CN102148170B - Substrate adhesion method - Google Patents
Substrate adhesion method Download PDFInfo
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- CN102148170B CN102148170B CN2011100052125A CN201110005212A CN102148170B CN 102148170 B CN102148170 B CN 102148170B CN 2011100052125 A CN2011100052125 A CN 2011100052125A CN 201110005212 A CN201110005212 A CN 201110005212A CN 102148170 B CN102148170 B CN 102148170B
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- colloid
- sidewall
- substrate
- bonding substrate
- framework
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- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a substrate adhesion method, which is applied to adhesion of two substrates. The substrate adhesion method comprises the following steps of: providing an adhesive-overflowing resistant device, wherein the adhesive-overflowing resistant device comprises a frame body and at least one colloid solidification piece, the frame body is provided with a sidewall which is arranged along a closed track, the sidewall is provided with at least one notch, and the colloid solidification piece is arranged on an outer surface of the sidewall; placing the substrates in the frame body and coating a colloid between the substrates; pressing the substrates; and solidifying the colloid by the at least one colloid solidification piece. In the adhesive-overflowing resistant device, the colloid can be overflowed only from the notch on the sidewall of the frame body, so that the situation of adhesive overflowing can be improved. Moreover, the colloid solidification piece which is arranged on the outer surface of the sidewall can solidify the colloid on edges of the substrates after the substrates are pressed, so that the situation of adhesive overflowing after the substrates are taken out can be prevented. Furthermore, the adhesive-overflowing resistant device is used in the substrate adhesion method, so that the situation of the adhesive overflowing can be improved.
Description
The present invention be directed to female case (application number: 200910211893.3, denomination of invention: the anti-overflow adhesive dispenser and use the method for bonding substrate of this anti-overflow adhesive dispenser) dividing an application of being proposed.
Technical field
The present invention relates to a kind of anti-overflow adhesive dispenser, and relate in particular to a kind of anti-overflow adhesive dispenser of baseplate-laminating technology and method for bonding substrate that uses this anti-overflow adhesive dispenser of being used for.
Background technology
In recent years, along with the progress of plane Display Technique, add that flat-panel screens has advantages such as in light weight, thin thickness and power saving, flat-panel screens has replaced traditional cathode ray tube (cathode ray tube, CRT) display gradually.At present common flat-panel screens comprise LCD (liquid crystal display, LCD), plasma display (plasma display panel, PDP), electrophoretic display device (EPD) (electrophoretic display, EPD) etc.Can be covered with substrate on the display floater of these flat-panel screens, and substrate can be baffle or the optical sheet of three-dimensional display function can be provided, like column type lens plate (lenticular lens plate) etc.
Fig. 1 is the sketch map that produces the glue that overflows when carrying out the baseplate-laminating processing procedure in the prior art.Please, in the prior art, when desire fits in display floater 60 with substrate 50, normally on display floater 60, be coated with colloid 70 earlier, then substrate 50 repeatedly placed on the display floater 60 with reference to Fig. 1.Afterwards, apply pressure to substrate 50, with pressing substrate 50 and display floater 60.Then, carry out the colloid curing process, colloid 70 is solidified, so can come adhesive base plate 50 and display floater 60 through colloid 70.
Yet, when applying pressure to substrate 50, because colloid 70 meetings are mobile, so cause the situation that excessive glue takes place of substrate 50 and display floater 60 easily all around.
Summary of the invention
The present invention provides a kind of method for bonding substrate in addition, to improve the situation of the glue that overflows.
For reaching above-mentioned purpose; The present invention proposes a kind of method for bonding substrate, two substrates that are suitable for fitting, and this method for bonding substrate comprises: an anti-overflow adhesive dispenser is provided; This anti-overflow adhesive dispenser comprises that a framework and at least one colloid solidify part; Wherein this framework has a sidewall that is provided with along a sealing track, and this sidewall has at least one breach, and this colloid solidifies the outer surface that part is arranged at this sidewall; Those substrates are positioned in this framework, and are coated with colloid between those substrates; Those substrates of pressing; And through this at least one this colloid of colloid curing part curing.
Wherein, also comprise: take out those substrates after fitting; And carry out the colloid curing process with this colloid of further curing.
Wherein, one of them is connected with a circuit board to those substrates at least, and this circuit board stretches out outside this framework via this breach of this sidewall.
Wherein, this colloid comprises UV glue, heat-curable glue or its combination.
Wherein, the material of this sidewall is a transparent material.
Wherein, the material of this sidewall comprises polymethyl methacrylate, Merlon or its combination.
Wherein, this at least one colloid curing part comprises uviol lamp, heating member or its combination.
Wherein, this heating member comprises infrared lamp.
Wherein, this at least one colloid solidifies part around this sidewall.
Wherein this framework also comprises a bottom, and this sidewall connects this bottom and centers on this bottom.
In anti-overflow adhesive dispenser of the present invention, the sidewall of framework can let colloid only can overflow from the breach of sidewall, so can improve the situation of the glue that overflows.In addition, the colloid curing part that is arranged at the sidewall outer surface can solidify the colloid of substrate edges after the substrate pressing, take out the situation that excessive glue takes place in the back so can prevent substrate.In addition, method for bonding substrate of the present invention is because of using this anti-overflow adhesive dispenser, so can improve the situation of the glue that overflows.
Description of drawings
Fig. 1 is the sketch map that produces the glue that overflows when carrying out baseplate-laminating technology in the prior art;
Fig. 2 is the sketch map of a kind of anti-overflow adhesive dispenser of one embodiment of the invention;
Fig. 3 A to Fig. 3 D illustrates the flow chart of the method for bonding substrate of one embodiment of the invention.
Wherein, Reference numeral:
50,210,220: substrate
60: display floater
70,230: colloid
100: the anti-overflow adhesive dispenser
102: the sealing track
110: framework
112: sidewall
113: breach
114: outer surface
116: the bottom
120: colloid solidifies part
212,222: circuit board
Embodiment
Fig. 2 is the sketch map of a kind of anti-overflow adhesive dispenser of one embodiment of the invention.Please with reference to Fig. 2, the anti-overflow adhesive dispenser 100 of present embodiment comprises that framework 110 and at least one colloid solidify part 120, and is that to solidify parts 120 with a plurality of colloids be example in the present embodiment.Framework 110 has the sidewall 112 that is provided with along sealing track 102, and in the present embodiment, sealing track 102 for example is the rectangular closed track.In addition, sidewall 112 has at least one breach 113, and is to be example with a breach 113 at present embodiment.In addition, colloid solidifies the outer surface 114 that part 120 is arranged at sidewall 112.
In the above-mentioned anti-overflow adhesive dispenser 100, the material of sidewall 112 for example is a transparent material, like polymethyl methacrylate, Merlon or its combination, but not as limit.The material of sidewall 112 can be selected for use and can easy removal be stained with the material that sticks at the colloid on the sidewall 112, and the material that sidewall 112 is selected for use need let colloid solidify the colloid that part 120 can be positioned at framework 110 across sidewall 112 curing.In addition, sidewall 112 can be made up of the transparent plate body of multi-disc.In addition, framework 110 can also comprise bottom 116, and sidewall 112 connects bottom 116 and center on bottom 116.What need explanation is that in other embodiments, framework 110 can not comprise bottom 116.
Above-mentioned colloid solidifies part 120 and can be uviol lamp, heating member or its combination, and wherein heating member can be infrared lamp, but not as limit.In addition, colloid curing part 120 is the sidewall 112 around framework 110.
Hereinafter will cooperate the graphic method of introducing the baseplate-laminating of one embodiment of the invention.
Fig. 3 A to Fig. 3 D illustrates the flow chart of the method for bonding substrate of one embodiment of the invention.Please earlier with reference to Fig. 3 A, the method for bonding substrate of present embodiment two substrates 210,220 that are suitable for fitting.Two substrates 210,220 of indication can be glass substrate and glass substrate, display floater and baffle, display floater and three-dimensional display function optical sheet (like column type lens plate), display floater and Trackpad or Trackpad and baffle etc. can be provided here, but not as limit.That is to say that the method for bonding substrate of present embodiment does not limit the kind of substrate 210,220.In addition, the method for bonding substrate of present embodiment is to come adhesive substrates 210,220 through colloid 230.Colloid 230 for example is UV glue, heat-curable glue or its combination.In addition, one of them is connected with circuit board to substrate 210,220 at least, and is that to be connected with circuit board 212,222 respectively with substrate 210,220 be example in the present embodiment.
Please with reference to Fig. 3 B, the method for bonding substrate of present embodiment comprises the following steps: at first, and above-mentioned anti-overflow adhesive dispenser 100 is provided.Then, substrate 210,220 is positioned in the framework 110, and substrate 210, is coated with colloid 230 between 220.In more detail, substrate 210,220 is centered on by the sidewall 112 of framework 110, and only has small gap between the sidewall 112 of substrate 210,220 and framework 110, or substrate 210,220 touches the sidewall 112 of framework 110.And the circuit board 212,222 that is connected in substrate 210,220 stretches out outside the framework 110 via the breach 113 of sidewall 112.In addition, in the present embodiment, can earlier substrate 220 be stacked on the substrate 210, afterwards, again the substrate behind the storehouse 210,220 be positioned in the framework 110.Perhaps, earlier substrate 210 is positioned in the framework 110, again substrate 220 is stacked on the substrate 210 afterwards.
Afterwards, shown in Fig. 3 C, pressing substrate 210,220.Particularly, can exert pressure F on substrate 220 through pressing piece, with pressing substrate 210,220.Though pressing substrate 210,220 o'clock can flow at substrate 210, colloid 230 between 220, the sidewall 112 of framework 110 can prevent that colloid 230 from overflowing, so 230 in colloid can overflow from the breach 113 of sidewall 112.So, can prevent the situation that excessive glue takes place of substrate 210,220 all around.
Then, solidify part 120 through colloid and solidify colloid 230.In more detail, when colloid 230 was UV glue, colloid solidified part 120 and can be uviol lamp.When colloid 230 was heat-curable glue, colloid solidified part 120 and can be heating member, like infrared lamp.When the colloid of selecting for use 230 receives ultraviolet irradiation or is heated all can solidify the time, then colloid solidifies part 120 and can comprise uviol lamp and heating member.
Because the method for bonding substrate of present embodiment solidifies part 120 through colloid and solidifies colloid 230,, can not produce the situation of the glue that overflows so take out substrate 210,220 backs (shown in Fig. 3 D) from framework 110.
What need explanation is, because above-mentioned colloid solidifies part 120 can only be positioned at substrate 210,220 edges in order to primary solidification colloid 230, so behind framework 110 taking-up substrates 210,220, can carry out one time the colloid curing process again, with further curing colloid 230.That is to say, the part colloid 230 that is not cured is as yet solidified through this colloid curing process.
In sum, have advantage at least at anti-overflow adhesive dispenser of the present invention and method for bonding substrate:
1. the sidewall of framework can let colloid can around substrate, not overflow, but only overflows from the breach of sidewall, so can improve the situation of excessive glue.
2. after the substrate pressing, the colloid that is arranged at the sidewall outer surface capable of using solidifies part and solidifies the colloid of substrate edges, in framework, takes out the situation that excessive glue takes place in the back so can prevent substrate.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (9)
1. method for bonding substrate, two substrates that are suitable for fitting is characterized in that, this method for bonding substrate comprises:
One anti-overflow adhesive dispenser is provided, and this anti-overflow adhesive dispenser comprises that a framework and at least one colloid solidify part, and wherein this framework has a sidewall that is provided with along a sealing track, and this sidewall has at least one breach, and this colloid solidifies the outer surface that part is arranged at this sidewall;
Those substrates are positioned in this framework, and are coated with colloid between those substrates;
Those substrates of pressing; And
Solidify part through this at least one colloid and solidify this colloid,
Wherein, one of them is connected with a circuit board to those substrates at least, and this circuit board stretches out outside this framework via this breach of this sidewall.
2. according to the described method for bonding substrate of claim 1, it is characterized in that, also comprise:
Take out those substrates after fitting; And
Carry out the colloid curing process with this colloid of further curing.
3. according to the described method for bonding substrate of claim 1, it is characterized in that this colloid comprises UV glue, heat-curable glue or its combination.
4. according to the described method for bonding substrate of claim 1, it is characterized in that the material of this sidewall is a transparent material.
5. according to the described method for bonding substrate of claim 1, it is characterized in that the material of this sidewall comprises polymethyl methacrylate, Merlon or its combination.
6. according to the described method for bonding substrate of claim 1, it is characterized in that this at least one colloid solidifies part and comprises uviol lamp, heating member or its combination.
7. according to the described method for bonding substrate of claim 6, it is characterized in that this heating member comprises infrared lamp.
8. according to the described method for bonding substrate of claim 1, it is characterized in that this at least one colloid solidifies part around this sidewall.
9. according to any described method for bonding substrate in the claim 4 to 8, it is characterized in that this framework also comprises a bottom, this sidewall connects this bottom and centers on this bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100052125A CN102148170B (en) | 2009-11-09 | 2009-11-09 | Substrate adhesion method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100052125A CN102148170B (en) | 2009-11-09 | 2009-11-09 | Substrate adhesion method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102118933A Division CN101702402B (en) | 2009-11-09 | 2009-11-09 | Glue overflow-preventing device and baseplate-laminating method using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102148170A CN102148170A (en) | 2011-08-10 |
| CN102148170B true CN102148170B (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100052125A Active CN102148170B (en) | 2009-11-09 | 2009-11-09 | Substrate adhesion method |
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| CN (1) | CN102148170B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103294241B (en) * | 2012-03-05 | 2016-04-06 | 冠伟科技股份有限公司 | The method of baseplate-laminating |
| TWI671921B (en) * | 2018-09-14 | 2019-09-11 | 頎邦科技股份有限公司 | Chip package and chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1149196A (en) * | 1995-04-24 | 1997-05-07 | 松下电子工业株式会社 | Image displaying device and manufacturing method thereof |
| US6004413A (en) * | 1995-12-19 | 1999-12-21 | Couttenier; Andre | Method for making a laminate and device for the application of this method |
| CN1929726A (en) * | 2005-09-05 | 2007-03-14 | 碟王科技开发股份有限公司 | Projector glass inlay plate fixing device |
| CN101478305A (en) * | 2009-01-08 | 2009-07-08 | 深圳市中显微电子有限公司 | Capacitance touch screen and manufacturing process thereof |
-
2009
- 2009-11-09 CN CN2011100052125A patent/CN102148170B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1149196A (en) * | 1995-04-24 | 1997-05-07 | 松下电子工业株式会社 | Image displaying device and manufacturing method thereof |
| US6004413A (en) * | 1995-12-19 | 1999-12-21 | Couttenier; Andre | Method for making a laminate and device for the application of this method |
| CN1929726A (en) * | 2005-09-05 | 2007-03-14 | 碟王科技开发股份有限公司 | Projector glass inlay plate fixing device |
| CN101478305A (en) * | 2009-01-08 | 2009-07-08 | 深圳市中显微电子有限公司 | Capacitance touch screen and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102148170A (en) | 2011-08-10 |
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