CN102181040A - Medium molecular weight solid bisphenol A epoxy resin - Google Patents
Medium molecular weight solid bisphenol A epoxy resin Download PDFInfo
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- CN102181040A CN102181040A CN 201110103266 CN201110103266A CN102181040A CN 102181040 A CN102181040 A CN 102181040A CN 201110103266 CN201110103266 CN 201110103266 CN 201110103266 A CN201110103266 A CN 201110103266A CN 102181040 A CN102181040 A CN 102181040A
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- epoxy resin
- molecular weight
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- weight solid
- solid bisphenol
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Abstract
The invention discloses a medium molecular weight solid bisphenol A epoxy resin. The epoxy resin is characterized by containing the following components in part by mass: 750 to 800 parts of diphenol propane, 420 to 440 parts of epoxy chloropropane, and 600 to 640 parts of 30 percent sodium hydroxide. The medium molecular weight solid bisphenol A epoxy resin has strong adsorption capacity and good bending performance; the impact resistant performance of the epoxy resin is improved by over 20 percent; and the epoxy resin can simultaneously resist the corrosion of acid, alkali, salt, ammonia and the like, has high storage stability, and can prolong the storage time.
Description
Technical field
The present invention relates to a kind of resin, be specially a kind of A type Resins, epoxy that is used for tackiness agent, protective system, decorative paint, varnish etc.
Background technology
The kind of present Resins, epoxy has a variety of, and purposes is also very extensive; Because its cohesive force is strong, shrinkability good, stability is high, in paint of coating, tackiness agent, obtained using widely.The corrosion that but the Resins, epoxy impact resistance of Shi Yonging is poor in the market, can not resist multiple medium, and storage stability is poor, has had a strong impact on functional quality, work-ing life and the quality guaranteed period of binding agent and coating.
Summary of the invention
Goal of the invention:, the invention provides a kind of shock resistance, corrosion-resistant, middle molecular weight solid bisphenol A type epoxy resin that storage stability is high in order to solve the problems of the prior art.
Technical scheme: to achieve these goals, a kind of middle molecular weight solid bisphenol A type epoxy resin of the present invention, the mass fraction of its content is as follows: 750 parts-800 parts of diphenylol propanes; 420 parts-440 parts of epoxy chloropropane; 30% sodium hydroxide 600-640 part.
Molecular weight solid bisphenol A type epoxy resin generation temperature is 70-75 ℃ in of the present invention; Churning time is 40-42 second.
The mass fraction of the preferred embodiment of molecular weight solid bisphenol A type epoxy resin is as follows in of the present invention: 760 parts of diphenylol propanes; 430 parts of epoxy chloropropane; 630 parts in 30% sodium hydroxide; Stir generation in 40 seconds down at 73.5 ℃.
Beneficial effect: the present invention compared with prior art has following advantage:
Molecular weight solid bisphenol A type epoxy resin high adsorption capacity in of the present invention, good bending property, shock resistance improve more than 20%, corrosion such as acid-and base-resisting simultaneously, salt, ammonia, the stability in storage height can prolong the storage time more than 1 year.
Embodiment
Below in conjunction with specific embodiment, further illustrate the present invention, should understand these embodiment only is used to the present invention is described and is not used in and limit the scope of the invention, after having read the present invention, those skilled in the art all fall within the application's claims to the modification of the various equivalent form of values of the present invention and limit.
Embodiment 1
Molecular weight solid bisphenol A type epoxy resin in a kind of, proportioning is as follows: diphenylol propane 760kg; Epoxy chloropropane 430kg; 30% sodium hydroxide 630kg; Stir generation in 40 seconds down at 73.5 ℃.
Embodiment 2
Molecular weight solid bisphenol A type epoxy resin in a kind of, proportioning is as follows: diphenylol propane 750kg; Epoxy chloropropane 420kg; 30% sodium hydroxide 610kg; Stir generation in 41 seconds down at 70 ℃.
Embodiment 3
Molecular weight solid bisphenol A type epoxy resin in a kind of, proportioning is as follows: diphenylol propane 765kg; Epoxy chloropropane 435kg; 30% sodium hydroxide 600kg; Stir generation in 41 seconds down at 72 ℃.
Embodiment 4
Molecular weight solid bisphenol A type epoxy resin in a kind of, proportioning is as follows: diphenylol propane 790kg; Epoxy chloropropane 440kg; 30% sodium hydroxide 635kg; Stir generation in 42 seconds down at 74 ℃.
Embodiment 5
Molecular weight solid bisphenol A type epoxy resin in a kind of, proportioning is as follows: diphenylol propane 800kg; Epoxy chloropropane 440kg; 30% sodium hydroxide 640kg; Stir generation in 42 seconds down at 75 ℃.
Claims (3)
1. molecular weight solid bisphenol A type epoxy resin in a kind, it is characterized in that: the mass fraction of its content is as follows: 750 parts-800 parts of diphenylol propanes; 420 parts-440 parts of epoxy chloropropane; 30% sodium hydroxide 600-640 part.
2. molecular weight solid bisphenol A type epoxy resin in according to claim 1 is characterized in that: molecular weight solid bisphenol A type epoxy resin generation temperature is 70-75 ℃ in this; Churning time is 40-42 second.
3. molecular weight solid bisphenol A type epoxy resin in according to claim 1, it is characterized in that: the mass fraction of described its content is as follows: 760 parts of diphenylol propanes; 430 parts of epoxy chloropropane; 630 parts in 30% sodium hydroxide; Stir generation in 40 seconds down at 73.5 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110103266 CN102181040A (en) | 2011-04-25 | 2011-04-25 | Medium molecular weight solid bisphenol A epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110103266 CN102181040A (en) | 2011-04-25 | 2011-04-25 | Medium molecular weight solid bisphenol A epoxy resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102181040A true CN102181040A (en) | 2011-09-14 |
Family
ID=44567349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110103266 Pending CN102181040A (en) | 2011-04-25 | 2011-04-25 | Medium molecular weight solid bisphenol A epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102181040A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756459A (en) * | 2014-01-22 | 2014-04-30 | 青岛金海鲨光电科技有限公司 | Nano optical waterproof glue and nano waterproof lamp employing same |
| CN104479498A (en) * | 2014-12-19 | 2015-04-01 | 苏州菲博特智能科技有限公司 | Monitoring equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1133305A (en) * | 1994-10-17 | 1996-10-16 | 布兰科尼尔有机合成研究院 | Process for making solid epoxy resin |
| CN1931890A (en) * | 2006-09-26 | 2007-03-21 | 蓝星化工新材料股份有限公司无锡树脂厂 | Synthesis process of epoxy resin with anionic catalyst |
-
2011
- 2011-04-25 CN CN 201110103266 patent/CN102181040A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1133305A (en) * | 1994-10-17 | 1996-10-16 | 布兰科尼尔有机合成研究院 | Process for making solid epoxy resin |
| CN1931890A (en) * | 2006-09-26 | 2007-03-21 | 蓝星化工新材料股份有限公司无锡树脂厂 | Synthesis process of epoxy resin with anionic catalyst |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756459A (en) * | 2014-01-22 | 2014-04-30 | 青岛金海鲨光电科技有限公司 | Nano optical waterproof glue and nano waterproof lamp employing same |
| CN104479498A (en) * | 2014-12-19 | 2015-04-01 | 苏州菲博特智能科技有限公司 | Monitoring equipment |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110914 |