CN102157409A - Bonder - Google Patents
Bonder Download PDFInfo
- Publication number
- CN102157409A CN102157409A CN2011100644325A CN201110064432A CN102157409A CN 102157409 A CN102157409 A CN 102157409A CN 2011100644325 A CN2011100644325 A CN 2011100644325A CN 201110064432 A CN201110064432 A CN 201110064432A CN 102157409 A CN102157409 A CN 102157409A
- Authority
- CN
- China
- Prior art keywords
- motor coil
- damping layer
- bonding machine
- soldering tip
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
The invention relates to a bonder comprising a motor coil, a welding head and a connecting piece which is fixed together with the motor coil and is used for supporting the welding head, wherein a damping layer is arranged on the outer surface of the motor coil. The bonder has the following beneficial effects: the damping layer can rapidly absorb the vibrational energy of the motor coil when the motor coil vibrates, thus preventing squeal.
Description
Technical field
The application relates to a kind of Electronic Packaging instrument, relates in particular to a kind of bonding machine.
Background technology
In semiconductor packaging, use the bonding machine to realize that the lead-in wire of microelectronic element connects usually, the soldering tip of bonding machine is finished lead-in wire and is connected under the driving of motor, with a kind of execution mode is example, during work, cable guide is in soldering tip, the end that methods such as utilization heating earlier will go between is fused into spherical, the motor driven soldering tip presses down a spherical end is welded on the lead terminal of chip electrode face, form first solder joint, soldering tip promotes then, and drives lead-in wire and move to substrate, descend on the terminal of voltage lead wires correspondence to the substrate again, move upward after the heating and break buttock line, just on substrate, form second bonding point.Soldering tip is to be connected on the connector that is fixed together with motor coil, soldering tip makes connector usually produce resonance with motor coil in motion process, the resonance that oscillation intensity is bigger causes uttering long and high-pitched sounds of motor coil easily, the quality that the influence lead-in wire connects, as, cause that first solder joint does not weld, makes the bulbous end distortion or second solder joint of lead-in wire to stick up silk, peel off, and causes the machine power down when serious, cause the damage of spare parts such as soldering tip, influence the ordinary production of product.
In order to eliminate uttering long and high-pitched sounds of resonating and cause, can adopt the method that weakens or eliminate vibration source on the principle, for example change the natural frequency of the working speed or the bonding system of motor, this method need spend bigger development resources, also can consider to install the isolated plant of dynamic absorber and vibration isolation, but the bonding machine itself is used for microelectric technique, the space is limited, especially the space between motor coil and the connector is very little, absorbing or isolation mounting is installed can't be realized at all.
Summary of the invention
Provide hereinafter about brief overview of the present invention, so that basic comprehension about some aspect of the present invention is provided.Should be appreciated that this general introduction is not about exhaustive general introduction of the present invention.It is not that intention is determined key of the present invention or pith, neither be intended to limit scope of the present invention.Its purpose only is to provide some notion with the form of simplifying, with this as the preorder in greater detail of argumentation after a while.
A main purpose of the present invention is to provide a kind of bonding machine of uttering long and high-pitched sounds of preventing.
According to an aspect of the present invention, a kind of bonding machine comprises: motor coil, soldering tip and be fixed together with motor coil and be used to support the connector of soldering tip, the outer surface of motor coil has damping layer.
The present invention is provided with damping layer at the motor coil outer surface, when motor coil produces vibration, but the vibrational energy of damping layer fast Absorption motor coil, cause the mutual friction mutually between motor coil and the damping layer, make the damping layer under tension or compression and vibrational energy is converted to heat energy and be consumed, therefore, can weaken collision of the intensity of vibration and machine that vibration causes and noise, thereby prevent to utter long and high-pitched sounds.
Description of drawings
With reference to below in conjunction with the explanation of accompanying drawing, can understand above and other purpose of the present invention, characteristics and advantage more easily to the embodiment of the invention.Parts in the accompanying drawing are just in order to illustrate principle of the present invention.In the accompanying drawings, same or similar technical characterictic or parts will adopt identical or similar Reference numeral to represent.
Fig. 1 is the structural representation of bonding machine better embodiment of the present invention.
Fig. 2 is the motor coil among Fig. 1 and the structural representation of connector.
Embodiment
Embodiments of the invention are described with reference to the accompanying drawings.Element of describing in an accompanying drawing of the present invention or a kind of execution mode and feature can combine with element and the feature shown in one or more other accompanying drawing or the execution mode.Should be noted that for purpose clearly, omitted the parts that have nothing to do with the present invention, those of ordinary skills are known and the expression and the description of processing in accompanying drawing and the explanation.
Please refer to Fig. 1 and Fig. 2, the better embodiment of bonding machine of the present invention comprise motor coil 10, soldering tip 20, and and motor coil 10 be fixed together and be used to support the connector 30 of soldering tip 20.
The outer surface of motor coil 10 has a damping layer 40.
Alternatively, damping layer 40 is made of damping material.Alternatively, damping layer 40 is made of flexible material.Flexible material can be, for example rubber.
Alternatively, damping layer 40 is that damping material in the outer surface of motor coil 10 spraying can increasing damping forms.
Alternatively, can damping layer be fixed on the outer surface of motor coil 10 by glue.
Alternatively, connector 30 is fixed on the both sides up and down of motor coil 10, and damping layer 40 is fixed on the left and right sides of motor coil 10.
When motor coil 10 produces vibration, but the vibrational energy of damping layer 40 fast Absorption motor coils 10, cause the mutual friction mutually between motor coil 10 and the damping layer 40, make damping layer 40 under tension or compressions and vibrational energy is converted to heat energy and be consumed, therefore, can weaken collision of the intensity of vibration and machine that vibration causes and noise, thereby prevent to utter long and high-pitched sounds.
In equipment of the present invention and method, obviously, after can decomposing, make up and/or decompose, each parts or each step reconfigure.These decomposition and/or reconfigure and to be considered as equivalents of the present invention.The step that also it is pointed out that the above-mentioned series of processes of execution can order following the instructions naturally be carried out in chronological order, but does not need necessarily to carry out according to time sequencing.Some step can walk abreast or carry out independently of one another.Simultaneously, in the above in the description to the specific embodiment of the invention, can in one or more other execution mode, use in identical or similar mode at the feature that a kind of execution mode is described and/or illustrated, combined with the feature in other execution mode, or the feature in alternative other execution mode.
Claims (6)
1. bonding machine comprises: motor coil, soldering tip and be fixed together with described motor coil and be used to support the connector of described soldering tip, it is characterized in that: the outer surface of described motor coil has damping layer.
2. bonding machine as claimed in claim 1 is characterized in that: described damping layer is made of damping material.
3. bonding machine as claimed in claim 2 is characterized in that: described damping layer is to form at the outer surface of described motor coil spraying damping material.
4. bonding machine as claimed in claim 1 is characterized in that: described damping layer is fixed on the outer surface of described motor coil by glue.
5. bonding machine as claimed in claim 1 is characterized in that: described connector is fixed on the upper and lower both sides of described motor coil, and described damping layer is located at the and arranged on left and right sides of described motor coil.
6. bonding machine as claimed in claim 1 is characterized in that: described damping layer is made of flexible material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100644325A CN102157409A (en) | 2011-03-17 | 2011-03-17 | Bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100644325A CN102157409A (en) | 2011-03-17 | 2011-03-17 | Bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102157409A true CN102157409A (en) | 2011-08-17 |
Family
ID=44438808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100644325A Pending CN102157409A (en) | 2011-03-17 | 2011-03-17 | Bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102157409A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102945813A (en) * | 2012-10-25 | 2013-02-27 | 广东工业大学 | Bonding head device applied to full-automatic wire bonding device |
| CN103177980A (en) * | 2013-03-01 | 2013-06-26 | 广东工业大学 | Bonding head device on full-automatic lead bonding equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238754A (en) * | 1997-10-30 | 1999-08-31 | Esec Sa | Method and apparatus for adjusting bonding head of bonder or pick-and-place device |
| CN1773688A (en) * | 2005-10-24 | 2006-05-17 | 中国电子科技集团公司第四十五研究所 | Light high-stiffness XY working platform and bonding head |
| CN1956144A (en) * | 2005-10-14 | 2007-05-02 | 先进科技新加坡有限公司 | Lightweight bondhead assembly |
| JP2008092198A (en) * | 2006-09-29 | 2008-04-17 | Renesas Technology Corp | Rfid label tag, and its manufacturing method |
| CN101445042A (en) * | 2008-10-11 | 2009-06-03 | 比亚迪股份有限公司 | Hybrid vehicle |
| CN101608944A (en) * | 2008-06-19 | 2009-12-23 | 上海前所光电科技有限公司 | A kind of optical fiber vibration sensing head and preparation method thereof |
| CN201393156Y (en) * | 2009-02-19 | 2010-01-27 | 中国电子科技集团公司第四十五研究所 | Linkage head Z-direction motor |
| CN202003969U (en) * | 2011-03-17 | 2011-10-05 | 南通富士通微电子股份有限公司 | Bonder |
-
2011
- 2011-03-17 CN CN2011100644325A patent/CN102157409A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238754A (en) * | 1997-10-30 | 1999-08-31 | Esec Sa | Method and apparatus for adjusting bonding head of bonder or pick-and-place device |
| CN1956144A (en) * | 2005-10-14 | 2007-05-02 | 先进科技新加坡有限公司 | Lightweight bondhead assembly |
| CN1773688A (en) * | 2005-10-24 | 2006-05-17 | 中国电子科技集团公司第四十五研究所 | Light high-stiffness XY working platform and bonding head |
| JP2008092198A (en) * | 2006-09-29 | 2008-04-17 | Renesas Technology Corp | Rfid label tag, and its manufacturing method |
| CN101608944A (en) * | 2008-06-19 | 2009-12-23 | 上海前所光电科技有限公司 | A kind of optical fiber vibration sensing head and preparation method thereof |
| CN101445042A (en) * | 2008-10-11 | 2009-06-03 | 比亚迪股份有限公司 | Hybrid vehicle |
| CN201393156Y (en) * | 2009-02-19 | 2010-01-27 | 中国电子科技集团公司第四十五研究所 | Linkage head Z-direction motor |
| CN202003969U (en) * | 2011-03-17 | 2011-10-05 | 南通富士通微电子股份有限公司 | Bonder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102945813A (en) * | 2012-10-25 | 2013-02-27 | 广东工业大学 | Bonding head device applied to full-automatic wire bonding device |
| CN102945813B (en) * | 2012-10-25 | 2016-12-21 | 广东工业大学 | A kind of bonding joint device on full-automatic lead bonding equipment |
| CN103177980A (en) * | 2013-03-01 | 2013-06-26 | 广东工业大学 | Bonding head device on full-automatic lead bonding equipment |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110817 |