CN102136523B - Encapsulation method for eyeball infrared receiver, special die and manufactured product - Google Patents
Encapsulation method for eyeball infrared receiver, special die and manufactured product Download PDFInfo
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- CN102136523B CN102136523B CN201010600936XA CN201010600936A CN102136523B CN 102136523 B CN102136523 B CN 102136523B CN 201010600936X A CN201010600936X A CN 201010600936XA CN 201010600936 A CN201010600936 A CN 201010600936A CN 102136523 B CN102136523 B CN 102136523B
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- die cavity
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- sensitive chip
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- eyeball type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses an encapsulation method for an eyeball infrared receiver, which is characterized by comprising the following steps of: manufacturing a die with a large die cavity; manufacturing a die with a small die cavity; combining large and small die cavities; inserting a sensitive chip support; encapsulating; baking; demoulding; and clearing. In the new encapsulation method for the eyeball infrared receiver, the investment cost of encapsulation tools and equipment are reduced greatly by replacing the conventional encapsulation method with the encapsulation method of combining the die with the large die cavity and the die with the small die cavity, and a die set with the large die cavity and a die set with the small die cavity have small volume, are convenient to assemble and disassemble and have small abrasion compared with the conventional die jacking machine, so the die set with the large die cavity and the die set with the small die cavity can be used circularly for multiple times and are convenient to store. In addition, liquid epoxy resin is used as an encapsulation material instead of expensive solid epoxy resin, so that the cost of the material is reduced; therefore, the method and the die have popularization and application prospects.
Description
Technical field
The present invention relates to the method field of manufacturing of intellectual technology field, particularly relate to the method for packing of eyeball type infrared remote receiver with device.
Background technology
Development and continuous progress in science and technology along with economic society; Function and performance requirement to household electrical appliances on the market are also increasingly high; The telecontrol engineering that relates to intelligent field is wherein one; Remote control is through the break-make of integrated circuit control infrared transmitting tube, launches a group coding with the form of high-low level, then by infrared receiving group IRM received code, decode and send control command and wait and finish the work.
All the time; The IRM that uses on the market encapsulates with eyeball type form mostly; And generally be to adopt mould top machine heating solid epoxy resin to make it softening, and pressurization squeezes into the mode of solidifying then in the mould and encapsulate, but the input of mould top machine is bigger; And the solid epoxy resin of encapsulation usefulness is generally by Taiwan or Japanese enterprises production, and price is higher; In addition, because of the problem of mold design, cause the utilance of solid epoxy resin not high; Waste is serious; This just makes that whole cost is difficult to descend, though some other mode has been proposed again in recent years, for example with the alternative traditional approach of bridge of the nose type packaged type; But product performance index in application are difficult to reach requirement, have replaced not the encapsulation of eyeball type.
Because the weak point of the above eyeball type infrared remote receiver method for packing is necessary it is made improvement.
Summary of the invention
To the problems referred to above, the invention provides the new method for packing of eyeball type infrared remote receiver.
The technical scheme that the present invention is adopted for its technical problem of solution is:
The method for packing of eyeball type infrared remote receiver is characterized in that may further comprise the steps:
Step 1, prepare mould: prepare big die cavity and little die cavity, wherein the die cavity body of big die cavity is provided with the inner chamber that width differs, and this inner chamber can hold little die cavity, and this little die cavity is provided with the concave surface of an eyeball type;
Step 4, sensitive chip support are inserted: an end that the sensitive chip support is provided with sensitive chip inserts in the infrared remote receiver eyeball type shell, and makes the concave surface of sensitive chip over against little die cavity;
Step 6 leaves mould: extract the sensitive chip support out, take little die cavity simultaneously out of;
Step 7, cleaning: the residue that produces in the cleaning above-mentioned steps, be reapposed over little die cavity in the big die cavity afterwards, repeat operation next time.
Said step 1 also comprises:
Step 1.1, make big die cavity: prepare a strip-shaped bracket, big die cavity body is placed in order boring on support then in each hole;
Step 1.2, make little die cavity: make the little die cavity that can hold in the chamber into according to the inner cavity size of big die cavity body, said little die cavity is provided with the concave surface of an eyeball type.
Be used for the mould of eyeball type infrared remote receiver encapsulation, comprise big die cavity and little die cavity, it is characterized in that:
Big die cavity comprises support, and said support lower surface is provided with and clamps the position, and support is provided with tactic hole, is provided with big die cavity body in the said hole, and said big die cavity body is provided with the inner chamber that width differs.
Said support is a silicon steel sheet.
Little die cavity comprises little die cavity body, and said little die cavity body one end is provided with handle, and little die cavity body surface is provided with the recess of an eyeball type.
Further, said little die cavity body is used with big die cavity body, and said big die cavity inner body wall is stepped, and little die cavity body is limited in the narrow inner chamber of big die cavity body, form jointly one possess eyeball type shape cavity.
Eyeball type infrared remote receiver module according to the said method manufacturing; It is characterized in that comprising: sensitive chip support, infrared sensitive chip and eyeball type shell; Said sensitive chip support is provided with lead frame; Said infrared sensitive chip is installed in this lead frame, and said lead frame is coated in the eyeball type shell.
Further, said sensitive chip support comprise lead frame, laterally reinforcement and with the vertically disposed pin of said horizontal reinforcement, said lead frame is located at an end of pin, and said lead frame, laterally reinforcement and the integrated molding structure of pin.
In addition, said eyeball type shell comprises rectangle housing and hemispherical shell, and said hemispherical shell is located on the rectangle housing, and both seamlessly transit the plastic packaging shell of being combined as a whole.
The invention has the beneficial effects as follows: the present invention is as the new method for packing of eyeball type infrared remote receiver; On the one hand; The present invention has abandoned packaged type and the bridge of the nose type packaged type that traditional use mould top machine presses solidly attitude epoxy resin; Replace the method for packing that big die cavity and little die cavity combine, make that expense reduces greatly on the cost input of encapsulation tool and equipment; On the other hand, because big die cavity module and the volume of little die cavity module own is little, the assembling partition is convenient is little compared to traditional mould top machine wearing and tearing, therefore can repeatedly recycles and deposit conveniently; In addition, encapsulating material adopts liquid-state epoxy resin to replace expensive solid epoxy resin, makes material cost also decrease.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is described further:
Fig. 1 is a method for packing schematic flow sheet of the present invention;
Fig. 2 is the big die cavity module of a present invention plan structure sketch map;
Fig. 3 is the big die cavity module of a present invention side-looking structural representation;
Fig. 4 is the big die cavity body construction of a present invention sketch map;
Fig. 5 is the little die cavity body construction of a present invention sketch map;
Fig. 6 is big die cavity body of the present invention and little die cavity body combining structure sketch map;
Fig. 7 is an eyeball type shell mechanism sketch map of the present invention;
Fig. 8 is an eyeball type infrared remote receiver monomer structure sketch map of the present invention;
Fig. 9 is in the eyeball type infrared remote receiver overall structure sketch map of half encapsulation state for the present invention.
Embodiment
With reference to Fig. 1, the method for packing of eyeball type infrared remote receiver is characterized in that may further comprise the steps:
Step 1, prepare mould: prepare big die cavity and little die cavity, wherein the die cavity body of big die cavity is provided with the inner chamber that width differs, and this inner chamber can hold little die cavity, and this little die cavity is provided with the concave surface of an eyeball type;
Step 4, sensitive chip support are inserted: an end that the sensitive chip support is provided with sensitive chip inserts in the infrared remote receiver eyeball type shell, and makes the concave surface of sensitive chip over against little die cavity;
Step 6 leaves mould: extract the sensitive chip support out, take little die cavity simultaneously out of;
Step 7, cleaning: the residue that produces in the cleaning above-mentioned steps, be reapposed over little die cavity in the big die cavity afterwards, repeat operation next time.
Like Fig. 2-shown in Figure 5, be used for the mould of eyeball type infrared remote receiver encapsulation, comprise big die cavity and little die cavity; Said big die cavity; Comprise support 1, said support 1 lower surface is provided with and clamps position 11, and support 1 is provided with tactic hole; Be provided with big die cavity body 2 in the said hole, said big die cavity body 2 is provided with the inner chamber that width differs; Said little die cavity comprises little die cavity body 3, and said little die cavity body 3 one ends are provided with handle 31, and little die cavity body 3 surfaces are provided with the recess 32 of an eyeball type.
With reference to Fig. 6; Said little die cavity body 3 is used with big die cavity body 2, and said big die cavity body 2 inwalls are stepped, and little die cavity body 3 is limited in the dark one-level of big die cavity body 2 inwall ladders; Common formation one possesses the cavity of eyeball type shape; Again sensitive chip support 4 is inserted these cavitys after cavity forms, and make the eyeball type recess 32 of position on the little die cavity body 3 of sensitive chip, the injection ring epoxy resins encapsulates in the cavity at last.
With reference to Fig. 7-Fig. 9; Eyeball type infrared remote receiver monomer according to the said method manufacturing; It comprises and the vertically disposed pin of horizontal reinforcement 42 43, infrared sensitive chip and eyeball type shell 5 that an end of said pin 43 is provided with lead frame 41, and said infrared sensitive chip is installed in this lead frame 41; Said lead frame 41 is coated in the eyeball type shell 5, and said eyeball type infrared remote receiver monomer sequence is arranged in horizontal reinforcement 42 tops and constitutes eyeball type infrared remote receiver module.
Said sensitive chip support 4 comprise lead frame 41, laterally reinforcement 42 and with said horizontal reinforcement 42 vertically disposed pins 43; Said lead frame 41 is located at an end of pin 43, and said lead frame 41, horizontal reinforcement 42 and pin 43 integrated molding structures.
Said eyeball type shell 5 comprises rectangle housing 51 and hemispherical shell 52, and said hemispherical shell 52 is located on the rectangle housing 51, and both seamlessly transit the plastic packaging shell of being combined as a whole.
Like Fig. 1-shown in Figure 9; The present invention is on the basis of big die cavity module and the combination of little die cavity module, injects encapsulating material through cavity and forms, after program is accomplished; Can carry out repetitive process next time after extracting final products out and taking little die cavity out of, so operating process is convenient and simple.
More than preferable enforcement of the present invention is specified; Certainly; The present invention can also adopt the form different with above-mentioned execution mode; These do not constitute any restriction to this execution mode, and those of ordinary skill in the art should belong in protection scope of the present invention conversion of under the prerequisite of spirit of the present invention, being done that is equal to or corresponding the change.
Claims (5)
1. the method for packing of an eyeball type infrared remote receiver is characterized in that may further comprise the steps:
Step 1, prepare mould: prepare big die cavity and little die cavity, wherein the die cavity body of big die cavity is provided with the inner chamber that width differs, and this inner chamber can hold little die cavity, and this little die cavity is provided with the concave surface of an eyeball type;
Step 2, the combination of big or small die cavity: little die cavity is placed the inner chamber of big die cavity, fixed by the narrower part of inner chamber, the die cavity that to constitute an inner space be eyeball type cavity makes up;
Step 3, encapsulating: epoxy resin is injected in the cavity after big or small die cavity makes up, form an infrared remote receiver eyeball type shell;
Step 4, sensitive chip support are inserted: an end that the sensitive chip support is provided with sensitive chip inserts in the infrared remote receiver eyeball type shell, and makes the concave surface of sensitive chip over against little die cavity;
Step 5, baking: the product after packaged was toasted 6 ~ 8 hours under 120 ° ~ 130 ° temperature;
Step 6 leaves mould: extract the sensitive chip support out, take little die cavity simultaneously out of;
Step 7, cleaning: the residue that produces in the cleaning above-mentioned steps, be reapposed over little die cavity in the big die cavity afterwards, repeat operation next time.
2. the method for packing of a kind of eyeball type infrared remote receiver according to claim 1 is characterized in that said step 1 also comprises:
Step 1.1, make big die cavity: prepare a strip-shaped bracket, big die cavity body is placed in order boring on support then in each hole;
Step 1.2, make little die cavity: make the little die cavity that can hold in the chamber into according to the inner cavity size of big die cavity body, said little die cavity is provided with the concave surface of an eyeball type.
3. eyeball type infrared remote receiver module that method according to claim 1 is made; It is characterized in that comprising: sensitive chip support (4), infrared sensitive chip and eyeball type shell (5); Said sensitive chip support (4) is provided with lead frame (41); Said infrared sensitive chip is installed in this lead frame (41), and said lead frame (41) is coated in the eyeball type shell (5).
4. a kind of eyeball type infrared remote receiver module according to claim 3; It is characterized in that: said sensitive chip support (4) comprise lead frame (41), laterally reinforcement (42) and with the vertically disposed pin of said horizontal reinforcement (42) (43); Said lead frame (41) is located at an end of pin (43), and said lead frame (41), horizontal reinforcement (42) and the integrated molding structure of pin (43).
5. according to claim 3 or 4 described a kind of eyeball type infrared remote receiver modules; It is characterized in that: said eyeball type shell (5) comprises rectangle housing (51) and hemispherical shell (52); Said hemispherical shell (52) is located on the rectangle housing (51), and both seamlessly transit the plastic packaging shell of being combined as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010600936XA CN102136523B (en) | 2010-12-22 | 2010-12-22 | Encapsulation method for eyeball infrared receiver, special die and manufactured product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010600936XA CN102136523B (en) | 2010-12-22 | 2010-12-22 | Encapsulation method for eyeball infrared receiver, special die and manufactured product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102136523A CN102136523A (en) | 2011-07-27 |
| CN102136523B true CN102136523B (en) | 2012-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010600936XA Expired - Fee Related CN102136523B (en) | 2010-12-22 | 2010-12-22 | Encapsulation method for eyeball infrared receiver, special die and manufactured product |
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| Country | Link |
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| CN (1) | CN102136523B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6692993B2 (en) * | 1998-10-13 | 2004-02-17 | Intel Corporation | Windowed non-ceramic package having embedded frame |
| CN1674775A (en) * | 2004-03-26 | 2005-09-28 | 夏普株式会社 | Semiconductor device for optical communication and manufacturing method therefor |
| CN2763912Y (en) * | 2005-01-04 | 2006-03-08 | 杨家象 | Convex remote control infrared receiver |
| CN2829295Y (en) * | 2005-08-29 | 2006-10-18 | 杨天昴 | All-integral infrared receiver |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103484A (en) * | 1980-01-21 | 1981-08-18 | Fuji Photo Film Co Ltd | Manufacture of semiconductor device for photoelectric conversion |
| JP2000036642A (en) * | 1998-05-14 | 2000-02-02 | Sanyo Electric Co Ltd | Optical semiconductor device |
-
2010
- 2010-12-22 CN CN201010600936XA patent/CN102136523B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6692993B2 (en) * | 1998-10-13 | 2004-02-17 | Intel Corporation | Windowed non-ceramic package having embedded frame |
| CN1674775A (en) * | 2004-03-26 | 2005-09-28 | 夏普株式会社 | Semiconductor device for optical communication and manufacturing method therefor |
| CN2763912Y (en) * | 2005-01-04 | 2006-03-08 | 杨家象 | Convex remote control infrared receiver |
| CN2829295Y (en) * | 2005-08-29 | 2006-10-18 | 杨天昴 | All-integral infrared receiver |
Non-Patent Citations (2)
| Title |
|---|
| JP昭56103484A 1981.08.18 |
| JP特开2000-36642A 2000.02.02 |
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| Publication number | Publication date |
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| CN102136523A (en) | 2011-07-27 |
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Granted publication date: 20121128 Termination date: 20171222 |
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| CF01 | Termination of patent right due to non-payment of annual fee |