CN102158051B - Power supply device and manufacturing method of printed circuit board winding - Google Patents
Power supply device and manufacturing method of printed circuit board winding Download PDFInfo
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- CN102158051B CN102158051B CN 201110001121 CN201110001121A CN102158051B CN 102158051 B CN102158051 B CN 102158051B CN 201110001121 CN201110001121 CN 201110001121 CN 201110001121 A CN201110001121 A CN 201110001121A CN 102158051 B CN102158051 B CN 102158051B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
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Abstract
The embodiment of the invention discloses a power supply device and a manufacturing method of a printed circuit board winding. The power supply device comprises at least one printed circuit board, at least one magnetic core and at least one set of semiconductor conversion unit, wherein the printed circuit board is provided with a magnetic core slot in which the magnetic core is installed, the side slot wall of at least one magnetic core slot of the printed circuit board is provided with a side wall conductive winding used for being matched with the magnetic core installed in the magnetic core slot to perform electromagnetic conversion, the side wall conductive winding is attached to the surface of the side slot wall of the magnetic core slot partially or completely, the semiconductor conversion unites are used for working together with the magnetic cores and the side wall conductive windings for converting electric energy. Through the scheme provided by the embodiment of the invention, the conduction resistance of the conductive windings on the printed circuit board of the power supply device can be relatively reduced.
Description
Technical field
The present invention relates to electronic technology field, be specifically related to a kind of supply unit and printed circuit board (PCB) winding manufacture method.
Background technology
Current, high power density has become one of developing direction of following switch converters.For improving power density, switch converters adopts modular form usually.
Power supply can be regarded a kind of product form of switch converters as, switch converters comprises: AC-to DC (AC-DC, Alternating Current-Direct Current), DC-to-DC (DC-DC) switch converters and AC to AC (AC-AC) switch converters etc.Transformer in the switch converters, inductance winding etc. are made of the conductive layer of printed circuit board (PCB) (PCB, Printed Circuit Board).
Because the demand of high power density, account for the plate area for the device that deperms; Also develop towards high switching frequency as the DC-DC switch converters, it is more serious that conductive winding is subjected to the influence of kelvin effect thus, switching frequency improves makes penetration depth diminish, electric current is tending towards surface of conductors under the high switching frequency, switching frequency improves makes penetration depth diminish, and same conductive layer can utilize that the cross-sectional area of conductor of conducting electric current is long-pending to be reduced.Therefore, the simple thickness that passes through increase PCB internal electrically conductive layer can't solve the conduction impedance problem.And under the demand of high power density module, the shared volume of each module progressively reduces, and the shared area of plane of conductive layer also progressively reduces, and in this case, the conduction impedance that reduces the conductive winding on the power supply PCB becomes technical barrier.
Summary of the invention
The embodiment of the invention provides a kind of supply unit and printed circuit board (PCB) winding manufacture method, to realize reducing relatively the conduction impedance of the conductive winding on the power supply PCB.
For solving the problems of the technologies described above, the embodiment of the invention provides following technical scheme:
At least one printed circuit board,
At least one magnetic core,
And at least one group of semiconductor conversion unit;
Wherein, offer on the described printed circuit board (PCB) for the magnetic core groove that described magnetic core is installed; The groove sidewall of at least one magnetic core groove of described printed circuit board (PCB) is provided with for cooperate the sidewall conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove, wherein, described sidewall conductive winding is attached to the part or all of surface of the groove sidewall of described magnetic core groove;
Described semiconductor conversion unit carries out transformation of electrical energy for cooperating with described magnetic core and sidewall conductive winding.
A kind of printed circuit board (PCB) winding manufacture method comprises:
Groove milling is carried out in the position that the magnetic core groove of sidewall conductive winding need be set on printed circuit board (PCB), forms the slotted eye that needs plating;
Sidewall to described slotted eye is electroplated, and forms the sidewall conductive winding; Wherein, the side surface of described sidewall conductive winding caves in or flushes in the notch edges of this magnetic groove; Described sidewall conductive winding is carried out electromagnetism transform for cooperating with the magnetic core that is installed in this magnetic core groove;
If the edge of described magnetic core groove overlaps fully with described sidewall conductive winding, then electroplate the back and form the magnetic core groove; If the edge of magnetic core groove not exclusively overlaps with described sidewall conductive winding, then groove milling is carried out in the non-slotted eye position on the above magnetic core trough rim edge of printed circuit board (PCB), form the magnetic core groove.
Therefore, the PCB that considers supply unit in the embodiment of the invention is difficult to reduce conduction impedance by the area that increases the plane conductive layer, therefore on the sidewall of the magnetic core groove of PCB, be provided for cooperating with magnetic core the sidewall conductive winding that realizes electromagnetism transform, to take full advantage of the side of PCB, the expansion conductive winding arranges the space, can reduce the conductive winding quantity that arranges at PCB plane conductive layer relatively, owing to increased the conducting sectional area of PCB relatively, and winding all is positioned at the surface, has reduced the influence of kelvin effect; And then be conducive to reduce relatively the conduction impedance of the conductive winding on the power supply PCB, and it is big to have increased area of dissipation relatively, is conducive to improve the radiating efficiency of supply unit PCB.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1-a is a kind of sidewall conductive winding of providing of the embodiment of the invention and the schematic diagram in parallel of a plane conductive winding;
Fig. 1-b is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plane conductive winding;
Fig. 1-c is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plane conductive winding;
Fig. 1-d is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plane conductive winding;
Fig. 1-e is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plane conductive winding;
Fig. 1-f is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plane conductive winding;
Fig. 2-a is a kind of sidewall conductive winding of providing of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 2-b is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 2-c is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 2-d is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 2-e is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 2-f is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 2-g is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 2-h is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the schematic diagram in parallel of a plurality of planes conductive winding;
Fig. 3-a is a kind of sidewall conductive winding of providing of the embodiment of the invention and the polyphone schematic diagram of a plurality of planes conductive winding;
Fig. 3-b is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the polyphone schematic diagram of a plurality of planes conductive winding;
Fig. 3-c is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the polyphone schematic diagram of a plurality of planes conductive winding;
Fig. 3-d is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the polyphone schematic diagram of a plurality of planes conductive winding;
Fig. 3-e is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the polyphone schematic diagram of a plurality of planes conductive winding;
Fig. 4-a is a kind of sidewall conductive winding of providing of the embodiment of the invention and the connection diagram of a plurality of planes conductive winding;
Fig. 4-b is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the connection diagram of a plurality of planes conductive winding;
Fig. 4-c is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the connection diagram of a plurality of planes conductive winding;
Fig. 4-d is the another kind of sidewall conductive winding that provides of the embodiment of the invention and the connection diagram of a plurality of planes conductive winding;
Fig. 5 is the structural representation of a kind of supply unit of providing of the embodiment of the invention;
Fig. 6 is a kind of PCB L2 endothecium structure schematic diagram that the embodiment of the invention provides;
Fig. 7 is a kind of PCB L3 endothecium structure schematic diagram that the embodiment of the invention provides;
Fig. 8 is the another kind of PCB L2 endothecium structure schematic diagram that the embodiment of the invention provides;
Fig. 9 is the another kind of PCB L2 endothecium structure schematic diagram that the embodiment of the invention provides;
Figure 10 is the another kind of PCB L3 endothecium structure schematic diagram that the embodiment of the invention provides;
Figure 11 is the another kind of PCB L3 endothecium structure schematic diagram that the embodiment of the invention provides;
Figure 12 is a kind of PCB processing schematic perspective view that the embodiment of the invention provides;
Figure 13 is a kind of PCB processing plane schematic diagram that the embodiment of the invention provides.
Embodiment
The embodiment of the invention provides a kind of supply unit and printed circuit board (PCB) winding manufacture method.
In order to make those skilled in the art person understand the present invention program better, below in conjunction with the accompanying drawing in the embodiment of the invention, technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the embodiment of a part of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills should belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Below be elaborated respectively.
Embodiment one
An embodiment of supply unit of the present invention can comprise: at least one printed circuit board, at least one magnetic core and at least one group of semiconductor conversion unit; Wherein, offer on the printed circuit board (PCB) for the magnetic core groove that magnetic core is installed; The groove sidewall of at least one magnetic core groove of this printed circuit board (PCB) is provided with for cooperate the sidewall conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove, wherein, this sidewall conductive winding is attached to the part or all of surface of the groove sidewall of this magnetic core groove; Semiconductor conversion unit carries out transformation of electrical energy for cooperating with this magnetic core and sidewall conductive winding.
Wherein, the printed circuit board (PCB) of supply unit can be lamina, doubling plate or multi-layer sheet.This printed circuit board (PCB) can comprise a plurality of planar isolated layers and plane conductive layer etc., and, can also offer a plurality of vias, non-conduction hole etc. on this printed circuit board (PCB).
Under a kind of application scenarios, the side surface of sidewall conductive winding (i.e. surface or its opposite of pasting mutually with the groove sidewall of this magnetic core groove) caves in or flushes in the notch edges of this magnetic groove
In actual applications, (for example the part of certain sidewall conductive winding 85% is arranged on the groove sidewall of magnetic core groove, and residue 15% part for example extends to other positions such as plane conductive layer) on the groove sidewall that partly or entirely is arranged on the magnetic core groove of sidewall conductive winding.Can be by electroplating or existing alternate manner, in the groove sidewall formation sidewall conductive winding of magnetic core groove.Certainly, also can be provided with one or more conductive winding on the plane conductive layer of printed circuit board (PCB), the conductive winding that is arranged on the plane conductive layer of printed circuit board (PCB) also can claim the plane conductive winding.
The semiconductor conversion unit of supply unit can comprise a plurality of semiconductor components and devices that are electrically connected by printed circuit board (PCB), and semiconductor conversion unit is with magnetic core and comprise that several conductive winding of sidewall conductive winding cooperate the realization transformation of electrical energy.
In actual applications, the groove sidewall of the magnetic core groove at sidewall conductive winding place is the above-mentioned any magnetic core groove opened of PCB and the groove sidewall of combination thereof, can comprise: center pillar groove sidewall and/or side column groove sidewall, namely the sidewall conductive winding can be arranged on the groove sidewall of center pillar magnetic core groove and/or the groove sidewall of side column magnetic core groove.
Under a kind of application scenarios, if printed circuit board plane conductive layer also is provided with for cooperate the plane conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in the magnetic core groove; The sidewall conductive winding that arranges on the groove sidewall of this magnetic core groove can be all standing on the surface of the thickness direction (thickness direction is perpendicular to the plane layer direction) of this groove sidewall or part covers, and this sidewall conductive winding can be the independent conductive winding that is not connected with the plane conductive winding.That is to say that the sidewall conductive winding can not connected with the plane conductive winding or be in parallel.
Under another kind of application scenarios, the sidewall conductive winding that arranges on the groove sidewall of magnetic core groove can be all standing on the surface of the thickness direction of this groove sidewall or part covers; The initiating terminal of the plane conductive winding of a plane conductive layer of printed circuit board (PCB) (if exist) or wherein one section the initiating terminal of this plane conductive winding, (directly link to each other when for example the sidewall conductive winding place coat of metal on the plane conductive layer at plane conductive winding place and the groove sidewall is by plating or continuous by conductor) can link to each other with the initiating terminal (or wherein one section initiating terminal) of sidewall conductive winding on this groove sidewall; Wherein one section the clearing end of the clearing end of this plane conductive winding or this plane conductive winding, can link to each other with the clearing end of this sidewall conductive winding on this groove sidewall (perhaps wherein one section clearing end), so that this sidewall conductive winding is in parallel with the plane conductive winding of this plane conductive layer, forms and cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove.For instance, the parallel way of the plane conductive winding of this sidewall conductive winding and this plane conductive layer for example can be shown in Fig. 1-a, Fig. 1-b, Fig. 1-c, Fig. 1-d, Fig. 1-e or Fig. 1-f, but is not limited to this example.Be understandable that this sidewall conductive winding yet can realize in parallel by alternate manner with the plane conductive winding of this plane conductive layer.
Under another kind of application scenarios, the sidewall conductive winding that arranges on the groove sidewall of magnetic core groove can be all standing on the surface of the thickness direction of this groove sidewall or part covers; The initiating terminal of the plane conductive winding of a plurality of planes conductive layer of printed circuit board (PCB) (if existence) or wherein one section the initiating terminal of this a plurality of planes conductive winding, link to each other with the initiating terminal of sidewall conductive winding on this groove sidewall (or wherein one section initiating terminal), wherein one section the clearing end of the clearing end of the plane conductive winding of this a plurality of planes conductive layer or this a plurality of planes conductive winding, link to each other with the clearing end of this sidewall conductive winding on this groove sidewall (or wherein one section clearing end), so that this sidewall conductive winding is in parallel with the conductive winding of this a plurality of planes conductive layer, forms and cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove.For instance, the parallel way of the plane conductive winding of this sidewall conductive winding and this a plurality of planes conductive layer can be shown in Fig. 2-a, Fig. 2-b, Fig. 2-c, Fig. 2-d, Fig. 2-e, Fig. 2-f, Fig. 2-g or Fig. 2-h, but is not limited to this example.Be understandable that the conductive winding of this sidewall conductive winding and this a plurality of planes conductive layer also can realize in parallel by alternate manner.
Under another kind of application scenarios, the sidewall conductive winding that arranges on the groove sidewall of magnetic core groove can be all standing or half on the surface of the thickness direction of this groove sidewall and cover; The initiating terminal of the plane conductive winding of one or more planes conductive layer of printed circuit board (PCB) or clearing end (or wherein initiating terminal or clearing end of one section on the conductive winding of plane), with on this groove sidewall with this sidewall conductive winding initiating terminal or clearing end or wherein one section initiating terminal or clearing end link to each other, so that this sidewall conductive winding connects with the plane conductive winding of this one or more planes conductive layer, form and cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove.For instance, the series system of the plane conductive winding of this sidewall conductive winding and this a plurality of planes conductive layer can be shown in Fig. 3-a, Fig. 3-b, Fig. 3-c, Fig. 3-d or Fig. 3-e, but is not limited to this example.Be understandable that the conductive winding of this one or more planes conductive layer of this sidewall conductive winding also can realize series connection by alternate manner.
Under another kind of application scenarios, the sidewall conductive winding that arranges on the groove sidewall of magnetic core groove can be all standing or half on the surface of the thickness direction of this groove sidewall and cover; The sidewall conductive winding is connected and is connected in parallel with the plane conductive winding of a plurality of planes conductive layer of this printed circuit board (PCB) (its serial or parallel connection mode can as for example above-mentioned), forms to cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove.For instance, the initiating terminal of the plane conductive winding of a plane conductive layer of printed circuit board (PCB) (if exist) and/or clearing end (or wherein one section initiating terminal and/or clearing end), link to each other with the initiating terminal of this sidewall conductive winding on this groove sidewall or clearing end (perhaps wherein one section initiating terminal and/or clearing end), and, the magnetic core with being installed in this magnetic core groove that wherein a section (as the part lead) of this sidewall conductive winding is also connected to other plane conductive layer of this printed circuit board (PCB) cooperates the same potential part of the plane conductive winding of carrying out electromagnetism transform, forms to cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove.For instance, the connected mode of the plane conductive winding of this sidewall conductive winding and plane conductive layer can be shown in Fig. 4-a, Fig. 4-b, Fig. 4-c or Fig. 4-d, but is not limited to this example.
Certainly, in actual applications, the connected mode of the conductive winding of each sidewall conductive winding and each plane conductive layer may be the combination of above-mentioned way of example, perhaps, the conductive winding of sidewall conductive winding and each plane conductive layer also can be given unnecessary details by other one or more connected mode combinations herein no longer one by one.
Therefore, the PCB that considers supply unit in the present embodiment is difficult to reduce conduction impedance by the area that increases the plane conductive layer, therefore on the sidewall of the magnetic core groove of PCB, be provided for cooperating with magnetic core the sidewall conductive winding that realizes electromagnetism transform, to take full advantage of the side of PCB, the expansion conductive winding arranges the space, can reduce the conductive winding quantity that arranges at PCB plane conductive layer relatively, owing to increased the conducting sectional area of PCB relatively, and winding all is positioned at the surface, has reduced the influence of kelvin effect relatively; And then be conducive to reduce relatively the conduction impedance of the conductive winding on the power supply PCB, and it is big to have increased area of dissipation relatively, is conducive to improve the radiating efficiency of supply unit PCB.
And, based on the multiple connected mode of sidewall conductive winding and plane conductive winding, can satisfy the flexible needs of multiple deployment scenario; Can realize the three-dimensional electric winding of PCB, the equal PCB number of plies realizes more multiturn number and more electric properties, can improve the switch converters power density.
Embodiment two
For ease of better understanding the technical scheme of the embodiment of the invention, below be example with the structure of the supply unit of the PCB that comprises 4 laminates mainly, the description of giving an example.Be appreciated that supply unit comprises that the scene of the PCB of doubling plate or other number of plies plate can analogize.
Referring to Fig. 5, the supply unit that the embodiment of the invention provides can comprise:
Printed circuit board (PCB) 100, the two pairs of magnetic cores 201 and 202, semiconductor conversion unit 301 etc.
Wherein, offer on the printed circuit board (PCB) 100 for the magnetic core groove that magnetic core is installed, the two pairs of magnetic cores 201 and 202 are respectively on the magnetic core groove that is buckled in printed circuit board (PCB) 100; Semiconductor conversion unit 301 is welded on (perhaps by other electric connecting mode) printed circuit board (PCB) 100.
As shown in Figure 5, the magnetic core groove that magnetic core 201 and magnetic core 202 are installed comprises 3 magnetic core grooves (existing center pillar groove respectively, the side column groove is arranged again), sidewall conductive winding 102, sidewall conductive winding 105 and sidewall conductive winding 107 are arranged at the groove sidewall for the magnetic core groove that magnetic core 202 is installed respectively.Wherein, sidewall conductive winding 102,105 and 107 is attached to the part or all of surface of the groove sidewall of this magnetic core groove, and the side surface of this sidewall conductive winding (surface that namely is parallel to thickness direction) caves in or flushes in the notch edges of this magnetic groove.In the present embodiment, with each the groove sidewall at the magnetic core groove of a pair of magnetic core correspondence the sidewall conductive winding being set is example, be understandable that, under a lot of actual scenes, also can the sidewall conductive winding be set at the groove sidewall of the corresponding magnetic core groove of a plurality of magnetic cores (for example magnetic core 201 and 202).
Printed circuit board (PCB) 100 comprises four layer plane conductive layers, and wherein, L1 and L4 are the set of outer layer plane conductive layer and planar isolated layer, and L2 and L3 are the set of interior layer plane conductive layer and planar isolated layer.
Referring to Fig. 6 and Fig. 7, Fig. 6 is the L2 plane conductive layer floor map corresponding with the set of planar isolated layer, and Fig. 7 is the L3 plane conductive layer floor map corresponding with the set of planar isolated layer.
Wherein, the in-plane of printed circuit board (PCB) refers to the bearing of trend of plane conductive layer, and the thickness direction of printed circuit board (PCB) refers to that each plane conductive laminate adds the direction of pressing.
As shown in Figure 6, plane conductive winding 103 on the L2 midplane conductive layer of printed circuit board (PCB) 100 and in parallel as a three-dimensional conductive winding (for ease of describing, can be referred to as the first three-dimensional conductive winding) with the sidewall conductive winding 102 on the groove sidewall that the magnetic core groove is set; Plane conductive winding 104 is connected in parallel as another three-dimensional conductive winding (can be referred to as the second three-dimensional conductive winding) with sidewall conductive winding 105 grades on the groove sidewall that the magnetic core groove is set.Or, sidewall conductive winding 102 and 105 can with can independently be respectively a circle conductive winding also, and not with other plane conductive winding serial or parallel connection.
As shown in Figure 7, the plane conductive winding 106 on the conductive layer L3 can be connected in parallel as a three-dimensional conductive winding (for ease of describing, can be referred to as the 3rd three-dimensional conductive winding) with sidewall conductive winding 107.
Certainly, sidewall conductive winding 107 and the shape that also can pass through change plane conductive winding 106 are connected in series sidewall conductive winding 107 and plane conductive winding 106; Or sidewall conductive winding 107 also can independently be a conductive winding.
Plane conductive winding 103,104 and 106, and sidewall conductive winding 102,105 and 107, the common conductive winding that cooperates magnetic core 202 to realize electromagnetism transform of forming.
Conductive via 401 can be used for being electrically connected of conductive winding of different conductive layers, and for example conductive via 401 can be connected the first three-dimensional conductive winding etc. with the 3rd three-dimensional conductive winding.
Printed circuit board (PCB) 100, magnetic core 201 and 202, conductive winding and semiconductor conversion unit 301 cooperate realizes that energy is from inputing to the conversion of output.
Referring to Fig. 8～11, Fig. 8～9 are the floor map of L2 midplane conductive layer correspondence under the another kind of annexation, and Figure 10～11 are the floor map of L3 midplane conductive layer correspondence under the another kind of annexation.
Wherein, than Fig. 6～7, also comprise sidewall conductive winding 108 in Fig. 8～10, sidewall conductive winding 108 and conductive via 401 1 are used from being electrically connected of conductive winding of different conductive layers, as the first three-dimensional conductive winding is connected with the 3rd three-dimensional conductive winding; Sidewall conduction connection 108 also can be used as wherein a section of sidewall conductive winding 107, realizes the winding function simultaneously and is electrically connected function (Fig. 8 and shown in Figure 10).
Shown in Fig. 8～9, the conductive winding 103 and 104 of conductive layer L2, can link to each other (serial or parallel connection) with the sidewall conductive winding 102,105 of different magnetic core grooves respectively, shown in Figure 10～11, the conductive winding 106 on the conductive layer L3 can be connected (serial or parallel connection) with sidewall conductive winding 107.Conductive via 401 and sidewall conduction is connected 108 being electrically connected for the conductive winding of different conductive layers; Sidewall conduction connection 108 can be used as the part of sidewall conductive winding.
Conductive winding 103,104 and 106, and sidewall conductive winding 102,105 and 107 etc., the common conductive winding that cooperates magnetic core 202 to realize electromagnetism transforms of forming;
Printed circuit board (PCB) 100, magnetic core 201 and 202, conductive winding and semiconductor conversion unit 301 cooperate realizes that energy is from inputing to the conversion of output.
Therefore, the PCB that considers supply unit in the present embodiment is difficult to reduce conduction impedance by the area that increases the plane conductive layer, therefore on the sidewall of the magnetic core groove of PCB, be provided for cooperating with magnetic core the sidewall conductive winding that realizes electromagnetism transform, to take full advantage of the side of PCB, the expansion conductive winding arranges the space, can reduce the conductive winding quantity that arranges at PCB plane conductive layer relatively, owing to increased the conducting sectional area of PCB relatively, and winding all is positioned at the surface, has reduced the influence of kelvin effect relatively; And then be conducive to reduce relatively the conduction impedance of the conductive winding on the power supply PCB, and it is big to have increased area of dissipation relatively, is conducive to improve the radiating efficiency of supply unit PCB.
And, based on the multiple connected mode of the conductive winding of sidewall conductive winding and plane conductive layer, can satisfy the flexible needs of multiple deployment scenario; Can realize the three-dimensional electric winding of PCB, the equal PCB number of plies realizes more multiturn number and more electric properties, can improve the switch converters power density.
Embodiment three
The embodiment of the invention also provides a kind of PCB winding manufacture method, can comprise: groove milling is carried out in the position that the magnetic core groove of sidewall conductive winding need be set on printed circuit board (PCB), forms the slotted eye that needs plating; Sidewall to this slotted eye is electroplated, and forms the sidewall conductive winding; Wherein, the side surface of this sidewall conductive winding caves in or flushes in the notch edges of this magnetic groove; This sidewall conductive winding is carried out electromagnetism transform for cooperating with the magnetic core that is installed in this magnetic core groove.
If the edge of this magnetic core groove overlaps (namely the in-plane at the magnetic core groove is all standing) fully with this sidewall conductive winding, then electroplate the back and form the magnetic core groove; If the edge of magnetic core groove not exclusively overlaps (namely the in-plane at the magnetic core groove is not exclusively covering) with this sidewall conductive winding, then groove milling is carried out in the non-slotted eye position on the magnetic core trough rim edge on the printed circuit board (PCB), form the magnetic core groove.
Under a kind of application scenarios, the sidewall conductive winding can be conductive winding independently, and namely this sidewall conductive winding is not connected with other conductive winding (other conductive winding herein comprises plane conductive winding, sidewall conductive winding etc.) or be in parallel.Perhaps, can be with conductive winding serial or parallel connection (the concrete serial or parallel connection mode of one or more planes conductive layer of sidewall conductive winding and printed circuit board (PCB), can with above-described embodiment in similar for example), form a circle or multiturn and can cooperate with the magnetic core that is installed in this magnetic core groove and carry out the three-dimensional conductive winding of electromagnetism transform;
Under another kind of application scenarios, can be with the sidewall conductive winding, conductive winding serial or parallel connection with a plane conductive layer of this printed circuit board (PCB), and, wherein one period can cooperating with the magnetic core that is installed in this magnetic core groove of other plane conductive layer that is also connected to this printed circuit board (PCB) of this sidewall conductive winding is carried out the electromagnetism transform conductive winding same potential part of (may comprise plane conductive winding and sidewall conductive winding), realizes that the connected in electrical series of the conductive winding of Different Plane conductive layer connects.
When electroplating, for example can electroplate at the sidewall of same magnetic core groove and form one or more snippets sidewall conductive winding.
Certainly, in the practical application, the connected mode of the conductive winding of each sidewall conductive winding and each plane conductive layer may be the combination of above-mentioned way of example, perhaps, the conductive winding of sidewall conductive winding and each plane conductive layer also can be given unnecessary details by other one or more connected mode combinations herein no longer one by one.
For ease of understanding and implementing, illustrate a kind of work flow that comprises four layers of PCB below;
Referring to Figure 12～13, Figure 12 is a kind of PCB processing schematic perspective view that the embodiment of the invention provides; Figure 13 is a kind of PCB processing plane schematic diagram that the embodiment of the invention provides, and is mainly as follows:
The processing of L2-3 internal layer mainly comprises: open material → interior layer pattern transfer → internal layer etching → oxidation processes;
The outer processing of L1-4 mainly comprises: pressing (L1～4 laminations close, and the PCB main body forms) → boring → groove milling 1 → chemical copper → whole plate plating → outer graphics transfer → graphic plating → (groove milling 2) → outer etching → welding resistance → surface treatment → moulding (can comprise groove milling 2).
Wherein, in the PCB course of processing, for example can form the coat of metal at the magnetic groove sidewall of PCB by the mode of electroplating, etching forms the sidewall conductive winding on this coat of metal again.
The PCB course of processing increases the groove milling operation twice;
Groove milling 1 mainly comprises: do fluting in the PCB zone that forms sidewall conductive winding correspondence and handle, form the slotted eye of the needs plating of sidewall conductive winding correspondence, expose the position that needs are electroplated, the side of exposing the internal layer conductive layer simultaneously can realize being electrically connected after it is electroplated with the sidewall conductive winding; Wherein, if the edge of this magnetic core groove (the magnetic core trough rim is along being non-closed curve or non-closed curve) overlaps (namely the in-plane at the magnetic core groove is all standing) fully with this sidewall conductive winding, then electroplate the back and directly form the magnetic core groove.
Groove milling 2 mainly comprises: if the edge of magnetic core groove (the magnetic core trough rim is along being non-closed curve or non-closed curve) not exclusively overlaps (namely the in-plane at the magnetic core groove is not exclusively covering) with this sidewall conductive winding, then groove milling 2 is carried out in the non-slotted eye position on the magnetic core trough rim edge on the printed circuit board (PCB), the other parts of mill off and non-sidewall conductive winding form the magnetic core groove.
In actual applications, after the graphic plating in the PCB course of processing was finished, the side surface of sidewall conductive winding can cave in or flush the magnetic core groove edge in this PCB, and milling cutter damages this sidewall conductive winding when avoiding groove milling 2.
Therefore the correspondence position that the magnetic core groove of sidewall conductive winding need be set on printed circuit board (PCB) in the present embodiment carries out groove milling, forms the slotted eye that needs plating; Sidewall to this slotted eye is electroplated, and forms the sidewall conductive winding; Be plated to shape sidewall conductive winding by powering at magnetic groove sidewall, can take full advantage of the side of PCB, can reduce the conductive winding quantity that arranges at PCB plane conductive layer so relatively, and owing to expanded conductive winding the space is set, increased the conducting area of PCB relatively, can reduce the conduction impedance of power supply PCB relatively, and it is big to have increased area of dissipation relatively, also is conducive to improve the radiating efficiency of supply unit PCB.
And, based on the multiple connected mode of the conductive winding of sidewall conductive winding and plane conductive layer, can satisfy the flexible needs of multiple deployment scenario; Can realize the three-dimensional electric winding of PCB, the equal PCB number of plies realizes more multiturn number and more electric properties, can improve the switch converters power density.
Need to prove, for aforesaid each method embodiment, for simple description, so it all is expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not subjected to the restriction of described sequence of movement, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in the specification all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, do not have the part that describes in detail among certain embodiment, can be referring to the associated description of other embodiment.
To sum up, the PCB that considers supply unit in the embodiment of the invention is difficult to reduce conduction impedance by the area that increases the plane conductive layer, therefore on the sidewall of the magnetic core groove of PCB, be provided for cooperating with magnetic core the sidewall conductive winding that realizes electromagnetism transform, to take full advantage of the side of PCB, the expansion conductive winding arranges the space, can reduce the conductive winding quantity that arranges at PCB plane conductive layer relatively, owing to increased the conducting sectional area of PCB relatively, and winding all is positioned at the surface, has reduced the influence of kelvin effect relatively; And then be conducive to reduce relatively the conduction impedance of the conductive winding on the power supply PCB, and it is big to have increased area of dissipation relatively, is conducive to improve the radiating efficiency of supply unit PCB.
And, based on the multiple connected mode of sidewall conductive winding and plane conductive winding, can satisfy the flexible needs of multiple deployment scenario; Can realize the three-dimensional electric winding of PCB, the equal PCB number of plies realizes more multiturn number and more electric properties, can improve the switch converters power density.
One of ordinary skill in the art will appreciate that all or part of step in the whole bag of tricks of above-described embodiment is to instruct relevant hardware to finish by program, this program can be stored in the computer-readable recording medium, and storage medium can comprise: read-only memory, random asccess memory, disk or CD etc.
More than supply unit and printed circuit board (PCB) winding manufacture method that the embodiment of the invention is provided be described in detail, use specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, to sum up, this description should not be construed as limitation of the present invention.
Claims (5)
1. a supply unit is characterized in that, comprising:
At least one printed circuit board,
At least one magnetic core,
And at least one group of semiconductor conversion unit;
Wherein, offer on the described printed circuit board (PCB) for the magnetic core groove that described magnetic core is installed; The groove sidewall of at least one magnetic core groove of described printed circuit board (PCB) is provided with for cooperate the sidewall conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove, wherein, described sidewall conductive winding is attached to the part or all of surface of the groove sidewall of described magnetic core groove;
Described semiconductor conversion unit carries out transformation of electrical energy for cooperating with described magnetic core and sidewall conductive winding;
Wherein, described printed circuit board plane conductive layer also is provided with for cooperate the plane conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in described magnetic core groove; The sidewall conductive winding that arranges on the groove sidewall of described magnetic core groove is all standing or part covering, the independent conductive winding of described sidewall conductive winding for not being connected with the plane conductive winding in the direction of this groove sidewall surfaces vertical plane conductive layer;
Perhaps,
The sidewall conductive winding that arranges on the groove sidewall of described magnetic core groove is all standing or part covering in the direction of this groove sidewall surfaces vertical plane conductive layer; Wherein one section the initiating terminal of the initiating terminal of the plane conductive winding of a plane conductive layer of described printed circuit board (PCB) or this plane conductive winding, link to each other with the initiating terminal of described the above sidewall conductive winding of groove sidewall or wherein one section the initiating terminal of this sidewall conductive winding, wherein one section the clearing end of the clearing end of described plane conductive winding or this plane conductive winding, link to each other with the clearing end of this above sidewall conductive winding of groove sidewall or wherein one section the clearing end of this sidewall conductive winding, so that described sidewall conductive winding is in parallel with the plane conductive winding of described plane conductive layer, forms and cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove;
Perhaps,
The sidewall conductive winding that arranges on the groove sidewall of described magnetic core groove is all standing or part covering in the direction of this groove sidewall surfaces vertical plane conductive layer; The initiating terminal of the plane conductive winding of a plurality of planes conductive layer of described printed circuit board (PCB) or wherein one section the initiating terminal of this a plurality of planes conductive winding, link to each other with the initiating terminal of this above sidewall conductive winding of groove sidewall or wherein one section the initiating terminal of this sidewall conductive winding, the clearing end of the plane conductive winding of described a plurality of planes conductive layer or wherein one section the clearing end of this a plurality of planes conductive winding, link to each other with the clearing end of this above sidewall conductive winding of groove sidewall or wherein one section the clearing end of this sidewall conductive winding, so that described sidewall conductive winding is in parallel with the conductive winding of described a plurality of planes conductive layer, forms and cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove;
Perhaps,
The sidewall conductive winding that arranges on the groove sidewall of described magnetic core groove is all standing or part covering in the direction of this groove sidewall surfaces vertical plane conductive layer; Wherein one section initiating terminal or the clearing end of the initiating terminal on the plane conductive winding of one or more planes conductive layer of described printed circuit board (PCB) or clearing end or this plane conductive winding, with on this groove sidewall with described sidewall conductive winding initiating terminal or clearing end or wherein one section initiating terminal or clearing end link to each other, so that described sidewall conductive winding connects with the plane conductive winding of described one or more planes conductive layer, form and cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove;
Perhaps,
The sidewall conductive winding that arranges on the groove sidewall of described magnetic core groove is all standing or part covering in the direction of this groove sidewall surfaces vertical plane conductive layer; Described sidewall conductive winding is connected and is connected in parallel with the plane conductive winding of a plurality of planes conductive layer of described printed circuit board (PCB), forms to cooperate the three-dimensional conductive winding of carrying out electromagnetism transform with the magnetic core that is installed in this magnetic core groove.
2. supply unit according to claim 1 is characterized in that,
The groove sidewall that the sidewall conductive winding is set is the groove sidewall of any one magnetic core groove or its combination of opening on the described printed circuit board (PCB).
3. a printed circuit board (PCB) winding manufacture method is characterized in that, comprising:
Groove milling is carried out in the position that the magnetic core groove of sidewall conductive winding need be set on printed circuit board (PCB), forms the slotted eye that needs plating;
Sidewall to described slotted eye is electroplated, and forms the sidewall conductive winding; Wherein, the side surface of described sidewall conductive winding caves in or flushes in the notch edges of this magnetic core groove; Described sidewall conductive winding is carried out electromagnetism transform for cooperating with the magnetic core that is installed in this magnetic core groove;
If the edge of described magnetic core groove overlaps fully with described sidewall conductive winding, then electroplate the back and form the magnetic core groove; If the edge of magnetic core groove not exclusively overlaps with described sidewall conductive winding, then groove milling is carried out in the non-slotted eye position on the above magnetic core trough rim edge of printed circuit board (PCB), form the magnetic core groove.
4. method according to claim 3 is characterized in that,
With the conductive winding serial or parallel connection of one or more planes conductive layer of described sidewall conductive winding and described printed circuit board (PCB), form a circle or multiturn and can cooperate with the magnetic core that is installed in described magnetic core groove and carry out the three-dimensional conductive winding of electromagnetism transform;
Perhaps,
With described sidewall conductive winding, conductive winding serial or parallel connection with a plane conductive layer of described printed circuit board (PCB), and, wherein one section other plane conductive layer that is also connected to described printed circuit board (PCB) of described sidewall conductive winding can cooperate the same potential part of carrying out the electromagnetism transform conductive winding with the magnetic core that is installed in described magnetic core groove, connect with the connected in electrical series of the conductive winding that realizes the Different Plane conductive layer.
5. according to claim 3 or 4 described methods, it is characterized in that described sidewall to described slotted eye is electroplated, form the sidewall conductive winding, comprising:
Electroplate one or more snippets sidewall conductive winding of formation at the sidewall of same magnetic core groove.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110001121 CN102158051B (en) | 2011-01-05 | 2011-01-05 | Power supply device and manufacturing method of printed circuit board winding |
| PCT/CN2011/078840 WO2012092778A1 (en) | 2011-01-05 | 2011-08-24 | Power device and method for manufacturing printed circuit board winding |
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| CN 201110001121 CN102158051B (en) | 2011-01-05 | 2011-01-05 | Power supply device and manufacturing method of printed circuit board winding |
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| CN102158051B true CN102158051B (en) | 2013-08-28 |
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| CN102158051B (en) * | 2011-01-05 | 2013-08-28 | 华为技术有限公司 | Power supply device and manufacturing method of printed circuit board winding |
| CN102369790B (en) * | 2011-09-14 | 2013-10-02 | 华为技术有限公司 | Printed circuit board and power supply module |
| CN104112576A (en) * | 2014-06-25 | 2014-10-22 | 东莞联宝光电科技有限公司 | Ultra-thin transformer |
| CN104219879A (en) * | 2014-09-05 | 2014-12-17 | 武汉永力睿源科技有限公司 | Electrical connection method of printed circuit boards and products |
| CN107046770A (en) * | 2017-04-13 | 2017-08-15 | 广东风华高新科技股份有限公司 | Core structure and power model |
| GB2572951A (en) * | 2018-04-12 | 2019-10-23 | Icergi Ltd | A method of manufacture of a gate drive circuit and a gate drive circuit |
| CN113518515B (en) * | 2021-03-15 | 2023-09-08 | 江西宇睿电子科技有限公司 | Method for manufacturing broken joint metalized edge and circuit board |
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| US7321283B2 (en) * | 2004-08-19 | 2008-01-22 | Coldwatt, Inc. | Vertical winding structures for planar magnetic switched-mode power converters |
| CN201032609Y (en) * | 2007-01-24 | 2008-03-05 | 千如电机工业股份有限公司 | Highly effective independent type planar transformer |
| CN101651008A (en) * | 2008-05-28 | 2010-02-17 | 弗莱克斯电子有限责任公司 | Inductor element |
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| US6867678B2 (en) * | 2003-01-28 | 2005-03-15 | Entrust Power Co., Ltd. | Transformer structure |
| US6992871B2 (en) * | 2003-08-06 | 2006-01-31 | Micron Technology, Inc. | Microtransformer for system-on-chip power supply |
| CN102158051B (en) * | 2011-01-05 | 2013-08-28 | 华为技术有限公司 | Power supply device and manufacturing method of printed circuit board winding |
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- 2011-01-05 CN CN 201110001121 patent/CN102158051B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7180397B1 (en) * | 2004-02-20 | 2007-02-20 | Tyco Electronics Power Systems, Inc. | Printed wiring board having edge plating interconnects |
| US7321283B2 (en) * | 2004-08-19 | 2008-01-22 | Coldwatt, Inc. | Vertical winding structures for planar magnetic switched-mode power converters |
| CN201032609Y (en) * | 2007-01-24 | 2008-03-05 | 千如电机工业股份有限公司 | Highly effective independent type planar transformer |
| CN101651008A (en) * | 2008-05-28 | 2010-02-17 | 弗莱克斯电子有限责任公司 | Inductor element |
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| CN102158051A (en) | 2011-08-17 |
| WO2012092778A1 (en) | 2012-07-12 |
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