CN102174974A - Vacuum insulation panel supported by full-paperboard structure and manufacturing method thereof - Google Patents

Abstract

The invention relates to a vacuum insulation material, and in particular relating to a vacuum insulation panel supported by a full-paperboard structure and a manufacturing method thereof. The vacuum insulation panel comprises core materials, and outer cladding materials which are made of impermeable thin films, wherein the core materials comprise an upper panel and a lower panel which are made of paper fiber boards with low heat conduction coefficient; a paper core is clamped between the upper panel and the lower panel; the paper core is internally provided with a plurality of square cavities, round cavities or polygon cavities; the paper core is made of paper fiber boards with lower heat conduction coefficient and high intensity; and the upper panel and the lower panel are provided with permeable small holes which are in one-to-one correspondence with the cavities. The vacuum insulation panel and the method provided by the invention have the advantages that because the used core materials have low cost, are easy to manufacture, thus the price of the vacuum insulation panel is far lower than that of the existing vacuum insulation panel; the reasonable space structure enables the vacuum insulation panel to have enough supporting intensity, and simultaneously the heat preservation property is far superior to that of the existing vacuum insulation panel; and the vacuum insulation panel can be greatly applied to all products which are required to be subjected to heat preservation at the middle and low temperature sections, and plays an impelling action on the implementation of the energy conservation and environmental protection strategies of the government.

Description

Vacuum insulation panel and manufacture method that full paperboard structure supports

[technical field]

The present invention relates to a kind of Vacuum thermal insulating material, be specifically related to be used for the vacuum insulation panel that a kind of full paperboard structure supports.

[background technique]

High thermal insulating material commonly used at present is the vacuum heat-insulation plate technique, and the vacuum heat-insulation intralamellar part is thermal-protective material such as glass fibre, the aerogel etc. that are full of low thermal conductivity, and the outside film wrapped that adopts high-barrier vacuumizes the back encapsulated moulding to it again.Present most vacuum heat-insulation intralamellar part is the solid material that is full of the low thermal conductivity material, when revealing, minimum gas just cause degree of vacuum to reduce rapidly when producing, thereby its thermal conductivity is raise, and thermal insulation property descends, and must add getter material and could prolong its working life;

Present vacuum insulation panel is to adopt the solid material of low thermal conductivity to fill, and for improving insulating power, needs the lower thermal conductivity of core to realize; The material of low thermal conductivity exists technical difficulty big and develop more, the shortcoming that cost of production is high.Its expensive price has hindered the high volume applications of vacuum heat-insulation technology.

Existing glass evacuated thermal baffle has than the large space volume because of inside, for reaching higher structural strength, sheet metal that both sides sheet material working strength is higher or thicker glass plate are as supporting element, cause panel weight too big, and adopt glass fibre or micropore open-cell polyurethane foam material as core, complex manufacturing technology, cost is too high.

[summary of the invention]

One of purpose of the present invention provides the vacuum insulation panel that a kind of full paperboard structure supports, this thermal baffle is the paper board material that adopts than low thermal conductivity, by space supporting structure reasonable in design, form bigger vacuum area, supporting structure only accounts for smaller portions, utilize most vacuum area to realize the purpose of high insulation, another purpose provides the manufacture method of above-mentioned vacuum insulation panel.

Technological scheme of the present invention is: the vacuum insulation panel that full paperboard structure supports, comprise core and the external cladding material of making by the air impermeability film, described core comprises two upper and lower panels of being made by low thermal conductivity paper wad, accompany refill between the described upper and lower panel, be provided with a plurality of square, circles or polygonal cavity in the described refill.Described upper and lower panel can be boxboard or PP plate.

Described upper and lower panel is adhered to described refill both sides, perhaps be placed on described refill both sides vacuumize after extrusion modling again; This refill supporting structure can reach the concora crush intensity of 100～500Kpa.For increasing the efficient of finding time of thermal baffle, have on the described upper and lower panel and the ventilative one to one aperture of described cavity, its aperture is 0.1～2mm.

Described refill preferred version adopts honeycomb cardboard, and the sandwich structure of honeycomb cardboard is compared with other various plate constructions, have maximum intensity/mass ratio, thereby the P/C of its manufactured good is than good.The honeycomb cardboard structure stability is good in addition, and surfacing is not yielding, has outstanding anti-pressure ability and bending resistance, is as the most important characteristic of supporting structure.

The thermal baffle external cladding material adopts MULTILAYER COMPOSITE high-isolation film material, accompanies the aluminum metal thin layer in the film, can effectively intercept gas leakage, but also usable reflection radiative heat transfer.

Principle of the present invention is: the present invention adopts cardboard space supporting structure, and described refill adopts the high strength fibre cardboard of low thermal conductivity to make, and its conquassation load-deformation curve as shown in Figure 3.Refill supporting walls thickness is between 0.1～5mm, and material thermal conductivity is between 0.06～0.13w/ (m.k); The above and below plate thickness is 0.2～2mm, and whole vacuum heat-insulation plate thickness is between 5～100mm, and under the prerequisite that guarantees structural strength, major part is an area of space.With Hexagon supporting structure (honeycomb cardboard) is that example is calculated, and the minimum 0.063w/ (m.k) that reaches of the thermal conductivity of paper fiber is l as hexagonal side length, and the support cal(l)iper is t; Then the average thermal conductivity K of vacuum insulation panel and supporting structure material thermal conductivity k close and are:

$K=\frac{4\&CenterDot;\mathrm{<figure-callout\; id="3"\; label="t"\; filenames="HSA00000442193900011.png,HSA00000442193900012.png"\; state="\{\{state\}\}">t</figure-callout>}}{\sqrt{3}\&CenterDot;l}\&CenterDot;k$

Through studies show that, vacuum insulation panel obtains better heat conductivity coefficient when l/t ratio is above greater than 50, can increase the ratio of l/t when the online elastic stage of described refill satisfies the product user demand as far as possible, can obtain lower average thermal conductivity.Exhaust that the minimum average thermal conductivity of this vacuum insulation panel can reach below the 0.002w/ (m.k) after the vacuum.

The invention has the advantages that: because the core lower cost for material that uses, make simple, the price that makes this vacuum heat-insulation sheet material is well below present vacuum insulation panel price, the spatial structure of appropriate design makes it have enough its thermal insulation properties of support strength while to be much better than present vacuum heat-insulation sheet material, can be widely used in that at present all need carry out on the product of energy-saving heat preserving in the medium and low temperature section, comprise household appliances that needs are incubated, Refrigerated Transport chain equipment, building thermal insulation material etc.; Great progradation is played in enforcement to the energy-conserving and environment-protective policy of country.

[description of drawings]

The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.

Fig. 1 is the structural representation of one embodiment of the invention,

Fig. 2 is the partial cutaway figure of vacuum insulation panel among Fig. 1,

Fig. 3 is the conquassation stress-strain curve of Hexagon supporting structure,

Fig. 4 is the stereogram of vacuum insulation panel refill among Fig. 1.

[embodiment]

Set forth characteristic of the present invention below by embodiment:

Embodiment one:

Referring to Fig. 1, the vacuum insulation panel that full paperboard structure supports comprises core and the external cladding material of being made by the air impermeability film 1, and core comprises two upper and lower panels of being made by low thermal conductivity paper wad 3.Accompany refill 2 between the upper and lower panel 3.Upper and lower panel 3 adopts the thick case board of 0.5mm to make, and is provided with surrounding edge 5 all around, as shown in Figure 4.The upper and lower panel surface evenly have with refill 2 in the ventilative one to one aperture 4 of cavity 6, as shown in Figure 2, the effect of ventilative aperture 4 is to be convenient in the cavity air can extract out fast.

Drying forming behind refill 2 and the upper and lower panel 3 employing non-volatility glue bonds, it is honeycomb cardboard that refill 2 adopts the hexagon supporting structures, is that the corrugated paperboard that 0.2mm is thick forms with high temperature resistant non-volatility glue bond.Its hexagonal cavities 6 length of sides are l=10mm, support thickness t=0.15mm; The cardboard thermal conductivity is 0.1w/ (m.k); According to formula

The average thermal conductivity that can calculate this thermal baffle is 0.0035w/ (m.k).

Thermal baffle outer membrane 1 adopts five floor height barrier films to make, and is respectively heat-sealing pvdf layer, polyethylene layer, aluminum membranous layer, polyethylene layer and heat-sealing pvdf layer from outside to inside, can effectively intercept moisture and air; Core layer after the oven dry is put into the high-isolation film bag of sealing in advance on three limits, put it into again and be evacuated in the vaccum-pumping equipment below the 5Pa, be equipped with hot sealing device in the vacuum chamber, just complete after under vacuum state, opening being shut.

Embodiment two:

The vacuum heat-insulation board core material adopts the corrugated paper refill that has equilateral triangle cavity, and the length of side is 10mm, and supporting walls thickness is 0.1mm; The cardboard thermal conductivity is 0.1w/ (m.k), and panel 3 adopts the PP sheet material of 0.1mm thickness; Average thermal conductivity that as calculated can this plate is 0.00536w/ (m.k); PP plate after will drying during assembling is placed on refill 2 both sides after the oven dry, need not during assembling to make to fasten with glue, it is put into high-barrier three bandings packs simultaneously and be placed on and vacuumize case and exhaust vacuum, be lower than below the 5Pa in degree of vacuum, keep after 5 minutes opening sealed and finish making, remaining part is identical with embodiment one.

The production procedure of core of the present invention is: send core paper → coremaking gluing → coremaking → platen core → cut paper core → refill stretch to draw → compound gluing → heating dewaters in advance → roll extrusion → heating, drying → roll extrusion in advance → cut → check warehouse-in.

When making thermal baffle, earlier with three limits of two MULTILAYER COMPOSITE high-isolation films with sealing and keeping dry; The high temperature resistant non-volatility glue of upper and lower panel 3 usefulness that cuts is bonded in refill 2 both sides of getting ready in advance, puts into drying oven then and dry, roasting temperature is at 130 ℃～160 ℃, is lower than 183 ℃ of the carburizing temperatures of paper; Stoving time is more than 30min; The above-mentioned sealed film bag of making is put into refill 2 rapidly in the oven dry back, this film bag is put into low vaccum-pumping equipment again and is found time; Pressure is lower than 5Pa and keeps a period of time in refill 2, at last the film bag opening is sealed the making that vacuum insulation panel is just finished in mouthful moulding.

High temperature resistant non-volatility glue preferred version uses starch glue class glue, can not volatilize gas componant again after the cardboard drying.

The present invention has following characteristics:

1, because of the transmission under the vacuum state in the space and convection coefficient near zero, and radiative heat transfer efficient under low-temperature condition is extremely low; Therefore this vacuum insulation panel thermal insulation property is far superior to present conventional vacuum thermal baffle;

2, vacuum insulation panel of the present invention even also can not cause the degree of vacuum in the thermal baffle to reduce rapidly, thereby effectively prolongs the working life of vacuum insulation panel because the inner space is bigger when high-isolation film produces minute leakage.

3, because core is the cardboard supporting structure, and used core cost of material is cheap, and cost of material is far below present vacuum insulation panel, and preparation process is simple, can significantly reduces the cost of present vacuum insulation panel and realize large batch of application.

The breeder tube that 4,0.1～2mm is arranged on the panel can effectively be extracted air in the plate out when board making, can significantly improve the manufacturing efficiency of sheet material in the board making chamber.

5, because of heat can't conduct and convection current by the vacuum space, the present invention adopts hollow supporting structure by design, is example with the Hexagon supporting structure, and its concora crush intensity reaches 100～500Kpa, and the horizontal ring crush compression resistance of core paper is at 8～14Nm/g; When guaranteeing product structure intensity, reduce the volume of blocking materials as far as possible, increase the volume in space; Vacuum space is incubated after vacuumizing; This design can significantly reduce the thermal conductivity of vacuum heat-insulation slab integral, increases the thermal insulation property of sheet material.

6, for present honeycomb sound-insulating and heat-insulating plate, this vacuum insulation panel has higher structural strength, can effectively support the inner vacuum space and can not subside, thereby form the thermal-protective coating of high-barrier heat; And the thermal insulation property of this vacuum insulation panel is far superior to present honeycomb sound-insulating and heat-insulating plate, and the minimum level that can reach 0.002w/ (m.k) of its thermal conductivity, its thermal insulation property are more than 10 times of normal cellular cardboard.

7, this thermal baffle can be widely used at present all need be on the medium and low temperature section be carried out the product of energy-saving heat preserving, comprise household appliances that needs are incubated, Refrigerated Transport chain equipment, building thermal insulation material etc.; Great progradation is played in enforcement to the energy-conserving and environment-protective policy of country.

Although illustrated and described embodiments of the invention, for the ordinary skill in the art, be appreciated that without departing from the principles and spirit of the present invention and can carry out multiple variation, modification, replacement and modification to these embodiments, scope of the present invention is limited by claims and equivalent thereof.

Claims (8)

1. the vacuum insulation panel that full paperboard structure supports, comprise core and the external cladding material of making by the air impermeability film, described core comprises two upper and lower panels of being made by low thermal conductivity paper wad, it is characterized in that: accompany refill between the described upper and lower panel, be provided with a plurality of square, circles or polygonal cavity in the described refill, have on the described upper and lower panel and the ventilative one to one aperture of described cavity.

2. according to the vacuum insulation panel of the described full paperboard structure support of claim 1, it is characterized in that: described refill is a honeycomb cardboard.

3. according to the vacuum insulation panel of each described full paperboard structure support of claim 1-2, it is characterized in that: described refill supporting walls thickness is between 0.1～5mm.

4. according to the vacuum insulation panel of each described full paperboard structure support of claim 1-2, it is characterized in that: described refill adopts the high strength paper wad of low thermal conductivity to make.

5. according to the vacuum insulation panel of the described full paperboard structure support of claim 1, it is characterized in that: described upper and lower panel is boxboard or PP plate.

6. according to the vacuum insulation panel of each described full paperboard structure support of claim 1-2, it is characterized in that: described external cladding material adopts MULTILAYER COMPOSITE high-isolation film material, accompanies the aluminum metal thin layer in this film.

7. make the method that the described full paperboard structure of claim 1 supports vacuum insulation panel for one kind, it is characterized in that adopting following steps: earlier with three limits of two MULTILAYER COMPOSITE high-isolation films with sealing and keeping dry; The upper and lower panel that cuts is bonded in the refill both sides of getting ready in advance with high temperature resistant non-volatility glue, puts into drying oven then and dry, roasting temperature is at 130 ℃～160 ℃, and stoving time is more than 30min; The above-mentioned sealed film bag of making is put into refill rapidly in the oven dry back, this film bag is put into low vaccum-pumping equipment again and is found time; Pressure is lower than 5Pa and keeps a period of time in core, at last the film bag opening is sealed the making that described vacuum insulation panel is just finished in mouthful moulding.

8. according to the described a kind of method that full paperboard structure supports vacuum insulation panel of making of claim 7, it is characterized in that: described high temperature resistant non-volatility glue is starch glue class glue.

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