CN102169395A - Arrangement method and structure of bridge electrode - Google Patents
Arrangement method and structure of bridge electrode Download PDFInfo
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- CN102169395A CN102169395A CN2010101262200A CN201010126220A CN102169395A CN 102169395 A CN102169395 A CN 102169395A CN 2010101262200 A CN2010101262200 A CN 2010101262200A CN 201010126220 A CN201010126220 A CN 201010126220A CN 102169395 A CN102169395 A CN 102169395A
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Abstract
The invention relates to an arrangement method and a structure of a bridge electrode. The arrangement method of the bridge electrode comprises the following steps of: providing a substrate; forming a transparent conductive layer on the substrate, wherein the transparent conductive layer is provided with a plurality of pattern blocks which are arranged adjacent to each other; forming an alignment film layer on the substrate, wherein the alignment film layer is provided with a plurality of bridge grooves used for crossing among the plurality of pattern blocks; forming a conductive layer on the substrate, wherein the conductive layer is provided with a plurality of electrical conductors which are respectively arranged on the plurality of bridge grooves, the plurality of electrical conductors of the conductive layer are formed by an optical compensation photomask together with over exposure or over development; and forming a protective layer on the substrate, wherein the protective layer is used for increasing optical transmittance and protecting the substrate, the transparent conductive layer, the alignment film layer and the conductive layer.
Description
Technical field
The invention relates to a kind of distribution method and its structure of electrode, particularly utilize special light shield to form the bridge connected groove, make the lead that is arranged at this bridge connected groove be difficult for causing distribution method and its structure of the not good bridge connected electrode of whole yield because of successive process in the insulation unit.
Background technology
Known technology, in the processing procedure of capacitance type touch-control panel, be on substrate, form two disalignments to electrode, and form insulation course once more on the axial electrode therein, be electrically connected by plain conductor set on this insulation course in order to another axial electrode to be provided.
Yet because the plain conductor that is arranged at traditionally on the insulation course might cause the damage of this plain conductor because in follow-up processing procedure, making can't conducting, and then causes capacitance type touch-control panel to make the decline of yield.
In addition, general factory is in the light shield design, the figure live width of production light shield is identical with the figure live width of required moulding circuit, and can't effectively overcome the above-mentioned problem that produces, and after development, its photoresistance is residual seriously, the phenomenons such as incomplete and overdevelop of developing also can exist simultaneously, is easy to cause bad order (the circuit edge forms zigzag or wavy) or electrically bad (reliability test is unusual) again after etching.
So be necessary to provide a kind of new structure, in order to promote the yield of this capacitive touch control plate efficiently.
Summary of the invention
A purpose of the present invention provides a kind of distribution method of bridge connected electrode, by having the light shield of halftone screen dot pattern, to form the bridge connected groove, in order to reach processing procedure process cause being arranged at the destruction of this bridge connected groove upper conductor.
Another object of the present invention provides a kind of bridge connected electrode structure, has bridge connected insulation unit carrying out the electrical connection between the electrode, and with being arranged at and being lower than this bridge joint and insulating in the bridge connected groove of height of unit so that connecting the lead of these electrodes.
A further object of the present invention provides a kind of bridge connected electrode structure, can be by luminous energy and/or the cooperation optical compensation formula light shield of adjusting exposure usefulness, make the generation each other of this luminous energy and this optical compensation formula light shield interact, in order to compensate these electrical leads, for example compensate key size loss (CriticalDimension Loss).
For reaching above-mentioned purpose and other purpose, the invention provides a kind of distribution method of bridge connected electrode, its method step comprises: form a transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks; Form an orientation rete on this substrate, and this orientation rete have a plurality of bridge connected grooves in order to across between these pattern blocks; Form a conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these bridge connected grooves, and these electrical leads of this conductive layer are by an optical compensation formula light shield, cooperate the one at least of overexposure or overdevelop to form; And form a protective seam on this substrate, in order to increase optics transmittance, and protect this substrate, this transparency conducting layer, this orientation rete and this conductive layer.
For reaching above-mentioned purpose and other purpose, the invention provides a kind of bridge connected electrode structure, be used for a capacitive touch control plate, it comprises substrate, a plurality of the first region piece, a plurality of second electrode block and bridge joint insulation unit.These the first region pieces are set at this substrate and are electrically connected in series by one first lead.These second electrode blocks are set at the both sides that this substrate and these second electrode blocks are arranged at this first lead respectively.This bridge joint insulation unit is vertically to be arranged on this first lead, and this bridge joint insulation unit has the bridge connected groove.Wherein, these second electrode blocks are electrically connected in series by this bridge connected groove by one second lead.
For reaching above-mentioned purpose and other purpose, the invention provides a kind of bridge connected electrode structure, it comprises substrate layer, transparency conducting layer, orientation rete and conductive layer.This transparency conducting layer is set at least one side of this substrate.This orientation rete is set at a side of this substrate layer and this transparency conducting layer.This conductive layer is in abutting connection with a side that is arranged at this orientation rete.In addition, at least one side that this bridge connected electrode structure also is included in this bridge connected electrode structure is provided with a protective seam, and wherein this protective seam is organic matter layer, photoresistance thing layer, anti-reflecting layer, anti-glare layer or above-mentioned combination.
With known art, the distribution method of bridge connected electrode of the present invention and structure thereof, it is bridge connected groove by bridge joint that light shield is formed at insulation unit with halftone screen dot pattern, make when carrying out being connected to each other between electrode, the electrode that has both direction on can being provided in a substrate simultaneously is insulated from each other and being electrically connected discriminably, be the structure that is lower than this bridge joint insulation cell height by this bridge connected groove again, can improve process rate effectively, wherein, particularly can be by luminous energy and/or the cooperation optical compensation formula light shield of adjusting exposure usefulness, make this luminous energy and this optical compensation formula light shield produce interaction each other, in order to compensate these electrical leads.
Description of drawings
Fig. 1 to 5 is the schematic flow sheet of the distribution method of the bridge connected electrode among the embodiment;
Fig. 6 a to 6c is the pattern synoptic diagram on the optical compensation formula light shield;
Fig. 7 a to 7d is the synoptic diagram of the bridge connected electrode structure among the embodiment; And
Fig. 8 a to 8b is the vertical cut-away schematic view of the bridge connected electrode structure among the embodiment.
[main element label declaration]
10 substrates
12 the first region pieces
14 second electrode blocks
16 bridge joints insulation unit
18 first leads
20 bridge connected grooves
22 second leads
The PL protective seam
The ECL transparency conducting layer
The SL substrate layer
PI orientation rete
The CL conductive layer
Embodiment
For fully understanding purpose of the present invention, feature and effect, now by following specific embodiment, and cooperate appended graphicly, the present invention is described in detail, illustrate as afterwards:
Referring to figs. 1 to 5, be the present invention's schematic flow sheet of bridge connected electrode distribution method in one embodiment.In Fig. 1, the step of the distribution method of bridge connected electrode originates in step S1 provides substrate; Then step S2 form a transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks; Then step S3 forms an orientation rete on this substrate again, and this orientation rete has a plurality of bridge connected grooves in order to across between these pattern blocks; Follow step S4 again, form a conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these bridge connected grooves, and these electrical leads of this conductive layer are by optical compensation formula light shield, cooperate the one at least of overexposure or overdevelop to form; And, form protective seam on this substrate in a step S5 again, in order to increasing the optics transmittance, and protect this substrate, this transparency conducting layer, this orientation rete and this conductive layer.
Moreover Fig. 2 is the more detailed step of above-mentioned steps S2, so the step that this transparency conducting layer forms also comprises, originates in step S2-1, and sputter conductive film (ITO) is on this substrate; Then step S2-2 applies photoresistance on this substrate; Then step S2-3 provides the light shield with corresponding these pattern blocks, and by this light shield these pattern block exposures is formed on this photoresistance; And follow step S2-4, these pattern blocks of development, etching and stripping have these pattern blocks adjacent one another are in order to formation.
Fig. 3 is the more detailed step of above-mentioned steps S3, so the step that this orientation rete forms also comprises, originates in step S3-1, applies a photoresistance on this substrate; Then step S3-2 provides the light shield with a shadow tone site (Half tone) pattern, and by this light shield in order to this halftone screen dot pattern is exposed on this photoresistance; Then step S3-3 develops this halftone screen dot pattern on this photoresistance, has across these bridge connected grooves between these pattern blocks in order to formation; And follow step S3-4, toast this photoresistance.In addition, this halftone screen dot pattern of this light shield forms the line footpath in a light tight zone that step comprises the surface that is provided in this light shield greater than the line footpath (shown in Fig. 6 a) of this halftone screen dot pattern or form a plurality of holes (for example these holes can be circle, rectangle or arbitrary shape), and the surface that is arranged at this light shield fifty-fifty is (as Fig. 6 b, shown in the 6c), and via when exposure light for interference and diffraction that this halftone screen dot pattern is caused, make photoresistance this bridge connected groove after development of this bridge connected groove be lower than the height (shown in Fig. 7 d) of this bridge joint insulation unit.
Fig. 4 is the more detailed step of above-mentioned steps S4, so the step that this conductive layer forms also comprises, originates in step S4-1, and sputter one conductive material is on this substrate; Then step S4-2 applies a photoresistance on this substrate; Then step S4-3 provides to have this optical compensation formula light shield again, and by this optical compensation formula light shield with an electrical lead pattern overexposure of corresponding these electrical leads on this photoresistance; And then step S4-4, this electrical lead pattern that develops has these pattern blocks adjacent one another are in order to formation, and this electrical lead pattern is to utilize overexposure and overdevelop and produce.In addition, the conductive layer step also can comprise a luminous energy of adjusting exposure usefulness again, and cooperate this optical compensation formula light shield, make this luminous energy and this optical compensation formula light shield produce interaction each other, in order to the key size loss (Critical Dimension Loss) that compensates these electrical leads, for example the pattern that produced of this optical compensation formula light shield can be shown in the electrical lead pattern of thick black line among Fig. 7 a and the 7b, and wherein Fig. 7 a is that this optical compensation formula light shield of expression produces and has the directly electrical lead of width such as the line of grade; And Fig. 7 b to be this optical compensation formula light shield of expression produce has the non-electrical lead that waits line footpath width, and the special line footpath that has broad at the two ends of electrical lead.
Fig. 5 is the more detailed step of above-mentioned steps S5, so the step that this protective seam forms also comprises, originates in step S5-1, applies a photoresistance or an organic one at least on this substrate; Then step S5-2 toasts this photoresistance or this organism, to form a hard type protection film.In addition, in another embodiment, when if this protective seam is the non-entire area that is used for this substrate, then comprise again after the step S5-1 again the light shield with a protection zone pattern is provided, and by this light shield this protection zone pattern is exposed on this photoresistance or this organism, and development is positioned at this protection zone pattern on this photoresistance or this organism; Then step S5-2 toasts this photoresistance or this organism, to form a hard type protection film.
With reference to figure 7c to 7d, be the synoptic diagram of the bridge connected electrode structure of the present invention in an embodiment.Fig. 7 c provides a kind of bridge connected electrode structure, is used for a capacitive touch control plate, and it comprises substrate 10, a plurality of the first region piece 12, a plurality of second electrode block 14 and bridge joint insulation unit 16.The material of this substrate 10 can be glass material, that is glass substrate.These the first region pieces 12 are set at this substrate 10 and are electrically connected in series by one first lead 18.These second electrode blocks 14 are set at the both sides that this substrate 10 and these second electrode blocks 14 are arranged at this first lead 18 respectively.This bridge joint insulation unit 16 vertically is arranged on this first lead 18, and this bridge joint insulation unit 16 has bridge connected groove 20, shown in Fig. 7 d.Wherein, these second electrode blocks 14 are electrically connected in series by this bridge joint insulation unit 16 by one second lead 22.Wherein, this first region piece 12, this second electrode block 14, this first lead 18 are to be selected from transparent or nontransparent conductive material, for example ITO (Indium tin oxide) with this second lead 22.Moreover this first lead 18 is structures of molybdenum (MO)-aluminium (AL)-molybdenum (MO) with this second lead 22.In addition; this bridge connected electrode structure also comprises at least one protective seam, is arranged at a side, opposite side or the both sides of this bridge connected electrode structure, does not show on the figure; and this protective seam is formed by an organism or a photoresistance, and for example the material of photoresistance is silicon dioxide (SiO2).
With reference to figure 8a to 8b, be the vertical cut-away schematic view of the bridge connected electrode structure of the present invention in an embodiment.In present embodiment, the bridge connected electrode structure is used for a capacitive touch control plate, and it comprises substrate layer SL, transparency conducting layer ECL, orientation rete PI and conductive layer CL.This transparency conducting layer ECL is set at least one side of this substrate layer SL.This orientation rete PI is set at the side of this substrate layer SL and this transparency conducting layer ECL.This conductive layer CL is in abutting connection with being arranged at the side of this orientation rete PI, and this conductive layer CL to can be the structure of molybdenum (MO)-aluminium (AL)-molybdenum (MO).In addition, at least one side of this bridge connected electrode structure one protective seam PL is set, and this protective seam PL can be organic matter layer, photoresistance thing layer, anti-reflecting layer (anti-reflection; AR), anti-glare layer (anti-glare; AG) or above-mentioned combination.Those skilled in the art should recognize that this protective seam PL also can ignore, and the arrangement process sequence of each layer also can change with demand.
With known art, the distribution method of bridge connected electrode of the present invention and structure thereof, it is bridge connected groove by bridge joint that light shield is formed at insulation unit with halftone screen dot pattern, make when carrying out being connected to each other between electrode, the electrode that has both direction on can being provided in a substrate simultaneously is insulated from each other and can being electrically connected respectively, be the structure that is lower than the height of this bridge joint insulation unit by this bridge connected groove again, can improve process rate effectively.
The present invention discloses with preferred embodiment hereinbefore, it will be understood by those skilled in the art that so this embodiment only is used to describe the present invention, does not limit the scope of the invention and should not be read as.It should be noted,, all should be made as and be covered by in the category of the present invention such as with the variation and the displacement of this embodiment equivalence.Therefore, protection scope of the present invention when with above claim scope the person of being defined be as the criterion.
Claims (21)
1. the distribution method of a bridge connected electrode, it comprises:
One substrate is provided;
Form a transparency conducting layer on this substrate, and this transparency conducting layer has the setting adjacent one another are of a plurality of pattern blocks;
Form an orientation rete on this substrate, and this orientation rete have a plurality of bridge connected grooves in order to across between these a plurality of pattern blocks;
Form a conductive layer on this substrate, and this conductive layer have a plurality of electrical leads respectively correspondence be arranged on these a plurality of bridge connected grooves, and these a plurality of electrical leads of this conductive layer are by an optical compensation formula light shield, cooperate the one at least of overexposure or overdevelop to form; And
Form a protective seam on this substrate,, and protect this substrate, this transparency conducting layer, this orientation rete and this conductive layer in order to increase optics transmittance.
2. distribution method as claimed in claim 1, the step that its this transparency conducting layer forms also comprises:
Sputter one conductive film is on this substrate;
Apply a photoresistance on this substrate;
A light shield that has should a plurality of pattern blocks is provided, and should a plurality of pattern blocks exposures be formed on this photoresistance by this light shield; And
These pattern blocks of development, etching and stripping have these pattern blocks adjacent one another are in order to formation.
3. distribution method as claimed in claim 2, the step that its this orientation rete forms also comprises:
Apply a photoresistance on this substrate;
Light shield with a shadow tone half-tone sample is provided, and by this light shield in order to this halftone screen dot pattern is exposed on this photoresistance;
Develop this halftone screen dot pattern on this photoresistance, have across these a plurality of bridge connected grooves between these a plurality of pattern blocks in order to formation; And
Toast this photoresistance.
4. distribution method as claimed in claim 3, the step that its this conductive layer forms also comprises:
Sputter one conductive material is on this substrate;
Apply a photoresistance on this substrate;
Provide to have this optical compensation formula light shield, and by this optical compensation formula light shield with an electrical lead pattern overexposure of corresponding these electrical leads on this photoresistance; And
This electrical lead pattern that develops has these a plurality of pattern blocks adjacent one another are in order to formation, and this electrical lead pattern is to utilize overdevelop and produce.
5. distribution method as claimed in claim 4, the step that its this protective seam forms also comprises:
Apply a photoresistance or an organic one at least on this substrate; And
Toast this photoresistance or this organism, to form a hard type protection film.
6. distribution method as claimed in claim 5, the step that its this protective seam forms comprises:
Light shield with a protection zone pattern is provided, and this protection zone pattern is exposed on this photoresistance or this organism by this light shield; And
Development is positioned at this protection zone pattern on this photoresistance or this organism.
7. distribution method as claimed in claim 3, wherein this halftone screen dot pattern formation step of this light shield comprises:
The line footpath in a light tight zone that this light shield surface is provided is greater than the line footpath of this halftone screen dot pattern.
8. distribution method as claimed in claim 3, wherein this halftone screen dot pattern formation step of this light shield comprises:
Form a plurality of holes and be arranged at the surface of this light shield fifty-fifty.
9. distribution method as claimed in claim 3, wherein this halftone screen dot pattern formation step of this light shield comprises:
Via when exposure light for interference and diffraction that this halftone screen dot pattern is caused, make the photoresistance of this bridge connected groove after development, this bridge connected groove is lower than the height of this bridge joint insulation unit.
10. distribution method as claimed in claim 4, wherein the conductive layer step also comprises:
Adjust a luminous energy of exposure usefulness, and cooperate this optical compensation formula light shield, make this luminous energy and this optical compensation formula light shield produce interaction each other, in order to compensate the key size loss of these electrical leads.
11. a bridge connected electrode structure is used for a capacitive touch control plate, it comprises:
One substrate;
A plurality of the first region pieces are set at this substrate and are electrically connected in series by one first lead;
A plurality of second electrode blocks are set at the both sides that this substrate and this a plurality of second electrode blocks are arranged at this first lead respectively; And
One bridge joint insulation unit vertically is arranged on this first lead, and this bridge joint insulation unit has a bridge connected groove;
Wherein these a plurality of second electrode blocks are to be electrically connected in series by this bridge joint insulation unit with one second lead.
12. bridge connected electrode structure as claimed in claim 11, wherein this first region piece, this second electrode block, this first lead and this second lead are to be selected from transparent or nontransparent conductive material.
13. bridge connected electrode structure as claimed in claim 12, wherein this substrate is a glass substrate.
14. bridge connected electrode structure as claimed in claim 11, wherein this first lead and this second lead are the structures of molybdenum MO-aluminium AL-molybdenum MO.
15. bridge connected electrode structure as claimed in claim 11 also comprises:
At least one protective seam is arranged at a side of this bridge connected electrode structure.
16. bridge connected electrode structure as claimed in claim 15 also comprises:
At least one this protective seam is arranged at the opposite side of this bridge connected electrode structure.
17. as claim 15 or 16 described bridge connected electrode structures, wherein this protective seam is formed by an organism or a photoresistance.
18. bridge connected electrode structure as claimed in claim 17, wherein the material of this photoresistance is silicon dioxide SiO
2
19. a bridge connected electrode structure is used for a capacitive touch control plate, it comprises:
One substrate layer;
One transparency conducting layer is set at least one side of this substrate layer;
One orientation rete is set at a side of this substrate layer and this transparency conducting layer; And
One conductive layer, quilt is in abutting connection with a side that is arranged at this orientation rete.
20. bridge connected electrode structure as claimed in claim 19, at least one side that also is included in this bridge connected electrode structure is provided with a protective seam.
21. bridge connected electrode structure as claimed in claim 20, wherein this protective seam is organic matter layer, photoresistance thing layer, anti-reflecting layer, anti-glare layer or above-mentioned combination.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010126220 CN102169395B (en) | 2010-02-26 | 2010-02-26 | Arrangement method and structure of bridge electrode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010126220 CN102169395B (en) | 2010-02-26 | 2010-02-26 | Arrangement method and structure of bridge electrode |
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| CN102169395A true CN102169395A (en) | 2011-08-31 |
| CN102169395B CN102169395B (en) | 2013-03-20 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102541324A (en) * | 2010-12-23 | 2012-07-04 | 范莉立 | Layout method for electrodes of touch pad and electrode structure of touch pad |
| CN102622154A (en) * | 2012-04-27 | 2012-08-01 | 福州华映视讯有限公司 | Capacitive touch panel |
| CN102855042A (en) * | 2012-09-03 | 2013-01-02 | 福建华映显示科技有限公司 | Manufacturing method of touch panel |
| WO2013078944A1 (en) * | 2011-11-29 | 2013-06-06 | 宸鸿科技(厦门)有限公司 | Touch-control sensing panel |
| CN103412688A (en) * | 2013-03-27 | 2013-11-27 | 深圳欧菲光科技股份有限公司 | Capacitive touch screen and preparation method thereof |
| TWI489362B (en) * | 2012-10-29 | 2015-06-21 | Tpk Touch Solutions Xiamen Inc | Touch sensor structures and methods of forming the same |
| CN107272935A (en) * | 2016-03-31 | 2017-10-20 | 东友精细化工有限公司 | Touch sensor |
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| CN101051255A (en) * | 2006-04-06 | 2007-10-10 | 达诺光电股份有限公司 | Capacitance type touch-control panel with improved electrode pattern |
| US20070240914A1 (en) * | 2006-04-14 | 2007-10-18 | Ritdisplay Corporation | Transparent touch panel |
| CN201078769Y (en) * | 2007-04-27 | 2008-06-25 | 宸鸿光电科技股份有限公司 | Touch control drawing structure of capacitance type touch control plate |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101051255A (en) * | 2006-04-06 | 2007-10-10 | 达诺光电股份有限公司 | Capacitance type touch-control panel with improved electrode pattern |
| US20070240914A1 (en) * | 2006-04-14 | 2007-10-18 | Ritdisplay Corporation | Transparent touch panel |
| CN201078769Y (en) * | 2007-04-27 | 2008-06-25 | 宸鸿光电科技股份有限公司 | Touch control drawing structure of capacitance type touch control plate |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102541324A (en) * | 2010-12-23 | 2012-07-04 | 范莉立 | Layout method for electrodes of touch pad and electrode structure of touch pad |
| CN102541324B (en) * | 2010-12-23 | 2014-09-03 | 范莉立 | Layout method for electrodes of touch pad and electrode structure of touch pad |
| WO2013078944A1 (en) * | 2011-11-29 | 2013-06-06 | 宸鸿科技(厦门)有限公司 | Touch-control sensing panel |
| CN102622154A (en) * | 2012-04-27 | 2012-08-01 | 福州华映视讯有限公司 | Capacitive touch panel |
| CN102622154B (en) * | 2012-04-27 | 2015-08-05 | 福州华映视讯有限公司 | Capacitance type touch-control panel |
| CN102855042A (en) * | 2012-09-03 | 2013-01-02 | 福建华映显示科技有限公司 | Manufacturing method of touch panel |
| CN102855042B (en) * | 2012-09-03 | 2015-07-22 | 福建华映显示科技有限公司 | Manufacturing method of touch panel |
| TWI489362B (en) * | 2012-10-29 | 2015-06-21 | Tpk Touch Solutions Xiamen Inc | Touch sensor structures and methods of forming the same |
| CN103412688A (en) * | 2013-03-27 | 2013-11-27 | 深圳欧菲光科技股份有限公司 | Capacitive touch screen and preparation method thereof |
| CN103412688B (en) * | 2013-03-27 | 2014-09-17 | 深圳欧菲光科技股份有限公司 | Capacitive touch screen and preparation method thereof |
| CN107272935A (en) * | 2016-03-31 | 2017-10-20 | 东友精细化工有限公司 | Touch sensor |
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| CN102169395B (en) | 2013-03-20 |
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