CN102161806A - Waste printed circuit board nonmetal powder/polyvinyl chloride/wood meal composite material and preparation method thereof - Google Patents
Waste printed circuit board nonmetal powder/polyvinyl chloride/wood meal composite material and preparation method thereof Download PDFInfo
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Abstract
The invention provides a waste printed circuit board nonmetal powder/polyvinyl chloride/wood meal composite material and a preparation method thereof. The raw materials of the composite material comprise printed circuit board nonmetal powder, wood meal, a polyvinyl chloride mixture and vinyl chloride in a weight ratio of (15-40):(10-50):40:10; and the polyvinyl chloride mixture contains polyvinyl chloride, a thermal stabilizer, a lubricating agent, a processing modifier and a plasticizer in a weight ratio of 100:2:5.2:2:8. The composite material is prepared by the material pretreatment, mixing treatment, hot pressing treatment and cold pressing treatment of the raw materials. In the invention, the recovery and use of waste printed circuit boards contribute to environment protection. The bending strength and Vicat softening temperature (VST) of the composite material are high. The composite material has high flame retardance and is a good composite material.
Description
Technical field:
The present invention relates to a kind of waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material and preparation method thereof, contain in the raw material of described matrix material: printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride; Described matrix material is that described raw material is prepared from through material pre-treatment, mixing treatment, hot-pressing processing, cold pressing treatment.
Background technology:
Printed circuit board (PCB) (PCB) is the electronics and IT products basic building blocks, and kind is numerous.Domestic electric appliance such as televisor, washing machine mostly is the paper fiber and soaks the single-side coated copper plate (FR-14) that the resol sclerosis forms.Present China has entered electronic appliance and has scrapped the peak period, it is predicted that China scrapped 3,718 ten thousand televisors, 9,240,000 refrigerators, 1,187 ten thousand washing machines at least in 2009, these are scrapped, and PCB accounts for 3% in the household electrical appliances, infer that thus paper substrate PCBs learies is huge.Metal accounts for 30% among the discarded PCBs, is the emphasis that resource utilization reclaims always; But about 70% nonmetal different or be dropped or burned because of metal recovery processes.In southern partial area, the illegal a large amount of organic pollutants that burn the generation of discarded PCB recovery metal process are diffused in the surrounding medium, cause serious environmental to pollute.
The thermosetting resin that is used for PCBs production can not be as thermoplastic material regeneration and granulation again, and how effectively to use is the difficult point of useless PCBs resource utilization.The application of relevant useless PCBs scrap metal powder at present mainly concentrates on to utilize and contains a large amount of glass fibre among the FR-4 and be used to make material of construction, thermoplastic or thermoset(ting)plastic etc. as filler.Do not see the correlative study report about utilizing waste paper base PCBs non-metal powder essential property and thermoplastic resin to make the matrix material aspect.So, need a kind of matrix material that is prepared from by waste paper base PCBs non-metal powder and thermoplastic resin on the market, realize that the resource utilization of useless PCBs reclaims and further the utilization.
Summary of the invention:
The object of the present invention is to provide a kind of waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material and preparation method thereof, contain in the raw material of described matrix material: contain in the raw material of described matrix material: printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride; Described matrix material is that described raw material is prepared from through material pre-treatment, mixing treatment, hot-pressing processing, cold pressing treatment.The present invention recycles waste printed circuit board, helps environmental protection; Flexural strength of the present invention, dimension card softening intensity (VST) height have flame retardant properties, are good matrix materials.
The objective of the invention is to realize by following technical scheme:
Contain in the raw material of described matrix material: printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride; The weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 15～40: 10～50: 40: 10; Contain polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent in the described polyvinyl chloride batch mixing; The weight ratio of described polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent is 100: 2: 5.2: 2: 8.
The objective of the invention is to realize by following another technical scheme:
The preparation method of a kind of waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material is characterized in that: contain in the raw material of described matrix material: printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride; The weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 15～40: 10～50: 40: 10; Contain polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent in the described polyvinyl chloride batch mixing; The weight ratio of described polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent is 100: 2: 5.2: 2: 8; The preparation method is:
I. material pre-treatment:
A. described wood powder preparation:
Described wood powder starting material are carried out pulverization process, and sieve processing, drying treatment obtain described wood powder again; The particle diameter of described wood powder is 60 orders; In the described drying treatment, temperature is 105 ℃, and the time is 2h;
B. described waste printed circuit board non-metal powder preparation:
Waste printed circuit board is removed the surface element device, and carry out pulverization process, sorting process, collection sieve processing, drying treatment, obtain the printed circuit board (PCB) non-metal powder; The particle diameter of described printed circuit board (PCB) non-metal powder is 180 orders; In the described drying treatment, temperature is 100～105 ℃, and the time is 0.5～2h;
II. batch mixing:
A. described polyvinyl chloride batch mixing preparation:
According to said ratio described polyvinyl chloride, thermo-stabilizer, lubricant, softening agent, modifier are carried out stir process, obtain described polyvinyl chloride batch mixing; In the described stir process, rotating speed is 1200～2000rpm, and temperature is 80～90 ℃, and the time is 5～15min;
B. total material preparation:
According to said ratio described polyvinyl chloride batch mixing, ethylene chloride, printed circuit board (PCB) non-metal powder, wood powder are carried out stir process, obtain total material; In the described stir process, rotating speed is 1200～2000rpm, and temperature is 80～90 ℃, and the time is 10～20min;
III. Composite Preparation:
Described total material is carried out hot-pressing processing, and in the described hot-pressing processing, temperature is 190～195 ℃, and the time is 5～8min, and pressure is 1～2Mpa;
To carry out cold pressing treatment through total material of described hot-pressing processing again, obtain described waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material; In the described cold pressing treatment, temperature is 15～25 ℃, and the time is 5～8min, and pressure is 1～2Mpa.
The present invention has following beneficial effect compared to existing technology:
1. the present invention recycles waste printed circuit board, helps environmental protection;
2. MOR of the present invention, internal bond strength, quiet bent modulus excellence have flame retardant properties, are good matrix materials.
Embodiment:
Embodiment 1:
A kind of waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material is characterized in that: contain in the raw material of described matrix material: printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride; The weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 15～40: 10～50: 40: 10; Contain polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent in the described polyvinyl chloride batch mixing; The weight ratio of described polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent is 100: 2: 5.2: 2: 8.
Described wood powder starting material are the weedtree powder, and the magnificent prosperous wood powder in effluent north factory produces;
Described polyvinyl chloride (PVC) is the DG-1000K type, is produced by Dagu, Tianjin chemical industry company limited;
Described thermo-stabilizer is a mercaptan butyl organotin, is the TJ636 type, is produced by Beijing addition auxiliary agent institute;
Described lubricant is stearic acid and paraffin, and the weight ratio of described stearic acid and paraffin is 0.2: 5; Described stearic acid (Hst) and paraffin (Wax) are analytical pure, are produced by Chemical Reagent Co., Ltd., Sinopharm Group;
Described modifier is acrylic acid esters co-polymer (ACR), is the antioxidant 1010 type, is produced by Beijing Chemical Factory No. 3;
Described softening agent is dimethyl phthalate (DOP, 99%), is analytical pure, is produced by Beijing chemical reagents corporation;
The preparation method of described matrix material is:
I. material pre-treatment:
A. described wood powder preparation:
Described wood powder starting material are carried out pulverization process, and sieve processing, drying treatment obtain described wood powder again; The particle diameter of described wood powder is 60 orders; In the described drying treatment, temperature is 105 ℃, and the time is 2h;
B. described waste printed circuit board non-metal powder preparation:
Waste printed circuit board is removed the surface element device, and carry out pulverization process, sorting process, collection sieve processing, drying treatment, obtain the printed circuit board (PCB) non-metal powder; The particle diameter of described printed circuit board (PCB) non-metal powder is 180 orders;
In the described pulverization process, the equipment of employing is that supper micron mill (RT-25, Taiwan) fragmentation is sieved;
Described sorting process is an electrostatic separation, and the equipment of employing is YD3040211I type Separators and High Tension Separation (physical dimension 900mm * 872mm * 2000mm, roller diameter 30cm, processing power 0.05～0.20t/h, transmission power 0.6kW);
Described sorting process also can adopt several method to make the treatment effect optimization, and the equipment of employing is vortex sorting machine YW type eddy current metal (non-iron) recovery machine, is produced by Changsha Mining ﹠ Metallurgy Inst;
In the described drying treatment, temperature is 100～105 ℃, and the time is 0.5～2h, is preferably 1.5h;
The equipment that described drying treatment adopts is the electric heating constant temperature air dry oven, and model is DHG-9140A, and company limited produces by the permanent scientific instrument in sea one;
II. batch mixing:
A. described polyvinyl chloride batch mixing preparation:
According to said ratio with described polyvinyl chloride, mercaptan butyl organotin, stearic acid, paraffin, acrylic acid esters co-polymer, dimethyl phthalate, carry out stir process, obtain described polyvinyl chloride batch mixing; In the described stir process, rotating speed is 1200～2000rpm, and temperature is 80～90 ℃, and the time is 5～15min;
B. total material preparation:
According to said ratio described polyvinyl chloride batch mixing, ethylene chloride, printed circuit board (PCB) non-metal powder, wood powder are carried out stir process, obtain total material; In the described stir process, rotating speed is 1200～2000rpm, and temperature is 80～90 ℃, and the time is 10～20min;
The equipment that described stir process adopts is high-speed mixer, and model is GH-10DY, is produced by Beijing China new plastic machinery company limited;
III. Composite Preparation:
Described total material is carried out hot-pressing processing, and in the described hot-pressing processing, temperature is 190～195 ℃, and the time is 5～8min, and pressure is 1～2Mpa;
The equipment that described hot-pressing processing adopts is thermocompressor, and model is QD-081, is produced by Shanghai Artificial Plate Machine Plant;
To carry out cold pressing treatment through total material of described hot-pressing processing again, obtain described waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material;
In the described cold pressing treatment, temperature is 15～25 ℃, and the time is 5～8min, and pressure is 1～2Mpa;
The equipment that described cold pressing treatment adopts is chilling press, and model is QD-065, is produced by Shanghai Artificial Plate Machine Plant;
The used weight unit of present embodiment is a kilogram, also can be gram;
In the present embodiment, each raw material in the described matrix material can be in the ratio range that provides flexible combination, do not enumerate one by one at this.
Embodiment 2:
Present embodiment is the preferred version on embodiment 1 basis, and the quality of raw materials used (component) is identical with embodiment 1; The weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 15: 35: 40: 10;
The preparation method of present embodiment is referring to embodiment 1, and difference is:
In the II-A step, in the described stir process, rotating speed is 1200rpm, and temperature is 80 ℃, 5min;
In the II-B step, in the described stir process, rotating speed is 1300rpm, and temperature is 80 ℃, and the time is 10min;
In the III step, in the described hot-pressing processing, 190 ℃ of temperature, the time is 5min, pressure is 1Mpa; In the described cold pressing treatment, temperature is 15 ℃, and the time is 5min, and pressure is 1Mpa.
The used weight unit of present embodiment is a kilogram, also can be gram.
The detected result of the matrix material in the present embodiment is as follows:
1. MOR detects:
According to GB/T17657-1999 " Test methods of evaluating the properties of woodbased panels and surface decorated woodbased panels " at universal material experimental machine (WDW-W, Shidai Shijin Meters Co., Ltd., Jinan) MOR of non-metal powder wood plastic composite is tested, the flexural strength of the matrix material of present embodiment is 29.36MPa;
2. quiet bent modulus detects:
According to GB/T17657-1999 " Test methods of evaluating the properties of woodbased panels and surface decorated woodbased panels " at universal material experimental machine (WDW-W, Shidai Shijin Meters Co., Ltd., Jinan) the quiet bent modulus of non-metal powder wood plastic composite is tested, the quiet bent modulus of the matrix material of present embodiment is 1650MPa;
3. internal bond strength detects:
According to GB/T17657-1999 " Test methods of evaluating the properties of woodbased panels and surface decorated woodbased panels " at universal material experimental machine (WDW-W, Shidai Shijin Meters Co., Ltd., Jinan) internal bond strength of non-metal powder wood plastic composite is tested, the internal bond strength of the matrix material of present embodiment is 1.43MPa;
Embodiment 3:
Present embodiment is the preferred version on embodiment 1 basis, and the quality of raw materials used (component) is identical with embodiment 1;
The preparation method of present embodiment is referring to embodiment 1; Difference is:
In the II-A step, in the described stir process, rotating speed is 1200rpm, and temperature is 80 ℃, and the time is 10min;
In the II-B step, in the described stir process, rotating speed is 1600rpm, and temperature is 85 ℃, and the time is 10min;
In the III step, in the described hot-pressing processing, temperature is 195 ℃, and the time is 5min, and pressure is 1.2Mpa; In the described cold pressing treatment, temperature is 20 ℃, and the time is 5min, and pressure is 2Mpa.
The used weight unit of present embodiment is a kilogram, also can be gram.
The detection method of present embodiment and equipment are referring to embodiment 2; The detected result of the matrix material in the present embodiment is as follows: the MOR of the matrix material of present embodiment is 30.22MPa; Quiet bent modulus is 2230MPa; Internal bond strength is 2.05MPa.
Embodiment 4:
Present embodiment is the preferred version on embodiment 1 basis, and the quality of raw materials used (component) is identical with embodiment 1;
The preparation method of present embodiment is referring to embodiment 1; Difference is
In the II-A step, in the described stir process, rotating speed 1900rpm, temperature is 85 ℃, the time is 5min;
In the II-B step, in the described stir process, rotating speed 1900pm, temperature is 80 ℃, the time is 15min;
In the III step, in the described hot-pressing processing, temperature is 190 ℃, and the time is 8min, and pressure is 1.7Mpa; In the described cold pressing treatment, temperature is 25 ℃, and the time is 8min, and pressure is 1Mpa.
The used weight unit of present embodiment is a kilogram, also can be gram.
The detection method of present embodiment and equipment are referring to embodiment 2; The detected result of the matrix material in the present embodiment is as follows:
The detection method of present embodiment and equipment are referring to embodiment 2; The detected result of the matrix material in the present embodiment is as follows: the MOR of the matrix material of present embodiment is 31.78MPa; Quiet bent modulus is 2675MPa; Internal bond strength is 2.31MPa.
Claims (9)
1. waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material is characterized in that: contain in the raw material of described matrix material: printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride; The weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 15～40: 10～50: 40: 10; Contain polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent in the described polyvinyl chloride batch mixing; The weight ratio of described polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent is 100: 2: 5.2: 2: 8.
2. waste printed circuit board non-metal powder/polyvinyl chloride according to claim 1/wood flour composite material, it is characterized in that: described thermo-stabilizer is a mercaptan butyl organotin, described lubricant is stearic acid and paraffin, the weight ratio of described stearic acid and paraffin is 0.2: 5, described modifier is an acrylic acid esters co-polymer, and described softening agent is a dimethyl phthalate.
3. waste printed circuit board non-metal powder/polyvinyl chloride according to claim 2/wood flour composite material is characterized in that: the weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 15: 35: 40: 10.
4. waste printed circuit board non-metal powder/polyvinyl chloride according to claim 2/wood flour composite material is characterized in that: the weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 30: 20: 40: 10.
5. waste printed circuit board non-metal powder/polyvinyl chloride according to claim 2/wood flour composite material is characterized in that: the weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 40: 10: 40: 10.
6. the preparation method of waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material is characterized in that: contain in the raw material of described matrix material: printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride; The weight ratio of described printed circuit board (PCB) non-metallic material, wood powder, polyvinyl chloride batch mixing, ethylene chloride is: 15～40: 10～50: 40: 10; Contain polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent in the described polyvinyl chloride batch mixing; The weight ratio of described polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent is 100: 2: 5.2: 2: 8;
The preparation method is:
I. material pre-treatment:
A. described wood powder preparation:
Described wood powder starting material are carried out pulverization process, and sieve processing, drying treatment obtain described wood powder again; The particle diameter of described wood powder is 60 orders; In the described drying treatment, temperature is 105 ℃, and the time is 2h;
B. described waste printed circuit board non-metal powder preparation:
Waste printed circuit board is removed the surface element device, and carry out pulverization process, sorting process, collection sieve processing, drying treatment, obtain the printed circuit board (PCB) non-metal powder; The particle diameter of described printed circuit board (PCB) non-metal powder is 180 orders;
In the described drying treatment, temperature is 100～105 ℃, and the time is 0.5～2h;
II. batch mixing:
A. described polyvinyl chloride batch mixing preparation:
According to said ratio described polyvinyl chloride, thermo-stabilizer, lubricant, modifier, softening agent are carried out stir process, obtain described polyvinyl chloride batch mixing; In the described stir process, rotating speed is 1200～2000rpm, and temperature is 80～90 ℃, and the time is 5～15min;
B. total material preparation:
According to said ratio described polyvinyl chloride batch mixing, ethylene chloride, printed circuit board (PCB) non-metal powder, wood powder are carried out stir process, obtain total material; In the described stir process, rotating speed is 1200～2000rpm, and temperature is 80～90 ℃, and the time is 10～20min;
III. Composite Preparation:
Described total material is carried out hot-pressing processing, and in the described hot-pressing processing, temperature is 190～195 ℃, and the time is 5～8min, and pressure is 1～2Mpa;
To carry out cold pressing treatment through total material of described hot-pressing processing again, obtain described waste printed circuit board non-metal powder/polyvinyl chloride/wood flour composite material; In the described cold pressing treatment, temperature is 15～25 ℃, and the time is 5～8min, and pressure is 1～2Mpa.
7. the preparation method of waste printed circuit board non-metal powder/polyvinyl chloride according to claim 6/wood flour composite material is characterized in that: (
In the II-A step, in the described stir process, rotating speed is 1200rpm, and temperature is 80 ℃, 5min;
In the II-B step, in the described stir process, rotating speed is 1300rpm, and temperature is 80 ℃, and the time is 10min;
In the III step, in the described hot-pressing processing, 190 ℃ of temperature, the time is 5min, pressure is 1Mpa; In the described cold pressing treatment, temperature is 15 ℃, and the time is 5min, and pressure is 1Mpa.
8. the preparation method of waste printed circuit board non-metal powder/polyvinyl chloride according to claim 6/wood flour composite material is characterized in that:
In the II-A step, in the described stir process, rotating speed is 1200rpm, and temperature is 80 ℃, and the time is 10min;
In the II-B step, in the described stir process, rotating speed is 1600rpm, and temperature is 85 ℃, and the time is 10min;
In the III step, in the described hot-pressing processing, temperature is 195 ℃, and the time is 5min, and pressure is 1.2Mpa; In the described cold pressing treatment, temperature is 20 ℃, and the time is 5min, and pressure is 2Mpa.
9. the preparation method of waste printed circuit board non-metal powder/polyvinyl chloride according to claim 6/wood flour composite material is characterized in that:
In the II-A step, in the described stir process, rotating speed 1900rpm, temperature is 85 ℃, the time is 5min;
In the II-B step, in the described stir process, rotating speed 1900pm, temperature is 80 ℃, the time is 15min;
In the III step, in the described hot-pressing processing, temperature is 190 ℃, and the time is 8min, and pressure is 1.7Mpa; In the described cold pressing treatment, temperature is 25 ℃, and the time is 8min, and pressure is 1Mpa.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103571079A (en) * | 2012-08-02 | 2014-02-12 | 河南新阳光建材有限公司 | Method for producing fireproof lightweight heat preservation floor slab by using waste polyvinyl chloride and product |
| CN113150463A (en) * | 2021-03-31 | 2021-07-23 | 华南理工大学 | Polymer composite shape-stabilized phase change material and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100588682C (en) * | 2007-05-28 | 2010-02-10 | 昆山市惠盛实业有限公司 | Modified plastic rubber composite material and preparation method thereof |
| CN101591459B (en) * | 2009-07-02 | 2011-04-06 | 上海交通大学 | Method for preparing wood plastic composite material from waste printed circuit boards |
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2010
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103571079A (en) * | 2012-08-02 | 2014-02-12 | 河南新阳光建材有限公司 | Method for producing fireproof lightweight heat preservation floor slab by using waste polyvinyl chloride and product |
| CN113150463A (en) * | 2021-03-31 | 2021-07-23 | 华南理工大学 | Polymer composite shape-stabilized phase change material and preparation method thereof |
| CN113150463B (en) * | 2021-03-31 | 2022-12-16 | 华南理工大学 | Polymer composite shape-stabilized phase change material and preparation method thereof |
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