bottom electrode electric current, make above-mentioned pedestal form the molten bath;
E, the energising of cutting off above-mentioned welding top electrode and welding bottom electrode wait for that the molten bath cooling of above-mentioned pedestal forms solder joint, finish welding.
Aforesaid seamless welding method is characterized in that, the ratio range of the height of above-mentioned salient point and above-mentioned welded attachment thickness is 0.5 to 1; Above-mentioned salient point be shaped as taper shape, the ratio range of conical base diameter and above-mentioned welded attachment thickness is 1.5 to 2; The thickness of above-mentioned welded attachment is less than the thickness of above-mentioned welding main part.
Usefulness of the present invention is: can guarantee to weld the outward appearance of back sheet metal component, save follow-up cost of processing, and reduced energy consumption relatively.
Description of drawings
Fig. 1 is the perspective view of a preferred embodiment of the seamless bonding machine that is applicable to the panel beating thin plate of the present invention;
Fig. 2 is the schematic process flow diagram that is applicable to the seamless welding method of panel beating thin plate of the present invention;
Fig. 3 utilizes the seamless bonding machine of panel beating thin plate and the seamless welding method of being applicable to of the present invention to carry out the Fundamentals of Welding schematic diagram.
Reference numeral implication among the figure:
1, welding main body, 2, the welding top electrode, 3, the welding bottom electrode, 4, welded attachment, 5, the welding main part; A, on weld the plane, B, weld plane, C, pedestal down.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the present invention is done concrete introduction.
Fig. 1 is the perspective view of a preferred embodiment of the seamless bonding machine that is applicable to the panel beating thin plate of the present invention; Fig. 2 is the schematic process flow diagram that is applicable to the seamless welding method of panel beating thin plate of the present invention; Fig. 3 utilizes the seamless bonding machine of panel beating thin plate and the seamless welding method of being applicable to of the present invention to carry out the Fundamentals of Welding schematic diagram.
Figure 1 shows that a preferred embodiment that is applicable to the seamless bonding machine of panel beating thin plate of the present invention, mainly comprise: welding main body 1, welding top electrode 2, welding bottom electrode 3.
As shown in Figure 1, welding top electrode 2 is connected with above-mentioned welding main body 1 with welding bottom electrode 3, is dismountable between welding top electrode 2, welding bottom electrode 3 and the welding main body 1; Welding top electrode 2 is positioned at the top of welding bottom electrode 3, its lower end is formed with upward welding plane A down, the upper end of welding bottom electrode is formed with following welding plane B up, be parallel to each other between last welding plane A and the following welding plane B, it should be noted that herein, last welding plane A and following welding plane B should have certain area, so that the even distribution of heat and suitably dispersive pressure.
As a kind of preferred version, the area of following welding plane B is greater than the area of last welding plane A.
As a kind of preferred version, welding top electrode 2 is block electrode, and welding bottom electrode 3 is tabular electrode.As shown in fig. 1, the electrode of described bulk is meant that the wide and high size of the coffin of the minimum that electrode is shared is more or less the same; And welding bottom electrode 3 is tabular electrode, and described tabular electrode is meant that the length and the wide size of comparing of the coffin of the minimum that electrode is shared are more or less the same, and length and width is compared with height, and high size is much smaller relatively.As shown in Figure 1, as preferably, welding top electrode 2 is that rectangular cross section is trapezoidal for a lower surface, and welding bottom electrode 3 is a rectangular slab.
As preferred version, welding top electrode 2 and welding bottom electrode 3 adopt with welding main body 1 and flexibly connect, and make to go up welding plane A and the adjustable welding with the sheet material that is suitable for different gauges of the distance between the welding plane B down.
Utilize the aforesaid seamless welding method of the seamless bonding machine of panel beating thin plate that is applicable to be elaborated below in conjunction with Fig. 2 and Fig. 3 to of the present invention.
With reference to Fig. 2, Fig. 3, seamless welding method of the present invention comprises the steps:
A, on welded attachment 4 according to the pedestal C of design at corresponding welding spots position processing certain size;
B, the pedestal C on the welded attachment 4 is alignd with the welding position of welding main part 5, then welded attachment 4 and welding main part 5 are stacked together;
C, the welding main part 5 that alignment is stacked and welded attachment 4 are placed between the welding top electrode 2 and welding bottom electrode 3 of the aforementioned seamless bonding machine that is applicable to the panel beating thin plate;
D, to welding top electrode 2 and the energising of welding bottom electrode 3, make formation molten bath, pedestal C place;
The electric current of e, cut-out welding top electrode 2 and welding bottom electrode 3, the cooling of molten bath, pedestal C place forms solder joint, finishes welding.
As a kind of preferred version, the height of salient point is 0.5 to 1 for height with the ratio range of above-mentioned welded attachment thickness; Above-mentioned salient point be shaped as taper shape, the ratio range of conical base diameter and above-mentioned welded attachment thickness is 1.5 to 2; The thickness of above-mentioned welded attachment is less than the thickness of above-mentioned welding main part.
With reference to Fig. 3, owing to processed pedestal C, after stacking, welding main part 5 and welded attachment 4 be placed on welding top electrode 2 and welding bottom electrode 3, have only pedestal C place to contact, so electric current concentrates on pedestal C place, and then resistance heat also concentrates on this place relatively, that is to say that pedestal C place heat is higher, therefore the fusing of the upper surface relative priority of the bottom surface of welding main part 5 herein and pedestal c forms the molten bath, this moment is because the welding plane B that goes up that goes up welding plane A and welding top electrode 3 of welding top electrode 2 has certain area, at least should be greater than the size of pedestal, its thermal diffusivity is better, the heat of the upper surface of welding main part 5 is dispersed, therefore do not form and its lower surface and the identical fusing of pedestal C contact position degree, even not fusing, after outage, cooling can not form obvious marks, this point is different with existing pinpoint welding procedure, existing be on, lower surface almost produces the same degree fusing, so when cooling, upper surface can stay obvious marks.Therefore, adopt method of the present invention can guarantee the outward appearance of welding, saved follow-up cost of processing, and because concentrating of resistance heat compared to existing technologies, reduced energy consumption relatively.
The foregoing description does not limit the present invention in any form, and all employings are equal to the technical scheme that mode obtained of replacement or equivalent transformation, all drop in protection scope of the present invention.

Claims (6)

1. be applicable to the seamless bonding machine of panel beating thin plate, comprise the bonding machine main body, it is characterized in that, also comprise: welding top electrode that the upright position that is connected with above-mentioned bonding machine main body is adjustable and welding bottom electrode, above-mentioned welding top electrode lower end is formed with upward welding plane down, and the upper end of above-mentioned welding bottom electrode is formed with following welding plane up; The above-mentioned welding plane of going up is parallel to each other with following welding plane.
2. the seamless bonding machine that is applicable to the panel beating thin plate according to claim 1 is characterized in that, the area on above-mentioned welding down plane is greater than the above-mentioned area of going up the welding plane.
3. the seamless bonding machine that is applicable to the panel beating thin plate according to claim 1 and 2 is characterized in that, the above-mentioned welding very block electrode that powers on, and above-mentioned welding bottom electrode is tabular electrode.
4. the seamless bonding machine that is applicable to the panel beating thin plate according to claim 3 is characterized in that, above-mentioned welding top electrode and welding bottom electrode and above-mentioned welding main body adopt and flexibly connect.
5. use the seamless welding method that is applicable to the seamless bonding machine of panel beating thin plate as claimed in claim 1, it is characterized in that, comprise the steps:
A, on welded attachment according to the pedestal of design at corresponding welding spots position processing certain size;
B, with the pedestal on the welded attachment with the welding main part the welding position align, then with welded attachment and the welding main part be stacked together;
C, the welding main part that above-mentioned alignment is stacked and welded attachment are installed between the welding top electrode and welding bottom electrode of the above-mentioned seamless bonding machine that is applicable to the panel beating thin plate;
D, to above-mentioned welding top electrode and welding bottom electrode electric current, make above-mentioned pedestal form the molten bath;
E, the energising of cutting off above-mentioned welding top electrode and welding bottom electrode, the cooling of above-mentioned pedestal molten bath forms solder joint, finishes welding.
6. seamless welding method according to claim 5 is characterized in that, the ratio range of the height of above-mentioned salient point and above-mentioned welded attachment thickness is 0.5 to 1; Above-mentioned salient point be shaped as taper shape, the ratio range of conical base diameter and above-mentioned welded attachment thickness is 1.5 to 2; The thickness of above-mentioned welded attachment is less than the thickness of above-mentioned welding main part.
CN 201110111005 2011-04-29 2011-04-29 Traceless welding machine and traceless welding method suitable for sheet metal plate Active CN102189346B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103331528A (en) * 2013-07-03 2013-10-02 景鑫精密组件(昆山)有限公司 Varnish baked product raw welding technology
CN104139244A (en) * 2014-07-23 2014-11-12 嘉兴永发电子有限公司 Single-face traceless welding method for stainless steel panels

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2191737Y (en) * 1994-03-18 1995-03-15 张倩法 Point and convex dual-purpose electric welding machine
CN2542392Y (en) * 2002-04-26 2003-04-02 张文巨 Floating spring secondary pressure electrode for projection welder
JP2005095963A (en) * 2003-09-26 2005-04-14 Nisshin Steel Co Ltd Method for forming butt welding joint of band steel
JP2009125801A (en) * 2007-11-28 2009-06-11 Nissan Motor Co Ltd Welding method
CN202079349U (en) * 2011-04-29 2011-12-21 兴威电脑(昆山)有限公司 Seamless welding machine suitable for sheet metal thin plates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2191737Y (en) * 1994-03-18 1995-03-15 张倩法 Point and convex dual-purpose electric welding machine
CN2542392Y (en) * 2002-04-26 2003-04-02 张文巨 Floating spring secondary pressure electrode for projection welder
JP2005095963A (en) * 2003-09-26 2005-04-14 Nisshin Steel Co Ltd Method for forming butt welding joint of band steel
JP2009125801A (en) * 2007-11-28 2009-06-11 Nissan Motor Co Ltd Welding method
CN202079349U (en) * 2011-04-29 2011-12-21 兴威电脑(昆山)有限公司 Seamless welding machine suitable for sheet metal thin plates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103331528A (en) * 2013-07-03 2013-10-02 景鑫精密组件(昆山)有限公司 Varnish baked product raw welding technology
CN103331528B (en) * 2013-07-03 2016-08-10 景鑫精密组件(昆山)有限公司 Varnish baked product raw welding technology
CN104139244A (en) * 2014-07-23 2014-11-12 嘉兴永发电子有限公司 Single-face traceless welding method for stainless steel panels

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