CN102163544A - Package carrier strip and method for preventing mixing thereof - Google Patents
Package carrier strip and method for preventing mixing thereof Download PDFInfo
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- CN102163544A CN102163544A CN201110027209.3A CN201110027209A CN102163544A CN 102163544 A CN102163544 A CN 102163544A CN 201110027209 A CN201110027209 A CN 201110027209A CN 102163544 A CN102163544 A CN 102163544A
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Abstract
The invention discloses a packaging carrier strip and a material mixing prevention method thereof, wherein at least one batch identification code is additionally marked on a frame of the packaging carrier strip, and the batch identification code is different from at least one product model code of the packaging carrier strip, so that the packaging carrier strip with the same specification but produced in different batches can be distinguished, the risk of accidental material mixing during packaging is effectively reduced, and the convenience and the accuracy of material management aiming at the packaging carrier strip can be relatively improved.
Description
Technical field
The invention relates to a kind of encapsulating carrier plate bar and prevent method for mixing particularly additionally have the encapsulating carrier plate bar that prevents batch mixing usefulness batch recognition coding and prevent method for mixing relevant for a kind of.
Background technology
Now, the semiconductor packages industry is in order to satisfy the demand of various high-density packages, develop the package design that various different types gradually, wherein Chang Yong encapsulating carrier plate (carrier) comprises base plate for packaging (substrate) with multilayer printed circuit and the lead frame (lead-frame) that is formed by metallic plate punching press or etching.
Please refer to shown in Figure 1, it discloses the schematic diagram of a kind of existing base plate for packaging bar (substrate strip), wherein have several base plate for packaging unit 11 and a frame 12 on the base plate for packaging bar 10, be respectively equipped with several weld pads 111 in the surface range of each base plate for packaging unit 11.The quantity of described base plate for packaging unit 11 and weld pad 111 thereof all is that the package requirements according to semiconductor chip designs.Described frame 12 mainly is located at the periphery of described base plate for packaging unit 11, and described base plate for packaging unit 11 rectangular rows be located in the scope of described frame 12.
On reality is made, described base plate for packaging bar 10 is normally prepared in advance by the material factory of semiconductor packages industry upstream to be finished, then again shipment to encapsulation factory carry out that cemented chip (die bond), routing (wirebonding) or flip-chip (flip chip) weld, sealing (molding) and cutting and separating operation technologies such as (singulation).Handling of goods and materials for convenience; material factory can form the product type coding 13 of described base plate for packaging bar 10 usually simultaneously with identical anti-welding paint material in the suitable surface location of described frame 12 when patterning is manufactured the surperficial welding resisting layer (solder mask) of described base plate for packaging bar 10; for example described product type coding 13 is " ABCDEF ", so that the follow-up operating personnel that encapsulate factory carry out handling of goods and materials and identification.
Yet, the problem of above line handling of goods and materials is: material factory is that encapsulation factory is given in batch shipment at set intervals, but base plate for packaging bar 10 at the same size of different time shipment, material factory still gives identical product type coding 13, its reason is: material factory uses identical photomask (photo mask) to manufacture the surperficial welding resisting layer pattern of described base plate for packaging bar 10, has identical product type coding 13 naturally.But for encapsulation factory, the base plate for packaging bar 10 of the same size of different time shipment must separately carry out handling of goods and materials basically, with the material source that makes things convenient for the follow-up package quality of management and control and be convenient to follow the trail of non-defective unit/defective products substrate.Therefore, if operating personnel still only use identical product type coding 13 to discern the base plate for packaging bar 10 of the same size of different batches, then will cause the batch mixing risk in the handling of goods and materials, and make the follow-up material that is difficult for correct tracking non-defective unit/defective products substrate originate.
So, be necessary to provide a kind of encapsulating carrier plate bar and prevent method for mixing, to solve the existing in prior technology problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of encapsulating carrier plate bar and prevents method for mixing, wherein extra flag has a batch recognition coding on the frame of encapsulating carrier plate bar, described batch of recognition coding is different from encapsulating carrier plate bar existing products model coding, therefore can be in order to difference tool same size but the encapsulating carrier plate bar that different batches is produced, and then effectively be reduced in the risk of batch mixing that meets accident during the encapsulation, and can improve convenience and accuracy relatively at the handling of goods and materials of described encapsulating carrier plate bar.
For reaching aforementioned purpose of the present invention, the invention provides a kind of encapsulating carrier plate bar and prevent method for mixing, it is characterized in that: described encapsulating carrier plate bar prevents that method for mixing from comprising step:
One encapsulating carrier plate bar is provided, and it comprises several encapsulating carrier plate unit and a frame;
According at least one production batch parameter of described encapsulating carrier plate bar, at least one batch of recognition coding of at least one surface location extra flag of described frame;
Before carrying out a follow-up packaging technology, whether batch recognition coding of inspecting described encapsulating carrier plate bar in advance meets original described production batch parameter; And
If survey and look the result, then carry out described follow-up packaging technology for meeting; If survey and look the result, then stop to carry out described follow-up packaging technology for not meeting.
In one embodiment of this invention, when described encapsulating carrier plate bar is provided, the frame of described encapsulating carrier plate bar has product type coding in advance, described product type coding is different from described batch of recognition coding, and the marker location of described product type coding and described batch of recognition coding differs from one another.
In one embodiment of this invention, described batch of recognition coding is indicated on the two symmetrical sides of frame of described encapsulating carrier plate bar, for example on two symmetrical minor faces or the long limits of two symmetries.
In one embodiment of this invention, described follow-up packaging technology is selected from a chip attach technology, and described chip attach technology comprises: several chips are separately fixed on the corresponding described encapsulating carrier plate unit.
In one embodiment of this invention, described follow-up packaging technology alternative is closed (ball mount) technology or cutting and separating technology from plasma (plasma) cleaning procedure, routing technology (or flip-chip welding procedure), open-short circuit (open short test) technology, optical detection (optical inspection) technology, fin (heat sink) combined process, sealing adhesive process, (marking) technology of impressing, tin chou.
In one embodiment of this invention, in the step that described encapsulating carrier plate bar is provided and indicate between the step of described batch of recognition coding, other comprises a chip attach technology, several chips are separately fixed on the corresponding described encapsulating carrier plate unit.
In one embodiment of this invention, described encapsulating carrier plate bar is selected from a base plate for packaging bar (substratestrip) or a conductive wire frame strip (leadframe strip).
In one embodiment of this invention, described production batch parameter is selected from date of manufacture, board numbering, processing temperature, tonnage, material charge number or the process time when producing described encapsulating carrier plate bar.
In one embodiment of this invention, described batch of recognition coding is selected from numeral, literal, symbol, bar code (bar code) or its combination.
In one embodiment of this invention, when indicating described batch of recognition coding, select to use ink-jet method or laser method to indicate described batch of recognition coding.
In one embodiment of this invention, described method of inspecting is selected to estimate and inspects or the automated optical detection.
Moreover, for reaching aforementioned purpose of the present invention, the invention provides a kind of encapsulating carrier plate bar, it is characterized in that: described encapsulating carrier plate bar comprises:
Several encapsulating carrier plate unit;
One frame is positioned at the periphery of described encapsulating carrier plate unit; And
At least one production batch parameter is indicated at least one surface location of described frame, and described production batch parameter is corresponding at least one production batch parameter of described encapsulating carrier plate bar.
In one embodiment of this invention, the frame of described encapsulating carrier plate bar has product type coding in advance, and described product type coding is different from described batch of recognition coding, and the marker location of described product type coding and described batch of recognition coding differs from one another.
In one embodiment of this invention, described product type coding is the part of a surperficial welding resisting layer of described encapsulating carrier plate bar, and described batch of recognition coding is formed in printing ink coding or laser engraving coding on the described surperficial welding resisting layer.
In one embodiment of this invention, the punching press depression coding that described product type coding is described encapsulating carrier plate bar, and described batch of recognition coding is printing ink coding or laser engraving coding.
Description of drawings
Fig. 1 is the schematic diagram of existing base plate for packaging bar.
Fig. 2 is the process block diagram that first embodiment of the invention encapsulating carrier plate bar prevents method for mixing.
Fig. 3 is the schematic diagram of the corresponding step S01 of encapsulating carrier plate bar of first time of first embodiment of the invention production.
Fig. 4 A is the schematic diagram of the corresponding step S02 of encapsulating carrier plate bar of first time of first embodiment of the invention production.
Fig. 4 B is that second batch of first embodiment of the invention produced but the schematic diagram of the encapsulating carrier plate bar of tool like products specification.
Fig. 5 A is the schematic diagram of the encapsulating carrier plate bar of first time of second embodiment of the invention production.
Fig. 5 B is that second batch of second embodiment of the invention produced but the schematic diagram of the encapsulating carrier plate bar of tool like products specification.
Embodiment
Below the explanation of each embodiment be with reference to additional graphic, can be in order to illustration the present invention in order to the specific embodiment of implementing.Moreover, the direction term that the present invention mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side ", " interior ", " outward " or " side " etc., only be direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to restriction the present invention.
Please refer to shown in Figure 2ly, the encapsulating carrier plate bar of first embodiment of the invention prevents that method for mixing from mainly comprising the following step: step (S01): an encapsulating carrier plate bar 20 is provided, and it comprises several encapsulating carrier plate unit 21 and a frame 22; Step (S02): according at least one production batch parameter of described encapsulating carrier plate bar 20, at least one batch of recognition coding of at least one surface location extra flag 24 of described frame 22; Step (S03): before carrying out a follow-up packaging technology, whether batch recognition coding 24 of inspecting described encapsulating carrier plate bar 20 in advance meets original described production batch parameter; And step (S04): look the result for meeting if survey, then carry out described follow-up packaging technology; If survey and look the result, then stop to carry out described follow-up packaging technology for not meeting.
At first, please refer to shown in Fig. 2 and 3, the encapsulating carrier plate bar of first embodiment of the invention prevents that the step (S01) of method for mixing from being: an encapsulating carrier plate bar 20 is provided, and it comprises several encapsulating carrier plate unit 21 and a frame 22.In the present embodiment, described encapsulating carrier plate bar 20 is to be example with a base plate for packaging bar (substratestrip), and just referring to can be for the tellite that carries out packaging technology.Be respectively equipped with several weld pads 211 in the surface range of each described encapsulating carrier plate unit 21, described weld pad 211 one common peripheral are not around definition one chip rest area (indicating).Described frame 22 mainly is located at the periphery of described encapsulating carrier plate unit 21, and described encapsulating carrier plate unit 21 rectangular rows be located in the scope of described frame 22.The quantity of described encapsulating carrier plate unit 21 and weld pad 211 thereof or arrangement mode all are that the package requirements according to semiconductor chip designs, so its quantity or arrangement mode are not limited.
Moreover, described encapsulating carrier plate bar 20 in a material factory, prepare in advance usually be transported to again one the encapsulation factory carry out subsequent step.Described encapsulating carrier plate bar 20 has product type coding 23 at described frame 21 usually during fabrication in advance, and described product type coding 23 is parts of a surperficial welding resisting layer (not illustrating) of described encapsulating carrier plate bar 20.Just; material factory can form described product type coding 23 with identical anti-welding paint material by the suitable surface location in described frame 22 usually simultaneously when patterning is manufactured the surperficial welding resisting layer of described base plate for packaging bar 10; product standard and type for the described encapsulating carrier plate bar 20 of identification for example is " ABCDEF ".The marker location of described product type coding 23 is for example in the position, the upper left corner of described frame 22, but is not limited to this.
Then, please refer to shown in Fig. 2,4A and the 4B, the encapsulating carrier plate bar of first embodiment of the invention prevents that the step (S02) of method for mixing from being: according at least one production batch parameter of described encapsulating carrier plate bar 20, at least one batch of recognition coding of at least one surface location extra flag 24 of described frame 22.In this step, the present invention preferably indicates described batch of recognition coding 24 with an independent board (not illustrating) that is provided with in encapsulation factory, wherein can select to use ink-jet (ink jet) method or laser (laser) method to come described batch of recognition coding 24 of extra flag, described production batch parameter 24 is indicated at least one surface location of described frame 22, for example in the present embodiment, described batch of recognition coding 24 is indicated on the two symmetrical sides of frame 22 of described encapsulating carrier plate bar 20, for example is on two symmetrical minor faces or the long limits of two symmetries.Described production batch parameter 24 is corresponding at least one production batch parameter of described encapsulating carrier plate bar 20, the processing conditions (as processing temperature, tonnage, material charge number or process time etc.) that described production batch parameter can be date of manufacture when producing described encapsulating carrier plate bar 20, board numbering or other when producing.
In the present invention, described batch of recognition coding 24 is formed in printing ink coding or the laser engraving coding on the described surperficial welding resisting layer, and therefore in fact described batch of recognition coding 24 be different from described product type coding 23.Moreover the marker location of described batch of recognition coding 24 and described product type coding 23 preferably also differs from one another, so that know identification.The content of described batch of recognition coding 24 can be selected from numeral, literal, symbol, bar code (bar code) or its combination.For instance, shown in Fig. 4 A, batch recognition coding 24 of the encapsulating carrier plate bar 20 of first time production for example is denoted as " 20101123A "; Shown in Fig. 4 B, produce but batch recognition coding 24 of the encapsulating carrier plate bar 20 of tool like products specification for example is denoted as " 20101203B " for second batch, but be not limited to this, for example both also can be denoted as different serial numbers respectively its, and for example " 123456 " reach " 123457 " etc.
Then, please refer to shown in Fig. 2,4A and the 4B, the encapsulating carrier plate bar of first embodiment of the invention prevents that the step (S03) of method for mixing from being: before carrying out a follow-up packaging technology, whether batch recognition coding 24 of inspecting described encapsulating carrier plate bar 20 in advance meets original described production batch parameter.In this step, described follow-up packaging technology can be selected from chip attach technology, plasma cleaning technology, routing technology (or flip-chip welding procedure), open-short circuit technology, optical detection technology, fin combined process, sealing adhesive process, the technology of impressing, tin chou and close technology or cutting and separating technology.In case of necessity, can before carrying out above-mentioned each technology, all carry out a step (S03) and step (S04), to guarantee the having or not batch mixing situation to take place in the same production procedure.
For example, the present invention can then carry out the follow-up packaging technology of a chip attach after indicating described batch of recognition coding 24.Described chip attach technology is that several chips (not illustrating) are separately fixed on the corresponding described encapsulating carrier plate unit 21, if wherein routing design, then the chip fixed form can use underfill (underfill) back side of chip to be cemented on the chip rest area (not indicating) of weld pad 211 inboards of each described encapsulating carrier plate unit 21; If flip-chip design, the active surface that then makes chip are up, and make projection on the described active surface and described weld pad 211 solder bond together with mode of heating.Before carrying out described chip attach technology, whether batch recognition coding 24 that the present invention promptly inspects described encapsulating carrier plate bar 20 in advance meets original described production batch parameter, the method of wherein inspecting can be operating personnel's range estimation and inspects, and perhaps carries out automated optical with the automatic optical detector device and detects.
Then, please refer to shown in Fig. 2,4A and the 4B, the encapsulating carrier plate bar of first embodiment of the invention prevents that the step (S04) of method for mixing from being: look the result for meeting if survey, then carry out described follow-up packaging technology; If survey and look the result, then stop to carry out described follow-up packaging technology for not meeting.As mentioned above, look the result for batch recognition coding 24 of described encapsulating carrier plate bar 20 meets original described production batch parameter (as being first batch " 20101123A " really), then to carry out described follow-up packaging technology (being described chip attach technology) if survey; Look the result for not meeting (as being second batch " 20101203B ") if survey, then represent previous steps (S01) or the problem of something unexpected happened (S02) time batch mixing, therefore must determine to stop to carry out described follow-up packaging technology (being described chip attach technology), so that operating personnel solve the batch mixing problem as quickly as possible, for example described encapsulating carrier plate bar 20 can be replaced by the encapsulating carrier plate bar 20 (as being first batch " 20101123A " really) of same size and predetermined correct batch of production, carry out step (S01)～(S04) afterwards more again.
Moreover, if completing steps (S03), (S04) and described chip attach technology, the present invention still can then carry out a step (S03) again, (S04) reaches down follow-up packaging technology together, for example closes technology or cutting and separating technology for plasma cleaning technology, routing technology (or flip-chip welding procedure), open-short circuit technology, optical detection technology, fin combined process, sealing adhesive process, the technology of impressing, tin chou.After final cutting and separating technology, because described frame 22 is cut, therefore last encapsulating carrier plate unit 21 does not have 24 existence of any batch of recognition coding, so can not influence the outward appearance of encapsulation finished product fully.
It should be noted that, in another by way of example, in response to the demand of some product, described chip attach technology also may be configured in the step that described encapsulating carrier plate bar 20 is provided (S01) and indicate between the step (S02) of described batch of recognition coding 24 carry out.
Please refer to shown in Fig. 5 A and the 5B, the encapsulating carrier plate bar of second embodiment of the invention and prevent that method for mixing is similar in appearance to first embodiment of the invention, and roughly continue to use the similar elements title, but the difference characteristic of second embodiment is: the encapsulating carrier plate bar 30 of described second embodiment is continued to use the identical method for mixing that prevents, but the encapsulating carrier plate bar 30 of described second embodiment is selected from a conductive wire frame strip (leadframe strip), and it is formed by punching press or etching by a metallic plate.Described encapsulating carrier plate bar 30 comprises several encapsulating carrier plate unit 31, a frame 32, at least one product type coding 33 and at least one batch of recognition coding 34.Be respectively equipped with several pins 311 in the surface range of each described encapsulating carrier plate unit 31, described pin 311 one common peripheral are around definition one chip bearing 312.Described frame 32 mainly is located at the periphery of described encapsulating carrier plate unit 31, and described encapsulating carrier plate unit 31 rectangular rows be located in the scope of described frame 32.The quantity of described encapsulating carrier plate unit 31 and pin 311 thereof or arrangement mode all are that the package requirements according to semiconductor chip designs, so its quantity or arrangement mode are not limited.
Moreover, the synchronous stamping cover impression of using when the suitable surface location of described frame 32 is shaped with lead frame of diel becomes punching press depression coding, to encode 33 as described product type, the product standard and type for the described encapsulating carrier plate bar 30 of identification for example is " ABCDEF ".The marker location of described product type coding 33 is for example in the position, the upper left corner of described frame 32, but is not limited to this.Described batch of 34 of recognition coding is to be indicated on the two symmetrical sides of frame 32 of described encapsulating carrier plate bar 30, for example two long limits (or two minor faces).Described batch of recognition coding 34 be printing ink coding or laser engraving coding preferably, and therefore in fact described batch of recognition coding 34 be different from described product type coding 33.The marker location of described batch of recognition coding 34 and described product type coding 33 preferably also differs from one another, so that know identification.The content of described batch of recognition coding 34 can be selected from numeral, literal, symbol, bar code (bar code) or its combination.For instance, shown in Fig. 5 A, batch recognition coding 34 of the encapsulating carrier plate bar 30 of first time production for example is denoted as first kind of bar code; Shown in Fig. 5 B, produce but batch recognition coding 34 of the encapsulating carrier plate bar 30 of tool like products specification for example is denoted as second kind of bar code for second batch, it is different from first kind of bar code, for distinguishing different batches production but the encapsulating carrier plate bar 30 of tool same size.
As mentioned above, often can't distinguish the batch mixing risk that causes in the handling of goods and materials and make the follow-up correct problems such as material source of following the trail of non-defective unit/defective products substrate that are difficult for compared to the base plate for packaging bar 10 of the same size that has the different time shipment now because of operating personnel, the encapsulating carrier plate bar of the present invention of Fig. 2 prevents that method for mixing from being that extra flag has described batch of recognition coding 24 on the frame 22 of described encapsulating carrier plate bar 20, described batch of recognition coding 24 is different from described encapsulating carrier plate bar 20 existing products models coding 23, therefore can be in order to difference tool same size but the encapsulating carrier plate bar 20 that different batches is produced, and then effectively reduce the risk of batch mixing that meets accident during the encapsulation, and can improve convenience and accuracy relatively at the handling of goods and materials of described encapsulating carrier plate bar 20.After finishing whole packaging technologies, because finally carried out cutting and separating technology with described frame 22 excisions, therefore last encapsulating carrier plate unit 21 does not have 24 existence of any batch of recognition coding, so can not influence the outward appearance of encapsulation finished product fully.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that disclosed embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope is included in the scope of the present invention.
Claims (11)
1. an encapsulating carrier plate bar prevents method for mixing, it is characterized in that: described encapsulating carrier plate bar prevents batch mixing side
Method comprises:
One encapsulating carrier plate bar is provided, and it comprises several encapsulating carrier plate unit and a frame;
According at least one production batch parameter of described encapsulating carrier plate bar, at least one batch of recognition coding of at least one surface location extra flag of described frame;
Before carrying out a follow-up packaging technology, whether batch recognition coding of inspecting described encapsulating carrier plate bar in advance meets original described production batch parameter; And
If survey and look the result, then carry out described back segment packaging technology for meeting; If survey and look the result, then stop to carry out described follow-up packaging technology for not meeting.
2. encapsulating carrier plate bar as claimed in claim 1 prevents method for mixing, it is characterized in that: when described encapsulating carrier plate bar is provided, the frame of described encapsulating carrier plate bar has product type coding in advance, described product type coding is different from described batch of recognition coding, and the marker location of described product type coding and described batch of recognition coding differs from one another.
3. encapsulating carrier plate bar as claimed in claim 1 prevents method for mixing, it is characterized in that: described batch of recognition coding is indicated in the two symmetrical minor faces or two symmetrical length on the limits of the frame of described encapsulating carrier plate bar.
4. encapsulating carrier plate bar as claimed in claim 1 prevents method for mixing, it is characterized in that: described follow-up packaging technology is selected from a chip attach technology, and described chip attach technology comprises: several chips are separately fixed on the corresponding described encapsulating carrier plate unit.
5. encapsulating carrier plate bar as claimed in claim 4 prevents method for mixing, it is characterized in that: described follow-up packaging technology alternative is closed technology or cutting and separating technology from plasma cleaning technology, routing technology, flip-chip welding procedure, open-short circuit technology, optical detection technology, fin combined process, sealing adhesive process, the technology of impressing, tin chou.
6. encapsulating carrier plate bar as claimed in claim 1 prevents method for mixing, it is characterized in that: in the step that described encapsulating carrier plate bar is provided and indicate between the step of described batch of recognition coding, other comprises a chip attach technology, several chips are separately fixed on the corresponding described encapsulating carrier plate unit.
7. encapsulating carrier plate bar as claimed in claim 1 prevents method for mixing, it is characterized in that: described encapsulating carrier plate bar is selected from a base plate for packaging bar or a conductive wire frame strip; Described production batch parameter is selected from date of manufacture, board numbering, processing temperature, tonnage, material charge number or the process time when producing described encapsulating carrier plate bar; Described batch of recognition coding is selected from numeral, literal, symbol, bar code or its combination; When indicating described batch of recognition coding, select to use ink-jet method or laser method to indicate described batch of recognition coding.
8. encapsulating carrier plate bar, it is characterized in that: described encapsulating carrier plate bar comprises:
Several encapsulating carrier plate unit;
One frame is positioned at the periphery of described encapsulating carrier plate unit; And
At least one production batch parameter is indicated at least one surface location of described frame, and described production batch parameter is corresponding at least one production batch parameter of described encapsulating carrier plate bar.
9. encapsulating carrier plate bar as claimed in claim 8, it is characterized in that: the frame of described encapsulating carrier plate bar has product type coding in advance, described product type coding is different from described batch of recognition coding, and the marker location of described product type coding and described batch of recognition coding differs from one another.
10. encapsulating carrier plate bar as claimed in claim 8, it is characterized in that: described product type coding is the part of a surperficial welding resisting layer of described encapsulating carrier plate bar, and described batch of recognition coding is formed in printing ink coding or laser engraving coding on the described surperficial welding resisting layer.
11. encapsulating carrier plate bar as claimed in claim 8 is characterized in that: the punching press depression coding that described product type coding is described encapsulating carrier plate bar, and described batch of recognition coding is printing ink coding or laser engraving coding.
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| CN201110027209.3A CN102163544B (en) | 2011-01-25 | 2011-01-25 | Package carrier strip and method for preventing mixing thereof |
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| CN201110027209.3A CN102163544B (en) | 2011-01-25 | 2011-01-25 | Package carrier strip and method for preventing mixing thereof |
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| CN102163544B CN102163544B (en) | 2013-05-08 |
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| CN108864806A (en) * | 2018-07-13 | 2018-11-23 | 新东方油墨有限公司 | A kind of liquid photosensitive welding resistance laser labelling ink and production and preparation method thereof |
| CN115090491A (en) * | 2022-07-13 | 2022-09-23 | 北京无线电测量研究所 | Microminiature high-density slide mounting tool and mounting method |
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| CN102163544B (en) | 2013-05-08 |
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