CN102186326A - Cooling arrangement - Google Patents
Cooling arrangement Download PDFInfo
- Publication number
- CN102186326A CN102186326A CN2010105249370A CN201010524937A CN102186326A CN 102186326 A CN102186326 A CN 102186326A CN 2010105249370 A CN2010105249370 A CN 2010105249370A CN 201010524937 A CN201010524937 A CN 201010524937A CN 102186326 A CN102186326 A CN 102186326A
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- China
- Prior art keywords
- electric
- electronic component
- pcb
- circuit board
- printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary PCB mounted on a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to an arrangement for cooling at least one electrical and/or electronic component and/or group of electrical/electronic components by means of a cooling body. The cooling body demonstrates at least one recess into which the electrical/electronic component and/or the group of electrical/electronic components to be cooled can be inserted. Introduced into the recess of the cooling body is a medium, which nearly completely surrounds the at least one electrical/electronic component and/or the group of electrical/electronic components in their state of insertion into the recess.
Description
Technical field
The present invention relates to rely on cooling body (cooling body) to cool off at least one device electric and/or electronic building brick and/or one group of electric/electronic component.
Background technology
Have much and come the device of cool electronic assemblies with cooling body.For example, the cooling body that is used for the power electronics assembly from EP 1 732 131 B1 as can be known.Being connected by cooling body is shaped of assembly and cooling body so that the shape and the position of the form fit of cooling body assembly to be cooled and realize that around them described arrangement of components is on printed circuit board (PCB) at least in part.Be used for the heat transmission from the assembly to the cooling body and guarantee have the heat transfer cream of certain distance can be introduced into described excrescence between the assembly in cooling body and excrescence.Yet the shortcoming of this execution mode is to be present in the cooling cream every pearl (spacer bead), described can be during installation and be easy in operation be moved every pearl, and can cause short circuit between assembly and the cooling body easily by this way.In addition, this invention only can be cooled off the assembly that is arranged to rest on the printed circuit board (PCB).In addition, this device can not provide the heat cooling of assembly complete cycle, makes the part of used heat continue to be dissipated to circuit board.In addition, must arrange be full of gel boring to reduce the thermal gradient between the top and bottom.But the shortcoming of essence is most of heat of assembly and continues to be dissipated to circuit board.
From US-A-5,315,480 are used for the cooling body of the electronic equipment of cool electronic assemblies as can be known.In this invention, cooling body is connected to printed circuit board (PCB), and electronic building brick is fastened to described printed circuit board (PCB).Cooling body is placed on the assembly to be cooled, and in this connected, cooling body can suitably be installed to assembly, and for example cooling body can show depression or corresponding form.Cooling body is made up of the second layer of first insulating barrier and the described assembly of cooling.In the method, cooling body surrounds assembly.This relates to the conventional apparatus of the cooling body on the electric/electronic component.The shortcoming of this invention is to be passed to printed circuit board (PCB) from the heat of electric/electronic component most.
EP 0 340 520 discloses and has been used for the device that the convection current cooling is arranged in the electronic building brick on the printed circuit board (PCB).The cooling body that uses is made up of the part that is arranged to two connections on another.The bottom of cooling body is made by the plastic-metal composite membrane, and be placed on be used on the assembly cooling.The position of matching component and shape and the shape that is full of the good heat conductive flexible material form cooling body, so that it is put on the assembly.The top of cooling body is made up of plate, and the structure that described plate shows has big surface on the face of assembly.In this execution mode, cooling body does not surround assembly to be cooled in the mode of complete cycle once more.In addition, the major part of the heat sent of assembly to be cooled is passed to printed circuit board (PCB).
From a kind of as can be known cooling body of EP 1 300 883 A2, it demonstrates the groove of having introduced Heat Conduction Material, and described Heat Conduction Material is used to improve the heat radiation of assembly to cooling body.Yet in this invention, most of the heat that assembly sent is passed to printed circuit board (PCB) itself once more.
The shortcoming of the known device that is used for cooling electric/electronic building brick is, most of the thermal output that electric/electronic component produces is passed to the described printed circuit board (PCB) that electric/electronic component is fastened to and/or is electrically connected to, and therefore quite a lot of ground of printed circuit board (PCB) heating.
Summary of the invention
The objective of the invention is to propose a kind of device that is used for cooling electric/electronic building brick, its heat that prevents that electric/electronic component from emitting is delivered to the printed circuit board (PCB) that electric/electronic component is electrically connected to.
This purpose is based on that the feature of Patent right requirement 1 realizes.
Favourable execution mode of the present invention is based on the associated description of the accompanying drawing of further description, dependent claims and embodiment example and accompanying drawing and produce.
Be used to rely on cooling body to cool off at least one electric and/or electronic building brick and/or one group of electric/electronic component according to device of the present invention.For this purpose, cooling body shows at least one groove, and electric/electronic component to be cooled and/or one group of electric/electronic component can insert in the described groove.Introduce medium in the groove of cooling body, it almost completely is enclosed at least one electric/electronic component and/or one group of electric/electronic component in the state that inserts groove.
The medium that is to be introduced into the groove in the cooling body according to the advantage of the working of an invention mode of claim 2 is a heat transfer medium.Preferably liquid, viscosity, gelatinous, the gluey or similar adhesive of heat transfer medium, and have a good thermal conductivity.But heat transfer medium is an electric insulation, and is promptly non-conductive, if need the words of electric insulation between assembly and the cooling body.If do not need electric insulation between assembly and the cooling body, then can use conducting medium yet.The heat transfer medium of introducing groove is shifted when at least one electric/electronic component and/or one group of electric/electronic component are inserted into, and is enclosed at least one electric/electronic component and/or one group of electric/electronic component in the state that inserts groove.Heat transfer medium guarantees well to dispel the heat and cooling body is well conducted heat from least one electric/electronic component and/or one group of electric/electronic component.Execution mode for example liquid, heat transfer medium viscosity, gelatinous, gluey or similar adhesive guarantees that on the one hand heat transfer medium almost completely also surrounds at least one electric/electronic component and/or the one group of electric/electronic component that is in insertion groove state in complete cycle ground, so that almost produce best heat radiation.On the other hand, the execution mode of the heat transfer medium of for example viscosity, gelatinous, gluey or similar adhesive must notice that heat transfer medium does not flow out groove, but for example stay wherein, and continue to surround at least one electric/electronic component and/or one group of electric/electronic component by adhesion.
In working of an invention mode according to claim 3, advantageously, at least one electric/electronic component and/or one group of electric/electronic component are surrounded by framework, wherein when at least one electric/electronic component and/or one group of electric/electronic component are inserted in the groove of cooling body and are in the state that inserts groove, framework prevent described at least one electric/electronic component and/or one group of electric/electronic component by in groove and/or on contact with cooling body and to form short circuit.Framework is just to cooperate (positivefit) and if necessary to surround at least one electric/electronic component and/or one group of electric/electronic component with non-just the cooperation, and improve the stability of at least one electric/electronic component and/or one group of electric/electronic component thus.The stability of this increase is with the feature that is fixed as of assembly.This is advantageous particularly during welding process because may exempt expensive measure for example plant equipment pin down assembly.
In addition, framework prevents that the zone that has electromotive force of at least one electric/electronic component and/or one group of electric/electronic component from contacting with cooling body during inserting groove.This prevents the formation of short circuit.
In working of an invention mode according to claim 4; advantageously; framework is by non-conductive material---preferably plastics are formed; and/or framework is just to cooperate and/or non-just being engaged in surrounded at least one electric/electronic component and/or one group of electric/electronic component to be cooled on the both sides at least; and/or framework be connected to printed circuit board (PCB) and thereby support and protect described at least one electric/electronic component to be cooled and/or one group of electric/electronic component; and/or framework is being faced or showing opening on the face of printed circuit board (PCB); at least one electric/electronic component to be cooled and/or one group of electric/electronic component can enter described opening and insert in the framework; and/or inside of frame shows guide, and this guide can insert in the process of framework its channeling conduct at least one electric/electronic component to be cooled and/or one group of electric/electronic component.Because of framework by non-conductive material---preferably plastics are formed, so prevented possible electrical short.Because of framework with just and/or non-just being engaged in surround at least one electric/electronic component and/or one group of electric/electronic component to be cooled on the both sides at least, so realized on the printed circuit board (PCB) and about the good stable of printed circuit board (PCB).Because of framework is connected to printed circuit board (PCB); so framework machinery twelve Earthly Branches are held the connection between at least one electric/electronic component to be cooled and/or the one group of electric/electronic component; and protect this connection not to be subjected to applied external force simultaneously, make framework at first compensate the mechanical force that the electromechanical of ground absorption between printed circuit board (PCB) and at least one electric/electronic component and/or one group of electric/electronic component connects.Because of framework in the face of or on the face of printed circuit board (PCB), opening is arranged, so at least one electric/electronic component to be cooled and/or one group of electric/electronic component can be easily mounted in the framework.Because of inside of frame have can be during at least one electric/electronic component to be cooled and/or one group of electric/electronic component insert framework to the guide of its guiding, so described at least one electric/electronic component and/or one group of electric/electronic component might easily be installed.
In working of an invention mode according to claim 5, advantageously, at least one electric/electronic component to be cooled and/or one group of electric/electronic component are electrically connected to printed circuit board (PCB) at least, and are arranged to depart from printed circuit board (PCB) or directly are fixed on the printed circuit board (PCB).At least one electric/electronic component to be cooled and/or the device of one group of electric/electronic component from printed circuit board (PCB) depart from make will at least one electric/electronic component to be cooled and/or one group of electric/electronic component enough insert deeply cooling body groove in case heat transfer medium complete cycle ground around they are possible with encirclement.
In the working of an invention mode according to claim 6, advantageously, at least one electric/electronic component to be cooled and/or one group of electric/electronic component can both equally with printed circuit board (PCB) be inserted in the groove of cooling body under being with or without the situation of framework.In this way, might cool off the whole sub-assembly that is arranged on the printed circuit board (PCB).In addition, the SMD assembly that is arranged on the printed circuit board (PCB) also can be cooled.
In working of an invention mode according to claim 7, advantageously, printed circuit board (PCB) can be fastened on the cooling body, and when printed circuit board (PCB) in its tightening state on cooling body the time, between circuit board and cooling body, leave the space, be transferred to printed circuit board (PCB) from cooling body and at least one electric/electronic component and/or one group of electric/electronic component to be cooled so that prevent temperature to a great extent.Therefore printed circuit board (PCB) avoids Temperature Influence.Printed circuit board (PCB) no longer is arranged the assembly and/or the heat release of one group of assembly and heating thereon.Therefore also may on this printed circuit board (PCB), arrange temperature-sensitive element.
In another favourable execution mode of invention, cooling body shows dividing plate, and described dividing plate is arranged on the face in the face of printed circuit board (PCB) at least, and printed circuit board (PCB) rests on the described dividing plate.These dividing plates prevent contact on a large scale between cooling body and the printed circuit board (PCB), prevent the heat radiation from the cooling body to the printed circuit board (PCB) thus.Because of the space forms, between printed circuit board (PCB) and cooling body, thermal insulation is arranged between printed circuit board (PCB) and cooling body.Simultaneously, increased the effective area of cooling body to the surrounding air heat radiation.
In further describing below, other features of the present invention and details will be described in conjunction with the accompanying drawings based on the example of embodiment.Feature described in individual other version and correlation all execution mode examples of can migrating basically.The invention is not restricted to a kind of in following embodiment example or the following execution mode example.In description of drawings, identical reference symbol is used to same element in institute's drawings attached.This helps to understand better the present invention.
Description of drawings
Accompanying drawing shows:
Fig. 1 by have framework, according to the longitudinal section of device of the present invention,
Fig. 2 has top view framework, foundation device of the present invention,
Fig. 3 is the electronic building brick that has framework that is arranged on the printed circuit board (PCB),
Fig. 4 is the electronic building brick that has framework that is arranged on the printed circuit board (PCB),
Fig. 5 is the electronic building brick that has framework that is arranged on the printed circuit board (PCB),
Fig. 6 is the assembly that has perimeter frame,
Fig. 7 is the frame side view,
Fig. 8 is another view of framework,
Fig. 9 is the schematic diagram with the longitudinal section according to cooling body of the present invention,
Figure 10 is the preceding schematic diagram by longitudinal section frameless (naked), foundation device of the present invention of assembling,
Figure 11 is the schematic diagram by the longitudinal section of foundation device of the present invention,
Figure 12 be by the SMD that is used to have printed circuit board (PCB), according to the schematic diagram of another longitudinal section of device of the present invention,
Figure 13 be before the assembling by having the schematic diagram that is used to another longitudinal section framework separating/insulate, foundation device of the present invention,
Figure 14 is that the assembling back is by having the schematic diagram of another longitudinal section framework, foundation device of the present invention.
Embodiment
Fig. 1 shows by the longitudinal section according to device of the present invention.Cooling body 2 has been shown in the longitudinal section.Cooling body 2 has shown corresponding grooves for the amplification on its surface.Groove 3 is being faced formation in cooling body 2 on the one side of printed circuit board (PCB) 7.Corresponding to the shape of assembly to be cooled 1, this assembly 1 will rely on cooling body to cool off to groove 3 approx.Assembly to be cooled can for example relate to power transistor or integrated circuit.Assembly 1 is electrically connected to printed circuit board (PCB) 7, and in Fig. 1, vertically away from printed circuit board (PCB), promptly, assembly 1 only is connected by simple thin mechanical connection, this preferably can only realize by the electric terminal of assembly 1 or be the special-purpose groove in the assembly 1 alternatively, so that the mechanical connection of formation and printed circuit board (PCB) 7.Heat transfer medium 4 is introduced in the groove 3.Heat transfer medium 4 is preferably liquid, viscosity, gelatinous, gluey or similar adhesive and has good thermal conductivity.And simultaneously, heat transfer medium is non-conductive.Heat transfer medium 4 must be introduced in the groove 3 before assembly 1 to be cooled is installed, and wherein assembly 1 may relate to single component, one group of assembly, it is provided with the integrated circuit or the printed circuit board (PCB) of a plurality of electric/electronic components.
Heat transfer medium is introduced in the groove 3.The assembly 1 that is arranged on the printed circuit board (PCB) now is inserted in the groove 3.When assembly 1 inserts in the groove 3, assembly 1 will be arranged in heat transfer medium 4 displacements of groove 3, make that heat transfer medium 4 centers on this assembly at complete cycle when assembly 1 is in the state that inserts groove 3.In a favourable execution mode, the amount of the heat transfer medium 4 in groove 3 is mixed with (dosed) and makes when assembly 1 is in the state that inserts groove 3, heat transfer medium 4 forms slight superelevation at the opening part of groove 3 with respect to printed circuit board (PCB) 7, makes heat transfer medium 4 fully also assembly 1 is enclosed in the groove 3 complete cycle ground.In another favourable execution mode of the present invention, select heat transfer medium 4, make that when cooling body 2 goes over or overturns it also is retained in the groove 3 and adhesively adheres to.
In another favourable execution mode of the present invention, heat transfer medium 4 sclerosis also thereby are fixed on assembly in the groove 3 simultaneously.
In another favourable execution mode, framework 5 surrounds assembly 1.Surround assembly 1 and in preferred embodiment, be mechanically connected to the framework 5 assurance assemblies 1 of printed circuit board (PCB) 7 and the stable connection between the printed circuit board (PCB) 7.Framework 7 is also comprised, makes that it prevents that assembly 1 from touching cooling body 2 when assembly 1 inserts groove 3.This prevents short circuit during the electric adjustment of assembly 1.
Be inserted in the state of groove 3 at assembly 1, printed circuit board (PCB) 7 rests on the rising point (elevation point) 11 of cooling body 2.By the raised portion 11 of selecting cooling body 2 cleverly, space 12 will remain between printed circuit board (PCB) 7 and the cooling body 2.Space 12 prevent heat from cooling body 2 and/or from assembly 1 to the complete cycle of printed circuit board (PCB) 7 and a large amount of transmission.
In groove 3, use the heat release as assembly 1 of sealing of the complete cycle of 4 pairs of assemblies 1 of heat transfer medium to be delivered to cooling body 2 in a large number and to prepare.Because of assembly 1 to the attachment of printed circuit board (PCB) 7 with regard to volume and area Yan Shixiao, so printed circuit board (PCB) 7 almost completely is not subjected to the influence of the heat radiation of assembly 1.
Fig. 2 shows the top view on the printed circuit board (PCB) 7, and described printed circuit board (PCB) rests on cooling body 2 and the raised portion 11.Clearly, assembly 1 has to the electrical connection of printed circuit board (PCB) 7, and framework 5 is mechanically connected to printed circuit board (PCB) 7.
Fig. 3 shows the execution mode of framework 5.Framework 5 is mechanically connected to printed circuit board (PCB) 7 by anchor point.Framework 5 preferably is made up of plastics and/or non-conductive material.In another embodiment, framework also can be by metal or metal material manufacturing.But at this moment be necessary to prevent not have electrical connection between framework 5 and the assembly 1.Framework 5 is stable prepare of assembly 1 on printed circuit board (PCB) 7, and also makes assembly 1 is arranged on the printed circuit board (PCB) 7 and departs from printed circuit board (PCB) 7 slightly and become possibility.
Fig. 4 shows another view of the framework 5 on the printed circuit board (PCB) 7.Assembly 1 is arranged in the framework 5.Framework 5 comprises guide 10, directing assembly 1 when it inserts framework 5 at assembly 1.
In yet another embodiment of the present invention, framework 5 is directly connected on the assembly 1 in independent job step.
Fig. 5 provides another view of framework 5, and assembly 1 is fastened in the framework 5.Framework 5 is mechanically connected to printed circuit board (PCB) 7.Assembly 1 is electrically connected to printed circuit board (PCB) by terminal 15.Fig. 5 has demonstrated the anchor point 14 between printed circuit board (PCB) 7 and the framework 5.The terminal 15 of assembly 1 is electrically connected to printed circuit board (PCB) 7.
Fig. 6 illustrates another framework 5 that has inserted assembly 1, and the shape of framework 5 clearly.In addition, the electric terminal 15 of assembly also is easy to identification, relies on described electric terminal, and assembly 1 is electrically connected to printed circuit board (PCB) 7.
Fig. 7 and Fig. 8 show the different views of the framework 5 that does not have assembly 1.Clearly, have frame groove 16, when assembly 1 was inserted in the framework 5, the electric terminal 15 of assembly 1 was conducted through this frame groove.Anchor point 14 embodies with hook shape.Therefore framework 5 can rely on the buckle-type securing member to be connected to printed circuit board (PCB) 7, and described buckle-type securing member stretches into the opening that is arranged on the printed circuit board (PCB) subsequently.In favourable execution mode, framework 5 has also been showed pin 17, when framework 5 is put into printed circuit board (PCB) 7 or be put on the printed circuit board (PCB) 7, and the framework 5 on described pin 17 printed circuit holdings 7.
Fig. 9 shows the longitudinal section by cooling body 2.Groove 3 forms in cooling body 2.For example, groove 3 with blind hole or otherwise square (quadratic) or rectangle countersunk in cooling body, form.The heat transfer medium 4 of determining amount is introduced into groove 3 by for example silk-screen technology or by injection.Guarantee that each raised portion 11 that printed circuit board (PCB) 7 (not showing) does not directly rest on the cooling body 2 is arranged on the cooling body 2 in Fig. 9.
Figure 10 shows cooling body 2.In the state that illustrates, printed circuit board (PCB) 7 has been introduced on the cooling body 2, and assembly 1 is introduced in the groove 3 that heat transfer medium 4 is arranged in, and wherein, the assembly 1 that is arranged to vertically stand on the printed circuit board (PCB) 7 in the execution mode according to Figure 10 is installed on the printed circuit board (PCB).
Figure 11 shows printed circuit board (PCB) 7, and wherein assembly 1 is arranged to stand on the printed circuit board (PCB) 7.Assembly 1 is introduced into the groove 3 of cooling body 2.The raised portion 11 of cooling body 2 remains on printed circuit board (PCB) 7 apart from the certain distance of cooling body 2.Space 12 forms between cooling body 2 and printed circuit board (PCB) 7.The insertion of heat transfer medium 4 by assembly 1 that is present in the groove 3 is shifted and surrounds now assembly 1, and assembly 1 almost complete cycle ground inserts in the groove 3 fully.This guarantees from assembly 1 to heat transfer medium 4 and stride across the good heat transmission of heat transfer medium 4 to cooling body 2.
Figure 12 illustrates the longitudinal section by cooling body 2 once more.Groove 3 forms in cooling body 2 once more.In Figure 12, assembly 1---is the SMD assembly---and is directly installed on the printed circuit board (PCB) 7 in this execution mode.Assembly 1 is introduced in the groove 3 jointly with printed circuit board (PCB) 7.The heat transfer medium 4 that has been present in before introducing in the groove 3 now surrounds assembly 1 and printed circuit board (PCB) 7 in groove 3.There is the complete cycle cooling of assembly 1 together with printed circuit board (PCB) 7.
In Figure 13, assembly 1 also directly is arranged on the printed circuit board (PCB) 7.Framework 5 surrounds assembly 1, and particularly electric terminal 15.Framework 5 guarantees in the process of assembly 1 being introduced and being placed in the groove 3, not contact between part assembly 1, the particularly charged gesture of assembly 1 and/or conduction and the cooling body 2.
Figure 14 shows the layout of Figure 13, makes assembly 1 be introduced in the groove 3 of cooling body 2 together with framework 5 on every side.Heat transfer medium 4 complete cycle ground surround framework 5 and assembly 1 now.Printed circuit board (PCB) 7 rests on the raised portion 11 of cooling body 2, and space 12 forms between printed circuit board (PCB) 7 and cooling body 2.
List of numerals
1 assembly
2 cooling bodies
3 grooves
4 media (heat transfer medium)
5 frameworks
7 printed circuit board (PCB)s
9 openings
10 guides
11 raised portions
12 spaces
14 anchor points
15 terminals
16 grooves
17 pin
Claims (7)
1. one kind is used to rely on cooling body (2) to cool off at least one device electric and/or electronic building brick and/or one group of electric/electronic component (1), it is characterized in that, described cooling body (2) shows at least one groove (3), described electric/electronic component to be cooled and/or one group of electric/electronic component (1) can be inserted in the described groove (3), and medium (4) is introduced in the described groove (3), and described medium (4) almost completely surrounds described at least one electric/electronic component and/or the one group of electric/electronic component (1) that is under the state that is inserted into described groove (3).
2. device as claimed in claim 1 is characterized in that, described medium (4) is a heat transfer medium, and described heat transfer medium is liquid, viscosity, gelatinous, gluey or similar adhesive, and described heat transfer medium has good thermal conductivity.
3. device as claimed in claim 1, it is characterized in that, described at least one electric/electronic component and/or one group of electric/electronic component (1) are surrounded by framework (5), wherein when described at least one electric/electronic component and/or one group of electric/electronic component (1) are inserted into the described groove (3) of described cooling body (2), and be inserted under the state of described groove (3) at described at least one electric/electronic component and/or one group of electric/electronic component (1), described framework (5) prevents that described at least one electric/electronic component and/or one group of electric/electronic component (1) from forming short circuit by the described cooling body of contact (2).
4. as claim 1 or 3 described devices; it is characterized in that; described framework (5) is by non-conductive material---preferably plastics are formed; and/or described framework (5) is just to cooperate and/or non-just being engaged in surrounded described at least one electric/electronic component and/or one group of electric/electronic component (1) to be cooled on the both sides at least; and/or described framework (5) be connected to described printed circuit board (PCB) (7) and thereby support and protect described at least one electric/electronic component to be cooled and/or one group of electric/electronic component (1); and/or described framework (5) is being faced or showing opening (9) on the face of described printed circuit board (PCB) (7); described at least one electric/electronic component to be cooled and/or one group of electric/electronic component (1) can enter described opening and insert in the described framework (5); and the inside of described framework (5) shows guide (10), and described guide inserts in the process of described framework (5) its channeling conduct at described at least one electric/electronic component to be cooled and/or one group of electric/electronic component (1).
5. as the described device of claim 1 to 4, it is characterized in that, described at least one electric/electronic component and/or one group of electric/electronic component (1) to be cooled are electrically connected to printed circuit board (PCB) (7) at least, and are arranged to depart from described printed circuit board (PCB) (7) or are fixed on the described printed circuit board (PCB) (7).
6. as the described device of claim 1 to 5, it is characterized in that described at least one electric/electronic component to be cooled and/or one group of electric/electronic component (1) can have framework (5) or not have the same described groove (3) that is inserted into described cooling body (2) with described printed circuit board (PCB) (7) under the situation of framework (5).
7. as the described device of claim 1 to 5, it is characterized in that, described printed circuit board (PCB) (7) can be fastened on the described cooling body (2), and when described printed circuit board (PCB) (7) in its tightening state when described cooling body (2) is gone up, between described printed circuit board (PCB) (7) and described cooling body (2), leave space (12), transmit to the temperature of described printed circuit board (PCB) (7) from described cooling body (2) and/or described at least one electric/electronic component and/or one group of electric/electronic component (1) to be cooled so that prevent to a great extent.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009044368.1A DE102009044368B4 (en) | 2009-10-30 | 2009-10-30 | cooling arrangement |
| DE102009044368.1 | 2009-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102186326A true CN102186326A (en) | 2011-09-14 |
Family
ID=43828511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105249370A Pending CN102186326A (en) | 2009-10-30 | 2010-10-27 | Cooling arrangement |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20110100598A1 (en) |
| CN (1) | CN102186326A (en) |
| DE (1) | DE102009044368B4 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106575643A (en) * | 2014-10-29 | 2017-04-19 | 新电元工业株式会社 | Heat-dissipating structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010043445B3 (en) | 2010-11-05 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Capacitor assembly for power electronic apparatus, has spacer and electrical isolating capping material that are arranged such that capacitor is in non contact with metal structure |
| DE102011006632A1 (en) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | electronic module |
| DE102012222959B4 (en) | 2012-12-12 | 2015-04-02 | Semikron Elektronik Gmbh & Co. Kg | Power component device |
| CN104682722B (en) * | 2013-11-26 | 2018-01-26 | 台达电子企业管理（上海）有限公司 | Power supply change-over device and its assemble method |
| EP3214646A4 (en) * | 2014-10-29 | 2018-05-30 | Shindengen Electric Manufacturing Co., Ltd. | Heat-dissipating structure |
| DE102017205857B3 (en) * | 2017-04-06 | 2018-06-07 | Audi Ag | Cooling device, in particular for electronic components, and electronic assembly with it |
| KR101957330B1 (en) | 2017-08-14 | 2019-06-19 | 전남대학교산학협력단 | Method for virtual electric power trading between e-prosumer and agent apparatus for the same |
| DE102021001714A1 (en) * | 2021-04-01 | 2022-10-06 | KSB SE & Co. KGaA | Centrifugal pump with electronics cooling within an electronics housing |
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| CN106575643B (en) * | 2014-10-29 | 2018-10-16 | 新电元工业株式会社 | Radiator structure |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102009044368B4 (en) | 2014-07-03 |
| DE102009044368A1 (en) | 2011-05-05 |
| US20110100598A1 (en) | 2011-05-05 |
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Application publication date: 20110914 |