CN102162634B

CN102162634B - Radiating method of LED globular bulb

Info

Publication number: CN102162634B
Application number: CN2010106189733A
Authority: CN
Inventors: 李金明
Original assignee: DONGGUAN WANFENG NANO MATERIAL Co Ltd
Current assignee: DONGGUAN WANFENG NANO MATERIAL Co Ltd
Priority date: 2010-12-31
Filing date: 2010-12-31
Publication date: 2013-03-13
Anticipated expiration: 2030-12-31
Also published as: CN102162634A

Abstract

The invention relates to a semiconductor illumination technology, in particular to a radiating method of a light emitting diode (LED) globular bulb. The globular bulb comprises a lamp body, two ends of the lamp body are provided with a thread interface piece and a light emitting cover respectively, the lamp body has a double-layer cylindrical structure consisting of an inner cylinder and an outer cylinder, heat exchange fins are arranged in an accommodating space between the inner cylinder and the outer cylinder, and the two ends of the lamp body are provided with air holes for communicating the accommodating space and the external space; an LED luminous source piece is arranged at the end of the inner cylinder of the lamp body; the LED globular bulb simultaneously has the following heat transfer paths: P1: from the LED luminous source piece, the inner cylinder, the accommodating space air to convect and exchange air with the outside; P2: from the LED luminous source piece, the inner cylinder, the radiating fins, the outer cylinder to conduct and exchange heat with the outside; and P3: from the LED luminous source piece to the inner cylinder, the radiating fins and the outer cylinder which simultaneously radiate outwards and transfer heat. The invention provides the multi-path radiating method of the LED globular bulb.

Description

A kind of LED globular bulb heat dissipating method

Technical field

The present invention relates to the semiconductor lighting technology, relate in particular to a kind of LED globular bulb heat dissipating method.

Background technology

Because have the advantages such as energy-conservation, long service life, semiconductor lighting is more and more universal, and the trend that progressively replaces the traditional lighting technology is arranged.

Existing LED bulb lamp has a lamp body substantially, and the lamp body front end is installed out light shield, and screw thread mouth is installed in the lamp body rear end, and actuator is installed in the lamp body, and the lamp body periphery arranges radiating fin.

Such as Chinese patent literature CN201507827U in disclosed a kind of LED ball bulb lamp structure on June 16th, 2010.It comprises glass ball bulb, led light source, LED pedestal, driving power and lamp holder, led light source is installed in the center, upper end of LED pedestal, the glass ball bulb spiral-lock is in LED pedestal upper end, be provided with driving power and bulb socket in LED pedestal rear end, be provided with heat-conducting seat in LED pedestal rear end, be provided with a radiator between bulb socket and LED pedestal, the radiator center is provided with the pedestal hole, and the heat-conducting seat of LED pedestal is plugged in the pedestal hole.The diameter of described heat-conducting seat is a bit larger tham the pedestal hole of radiator, and namely heat-conducting seat and radiator closely cooperate.So that the contact area of LED pedestal and radiator is larger, be convenient to the LED pedestal and conduct heat to radiator, so that whole LED bulb lamp has fine thermal diffusivity, can effectively prolong led light source service life.　

The same with the aforementioned patent document, radiator of the prior art is single heat loss through conduction and passive heat loss through convection substantially; Radiating effect is undesirable.

Summary of the invention

The LED globular bulb heat dissipating method that the object of the invention is to overcome above-mentioned the deficiencies in the prior art part and a kind of multipath is provided.

Purpose of the present invention can be achieved through the following technical solutions:

A kind of LED globular bulb heat dissipating method, this globular bulb comprises lamp body, lamp body two ends arrange respectively hickey spare and go out light shield, described lamp body is the double tubular structure that is made of inner core and urceolus, be provided with the heat exchange wing in the accommodation space between inner core and the urceolus, and the lamp body two ends has respectively the pore that is communicated with described accommodation space and extraneous space; The luminous original paper of LED is arranged at lamp body inner core end, it is characterized in that there is the luminous original paper of following heat transfer path: P1:LED simultaneously in this LED globular bulb---inner core---radiating fin---air between accommodating appearance---and extraneous convective exchange air; The luminous original paper of P2:LED---inner core---radiating fin---urceolus---and external world's conduction heat-shift; The luminous original paper of P3:LED---inner core---radiating fin---urceolus---inner core, radiating fin, the simultaneously outside radiation delivery heat of urceolus.

LED globular bulb heat dissipating method is characterized in that: at each radiating fin hole is set, so that air flows between the name radiating fin.

LED globular bulb heat dissipating method is characterized in that: the end that described lamp body is assembled out light shield is defined as the top, and the top of described inner core is a plane, and the luminous original paper of LED is arranged at plane, described inner core top.

LED globular bulb heat dissipating method is characterized in that: the electric wire that is communicated with the luminous original paper of LED and described hickey spare is arranged at the inner core space, the inner core space by plane, inner core top, inner core, state hickey spare and jointly define and form.

LED globular bulb heat dissipating method, it is characterized in that: described LED illuminator is led chip, described inner core top also has encapsulating structure, described envelope shape structure comprises the copper post, the copper post is arranged in the glue shell, led chip is arranged at the end of copper post upper surface, copper post lower surface is exposed from the lower surface of glue shell and is connected to the inner core end face, led chip exposes from the upper surface of glue shell, sandwiched electrode in the glue shell, electrode also exposes from the upper surface of glue shell, is connected by gold thread between led chip and the electrode, also is provided with sealing in the glue shell.

LED globular bulb heat dissipating method is characterized in that: the material of described lamp body is aluminium or almag or kirsite or pottery.

LED globular bulb heat dissipating method is characterized in that: the lamp body surface scribbles heat and turns thermal-radiating material.

LED globular bulb heat dissipating method is characterized in that: describedly go out light shield and comprise substrate layer, also comprise color-temperature regulating layer, diffusion lustre adding layer, anti-scratch coating, self-cleaning layer; The self-cleaning layer of described cover body is arranged at outermost layer, secondly is anti-scratch coating; From inside to outside, be successively color-temperature regulating layer, diffusion lustre adding layer, substrate layer; Described color-temperature regulating layer comprises red fluorescence powder; Described substrate layer is transparent PET or PVC; Described diffusion lustre adding layer comprises the unit that adds lustre to inner process, and the described unit that adds lustre to has the pyramid structure, and the drift angle of the described unit that adds lustre to is roughly 88 °, or 89 °, or 91 °, or 92 °; Described self-cleaning layer is the Nano titanium dioxide plated film.

There is the luminous original paper of many heat transfer path: P1:LED simultaneously in LED globular bulb heat dissipating method of the present invention---inner core---radiating fin---air between accommodating appearance---and extraneous convective exchange air; The luminous original paper of P2:LED---inner core---radiating fin---urceolus---and external world's conduction heat-shift; The luminous original paper of P3:LED---inner core---radiating fin---urceolus---inner core, radiating fin, the simultaneously outside radiation delivery heat of urceolus; Compared with prior art, the characteristics that have good heat dissipation effect.

Description of drawings

Fig. 1 is the schematic diagram of the LED globular bulb of first embodiment of the invention.

Fig. 2 is the LED globular bulb lamp body schematic diagram of first embodiment of the invention.

Fig. 3 is one of the heat transfer path of first embodiment of the invention schematic diagram.

Fig. 4 is two schematic diagrames of the heat transfer path of first embodiment of the invention.

Fig. 5 is three schematic diagrames of the heat transfer path of first embodiment of the invention.

The specific embodiment

The invention will be further described below in conjunction with accompanying drawing.

With reference to figure 1, Fig. 2, it is a kind of LED globular bulb, comprise lamp body 103, lamp body 103 two ends arrange respectively hickey spare 102 and go out light shield 101, described lamp body 103 is the double tubular structures that are made of inner core 1031 and urceolus 1032, be provided with heat exchange wing 1033 in the accommodation space between inner core 1031 and the urceolus 1032, and lamp body 103 two ends has respectively the pore 1034 that is communicated with described accommodation space and extraneous space.

The end that described lamp body 103 is assembled out light shield 101 is defined as the top, and the top of described inner core 1031 is planes 1035, and the luminous original paper 1036 of LED is arranged at plane, described inner core 1031 top 1035; The electric wire and the driver part that are communicated with the luminous original paper 1036 of LED and described hickey spare 102 are arranged at the inner core space, the inner core space by plane, inner core top 1035, inner core 1031, state hickey spare 102 and jointly define and form; It is led chip that described LED sends out original paper, described inner core top also has encapsulating structure, described envelope shape structure comprises the copper post, and the copper post is arranged in the glue shell, and led chip is arranged at the end of copper post upper surface, copper post lower surface is exposed from the lower surface of glue shell and is connected to the inner core end face, led chip exposes from the upper surface of glue shell, sandwiched electrode in the glue shell, and electrode also exposes from the upper surface of glue shell, be connected by gold thread between led chip and the electrode, also be provided with sealing in the glue shell; The material of described lamp body is aluminium, can certainly be almag, kirsite, pottery; Lamp body 103 surfaces scribble heat and turn thermal-radiating material; Describedly go out light shield and comprise substrate layer, also comprise color-temperature regulating layer, diffusion lustre adding layer, anti-scratch coating, self-cleaning layer; The self-cleaning layer of described cover body is arranged at outermost layer, secondly is anti-scratch coating; From inside to outside, be successively color-temperature regulating layer, diffusion lustre adding layer, substrate layer; Described color-temperature regulating layer comprises red fluorescence powder; Described substrate layer is transparent PET or PVC; Described diffusion lustre adding layer comprises the unit that adds lustre to inner process, and the described unit that adds lustre to has the pyramid structure, and the drift angle of the described unit that adds lustre to is roughly 89 °; Described self-cleaning layer is the Nano titanium dioxide plated film.

With reference to figure 3 to Fig. 5, first embodiment of the invention is a kind of LED globular bulb heat dissipating method, this globular bulb comprises lamp body, lamp body two ends arrange respectively hickey spare and go out light shield, described lamp body is the double tubular structure that is made of inner core and urceolus, be provided with the heat exchange wing in the accommodation space between inner core and the urceolus, and the lamp body two ends has respectively the pore that is communicated with described accommodation space and extraneous space; The luminous original paper of LED is arranged at lamp body inner core end, it is characterized in that there is the luminous original paper of following heat transfer path: P1:LED simultaneously in this LED globular bulb---inner core---radiating fin---air between accommodating appearance---and extraneous convective exchange air; The luminous original paper of P2:LED---inner core---radiating fin---urceolus---and external world's conduction heat-shift; The luminous original paper of P3:LED---inner core---radiating fin---urceolus---inner core, radiating fin, the simultaneously outside radiation delivery heat of urceolus.

In the present embodiment, at each radiating fin hole is set, so that air flows between each radiating fin; Mainly when LED globular bulb horizontal operation, be convenient to hot-air and upwards flow.

Claims

1. LED globular bulb heat dissipating method, this globular bulb comprises lamp body, lamp body two ends arrange respectively hickey spare and go out light shield, described lamp body is the double tubular structure that is made of inner core and urceolus, be provided with the heat exchange wing in the accommodation space between inner core and the urceolus, and the lamp body two ends has respectively the pore that is communicated with described accommodation space and extraneous space; The luminous original paper of LED is arranged at lamp body inner core end, it is characterized in that there is following heat transfer path simultaneously in this LED globular bulb:

Air between the luminous original paper-〉 inner core of P1:LED-〉 heat exchange wing-〉 accommodating appearance-〉 with extraneous convective exchange air;

Luminous original paper-〉 the inner core of P2:LED-〉 heat exchange wing-〉 urceolus-〉 conduct heat-shift with the external world;

Luminous original paper-〉 the inner core of P3:LED-〉 heat exchange wing-〉 urceolus-〉 inner core, heat exchange wing, the simultaneously outside radiation delivery heat of urceolus;

The end that described lamp body is assembled out light shield is defined as the top, and the top of described inner core is a plane, and the luminous original paper of LED is arranged at plane, described inner core top;

The electric wire that is communicated with the luminous original paper of LED and described hickey spare is arranged at the inner core space, the inner core space by plane, inner core top, inner core, state hickey spare and jointly define and form;

The luminous original paper of described LED is led chip, described inner core top also has encapsulating structure, described encapsulating structure comprises the copper post, and the copper post is arranged in the glue shell, and led chip is arranged at the end of copper post upper surface, copper post lower surface is exposed from the lower surface of glue shell and is connected to the inner core end face, led chip exposes from the upper surface of glue shell, sandwiched electrode in the glue shell, and electrode also exposes from the upper surface of glue shell, be connected by gold thread between led chip and the electrode, also be provided with sealing in the glue shell.

2. LED globular bulb heat dissipating method according to claim 1 is characterized in that: at each heat exchange wing hole is set, so that air flows between each heat exchange wing.

3. according to the described LED globular bulb of aforementioned any one claim heat dissipating method, it is characterized in that: the material of described lamp body is aluminium or almag or kirsite or pottery.

4. LED globular bulb heat dissipating method according to claim 1 is characterized in that: describedly go out light shield and comprise substrate layer, also comprise color-temperature regulating layer, diffusion lustre adding layer, anti-scratch coating, self-cleaning layer; The described self-cleaning layer that goes out light shield is arranged at outermost layer, secondly is anti-scratch coating; From inside to outside, be successively color-temperature regulating layer, diffusion lustre adding layer, substrate layer; Described color-temperature regulating layer comprises red fluorescence powder; Described substrate layer is transparent PET or PVC; Described diffusion lustre adding layer comprises the unit that adds lustre to inner process, and the described unit that adds lustre to has the pyramid structure, and the drift angle of the described unit that adds lustre to is roughly 88 °, or 89 °, or 91 °, or 92 °; Described self-cleaning layer is the Nano titanium dioxide plated film.