CN102157390A - Machine and method for automatically removing defective semiconductor packages - Google Patents
Machine and method for automatically removing defective semiconductor packages Download PDFInfo
- Publication number
- CN102157390A CN102157390A CN201110027299.6A CN201110027299A CN102157390A CN 102157390 A CN102157390 A CN 102157390A CN 201110027299 A CN201110027299 A CN 201110027299A CN 102157390 A CN102157390 A CN 102157390A
- Authority
- CN
- China
- Prior art keywords
- defective products
- semiconductor packages
- conductive wire
- wire frame
- frame strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a machine and a method for automatically removing a defective semiconductor package product, wherein the machine captures a surface defective product mark of the defective semiconductor package product or a code on a frame of a lead frame strip through an image capturing device, and transmits an image back to a control host machine to obtain the relative position of the defective semiconductor package product on the lead frame strip, and the control host machine then sends a control signal to control a stamping die to actuate to cut off the defective semiconductor package product so that only the defective semiconductor package product is left on the lead frame strip, thereby relatively reducing the man-machine ratio required by single appearance visual detection operation and improving the overall equipment efficiency.
Description
Technical field
The invention relates to a kind of board and method of automatic removal semiconductor packages defective products, particularly relevant for a kind of board and method of before the semiconductor package product moulding separates, removing the semiconductor packages defective products in advance automatically.
Background technology
Now, the semiconductor packages industry is in order to satisfy the demand of various high-density packages, develop the package design that various different types gradually, wherein Chang Yong encapsulating carrier plate (carrier) comprises base plate for packaging (substrate) with multilayer printed circuit and the lead frame (leadframe) that is formed by metallic plate punching press or etching.
In using the existing semiconductor packaging process of lead frame as encapsulating carrier plate, it mainly comprises following step: at first prepare a conductive wire frame strip (leadframe strip), it has several lead frame unit and a frame; Then be fixed on the chip bearing of each lead frame unit several chips are corresponding respectively; Utilize routing (wire bonding) technology to use lead to electrically connect the weld pad on the active surface of chip and the corresponding pin of each lead frame unit; Coat protection chip and lead by sealing (molding) technology with packing colloid, and on the position of each lead frame unit, form the semiconductor encapsulating products respectively; Each semiconductor package product is carried out outward appearance visual detection (visual inspection) and electrical functionality test (function test); Utilize moulding/separation (forming/singulation) technology that pin is bent into reservation shape, and will cut down on the frame of semiconductor package product by conductive wire frame strip, thereby become separately independently single semiconductor package product; Single semiconductor package product is installed in hollow plastic cement pipe (tube) or the carrier (tray); At last more single semiconductor package product in plastic cement pipe or the carrier is carried out the outward appearance visual detection one time.
Yet the existing semiconductor packaging process of above-mentioned lead frame type still has following problems in the practical operation: behind sealing adhesive process, inevitably will produce a spot of semiconductor packages defective products.Because the cutting machine that existing moulding/separating technology uses also can't automatic screening be removed the semiconductor packages defective products during cutting.Therefore, if these semiconductor packages defective productss fail to be removed before moulding/separating technology, then when semiconductor package product all is cut into separately independently single form, these single semiconductor packages defective products will be mingled in single a large amount of semiconductor packages non-defective units, and in the plastic cement pipe of being packed into one by one.Therefore, not only significantly increase operating personnel single semiconductor package product is carried out the burden of outward appearance visual detection and consuming time, and when in finding the plastic cement pipe, the semiconductor packages defective products being arranged, also must manually all single semiconductor package products in the same plastic cement pipe be poured out, the screening of semiconductor packages defective products is removed, again the semiconductor packages non-defective unit is reinstalled in the plastic cement pipe.This measure will be unfavorable for reducing the man-machine than (ratio of personnel and board collocation operation) and raising integral device efficient of single outward appearance visual detection, simultaneously also easily in manually pouring out pipe during product accident cause the semiconductor packages non-defective unit because of dropping or collide defectives such as causing clubfoot, so the utmost point is unfavorable for improving production efficiency and the yields that has semiconductor packaging process now and reduces its production required manpower and time.
Die, be necessary to provide a kind of board and method of automatic removal semiconductor packages defective products, to solve the existing in prior technology problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of board and method of automatic removal semiconductor packages defective products, wherein said board is by the surperficial defective products mark of image capture unit acquisition semiconductor packages defective products or the code on the frame of conductive wire frame strip, and with image post-back to a main control system, to obtain the relative position of semiconductor packages defective products on conductive wire frame strip, described main control system then sends control signal and controls a diel start, with excision semiconductor packages defective products, make and only retain the semiconductor packages non-defective unit on the conductive wire frame strip, therefore follow-up when carrying out moulding separating technology and single outward appearance visual detection operation, can effectively avoid because of defective products and the non-defective unit detection burden that causes mixed in together and consuming time, when improve integral device efficient so can reduce required man-machine of single outward appearance visual detection operation relatively, and then guarantee production efficiency and the yields of semiconductor packaging process and reduce its production required manpower and time.
For reaching aforementioned purpose of the present invention, the invention provides a kind of board of automatic removal semiconductor packages defective products, the board of wherein said automatic removal semiconductor packages defective products is in order to anticipate a conductive wire frame strip before a moulding/separation board, the board of wherein said automatic removal semiconductor packages defective products comprises: a feed module, supply described conductive wire frame strip, it comprises several semiconductor package products, comprises at least one semiconductor packages defective products in described several semiconductor package products; At least one image capture unit captures the image of the semiconductor package product on the described conductive wire frame strip; One main control system receives the image of described image capture unit passback, and sends a control signal according to described image result and (for example judge whether that according to described image result the image of described conductive wire frame strip has described semiconductor packages defective products; If then send a control signal); One punching module, be subjected to described control signal control and comprise a conveyer belt and at least one diel, described conveyer belt is carried described conductive wire frame strip, and the semiconductor packages defective products that makes described conductive wire frame strip arrive described diel below the time suspend and move, described semiconductor packages defective products is excised in described diel punching press; And a discharging module, the described conductive wire frame strip of described semiconductor packages defective products has been excised in output.
In one embodiment of this invention, described image capture unit selects to be positioned at the top of described feed module and/or punching module.
In one embodiment of this invention, described semiconductor packages defective products has a surperficial defective products mark.
In one embodiment of this invention, comprise one single testing electrical property board in addition after described moulding/separation board, to test described single semiconductor package product.
In one embodiment of this invention, have at least one code (as two-dimensional bar) on the frame of described conductive wire frame strip, it represents the relative two-dimensional position of each described semiconductor packages defective products on described conductive wire frame strip.
In one embodiment of this invention, comprise a strip testing electrical property board before described moulding/separation board in addition and test semiconductor package product on the described conductive wire frame strip.
In one embodiment of this invention, described punching module comprises several described diels of independent start separately, what wherein said several diels misplaced each other alternately arranges, and described several diels are distinguished on the corresponding described conductive wire frame strip with several the described semiconductor package products in the delegation.
In one embodiment of this invention, described semiconductor package product is little outline packages (smalloutline package, SOP) a type encapsulating products.
Moreover, the present invention provides a kind of method of automatic removal semiconductor packages defective products in addition, wherein said method is to use a board of removing the semiconductor packages defective products automatically to anticipate a conductive wire frame strip before a moulding/separation board, the board of described automatic removal semiconductor packages defective products comprises a feed module, one punching module, one discharging module, an at least one image capture unit and a main control system, wherein said method comprises following step: supply described conductive wire frame strip by described feed module, it comprises several semiconductor package products, comprises at least one semiconductor packages defective products in described several semiconductor package products; Capture the image of the semiconductor package product on the described conductive wire frame strip by described image capture unit; Utilize described main control system to receive the image of described image capture unit passback, and send a control signal according to described image result and (for example judge whether that according to described image result the image of described conductive wire frame strip has described semiconductor packages defective products; If then send a control signal); Control described punching module by described control signal, it comprises a conveyer belt and at least one diel, described conveyer belt is carried described conductive wire frame strip, and the semiconductor packages defective products that makes described conductive wire frame strip arrive described diel below the time suspend and move, excise described semiconductor packages defective products to utilize described diel punching press; Excised the described conductive wire frame strip of described semiconductor packages defective products by described discharging module output; And utilize described moulding/separation board that remaining semiconductor package product on the described conductive wire frame strip is carried out one moulding/separating technology, to obtain several single semiconductor package product.
In one embodiment of this invention, before supplying described conductive wire frame strip by described feed module, other comprises: by a sealing board described conductive wire frame strip is carried out a sealing operation, to manufacture described semiconductor package product, wherein after finishing described sealing operation, on the surface of each described semiconductor packages defective products, indicate a surperficial defective products mark in addition.
In one embodiment of this invention, before after described sealing operation and by described feed module, supplying described conductive wire frame strip, other comprises: the semiconductor package product on the described conductive wire frame strip is carried out a strip outward appearance visual detection operation, whether include described semiconductor packages defective products to detect.
In one embodiment of this invention, after finishing described moulding/separating technology, other comprises: described single semiconductor package product is carried out the operation of one single outward appearance visual detection, whether still include described semiconductor packages defective products to detect.
In one embodiment of this invention, after the operation of described single outward appearance visual detection, other comprises: utilize one single testing electrical property board to test described single semiconductor package product.
In one embodiment of this invention, after indicating described surperficial defective products mark, other comprises: utilize a laser aid at the frame subscript of described conductive wire frame strip generation sign indicating number (as two-dimensional bar) at least to be shown, it represents the relative position of each described semiconductor packages defective products on described conductive wire frame strip.
In one embodiment of this invention, before after indicating described code and by described feed module, supplying described conductive wire frame strip, other comprises: the semiconductor package product on the described conductive wire frame strip is carried out a strip outward appearance visual detection operation, whether include described semiconductor packages defective products to detect.
In one embodiment of this invention, supply described conductive wire frame strip after the operation of described strip outward appearance visual detection and by described feed module before, other comprises: utilize a strip testing electrical property board to test semiconductor package product on the described conductive wire frame strip.
In one embodiment of this invention, utilizing after described main control system receives the image of described image capture unit passback, described main control system is integrated the described surperficial defective products mark in the described image mutually with described code, and the data after will integrating are delivered to the server host of a strip testing electrical property board, described strip testing electrical property board is follow-up when carrying out a strip testing electrical property operation, directly skip and omit and do not test described semiconductor packages defective products, only test remaining semiconductor package product.
In one embodiment of this invention, if described main control system judges that the image of described conductive wire frame strip does not have described semiconductor packages defective products, then described main control system sends described control signal and controls the conveyer belt of described punching module and do not suspend and move and continue to carry described conductive wire frame strip to arrive described discharging module.
Description of drawings
Fig. 1 is the front view that first embodiment of the invention is removed the board of semiconductor packages defective products automatically.
Fig. 2 is the top view that first embodiment of the invention is removed the board of semiconductor packages defective products automatically.
Fig. 3 is the schematic diagram that first embodiment of the invention conductive wire frame strip and staking punch carry out contraposition.
Fig. 4 is the local amplification view of the staking punch of first embodiment of the invention board.
Fig. 5 is that method that first embodiment of the invention is removed the semiconductor packages defective products automatically is applied to the process block diagram in the packaging operation of single testing electrical property (unit test).
Fig. 6 is that method that second embodiment of the invention is removed the semiconductor packages defective products automatically is applied to the process block diagram in the packaging operation of strip testing electrical property (strip test).
Embodiment
Below the explanation of each embodiment be with reference to additional graphic, can be in order to illustration the present invention in order to the specific embodiment of implementing.Moreover, the direction term that the present invention mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side ", " interior ", " outward " or " side " etc., only be direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to restriction the present invention.
Please refer to shown in Fig. 1,2 and 3, its board 10 of removing the semiconductor packages defective products automatically that discloses first embodiment of the invention mainly comprises: a feed module 11, a punching module 12, a discharging module 13, at least one image capture unit 14 and a main control system 15, wherein said main control system 15 electrically connects described at least one image capture (image capturing) device 14 in addition, to receive the image of described at least one image capture unit 14 passbacks; And described main control system 15 sends a control signal according to the image result of passback, and by a programmable controller (programmable logic controller, PLC does not illustrate) electric connection utilize described control signal to control the operation of described feed module 11, punching module 12 and discharging module 13.The board 10 of described automatic removal semiconductor packages defective products is mainly used in processing one conductive wire frame strip 20, so that the semiconductor packages defective products in several semiconductor package products 21 on the described conductive wire frame strip 20 22 is removed automatically, wherein said semiconductor package product 21 is meant little outline packages (small outline package, SOP) type encapsulating products especially.
In more detail, please refer to shown in Fig. 1,2 and 3, the feed module 11 of first embodiment of the invention can be subjected to described control signal control and have a feed casket 111, and described feed casket 111 can pile up several conductive wire frame strips 20 that sealing operation and the operation of strip outward appearance visual detection have been finished in placement.The feed casket 111 of described feed module 11 can promptly upwards promote described conductive wire frame strip 20 every one period scheduled time, and described punching module 12 is imported and be supplied to a described conductive wire frame strip 20 at every turn.As shown in Figure 3, each described conductive wire frame strip 20 respectively comprises several semiconductor package products 21, and may comprise at least one semiconductor packages defective products 22 in described several semiconductor package products 21.
Please refer to shown in Fig. 1,2,3 and 4, the punching module 12 of first embodiment of the invention is assembled in the downstream of described feed module 11, described punching module 12 can be subjected to the control of described control signal and comprise a conveyer belt 121 and a diel group 122, and wherein said diel group 122 also has the diel 123 of several separate starts.Described punching module 12 also utilizes a servomotor (servomotor) 124 to drive described conveyer belt 121 runnings by a ball screw (ball screw) 125, advances to carry described conductive wire frame strip 20.Described servomotor 124 and ball screw 125 are controlled by described control signal, and make described conveyer belt 121 the semiconductor packages defective products 22 of described conductive wire frame strip 20 arrive described diel groups 122 and diel 123 below the time suspend the action of moving, utilize the diel 123 of appropriate location to come punching press to excise described semiconductor packages defective products 22 with convenient described diel group 122.Shown in Fig. 2 and 3, the quantity of the diel 123 of described diel group 122 for example is set at 8 diels 123 of independent start separately corresponding to a number (8) of the semiconductor package product 21 of described conductive wire frame strip 20 every row.
Moreover described diel 123 is two row (each four) before and after alternately being arranged in of dislocation each other preferably, wherein said several diels 123 respectively on the corresponding described conductive wire frame strip 20 with several the described semiconductor package products 21 in the delegation.Described diel group 122 is the also corresponding hole punching 126 that is provided with a complementation below each described diel 123, so that described semiconductor packages defective products 22 is excised in punching press, and described semiconductor packages defective products 22 is collected into a defective products downwards reclaims in the casket (not illustrating).Misplace the each other advantage of alternately arranging of described diel 123 is not only can to avoid the mechanism of adjacent diel 123 that the problem of assembling space deficiency takes place, and when described conductive wire frame strip 20 has one of each tool in two adjacent lines or above semiconductor packages defective products 22, also can utilize two or above diel 123 punching presses excision two or above semiconductor packages defective products 22 simultaneously, to quicken punching press excision operation.
It should be noted that, if described conductive wire frame strip 20 comprises several non-conterminous semiconductor packages defective productss 22, then described conveyer belt 121 can suspend and moves described conductive wire frame strip 20, makes the 1st 22 pairs of semiconductor packages defective products be positioned at the diel 123 of appropriate location and in addition punching press excision earlier.Then, described conveyer belt 121 can make described conductive wire frame strip 20 move again a segment distance and then suspend mobile so that the 2nd 22 pairs of semiconductor packages defective products is positioned at the diel 123 of appropriate location and in addition punching press excision.After this, again with the identical flowing mode of doing, the 3rd to n semiconductor packages defective products 22 is excised in punching press in regular turn.So, 123 vertical movement mechanism that need the configuration Y direction of the diel of described diel group 122 need not carried out moving horizontally of X-direction; Simultaneously described conveyer belt 121 also only needs the horizontal mobile mechanism of configuration X-direction, and the horizontal cross that need not carry out Z-direction moves or the vertical moving of Y direction, so can simplify the assembled configuration of described diel group 122 and described conveyer belt 121 relatively.
Please refer to shown in Fig. 1,2 and 3, the discharging module 13 of first embodiment of the invention is assembled in the downstream of described punching module 12, described discharging module 13 can be subjected to described control signal control and have a rewinding casket 131, and described rewinding casket 131 can pile up accommodates the described conductive wire frame strip 20 that excises described semiconductor packages defective products 22.After the rewinding casket 131 of described discharging module 1 is collected the conductive wire frame strip 20 of sufficient amount, described conductive wire frame strip 20 can be moved on to next board (for example moulding/separation board) and process.
Please refer to shown in Fig. 1,2 and 3, at least one image capture unit 14 of first embodiment of the invention selects to be positioned at the top of described feed module 11 and/or punching module 12.In the present embodiment, the present invention comprises the top that two image capture units 14 lay respectively at described feed module 11 and punching module 12.Described two image capture units 14 are all in order to capture the surface image of the semiconductor package product 21 on the described conductive wire frame strip 20, the image capture unit 14 of wherein said feed module 11 tops is main in order to capture the surface image of described semiconductor package product 21, for having judged whether to exist any described semiconductor packages defective products 22, its surface mark in advance has a surperficial defective products mark (as shown in Figure 3); In addition, the image capture unit 14 of described punching module 12 tops is main then in order to capture the surface image of described conductive wire frame strip 20, for having at least one code 24 on the frame 23 that judges whether described conductive wire frame strip 20, for example be two-dimensional bar (bar code), described code 24 is represented the relative position of each described semiconductor packages defective products 22 on described conductive wire frame strip 20.
Please refer to shown in Fig. 1,2 and 3, the main control system 15 of first embodiment of the invention for example is personal computer (personal computer), it is in order to receive the image of described image capture unit 14 passbacks, and send a control signal, utilize described control signal to control the operation of described feed module 11, punching module 12 and discharging module 13 with electric connection by a programmable controller (PLC does not illustrate).In one embodiment, when if described punching module 12 tops are provided with described image capture unit 14 with the code 24 on the frame 23 that captures described conductive wire frame strip 20, the described surperficial defective products mark that described main control system 15 also can capture the image capture unit 14 of described feed module 11 tops is integrated mutually with described code 24, and the data after will integrating are delivered to the server host (server does not illustrate) of a strip testing electrical property board.So, described strip testing electrical property board is follow-up when carrying out a strip testing electrical property operation, can directly skip and omit and do not test described semiconductor packages defective products 22, only test remaining semiconductor package product 21 (being the outward appearance preliminary judgement is the non-defective unit person), so that save the testing time and promote testing efficiency.
In addition, in one embodiment, if the surface image that the image capture unit 14 of described feed module 11 tops captures is gone out described conductive wire frame strip 20 by described main control system 15 interpretations and is not had any semiconductor packages defective products 22 (promptly all semiconductor package products 21 are non-defective unit by the outward appearance preliminary judgement all), then described main control system 15 also can send control signal and control the conveyer belt 121 of described punching module 12 and do not suspend and move and continue to carry described conductive wire frame strip 20, till described conductive wire frame strip 20 arrives described discharging module 13.So, can avoid the whole piece outward appearance just to declare being all the described conductive wire frame strip 20 of non-defective unit that the too many unnecessary time of staying is arranged at described punching module 12 places, so that save the testing time and promote testing efficiency.
Please refer to shown in Figure 5ly, it discloses the block schematic diagram of the packaging operation flow process of first embodiment of the invention.Shown in Fig. 1 to 5, the method of the automatic removal semiconductor packages defective products of first embodiment of the invention mainly is to use a board 10 of removing the semiconductor packages defective products automatically to anticipate a conductive wire frame strip 20 before at a moulding/separation board (not illustrating), the board 10 of described automatic removal semiconductor packages defective products comprises a feed module 11, one punching module 12, one discharging module 13, an at least one image capture unit 14 and a main control system 15, wherein said method comprises following step: by the described conductive wire frame strip 20 of described feed module 11 supplies, it comprises several semiconductor package products 21, comprises at least one semiconductor packages defective products 22 in described several semiconductor package products 21; Image by the semiconductor package product 21 on the described conductive wire frame strip 20 of described image capture unit 14 acquisitions; Utilize described main control system 15 to receive the image of described image capture unit 14 passbacks, and send a control signal; Control described punching module 12 by described control signal, it comprises a conveyer belt 121 and at least one diel 123, described conveyer belt 121 is carried described conductive wire frame strip 20, and the semiconductor packages defective products 22 that makes described conductive wire frame strip 20 arrive described diel 123 below the time suspend and move, excise described semiconductor packages defective products 22 to utilize described diel 123 punching presses; Excised the described conductive wire frame strip 20 of described semiconductor packages defective products 22 by described discharging module 13 outputs; And utilize described moulding/separation board that remaining semiconductor package product 21 on the described conductive wire frame strip 20 is carried out one moulding/separating technology, to obtain several single semiconductor package products 21.
In more detail, as shown in Figure 4, in the semiconductor packaging technology, if begin by the step that described conductive wire frame strip 20 is carried out sealing, then first embodiment of the invention is applicable to the packaging operation flow process of single testing electrical property (unittest) pattern, the packaging operation flow process of described single testing electrical property pattern roughly comprises following step in regular turn: a sealing (molding) step (S501), one indicates defective products step (S502), one sealing baking (curing) step (S503), one (marking) step (S504) of impressing, one latitude (dejunk/trim) step (S505) of removing photoresist/go, one pin is electroplated (plating) step (S506), one strip outward appearance visual detection (strip visual inspection) step (S507), one removes defective products step (S508) automatically, one moulding/separation (forming/singulation) step (S509), one single outward appearance visual detection (unit visualinspection) step (S510), one single testing electrical property (unit test) step (S511) and packing (packing) step (S512), wherein the method for the automatic removal semiconductor packages defective products of first embodiment of the invention is the automatic removal defective products step (S508) of indication herein, in the present embodiment, described image capture unit 14 mainly is located at described feed module 11 tops, in order to capture the surface image of described semiconductor package product 21, exist any mark in advance to have the semiconductor packages defective products 22 (as shown in Figure 3) of surperficial defective products mark for judging whether; Described moulding/separation board then is to be used in moulding/separating step (S509).
Further, the present invention is before supplying described conductive wire frame strip 20 by described feed module 11, finish described sealing step (S501) in advance, it comprises: by a sealing board (not illustrating) described conductive wire frame strip 20 is carried out a sealing operation, to manufacture described semiconductor package product 21, wherein said surperficial defective products mark (as shown in Figure 3) is to carry out described sign defective products step (S502) and be indicated in advance on the surface of described semiconductor packages defective products 22 after finishing described sealing operation, and it can finish sign automatically by indicating or utilize machinery manually.Moreover, after described sealing operation and by before the described conductive wire frame strip 20 of described feed module 11 supplies, other comprises described strip outward appearance visual detection step (S507), it comprises: the semiconductor package product on the described conductive wire frame strip 20 21 is carried out a strip outward appearance visual detection operation, whether include described semiconductor packages defective products 22 to detect.Then belong to existing encapsulation technology about step (S503) to (S506), so give detailed description no longer in addition in this.
In addition, finish described moulding/separating step (S509) afterwards, other comprises described single outward appearance visual detection step (S510), it comprises: described single semiconductor package product 21 is carried out the operation of one single outward appearance visual detection, whether still include described semiconductor packages defective products 22 to detect; If have, then artificial screening is removed described semiconductor packages defective products 22.In described single outward appearance visual detection step (S510) afterwards, other comprises described single testing electrical property step (S511), it comprises: utilize described single the semiconductor package product 21 of one single testing electrical property board (not illustrating) test, wherein the testing electrical property project for example is open-short circuit (open short test) or other burn-in tests (burn-in test) etc., but the testing electrical property project is increase and decrease to some extent according to the product estovers, so do not limited in this.At completing steps (S501) to (S511) afterwards, then carry out described packaging step (S512) at last, so that described single semiconductor package product 21 is installed in a hollow plastic cement pipe or the carrier (not illustrating), so that collect, transport and use.
Please refer to shown in Figure 6, the board and the method for the automatic removal semiconductor packages defective products of second embodiment of the invention are same as first embodiment of the invention, and roughly continue to use similar elements title and figure number, but the difference characteristic of first and second embodiment is: the method for the automatic removal semiconductor packages defective products of described first embodiment is applied in the packaging operation flow process of single testing electrical property (unit test) pattern and described image capture unit 14 only is set to capture the surface image of described semiconductor package product 21 above described feed module 11, exists any mark in advance to have the semiconductor packages defective products 22 of surperficial defective products mark for judging whether; In comparison, the method of the automatic removal semiconductor packages defective products of described second embodiment then is to be applied in the packaging operation flow process of strip testing electrical property (strip test) pattern and except described image capture unit 14 is set above described feed module 11, and another is set above described punching module 12 is provided with described image capture unit 14 to capture the image of described conductive wire frame strip 20, whether to have described code 24 on the frame 23 of judging described conductive wire frame strip 20 in addition.
As shown in Figure 6, in the semiconductor packaging technology, if begin by the step that described conductive wire frame strip 20 is carried out sealing, then second embodiment of the invention is applicable to the packaging operation flow process of strip testing electrical property (strip test) pattern, the packaging operation flow process of described strip testing electrical property pattern roughly comprises following step in regular turn: a sealing step (S601), one indicates defective products step (S602), one sealing baking procedure (S603), one back side (bottom marking) step (S604) of impressing, the one latitude step (S605) of removing photoresist/go, one pin plating step (S606), long (isolation) step (S607) of all pin, one laser marker code steps (S608), one strip outward appearance visual detection (strip visual inspection) step (S609), one strip testing electrical property (strip test) step (S610), one front (marking) step (S611) of impressing, one removes defective products step (S612) automatically, one moulding/separating step (S613), an one single outward appearance visual detection step (S614) and a packaging step (S615), wherein the method for the automatic removal semiconductor packages defective products of second embodiment of the invention is the automatic removal defective products step (S612) of indication herein, and described moulding/separation board then is to be used in moulding/separating step (S613).
Further, the present invention is before supplying described conductive wire frame strip 20 by described feed module 11, finish described sealing step (S601) in advance, it comprises: by a sealing board (not illustrating) described conductive wire frame strip 20 is carried out a sealing operation, manufacturing described semiconductor package product 21, wherein said surperficial defective products mark (as shown in Figure 3) is to carry out described sign defective products step (S602) and be indicated in advance on the surface of described semiconductor packages defective products 22 after finishing described sealing operation.After completing steps (S603) to (S606) then belongs to existing encapsulation technology, other comprises the described long step (S607) of pin of cutting, it comprises: the pin of described semiconductor package product 21 position that links to each other with described conductive wire frame strip 20 is cut off, so that the frame 23 of its pin and described conductive wire frame strip 20 does not have electrical connection, but described semiconductor package product 21 still is connected on the described frame 23 by the ribs (tie bar) of its chip bearing.Then, grow step (S607) afterwards at described surperficial defective products mark of sign and the described pin of cutting, other comprises described laser marker code steps (S608), and it comprises: utilize a laser (laser) device to indicate described code 24 on the frame 23 of described conductive wire frame strip 20.
Moreover, after indicating described code 24 and by before the described conductive wire frame strip 20 of described feed module 11 supplies, other comprises described strip outward appearance visual detection step (S609), it comprises: the semiconductor package product on the described conductive wire frame strip 20 21 is carried out a strip outward appearance visual detection operation, whether include described semiconductor packages defective products 22 to detect.Before described strip outward appearance visual detection step (S609) reaches by the described conductive wire frame strip 20 of described feed module 11 supplies afterwards, other comprises described strip testing electrical property step (S610), it comprises: utilize the semiconductor package product 21 on the described conductive wire frame strip 20 of a strip testing electrical property board (not illustrating) test, wherein Ci Shi semiconductor package product 21 is by the described long step (S607) of pin of cutting, so can on same described conductive wire frame strip 20, carry out testing electrical property separately, the testing electrical property project for example is open-short circuit (open short test) or other burn-in tests (burn-in test) etc., but the testing electrical property project is increase and decrease to some extent according to the product estovers, so do not limited in this.
In addition, finish described moulding/separating step (S613) afterwards, other comprises described single outward appearance visual detection step (S614), it comprises: described single semiconductor package product 21 is carried out the operation of one single outward appearance visual detection, whether still include described semiconductor packages defective products 22 to detect; If have, then artificial screening is removed described semiconductor packages defective products 22.At completing steps (S601) to (S614) afterwards, then carry out described packaging step (S615) at last, so that described single semiconductor package product 21 is installed in a hollow plastic cement pipe or the carrier (not illustrating), so that collect, transport and use.
As mentioned above, in practical operation, often be mingled in single semiconductor packages defective products in single a large amount of semiconductor packages non-defective units thereby significantly increase operating personnel carry out outward appearance visual detection and defective products screening to single semiconductor package product burden and problem such as consuming time compared to the existing semiconductor packaging process of existing lead frame type, the board 10 that the present invention of Fig. 1 to 6 removes the semiconductor packages defective products automatically is by the surperficial defective products mark of the described semiconductor packages defective products 22 of described image capture unit 14 acquisitions or the code 24 on the frame 23 of described conductive wire frame strip 20, and with image post-back to described main control system 15, to obtain the relative position of described semiconductor packages defective products 22 on described conductive wire frame strip 20, described main control system 15 then sends described diel 123 starts of control signal control appropriate location, to excise described semiconductor packages defective products 22, make on the described conductive wire frame strip 20 and only retain the semiconductor packages non-defective unit, therefore follow-up when carrying out moulding separating technology and single outward appearance visual detection operation, can effectively avoid because of defective products and the non-defective unit detection burden that causes mixed in together and consuming time, when improve integral device efficient so can reduce required man-machine of single outward appearance visual detection operation relatively, and then guarantee production efficiency and the yields of semiconductor packaging process and reduce its production required manpower and time.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that disclosed embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and the modification and impartial setting of scope is included in the scope of the present invention.
Claims (17)
1. board of automatically removing the semiconductor packages defective products, it is characterized in that: the board of described automatic removal semiconductor packages defective products is in order to anticipate a conductive wire frame strip before a moulding/separation board, the board of wherein said automatic removal semiconductor packages defective products comprises:
One feed module is supplied described conductive wire frame strip, and it comprises several semiconductor package products, comprises at least one semiconductor packages defective products in described several semiconductor package products;
At least one image capture unit captures the image of the semiconductor package product on the described conductive wire frame strip;
One main control system receives the image that described image capture unit returns, and sends a control signal according to described image result;
One punching module, be subjected to described control signal control and comprise a conveyer belt and at least one diel, described conveyer belt is carried described conductive wire frame strip, and the semiconductor packages defective products that makes described conductive wire frame strip arrive described diel below the time suspend and move, described semiconductor packages defective products is excised in described diel punching press; And
One discharging module, the described conductive wire frame strip of described semiconductor packages defective products has been excised in output.
2. the board of automatic removal semiconductor packages defective products as claimed in claim 1 is characterized in that: described image capture unit is positioned at the top of described feed module or punching module.
3. the board of automatic removal semiconductor packages defective products as claimed in claim 1 is characterized in that: described semiconductor packages defective products has a surperficial defective products mark.
4. the board of automatic removal semiconductor packages defective products as claimed in claim 3 is characterized in that: comprise one single testing electrical property board in addition after described moulding/separation board, to test described single semiconductor package product.
5. the board of automatic removal semiconductor packages defective products as claimed in claim 1 is characterized in that: comprise a strip testing electrical property board before described moulding/separation board in addition and test semiconductor package product on the described conductive wire frame strip.
6. the board of automatic removal semiconductor packages defective products as claimed in claim 5, it is characterized in that: have at least one code on the frame of described conductive wire frame strip, it represents the relative two-dimensional position of each described semiconductor packages defective products on described conductive wire frame strip.
7. the board of automatic removal semiconductor packages defective products as claimed in claim 1, it is characterized in that: described punching module comprises several described diels of independent start separately, what wherein said several diels misplaced each other alternately arranges, and described several diels are distinguished on the corresponding described conductive wire frame strip with several the described semiconductor package products in the delegation.
8. the board of automatic removal semiconductor packages defective products as claimed in claim 1 is characterized in that: described semiconductor package product is little outline packages type encapsulating products.
9. method of automatically removing the semiconductor packages defective products, it is characterized in that: described method is to use a board of removing the semiconductor packages defective products automatically to anticipate a conductive wire frame strip before a moulding/separation board, the board of described automatic removal semiconductor packages defective products comprises a feed module, a punching module, a discharging module, at least one image capture unit and a main control system, and wherein said method comprises step:
Supply described conductive wire frame strip by described feed module, it comprises several semiconductor package products, comprises at least one semiconductor packages defective products in described several semiconductor package products;
Capture the image of the semiconductor package product on the described conductive wire frame strip by described image capture unit; Utilize described main control system to receive the image that described image capture unit returns, and send a control signal according to described image result;
Control described punching module by described control signal, it comprises a conveyer belt and at least one diel, described conveyer belt is carried described conductive wire frame strip, and the semiconductor packages defective products that makes described conductive wire frame strip arrive described diel below the time suspend and move, excise described semiconductor packages defective products to utilize described diel punching press;
Excised the described conductive wire frame strip of described semiconductor packages defective products by described discharging module output; And
Utilize described moulding/separation board that remaining semiconductor package product on the described conductive wire frame strip is carried out one moulding/separating technology, to obtain several single semiconductor package product.
10. the method for automatic removal semiconductor packages defective products as claimed in claim 9, it is characterized in that: before supplying described conductive wire frame strip by described feed module, other comprises: by a sealing board described conductive wire frame strip is carried out a sealing operation, to manufacture described semiconductor package product, wherein after finishing described sealing operation, on the surface of each described semiconductor packages defective products, indicate a surperficial defective products mark in addition.
11. the method for automatic removal semiconductor packages defective products as claimed in claim 10, it is characterized in that: before after described sealing operation and by described feed module, supplying described conductive wire frame strip, other comprises: the semiconductor package product on the described conductive wire frame strip is carried out a strip outward appearance visual detection operation, whether include described semiconductor packages defective products to detect.
12. the method for automatic removal semiconductor packages defective products as claimed in claim 9, it is characterized in that: after finishing described moulding/separating technology, other comprises: described single semiconductor package product is carried out the operation of one single outward appearance visual detection, whether still include described semiconductor packages defective products to detect.
13. the method for automatic removal semiconductor packages defective products as claimed in claim 12 is characterized in that: after the operation of described single outward appearance visual detection, other comprises: utilize one single testing electrical property board to test described single semiconductor package product.
14. the method for automatic removal semiconductor packages defective products as claimed in claim 10, it is characterized in that: after indicating described surperficial defective products mark, other comprises: utilize a laser aid at the frame subscript of described conductive wire frame strip at least one code to be shown, it represents the relative two-dimensional position of each described semiconductor packages defective products on described conductive wire frame strip.
15. the method for automatic removal semiconductor packages defective products as claimed in claim 14, it is characterized in that: before after indicating described code and by described feed module, supplying described conductive wire frame strip, other comprises: the semiconductor package product on the described conductive wire frame strip is carried out a strip outward appearance visual detection operation, whether include described semiconductor packages defective products to detect.
16. the method for automatic removal semiconductor packages defective products as claimed in claim 15, it is characterized in that: before supplying described conductive wire frame strip after the operation of described strip outward appearance visual detection and by described feed module, other comprises: utilize a strip testing electrical property board to test semiconductor package product on the described conductive wire frame strip.
17. the method for automatic removal semiconductor packages defective products as claimed in claim 9 is characterized in that: described semiconductor package product is little outline packages type encapsulating products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110027299.6A CN102157390B (en) | 2011-01-25 | 2011-01-25 | Machine and method for automatically removing defective semiconductor packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110027299.6A CN102157390B (en) | 2011-01-25 | 2011-01-25 | Machine and method for automatically removing defective semiconductor packages |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102157390A true CN102157390A (en) | 2011-08-17 |
| CN102157390B CN102157390B (en) | 2013-03-27 |
Family
ID=44438793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110027299.6A Active CN102157390B (en) | 2011-01-25 | 2011-01-25 | Machine and method for automatically removing defective semiconductor packages |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102157390B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700608A (en) * | 2013-12-30 | 2014-04-02 | 日月光半导体（昆山）有限公司 | Method and device for generating unqualified product map of semiconductor package |
| CN113035791A (en) * | 2021-02-05 | 2021-06-25 | 珠海越亚半导体股份有限公司 | Method for recombining packaging substrate unit |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244028A (en) * | 1998-07-31 | 2000-02-09 | 精工爱普生株式会社 | Semiconductor device and manufacture thereof, substrate, electric circuit board and electronic device for manufacturing same |
| US20020050591A1 (en) * | 1999-04-15 | 2002-05-02 | Tandy Patrick W. | Apparatus and method for marking defective sections of laminate substrates |
| JP2003179104A (en) * | 2001-10-05 | 2003-06-27 | Toppan Printing Co Ltd | Double-sided wiring-attached tape carrier and multilayer wiring-attached tape carrier |
| CN1697149A (en) * | 2004-05-12 | 2005-11-16 | 宏连国际科技股份有限公司 | Method for encapsulating IC |
| US20050269713A1 (en) * | 2004-06-05 | 2005-12-08 | Kook-Jin Oh | Apparatus and method for wire bonding and die attaching |
| CN101241869A (en) * | 2007-02-08 | 2008-08-13 | 鸿劲科技股份有限公司 | Chip testing classifier |
| CN201936852U (en) * | 2011-01-25 | 2011-08-17 | 日月光半导体（昆山）有限公司 | Machine capable of automatically removing semiconductor packaging rejects |
-
2011
- 2011-01-25 CN CN201110027299.6A patent/CN102157390B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244028A (en) * | 1998-07-31 | 2000-02-09 | 精工爱普生株式会社 | Semiconductor device and manufacture thereof, substrate, electric circuit board and electronic device for manufacturing same |
| US20020050591A1 (en) * | 1999-04-15 | 2002-05-02 | Tandy Patrick W. | Apparatus and method for marking defective sections of laminate substrates |
| JP2003179104A (en) * | 2001-10-05 | 2003-06-27 | Toppan Printing Co Ltd | Double-sided wiring-attached tape carrier and multilayer wiring-attached tape carrier |
| CN1697149A (en) * | 2004-05-12 | 2005-11-16 | 宏连国际科技股份有限公司 | Method for encapsulating IC |
| US20050269713A1 (en) * | 2004-06-05 | 2005-12-08 | Kook-Jin Oh | Apparatus and method for wire bonding and die attaching |
| CN101241869A (en) * | 2007-02-08 | 2008-08-13 | 鸿劲科技股份有限公司 | Chip testing classifier |
| CN201936852U (en) * | 2011-01-25 | 2011-08-17 | 日月光半导体（昆山）有限公司 | Machine capable of automatically removing semiconductor packaging rejects |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700608A (en) * | 2013-12-30 | 2014-04-02 | 日月光半导体（昆山）有限公司 | Method and device for generating unqualified product map of semiconductor package |
| CN103700608B (en) * | 2013-12-30 | 2016-08-17 | 日月光半导体（昆山）有限公司 | Method and device for generating unqualified product map of semiconductor package |
| CN113035791A (en) * | 2021-02-05 | 2021-06-25 | 珠海越亚半导体股份有限公司 | Method for recombining packaging substrate unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102157390B (en) | 2013-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101483976B (en) | Method for manufacturing flexible substrate and flexible substrate punching device | |
| CN104934405B (en) | Lead frame based on DIP Duo Ji islands and manufacture the method for packaging part with it | |
| CN108519550A (en) | IC wafers test optimization method | |
| CN103713221A (en) | Low-frequency transformer automatic comprehensive test machine based on GROOVY data collecting and analyzing system controlled by PLC | |
| CN103021899A (en) | Semiconductor product detection machine and detection method thereof | |
| JPH08510601A (en) | Method and apparatus for automatically positioning an electronic die within a component package | |
| CN103687467A (en) | Electronic component mounting device | |
| CN201936852U (en) | Machine capable of automatically removing semiconductor packaging rejects | |
| CN102157390B (en) | Machine and method for automatically removing defective semiconductor packages | |
| CN104707915A (en) | Automatic high-security-seal lock cylinder riveting and detecting machine and control method thereof | |
| CN203929909U (en) | Transformer voltage-withstand test mechanism | |
| CN108878306A (en) | A kind of multistation IC fuses trim test macro and its method for repairing and regulating | |
| JP2591464B2 (en) | Die bonding equipment | |
| CN208289402U (en) | Loudspeaker integrated form automatic assembly line | |
| CN211217591U (en) | Automatic detection machine for electronic component cable | |
| CN203225236U (en) | Semiconductor product detection device | |
| JP4398768B2 (en) | Semiconductor resin sealing device and resin sealing method | |
| CN206142367U (en) | Intelligent test braider | |
| CN201848370U (en) | Instantaneous detection control system for glue dispenser | |
| CN204596785U (en) | Based on the lead frame on DIP Duo Ji island | |
| CN208333417U (en) | A kind of stator or rotor die mould detect special plane | |
| CN104838482A (en) | Method and apparatus for the engagement of IC units | |
| CN102064270B (en) | Feedback control method for glue dispenser | |
| TW513795B (en) | Wire bonding method and system for fabricating semiconductor package | |
| CN101315408A (en) | Detection and package equipment of IC chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215341 No. 497, Huangpujiang South Road, Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Riyuexin semiconductor (Kunshan) Co.,Ltd. Address before: 215341 No. 373, Songnan Road, Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: ADVANCED SEMICONDUCTOR ENGINEERING (KUNSHAN) Ltd. |