CN102174386A - Temperature control unit of narrow and long thermal cycle block and thermal cycler - Google Patents
Temperature control unit of narrow and long thermal cycle block and thermal cycler Download PDFInfo
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- CN102174386A CN102174386A CN2011100406083A CN201110040608A CN102174386A CN 102174386 A CN102174386 A CN 102174386A CN 2011100406083 A CN2011100406083 A CN 2011100406083A CN 201110040608 A CN201110040608 A CN 201110040608A CN 102174386 A CN102174386 A CN 102174386A
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Abstract
The invention relates to a temperature control component with a fluorescent quantitative detection module, of a thermal cycle block for finishing PCR (Polymerase Chain Reaction) and real-time PCR, disclosing a temperature control unit of a narrow and long thermal cycle block and a thermal cycler. The temperature control unit comprises the narrow and long thermal cycle block, two or more semiconductor refrigerating sheets and a heat radiator which are sequentially and closely attached with one another from top to bottom, wherein blind holes are uniformly distributed on the narrow and long thermal cycle block; and the two or more semiconductor refrigerating sheets are uniformly distributed below the narrow and long thermal cycle block. According to the technical scheme provided by the invention, temperature uniformity of the narrow and long thermal cycle block is obviously improved.
Description
Technical field
The present invention relates to a kind of be used to finish PCR reaction and PCR in real time, be applicable to thermal cycler, have the temperature control parts of the thermal cycler of fluorescent quantitation detection module, relate in particular to a kind of temperature control unit and thermal cycler of narrow long type thermal cycling piece.
Background technology
Thermal cycler be reactant in specified denaturation temperature, the instrument of automated cycle between renaturation temperature and the elongating temperature.When containing archaeal dna polymerase, deoxynucleoside triphosphate, template DNA, the reactant of compositions such as magnesium ion is put into thermal cycler, stands sex change, after the temperature cycle of renaturation and extension, can at short notice template DNA be increased millions of times, finish polymerase chain reaction (abbreviation PCR).In reactant, add fluorescence molecule, comprise DNA binding fluorescent dyes and fluorescently-labeled sequence specific primer or probe, by fluorescent signal increase the increase reflect the DNA amount in proportion, make the real-time detection of PCR product become possibility.
A kind of typical thermal cycler that uses now comprise the microcomputer automatic control circuit of controlling heating and cooling and by the X that inserts several test tubes (holding reactant in the test tube) to Y to symmetric thermal cycling piece, both can heat, but also refrigerating semiconductor chilling plate, scatterer are close to successively from top to bottom and are installed on the intravital alternating temperature assembly of case.Above the thermal cycling piece, be provided with the pressure cover that compresses test tube, be embedded with temperature sensor in the thermal cycling piece, the output signal input control heating and the refrigerating microcomputer automatic control circuit of temperature sensor.During work, control heating and refrigerating microcomputer automatic control circuit are pressed working procedure and from the size of current and the direction of the signal control semiconductor chilling plate of temperature sensor, the temperature follow procedure of thermal cycling piece is heated up and cooling, thereby make and be positioned in the thermal cycling piece invisible spectro reactant and finish DNA cloning by the temperature required circulation change of PCR.Thermal cycler is equipped with special fluoroscopic examination module, constitutes the thermal cycler with fluorescent quantitation detection module, the fluorescence when being used to monitor amplification, and detected fluorescent signal has reflected the amount of each cyclic amplification product.
The thermal cycling piece selects for use the good material of heat conduction to make required shape and form through shaping.Thermal cycling piece lower surface is smooth fits with semiconductor chilling plate, and upper surface is formed with the blind hole of two-dimentional determinant matrix distribution, and blind hole shape and test tube bottom shape fit.The blind hole between centers that meets the thermal cycling piece of ANSI/MBS standard is 9 millimeters.16 blind holes take advantage of 2 ranks to distribute by 8 on the 16 hole thermal cycling pieces, once can insert 16 test tubes.On the thermal cycling piece between blind hole top temperature and minimum temperature difference be called temperature homogeneity, the temperature homogeneity of existing thermal cycler is generally less than positive and negative 0.5 degree Celsius.Obviously concerning the thermal cycling piece, temperature homogeneity is most important index, and it is the smaller the better.Otherwise the same test tube that reactant is housed inserts the blind hole of different positions on the thermal cycling piece, and the experimental result that obtains is inequality, obviously is unallowed.
Narrow long type thermal cycling piece is meant length greater than 45 millimeters, and width is less than 18 millimeters thermal cycling piece.Because the area of narrow long type thermal cycling piece bottom surface is little, with a slice length and width and the wide identical semiconductor chilling plate of narrow long type thermal cycling block length rather than more than two with it applying come alternating temperature, can reduce cost and assemble complicacy.But this structure exists narrow long type thermal cycling piece middle portion and the big problem of the two ends temperature difference.Especially at high temperature, for example 95 when spending, and temperature homogeneity is greater than positive and negative 0.5 degree Celsius, even greater than positive and negative 1 degree Celsius.Having hindered this narrow long type thermal cycling piece is applied in the thermal cycler.During the semiconductor chilling plate heating, generally all be hot at first, to diffusion all around, have thermograde gradually from geometric centre.When the semiconductor chilling plate Aspect Ratio was more or less the same, the center heat to diffusion all around, caused the center and the peripheral temperature difference little fast.The narrow long type semiconductor chilling plate situation that differs bigger for Aspect Ratio is then different.Semiconductor chilling plate centre portions heat can only spread to length direction, adds that length dimension is bigger, and rate of diffusion is relatively slow, causes center and two ends temperature head bigger.The heat transferred narrow long type thermal cycling piece of semiconductor chilling plate, there is same problem in narrow long type thermal cycling piece, so narrow long type thermal cycling piece center and the two ends temperature difference are bigger.
At narrow long type thermal cycling piece, the applying fit on of semiconductor chilling plate and scatterer also can produce non-uniform temperature problem because of avoiding two ends fixed assembly method to cause with a slice semiconductor chilling plate.Existing method adopts at narrow long type thermal cycling piece two ends with screw or the mode that is aided with pressing plate narrow long type thermal cycling piece and semiconductor chilling plate is fastened on the scatterer.Because the fastening condition in two ends is just the same very difficult, adds the easy flexural deformation of narrow long type semiconductor chilling plate, causes two ends applying degree difference, it is inconsistent to produce temperature variation.In a word, prior art is not suitable for the temperature homogeneity requirement of narrow long type thermal cycling piece.
Summary of the invention
The present invention is directed to the even deficiency of temperature distributing disproportionation in the narrow long type thermal cycling piece prior art, a kind of temperature control unit of narrow long type thermal cycling piece is provided, by redesign semiconductor chilling plate and mode of connection, produce new temperature control method and new narrow long type thermal cycling block structure and assembly method thus, improved the temperature homogeneity of narrow long type thermal cycling piece significantly, narrow long type thermal cycling piece is widely applied becomes possibility.
In order to solve the problems of the technologies described above, the present invention is solved by following technical proposals:
The temperature conditioning unit of narrow long type thermal cycling piece comprises narrow long type thermal cycling piece, and semiconductor chilling plate and scatterer are adjacent to cooperation according to top-down order, and the length of narrow long type thermal cycling piece is greater than 45 millimeters, and width is less than 18 millimeters.Semiconductor chilling plate is more than two or two, is evenly distributed on the below of narrow long type thermal cycling piece.When fit in semiconductor chilling plate and narrow long type thermal cycling piece bottom, semiconductor chilling plate covers the lower surface of narrow long type thermal cycling piece as wide as possible.As preferably, two chip semiconductor cooling pieces can significantly improve narrow long type thermal cycling deblocking temperature homogeneity, make it less than positive and negative 0.5 degree Celsius, even positive and negative 0.3 degree Celsius, every chip semiconductor cooling piece width size is identical with narrow long type thermal cycling piece bottom width, and two chip semiconductor cooling piece lengthwise dimension sums are slightly less than narrow long type thermal cycling piece bottom surface length.
As preferably, narrow long type thermal cycling block length select greater than 45 millimeters, less than 100 millimeters.Narrow long type thermal cycling block length is 45 millimeters, during less than 100 millimeters, prior art adopts a slice cooling piece usually, but when the present invention is directed to a slice cooling piece, the situation that temperature distributing disproportionation is even adopts the solution of two or two above cooling pieces.Particularly under the situation of two chip semiconductor cooling pieces, can guarantee that semiconductor chilling plate is evenly distributed on the below of thermal cycling piece, and between two chip semiconductor cooling pieces, leave the gap, the convenient securing gear of installing in thermal cycling piece central position, when fastening stressed evenly, avoid the defective of two ends fastening method.
As preferably, narrow long type thermal cycling piece bottom surface is provided with joint pin, and corresponding joint pin is provided with through hole on the scatterer, and joint pin passes position between the semiconductor chilling plate and the through hole on the scatterer, is fastenedly connected with securing gear.Semiconductor chilling plate clamps by narrow long type thermal cycling piece and scatterer, does not contact any fastening piece.
As preferably, joint pin is a double-screw bolt, and described securing gear is a nut.
As preferably, narrow long type thermal cycling piece is provided with screw, scatterer be provided with through hole, also comprise bolt, bolt passes the through hole of scatterer and the position between the semiconductor chilling plate, is fastenedly connected with narrow long type thermal cycling piece.When arranging semiconductor chilling plate, the space is left in the centre, makes bolt pass, and contact semiconductor cooling piece not.
As preferably, narrow long type thermal cycling piece is provided with open holes, and scatterer is provided with through hole or threaded hole, also comprises bolt, by bolt narrow long type thermal cycling piece, semiconductor chilling plate and scatterer is fastenedly connected.
As preferably, be evenly distributed with blind hole on the narrow long type thermal cycling piece, blind hole is used to cooperate containers such as test tube.The material of described narrow long type thermal cycling piece is that heat-conducting metal or alloy or heat conduction are nonmetal.As aluminium, copper, magnesium, silver etc. and alloy thereof, or as heat-conducting plastic, thermal conductive ceramic, materials such as graphite.
As preferably, the face that described narrow long type thermal cycling piece and semiconductor chilling plate are in contact with one another, and be respectively equipped with for example heat-conducting silicone grease etc. of heat-conducting medium layer on the face that is in contact with one another of semiconductor chilling plate and scatterer.Make narrow long type thermal cycling piece be heated and conduct heat more even.
Thermal cycler, the temperature conditioning unit that comprises above-mentioned narrow long type thermal cycling piece, also comprise housing, control heating and refrigerating pilot circuit and temperature sensor, temperature sensor is imbedded in the slotted eye at narrow long type thermal cycling piece two ends, pilot circuit is connected with temperature sensor with semiconductor chilling plate through wire respectively, constitutes closed loop.Be used to finish PCR reaction and real-time PCR reactions, it is quick to have an alternating temperature, the advantage of the constant temperature uniformity that relents.
As preferably, described semiconductor chilling plate be serial or parallel connection together, regulate by temperature sensor and closed loop; Perhaps semiconductor chilling plate is separately regulated separately by separately temperature sensor and closed loop alone; The temperature of narrow long type thermal cycling piece is controlled by the size and the direction of regulating the semiconductor chilling plate electric current.
As preferably, described temperature sensor is an occasionally semiconductor temperature sensor of thermistor or platinum resistance or thermoelectricity.
According to technical scheme of the present invention, help improving the consistence that narrow long type thermal cycling deblocking temperature changes, further improve the temperature homogeneity of whole narrow long type thermal cycling piece, the temperature follow procedure of narrow long type thermal cycling piece is heated up and cooling, thereby make and be positioned in the narrow long type thermal cycling piece invisible spectro reactant and finish DNA cloning by the temperature required circulation change of PCR.
Description of drawings
Fig. 1 is the structural representation of narrow long type thermal cycling piece and semiconductor chilling plate.
Fig. 2 is embodiments of the invention 1 synoptic diagram.
Fig. 3 is embodiments of the invention 2 synoptic diagram.
Fig. 4 is embodiments of the invention 3 synoptic diagram.
Fig. 5 is embodiments of the invention 4 synoptic diagram.
1-narrow long type thermal cycling piece; The 2-semiconductor chilling plate; The 3-scatterer; The 4-securing gear; The 5-temperature sensor; The 6-pilot circuit; The 7-wire; The 8-test tube; The 9-housing; The 11-blind hole; The 12-joint pin; The 13-slotted eye; The 14-screw; The 15-open holes; The 31-through hole; The 41-nut; The 42-bolt.
Embodiment
Below in conjunction with accompanying drawing 1 to 5 and embodiment the present invention is described in further detail.
Referring to accompanying drawing 1 and accompanying drawing 2, the temperature conditioning unit of narrow long type thermal cycling piece comprises narrow long type thermal cycling piece 1, semiconductor chilling plate 2 and scatterer 3, and with narrow long type thermal cycling piece 1, semiconductor chilling plate 2 is adjacent to scatterer 3 and cooperates according to top-down order; Be evenly distributed with blind hole 11 on the narrow long type thermal cycling piece 1.Semiconductor chilling plate 2 is two, is evenly distributed on the below of narrow long type thermal cycling piece 1; The central position of narrow long type thermal cycling piece 1 bottom surface is provided with joint pin 12, and the corresponding joint pin 12 of the substrate of scatterer 3 is provided with through hole 31, and joint pin 12 passes space, position between the semiconductor chilling plate 2 and the substrate through-hole 31 of scatterer 3 is fastenedly connected with securing gear 4.Described joint pin 12 is a double-screw bolt, and securing gear 4 is a nut.
The face that narrow long type thermal cycling piece 1 and semiconductor chilling plate 2 are in contact with one another, and be respectively equipped with the heat-conducting medium layer on the face that is in contact with one another of semiconductor chilling plate 2 and scatterer 3, for example heat-conducting silicone grease etc.Make and to be heated and to conduct heat more even.
The material of narrow long type thermal cycling piece 1 is that heat-conducting metal or alloy or heat conduction are nonmetal, as aluminium, and copper, magnesium, silver etc. and alloy thereof, or as heat-conducting plastic, thermal conductive ceramic, materials such as graphite.The length of narrow long type thermal cycling piece 1 is greater than 45 millimeters, and width is less than 18 millimeters.When semiconductor chilling plate 2 is two, can significantly improve narrow long type thermal cycling deblocking temperature homogeneity, make it less than positive and negative 0.5 degree Celsius, even positive and negative 0.3 degree Celsius.Semiconductor chilling plate 2 clamps by narrow long type thermal cycling piece 1 and scatterer 3, does not contact any fastening piece, makes semiconductor chilling plate 2 can not deform because of long-term local pressure, causes damaging.When semiconductor chilling plate 2 is fitted with narrow long type thermal cycling piece 1 bottom, semiconductor chilling plate 2 width sizes are identical with narrow long type thermal cycling piece 1 bottom width, and two chip semiconductor cooling piece 2 lengthwise dimension sums are slightly less than narrow long type thermal cycling piece 1 bottom surface length.When arranging semiconductor chilling plate 2, the space is left in the centre, makes joint pin 12 pass, and contact semiconductor cooling piece 2 not makes semiconductor chilling plate 2 can not deform because of long-term local pressure, causes damaging.
Referring to accompanying drawing 1 and 3, the temperature conditioning unit of narrow long type thermal cycling piece comprises narrow long type thermal cycling piece 1, semiconductor chilling plate 2 and scatterer 3, and with narrow long type thermal cycling piece 1, semiconductor chilling plate 2 is adjacent to scatterer 3 and cooperates according to top-down order; Be evenly distributed with blind hole 11 on the narrow long type thermal cycling piece 1.Semiconductor chilling plate 2 is two, is evenly distributed on the below of narrow long type thermal cycling piece 1; The central position of narrow long type thermal cycling piece 1 bottom surface is provided with threaded hole, passes the substrate through-hole 31 of scatterer and the space, position between the semiconductor chilling plate 2 and narrow long type thermal cycling piece 1 with screw and is fastenedly connected.
The face that narrow long type thermal cycling piece 1 and semiconductor chilling plate 2 are in contact with one another, and be respectively equipped with the heat-conducting medium layer on the face that is in contact with one another of semiconductor chilling plate 2 and scatterer 3, for example heat-conducting silicone grease etc.Make and to be heated and to conduct heat more even.
The material of narrow long type thermal cycling piece 1 is that heat-conducting metal or alloy or heat conduction are nonmetal, as aluminium, and copper, magnesium, silver etc. and alloy thereof, or as heat-conducting plastic, thermal conductive ceramic, materials such as graphite.The length of narrow long type thermal cycling piece 1 is greater than 45 millimeters, and width is less than 18 millimeters.When semiconductor chilling plate 2 is two, can significantly improve narrow long type thermal cycling deblocking temperature homogeneity, make it less than positive and negative 0.5 degree Celsius, even positive and negative 0.3 degree Celsius.Semiconductor chilling plate 2 clamps by narrow long type thermal cycling piece 1 and scatterer 3, does not contact any fastening piece, makes semiconductor chilling plate 2 can not deform because of long-term local pressure, causes damaging.When semiconductor chilling plate 2 is fitted with narrow long type thermal cycling piece 1 bottom, semiconductor chilling plate 2 width sizes are identical with narrow long type thermal cycling piece 1 bottom width, and two chip semiconductor cooling piece 2 lengthwise dimension sums are slightly less than narrow long type thermal cycling piece 1 bottom surface length.When arranging semiconductor chilling plate 2, the space is left in the centre, makes joint pin 12 pass, and contact semiconductor cooling piece 2 not makes semiconductor chilling plate 2 can not deform because of long-term local pressure, causes damaging.
Embodiment 3
Referring to accompanying drawing 1 and 4, the temperature conditioning unit of narrow long type thermal cycling piece comprises narrow long type thermal cycling piece 1, semiconductor chilling plate 2 and scatterer 3, and with narrow long type thermal cycling piece 1, semiconductor chilling plate 2 is adjacent to scatterer 3 and cooperates according to top-down order; Be evenly distributed with blind hole 11 on the narrow long type thermal cycling piece 1.Semiconductor chilling plate 2 is two, is evenly distributed on the below of narrow long type thermal cycling piece 1; Narrow long type thermal cycling piece 1 is provided with open holes 15, and scatterer 3 is provided with through hole 31 or threaded hole, also comprises bolt 42, by bolt 42 narrow long type thermal cycling piece 1, semiconductor chilling plate 2 and scatterer 1 is fastenedly connected.
The face that narrow long type thermal cycling piece 1 and semiconductor chilling plate 2 are in contact with one another, and be respectively equipped with the heat-conducting medium layer on the face that is in contact with one another of semiconductor chilling plate 2 and scatterer 3, for example heat-conducting silicone grease etc.Make and to be heated and to conduct heat more even.
The material of narrow long type thermal cycling piece 1 is that heat-conducting metal or alloy or heat conduction are nonmetal, as aluminium, and copper, magnesium, silver etc. and alloy thereof, or as heat-conducting plastic, thermal conductive ceramic, materials such as graphite.The length of narrow long type thermal cycling piece 1 is greater than 45 millimeters, and width is less than 18 millimeters.When semiconductor chilling plate 2 is two, can significantly improve narrow long type thermal cycling deblocking temperature homogeneity, make it less than positive and negative 0.5 degree Celsius, even positive and negative 0.3 degree Celsius.Semiconductor chilling plate 2 clamps by narrow long type thermal cycling piece 1 and scatterer 3, does not contact any fastening piece, makes semiconductor chilling plate 2 can not deform because of long-term local pressure, causes damaging.When semiconductor chilling plate 2 is fitted with narrow long type thermal cycling piece 1 bottom, semiconductor chilling plate 2 width sizes are identical with narrow long type thermal cycling piece 1 bottom width, and two chip semiconductor cooling piece 2 lengthwise dimension sums are slightly less than narrow long type thermal cycling piece 1 bottom surface length.When arranging semiconductor chilling plate 2, the space is left in the centre, makes joint pin 12 pass, and contact semiconductor cooling piece 2 not makes semiconductor chilling plate 2 can not deform because of long-term local pressure, causes damaging.
On the basis of embodiment 1 or embodiment 2 or embodiment 3, semiconductor chilling plate 2 can be provided with more than two.
Embodiment 4
Referring to accompanying drawing 2 and accompanying drawing 5, thermal cycler, housing 9 inside comprise the temperature conditioning unit of embodiment 1 described narrow long type thermal cycling piece, also comprise control heating and refrigerating microcomputer automatic control circuit 6 and temperature sensor 5, temperature sensor 5 is imbedded in the slotted eye 13 at narrow long type thermal cycling piece 1 two ends, microcomputer automatic control circuit 6 is connected with temperature sensor 5 with semiconductor chilling plate 2 through wire 7 respectively, constitutes closed loop.
In control heating and refrigerating microcomputer automatic control circuit 6, two chip semiconductor cooling pieces 2 can be cascaded is connected to the control heating and size of current and direction are regulated in loop line of refrigerating microcomputer automatic control circuit 6 formations.Control heating and refrigerating pilot circuit 6 link together by wire and a temperature sensor 5 and two semiconductor chilling plates 2.Control heating and refrigerating microcomputer automatic control circuit 6 are according to working procedure with from the size of current and the direction of the signal control semiconductor chilling plate 2 of temperature sensor 5, the temperature follow procedure of narrow long type thermal cycling piece 1 is heated up and cooling, thereby make the reactant that is positioned in the test tube in the narrow long type thermal cycling piece 18 by the temperature required circulation change of PCR, finish DNA cloning.
In control heating and refrigerating microcomputer automatic control circuit 6, two chip semiconductor cooling pieces 2 can be connected in parallel is connected to the control heating and size of current and direction are regulated in loop line of refrigerating microcomputer automatic control circuit 6 formations.Control heating and refrigerating pilot circuit 6 link together by wire and a temperature sensor 5 and two semiconductor chilling plates 2.Control heating and refrigerating microcomputer automatic control circuit 6 are according to working procedure with from the size of current and the direction of the signal control semiconductor chilling plate 2 of temperature sensor 5, the temperature follow procedure of narrow long type thermal cycling piece 1 is heated up and cooling, thereby make the reactant that is positioned in the test tube in the narrow long type thermal cycling piece 18 by the temperature required circulation change of PCR, finish DNA cloning.Above-mentioned one or more temperature conditioning units are formed thermal cyclers or have the temperature control parts of the thermal cycler of fluoroscopic examination module, be used to finish PCR reaction and real-time PCR reactions, it is quick to have an alternating temperature, the advantage of the constant temperature uniformity that relents.
On the basis of embodiment 4, semiconductor chilling plate 2 is independent separately, do not connect and be not together in parallel yet, respectively and separately contiguous temperature sensor 5 is connected to control heating and refrigerating microcomputer automatic control circuit 6 inner formations closed loop independently separately together, regulates the size of current and the direction of semiconductor chilling plate 2 separately respectively.Regulate by separately temperature sensor 5 and closed loop, can heat according to concrete needs like this or cool off semiconductor chilling plate 2, make corresponding test tube 8 above the narrow long type thermal cycling piece 1 be in the state of temperature unanimity.
In a word, the above only is preferred embodiment of the present invention, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (10)
1. the temperature conditioning unit of narrow long type thermal cycling piece, comprise narrow long type thermal cycling piece (1), semiconductor chilling plate (2) and scatterer (3), cooperate according to top-down order, it is characterized in that: the length of described narrow long type thermal cycling piece (1) is greater than 45 millimeters, width is less than 18 millimeters, and semiconductor chilling plate (2) is more than two or two, is distributed in the below of narrow long type thermal cycling piece (1).
2. the temperature conditioning unit of narrow long type thermal cycling piece according to claim 1, it is characterized in that: described narrow long type thermal cycling piece (1) is provided with joint pin (12), scatterer (3) is provided with through hole (31), joint pin (12) passes the position between the semiconductor chilling plate (2) and the through hole (31) of scatterer (1), is fastenedly connected with securing gear (4).
3. the temperature conditioning unit of narrow long type thermal cycling piece according to claim 2 is characterized in that: joint pin (12) is a double-screw bolt, and described securing gear (4) is nut (41).
4. the temperature conditioning unit of narrow long type thermal cycling piece according to claim 1, it is characterized in that: described narrow long type thermal cycling piece (1) is provided with screw (14), scatterer (3) is provided with through hole (31), also comprise bolt (42), bolt (42) passes the through hole (31) of scatterer (1) and the position between the semiconductor chilling plate (2), is fastenedly connected with the screw (14) of narrow long type thermal cycling piece (1).
5. the temperature conditioning unit of narrow long type thermal cycling piece according to claim 1, it is characterized in that: described narrow long type thermal cycling piece (1) is provided with open holes (15), scatterer (3) is provided with through hole (31) or threaded hole, also comprise bolt (42), narrow long type thermal cycling piece (1), semiconductor chilling plate (2) and scatterer (3) are fastenedly connected by bolt (42).
6. according to claim 1 or 2 or the temperature conditioning unit of 3 or 4 or 5 described narrow long type thermal cycling pieces, it is characterized in that: be evenly distributed with blind hole (11) on the described narrow long type thermal cycling piece (1), the material of narrow long type thermal cycling piece (1) is that heat-conducting metal or alloy or heat conduction are nonmetal.
7. according to claim 1 or 2 or the temperature conditioning unit of 3 or 4 or 5 described narrow long type thermal cycling pieces, it is characterized in that: the face that described narrow long type thermal cycling piece (1) and semiconductor chilling plate (2) are in contact with one another, and be respectively equipped with the heat-conducting medium layer on the face that is in contact with one another of semiconductor chilling plate (2) and scatterer (3).
8. thermal cycler, it is characterized in that: the temperature conditioning unit that comprises the narrow long type thermal cycling piece of claim 1 or 2 or 3 or 4 or 5, also comprise housing (9), control heating and refrigerating pilot circuit (6) and temperature sensor (5), temperature sensor (5) is imbedded in the slotted eye (13) at narrow long type thermal cycling piece (1) two ends, pilot circuit (6) is connected with temperature sensor (5) with semiconductor chilling plate (2) through wire (7) respectively, constitutes closed loop.
9. thermal cycler according to claim 8 is characterized in that: described semiconductor chilling plate (2) serial or parallel connection, regulate by temperature sensor (5) and closed loop; Perhaps semiconductor chilling plate (2) is regulated separately by separately temperature sensor (5) and closed loop; The temperature of narrow long type thermal cycling piece (1) realizes by the size and the direction of regulating semiconductor chilling plate (2) electric current.
10. thermal cycler according to claim 8 is characterized in that: described temperature sensor (5) is thermistor or platinum resistance or thermoelectricity semiconductor temperature sensor occasionally.
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| CN2011100406083A CN102174386A (en) | 2011-02-18 | 2011-02-18 | Temperature control unit of narrow and long thermal cycle block and thermal cycler |
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| CN2011100406083A CN102174386A (en) | 2011-02-18 | 2011-02-18 | Temperature control unit of narrow and long thermal cycle block and thermal cycler |
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Application publication date: 20110907 |