CN102185223A - Electrical connector system - Google Patents
Electrical connector system Download PDFInfo
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- CN102185223A CN102185223A CN2010106252262A CN201010625226A CN102185223A CN 102185223 A CN102185223 A CN 102185223A CN 2010106252262 A CN2010106252262 A CN 2010106252262A CN 201010625226 A CN201010625226 A CN 201010625226A CN 102185223 A CN102185223 A CN 102185223A
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- wafer assemblies
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Abstract
The invention provides an electrical connector system, which comprises a first sheet assembly (210) engaged with a substrate and a second sheet assembly (210) configured to be engaged with the substrate. A grounding piece (212) is coupled to the first sheet assembly and the second sheet assembly. The grounding piece arranged to be engaged with the substrate provides a ground potential between the first sheet assembly, the second sheet assembly and the substrate.
Description
Technical field
The present invention relates to a kind of electric connector system that is used to be installed on the substrate.
Background technology
Typically, the back plane connector system be used for with first substrate that connects such as the parallel or vertical relation of second substrate of another printed circuit board (PCB) such as printed circuit board (PCB).Along with electronic component dimensions reduce and it becomes and becomes increasingly complex, often wish in the littler space on circuit board or other substrate, to install more electronic component.Thereby, wished to reduce the quantity that space between the intrasystem electrical contact of back plane connector and increase are contained in the electrical contact in the back plane connector system.Reduce space between the electrical contact and be easy to increase electrical noise and interference between the electrical contact, especially when the signal speed in the electric connector system increases.
Need a kind of electric connector system, it can increase and be contained under the situation that the quantity of the electrical contact in the electric connector system increases and moves in speed.
Summary of the invention
According to the present invention, a kind of electric connector system comprises first wafer assemblies that is configured to bonded substrate and second wafer assemblies that is configured to bonded substrate.Ground strip couples mutually with first wafer assemblies and second wafer assemblies.Ground strip is configured to bonded substrate and public ground potential is provided between first wafer assemblies, second wafer assemblies and substrate.
Description of drawings
Fig. 1 connects the schematic diagram of first substrate to the back plane connector system of second substrate;
Fig. 2 A is the perspective view that comprises the electric connector system of ground strip;
Fig. 2 B is the partial exploded view of the electric connector system of Fig. 2 A;
Fig. 3 is the perspective view of an execution mode of ground strip;
Fig. 4 is the guide wire of alternative shape of the electric connector system of Fig. 2 A;
Fig. 5 is another view of a part of the electric connector system of Fig. 2 A;
Fig. 6 is the perspective view that comprises earth-shielded electric connector system;
Fig. 7 is the perspective view of an earth-shielded execution mode;
Fig. 8 is the guide wire of alternative shape of the electric connector system of Fig. 6;
Fig. 9 is another view of a part of the electric connector system of Fig. 6;
Figure 10 is earth-shielded another perspective view of Fig. 7;
Figure 11 is the perspective view that comprises the electric connector system of organizer;
Figure 12 is the perspective view of the electric connector system that soon engages with substrate;
Figure 13 is the guide wire of alternative shape of the electric connector system of Figure 12;
Figure 14 is the electric connector system of Figure 12 and perspective view after substrate engages.
Embodiment
The present invention relates to the back plane connector system that is connected with one or more substrate.The back plane connector system can move (that is, at least up to 25Gbps) under high speed, and in some embodiments, also provides high density pin (that is at least 50 pairs of electric connectors of per inch).In one embodiment, as shown in Figure 1, back plane connector system 102 can be used for with second the substrate 106 parallel or vertical relation of another printed circuit board (PCB) for example, connect first substrate 104, for example printed circuit board (PCB).Describe in detail more as following, the execution mode of disclosed connector system can comprise ground strip, earth shield, and/or other ground structure, it is at the base plate trace, back plane connector, and/or it is right roughly to seal the right electric connector of the electric connector that can be difference in the mode of three-dimensional in the gamut of subcard trace.The ground strip of these sealings, earth shield, and/or ground structure, together with around electric connector to the dielectric filler in the difference cavity itself, can prevent in high speed backplane connector system running undesirable non-horizontal, longitudinally and the more propagation of higher order mode.
Fig. 2 A is the perspective view that is used to connect the electric connector system 202 of a plurality of substrates.In one embodiment, electric connector system 202 has installation end 204 that is connected to first substrate (for example, the substrate among Fig. 1 104) and the abutting end 206 that is connected to second substrate (for example, the substrate among Fig. 1 106).When engaging with electric connector system 202, first and second substrates are arranged with the relation of approximate vertical.Electric connector system 202 can comprise thin slice shell 208, one or more wafer assemblies 210, and one or more ground strip 212.
In the execution mode of Fig. 2 A and Fig. 2 B, first shell 214 of wafer assemblies 210 comprises conductive surface, and this conductive surface defines a plurality of passages 222 that are sized to receive the first array electrical contact 216.In this embodiment, second shell 220 also comprises conductive surface, and this conductive surface defines a plurality of being sized to receive the passage of the second array electrical contact 218.Passage 222 shown in the passage of second shell 220 and Fig. 2 B is roughly similar.In some embodiments, be lined with insulating barrier in the passage, for example over-molded plastic dielectric, thus when the first and second array electrical contacts 216 and 218 roughly were positioned at separately in the passage, insulating barrier was with the conductive surface electrical isolation of electrical contact and first and second shells 214 and 220.In other embodiments, insulating barrier directly is coated to described array electrical contact 216 and 218.After described array electrical contact 216 and 218 had navigated in crust component 214 and 218, shell 214 and 218 was joined together to form wafer assemblies 210.
The described array electrical contact 216 and 218 of wafer assemblies 210 can comprise a series of substrate joint element, and the electrical contact that for example is shown in Fig. 2 B is installed pin 224.In one embodiment, the substrate joint element is with wafer assemblies 210 and substrate machinery and the electric signal contact that couples.When the first and second array electrical contacts 216 and 218 were positioned in a plurality of passages in crust component 214 and 220, the substrate joint element extended to couple with first substrate from the installation end 204 of wafer assemblies 210.Similarly, the first and second array electrical contacts 216 and 218 matching connector 226 from the abutting end 206 of wafer assemblies 210 extend with second substrate or another adapting device, for example top module couples.Matching connector 226 can close band shape, three beam shapes, twin beams shape, circular, sun, cloudy, positive cloudy coenosarc, perhaps the connector form of another cooperation.
When the first array electrical contact 216 roughly is positioned in a plurality of passages 222 of first shell 214 and the second array electrical contact 218 when roughly being positioned in a plurality of passages of second shell 220, each electrical contact of the first array electrical contact 216 can be positioned to adjacent with the electrical contact of the second array electrical contact 218.In some embodiments, the first and second array electrical contacts 216 and 218 are positioned in a plurality of passages, thereby the distance between the adjacent electrical contact is roughly the same in the gamut of wafer assemblies 210.Simultaneously, to form a series of electrical contact right for the first and second array electrical contacts 216 and 218 adjacent electrical contact.In some embodiments, electrical contact is to can being that the electrical contact of difference is right.For example, electrical contact is to can be used for differential signal.
In some embodiments, right for each electrical contact, the electrical contact of the first array electrical contact 216 is corresponding with the electrical contact mirror image of the adjacent second array electronic contact 218.Right electrical contact becomes mirror image to provide advantage at the row of manufacturing and high speed electric property aspect the consistency of row to make electrical contact, also provides two row paired single structure simultaneously.
First and second shells 214 of wafer assemblies 210 and 220 form has conductive surface.For example, first and second shells 214 and 220 can form the plastics rack earth shell of plating.In some embodiments, each first and second shell 214 and 220 comprises the plastics or the die casting ground connection thin slice of plating, for example goes up zinc-plated (Sn) or die case zinc (Zn) at nickel (Ni).In other embodiments, first and second shells 214 and 220 can comprise die casting aluminium (Al), conductive polymer, metal jet molded part, the perhaps metal of other form.
The first and second array electrical contacts 216 and 218 of wafer assemblies 210 are made by electric conducting material.In some embodiments, the first and second array electrical contacts 216 and 218 are included in and are coated with phosphor-copper and gold (Au) or tin (Sn) on the nickel (Ni).In other embodiments, the electrical contact 216 and 218 of first and second arrays comprises any copper (Cu) alloy material.Plating can be any heavy metal for example palladium (Pd) or alloy for example Pd-Ni or on voltage contact area Pd flash plating Au, zinc-plated in the installation region (Sn) or nickel (Ni), and electroplate in the bottom or bottom electrical is coated with nickel (Ni).
Shown in Fig. 2 A, the installation end 204 that a plurality of ground strips 212 are positioned at electric connector system 202 is connected with a plurality of wafer assemblies 210.Each ground strip 212 is orientated as and is passed a plurality of wafer assemblies 210, thereby ground strip 212 engages each wafer assemblies 210.In other embodiments, the ground strip wafer assemblies 210 of bonding part only.
Fig. 3 is the perspective view of ground strip 212.Ground strip 212 among Fig. 3 comprises substrate joint element 302, shoulder 304, base portion 306 and holding element 308.Substrate joint element 302 can be that contact is installed, and for example ground connection is installed pin, when electric connector system 202 is installed on the substrate, this installations contact with ground strip 212 and substrate machinery be electrically connected.
Fig. 4 shows a plurality of ground strips 212 that engage with a plurality of wafer assemblies 210 and a ground strip 212 that soon engages with a plurality of wafer assemblies 210.Fig. 5 shows the end view of a plurality of ground strips 212 that engage with a plurality of wafer assemblies 210.When a plurality of ground strips 212 engaged with wafer assemblies 210, each ground strip 212 was arranged in and other ground strip 212 almost parallels.
Shown in Figure 4 and 5, each shell of wafer assemblies 210 is formed with groove 402.Groove 402 in the shell of first wafer assemblies 210 aligns with groove 402 in the shell of contiguous slices assembly 210, thereby a plurality of grooves 402 in the shell of ground strip 212 and a plurality of wafer assemblies 210 engage.When ground strip 212 engaged with one or more wafer assemblies 210, the base portion 306 of ground strip 212 was inserted in the groove 402 of wafer assemblies 210.After ground strip 212 was put in the groove 402, holding element 308 had formed by interference fit or interference engagement at the inner surface place of groove 402.For example, the width of groove 402 is defined as the holding element 308 that receives and keep ground strip 212.Holding element 308 can be formed in nick interface or other projection of lip-deep embossment of the base portion 306 of ground strip 212.This projection can extend out from the one side or the two sides of ground strip 212.In other embodiments, ground strip 212 is connected with the shell of wafer assemblies 210 by other syndeton.
With reference to figure 5, some ground strips 212 have blocked sight line at least in part between the signal contact of wafer assemblies 210.For example, the part of ground strip 212 has stopped a beeline channel at least in part between adjacent signal contact.By stopping at least in part that between two signal contacts this beeline channel, ground strip 212 help to be reduced in the propagation of disturbing between two signal contacts.For example, ground strip 212 can reduce crosstalking between the adjacent signal contact.When the signal along first signal pins transmission has disturbed signal along the transmission of secondary signal pin, may crosstalk.
In the execution mode of Fig. 5, a wafer assemblies 210 can comprise a plurality of signal contacts that extend from wafer assemblies 210.For example, a wafer assemblies can comprise signal contact 502,504,506 and 508.In one embodiment, signal contact 502 and 504 is parts of an electrical contact array, and signal contact 506 and 508 is parts of another electrical contact array.In Fig. 5, ground strip 212 be positioned to make these signal contacts some keep apart at least in part each other.For example, the substrate joint element 510 of ground strip 212 (and its shoulder 512 that links to each other) has stopped the sight line (for example, having stopped direct interferencing propagation path) between signal contact 502 and the signal contact 504.The substrate joint element 514 of ground strip 212 (and its shoulder 516 that links to each other) has been positioned to stop the sight line between signal contact 506 and the signal contact 508.
As shown in Figure 5, the ground strip 212 that comprises substrate joint element 510 and 514 also comprises other substrate joint element.These other substrate joint elements (link to each other with its shoulder) are used to be blocked in the various sight lines between other adjacent signal contact of other wafer assemblies.And, as shown in Figure 5, comprising signal contact 502,504,506 and 508 wafer assemblies can comprise other signal contact.Electric connector system 202 comprises that other ground strip is to be blocked in the various sight lines between these signal contacts.For example, Fig. 5 shows other ground strip 212, its stopped signal contact 504 and 508 and the adjacent signal contact in signal contact 504 and 508 left sides between sight line.
Other execution modes of electric connector system 202 can comprise other the earth shield structure except ground strip 212.Fig. 6 is the perspective view that comprises the electric connector system 202 of earth shield 602.As shown in Figure 6, an engage sides of an earth shield 602 and a wafer assemblies 210.The other earth shield similar or identical with shown earth shield 602 can be positioned between the wafer assemblies 210.Two in these other earth shields are marked as 604 and 606, though only can see each less end in these earth shields in Fig. 6.Earth shield 602 can be disposed on first side of first wafer assemblies, and earth shield 604 is disposed on second side of first wafer assemblies between first wafer assemblies and second wafer assemblies.Earth shield 606 is disposed on the opposite side of second wafer assemblies then.
Fig. 7 is the perspective view of an execution mode of earth shield 602.Earth shield 602 can comprise one or more substrate joint element 702, and one or more ground connection cooperates fin 704, and one or more gang socket 706.Substrate joint element 702, for example ground connection is installed pin, is configured to earth shield 602 and the electric and mechanical connection of substrate.
When earth shield 602 engaged with wafer assemblies 210, ground connection cooperated fin 704 to extend away from the abutting end 206 of wafer assemblies 210.For example, ground connection fin 704 is by corresponding aperture on thin slice shell 208.In some embodiments, a ground connection cooperates fin 704 to be positioned on the pair of mating connectors that links to each other with wafer assemblies 210, and another ground connection cooperates fin 704 to be positioned at this under the matching connector.For example, pair of mating connectors can be enclosed in the interval 708 that forms between the adjacent cooperation fin 704 thereby ground connection fin 704 is separated from each other.In some embodiments, ground connection cooperates fin 704 to comprise one or more fit ribs 710.When earth shield 602 engages with wafer assemblies 210, the housing contacts of fit ribs 710 and wafer assemblies 210, thus the external conductive casing of ground connection fin 704 and wafer assemblies 210 is electrically connected.
As shown in Figure 8, the gang socket 706 of earth shield 602 is in order to connect one or more ground strip 212.Earth shield 602 can couple with a plurality of ground strips 212 and substrate, thereby provides a public ground potential between a plurality of ground strips 212 and this substrate.When earth shield 602 engaged with a plurality of ground strips 212, ground strip 212 is almost parallel each other, and with the main surface portion approximate vertical of earth shield 602.
The gang socket 706 of earth shield 602 be defined as with ground strip 212 by interference fit or interference engagement.In one embodiment, gang socket 706 comprises by first plate of material, 804, the second plate of material 806 and is positioned at a pair of protruding 808 grooves 802 that limit on first and second plate of material 804 and 806 apparent surfaces.First plate of material 804 defines first space 810 in earth shield 602.Similarly, second plate of material 806 defines second space 812 in earth shield 602.When ground strip 212 was put into groove 802, ground strip 212 made the part of the plate of material 804 of winning enter into first space 810, made the part of second plate of material 806 enter into second space 812, perhaps made the both like this.Ground strip 212 contacts to projection 808 with that in groove 802.When ground strip 212 engages with groove 802, groove 802 and projection 808 be defined as with ground strip 212 by interference fit or interference engagement.In other embodiments, ground strip 212 is connected with earth shield 602 by another bindiny mechanism.
With reference to figure 9 and 10, earth shield 602 can comprise that one or more connecting element 902 and 904 is so that the shell of earth shield 602 and wafer assemblies 210 couples.The shell of wafer assemblies 210 can comprise that corresponding element is with receiving connector element 902 and 904.For example, the shell of wafer assemblies 210 can comprise that one or more complementary openings is with receiving connector element 902 and form by interference fit or interference engagement.The shell of wafer assemblies 210 comprises that also one or more groove is to receive earth-shielded connecting element 904.Other execution modes may adopt different engaging mechanisms to connect earth shield 602 and wafer assemblies 210.
With reference to Figure 11, the installation end 204 of electric connector system 202 can comprise a plurality of ground strips 212 and a plurality of earth shield 602, and it is right that the electric connector of sealing or shield sheet assembly 210 is roughly orientated in this earth shield as.Electric connector is to being labeled as 1102, and is depicted as each side and all centers on ground strip 212 and earth shield 602 are arranged.The ground connection of a ground strip 212 is installed pin 1104 can be arranged on electric connector on 1102 first side (for example, the top side of Figure 11), and to be electric connector provide the ground connection isolation barrier to 1102 first side to be used for.The ground connection of another ground strip 212 is installed pin 1106 can be arranged on electric connector on 1102 second side (for example, the bottom side of Figure 11), and to be electric connector provide the ground connection isolation barrier to 1102 second side to be used for.The ground connection of an earth shield 602 is installed pin 1108 and is arranged on electric connector on 1102 the 3rd side (for example, the left side of Figure 11), and to be electric connector provide the ground connection isolation barrier to 1102 the 3rd side to be used for.At last, the ground connection of another earth shield 602 is installed pin 1110 can be arranged on electric connector on 1102 the 4th side (for example, the right side of Figure 11), and to be electric connector provide the ground connection isolation barrier to 1102 the 4th side to be used for.The ground connection isolation barriers of pin 1104,1106,1108 and 1110 formation are installed by ground connection can crosstalk in the prevention of electric connector system 202 run durations, interferes perhaps other undesirable non-laterally, vertically and more propagation of higher order mode.As shown in figure 11, other signal contact is to being grounded sheet 212 and earth shield 602 isolation similarly.
Figure 11 shows a kind of electric connector system 202, and it comprises the organizer 1112 on the installation end 204 that is positioned in a plurality of wafer assemblies 210.Organizer 1112 comprises the aperture, and it is defined as and allows electrical contact that pin is installed, and for example the electric connector of wafer assemblies 210 is to 1102, passes organizer and is connected with substrate.Organizer 1112 also comprises some apertures, and its ground connection installation pin 1104,1106,1108 and 1110 that is defined as permission earth shield 602 and ground strip 212 passes organizer 1112 and is connected with substrate.
Figure 12 and 13 shows the electric connector system 202 that will be connected with substrate 1202.In some embodiments, substrate 1202 comprises the printed circuit board (PCB) of have a plurality of signalling channels (for example passage 1302) and a plurality of ground connection passage (for example, passage 1304).The signal contact of signalling channel and wafer assemblies 210 machinery and being electrically connected is to couple wafer assemblies 210 and substrate 1202.Electric signal is transmitted between substrate 1202 and wafer assemblies 210 by signal contact then.The grounding contact of ground connection passage and earth shield 602 and ground strip 212 machinery and being electrically connected, thus ground strip 212 and earth shield 602 are coupled with substrate 1202.But the ground potential of sharing of common between substrate 1202, ground strip 212 and earth shield 602 then.Figure 14 shows and electric connector system 202 after substrate 1202 engages.
Claims (7)
1. electric connector system comprises first wafer assemblies (210) that is configured to bonded substrate and is configured to engage second wafer assemblies (210) of described substrate, it is characterized in that:
Ground strip (212) couples with described first wafer assemblies and described second wafer assemblies, and wherein said ground strip is configured to engage with described substrate and provide public ground potential between described first wafer assemblies, described second wafer assemblies and described substrate.
2. electric connector system as claimed in claim 1, wherein said first wafer assemblies comprises a plurality of signal contacts (224), these a plurality of signal contacts are configured to described first wafer assemblies and described substrate machinery and electric coupling, and wherein said ground strip is configured to when described ground strip and described first wafer assemblies couple, and is blocked in the sight line between the secondary signal contact of first signal contact of described a plurality of signal contacts and described a plurality of signal contacts at least in part.
3. electric connector system as claimed in claim 2, wherein said ground strip comprise be configured to described ground strip and described substrate machinery and electric couple first the contact (302) and the second installation contact (302) are installed;
Wherein said first installs contact is positioned on the described ground strip, thereby when described ground strip and described first wafer assemblies couple, is blocked in the sight line between described first signal contact and the described secondary signal contact at least in part; And
Wherein said second installs contact is positioned on the described ground strip, thereby when described ground strip and described first wafer assemblies couple, be blocked in the sight line between the 4th signal contact of the 3rd signal contact of described a plurality of signal contacts and described a plurality of signal contacts at least in part.
4. electric connector system as claimed in claim 2, wherein said ground strip comprise be configured to described ground strip and described substrate machinery and electric couple first the contact (302) and the second installation contact (302) are installed;
Wherein said first installs contact is positioned on the described ground strip, thereby when described ground strip and described first wafer assemblies couple, stops the sight line between described first signal contact and the described secondary signal contact at least in part; With
Wherein said second installs contact is positioned on the described ground strip, thereby when described ground strip and described second wafer assemblies couple, be blocked in the sight line between the secondary signal contact of first signal contact of described second wafer assemblies and described second wafer assemblies at least in part.
5. electric connector system as claimed in claim 1, wherein said first wafer assemblies comprises first shell (214) that defines first groove (402), wherein said second wafer assemblies comprises second shell (220) that defines second groove (402), and wherein said ground strip is configured to engage described first groove and described second groove, thus machinery and be electrically connected described first wafer assemblies and described second wafer assemblies.
6. electric connector system as claimed in claim 5, wherein said ground strip comprise holding member (308), and this holding member is configured to form interference engagement with the inner surface of described first groove or described second groove.
7. electric connector system as claimed in claim 1, wherein said first wafer assemblies comprises first shell (214) with conductive surface, wherein said second wafer assemblies comprises second shell (220) with conductive surface, thereby and wherein said ground strip and described first shell are connected with described second shell and described first wafer assemblies and described second wafer assemblies machinery and electric coupling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/641,904 | 2009-12-18 | ||
| US12/641,904 US7967637B2 (en) | 2008-12-05 | 2009-12-18 | Electrical connector system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102185223A true CN102185223A (en) | 2011-09-14 |
| CN102185223B CN102185223B (en) | 2015-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010625226.2A Active CN102185223B (en) | 2009-12-18 | 2010-12-20 | Electric connector system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102185223B (en) |
| TW (1) | TWI505579B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969618A (en) * | 2012-12-17 | 2013-03-13 | 深圳格力浦电子有限公司 | Female end plug of high-speed connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1710873A1 (en) * | 2004-01-09 | 2006-10-11 | Japan Aviation Electronics Industry, Limited | Connector |
| US20070155241A1 (en) * | 2005-12-31 | 2007-07-05 | Erni Elektroapparate Gmbh | Plug-and-socket connector |
| US20080146046A1 (en) * | 2006-12-19 | 2008-06-19 | Fci Americas Technology, Inc. | Backplane connector |
| CN101471515A (en) * | 2007-12-29 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7018239B2 (en) * | 2001-01-22 | 2006-03-28 | Molex Incorporated | Shielded electrical connector |
| US7682193B2 (en) * | 2007-10-30 | 2010-03-23 | Fci Americas Technology, Inc. | Retention member |
-
2010
- 2010-12-16 TW TW099144163A patent/TWI505579B/en active
- 2010-12-20 CN CN201010625226.2A patent/CN102185223B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1710873A1 (en) * | 2004-01-09 | 2006-10-11 | Japan Aviation Electronics Industry, Limited | Connector |
| US20070155241A1 (en) * | 2005-12-31 | 2007-07-05 | Erni Elektroapparate Gmbh | Plug-and-socket connector |
| US20080146046A1 (en) * | 2006-12-19 | 2008-06-19 | Fci Americas Technology, Inc. | Backplane connector |
| CN101471515A (en) * | 2007-12-29 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969618A (en) * | 2012-12-17 | 2013-03-13 | 深圳格力浦电子有限公司 | Female end plug of high-speed connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102185223B (en) | 2015-08-26 |
| TWI505579B (en) | 2015-10-21 |
| TW201126835A (en) | 2011-08-01 |
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Address after: American Pennsylvania Patentee after: Tailian Corporation Address before: American Pennsylvania Patentee before: Tyco Electronics Corp. |