CN102131374A - Shielding structure with electromagnetic protection function - Google Patents
Shielding structure with electromagnetic protection function Download PDFInfo
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- CN102131374A CN102131374A CN2011100211526A CN201110021152A CN102131374A CN 102131374 A CN102131374 A CN 102131374A CN 2011100211526 A CN2011100211526 A CN 2011100211526A CN 201110021152 A CN201110021152 A CN 201110021152A CN 102131374 A CN102131374 A CN 102131374A
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- substrate
- electrically connected
- conducting membrane
- membrane structure
- electromagnetic protection
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Abstract
The invention relates to a shielding structure with an electromagnetic protection function. The shielding structure comprises a substrate and a conductive film structure, wherein, the substrate comprises at least one electric connection area and a grounding area; and the conductive film structure is formed on the substrate and is electrically connected to the grounding area, so the conductive film structure can conduct electromagnetic interference (EMI) to the grounding area. The shielding structure has the beneficial effects that the conductive film structure is directly formed on the substrate so that the substrate has anti-EMI characteristic, thus saving the traditional metal cover body, reducing procedures of the whole preparation process and saving time and cost; and in addition, a high-temperature reflow mode is not needed for assembling the metal cover body, thus preventing heat influence on an element and improving reliability of the element.
Description
Technical field
The present invention relates to a kind of shielding construction, particularly a kind of shielding construction that conducting membrane structure is taken shape in substrate and form with electromagnetic protection effect with electromagnetic protection.
Background technology
Technology fast development along with electronic product, characteristics such as that the Related product characteristic requires mostly is in light weight, volume is little, high-quality, low price, low consumpting power and high-reliability, These characteristics has promoted the exploitation and the Market Growth of technology such as communication, multimedia, and that the quality requirements of electromagnetic armouring structure in the electronic product and anti-electromagnetic interference seems relatively is important, disturbs and has influence on the operation quality of product to avoid environmental electromagnetic wave to produce for wafer.
In the traditional screen shield structure, crown cap is known from experience cover cap on integrated circuit (IC) wafer and general peripheral element, to reach the effect of anti-electromagnetic interference.Yet the electromagnetic wave of electronic component institute scattering (Scattering) does not dissipate, and runs helter-skelter in shielding construction on the contrary and the electronic circuit of indirect or directly interference sensitivity, so that have influence on the characteristic of product.
On the other hand, in traditional preparation process technology, this metal cap body is to be connected in circuit board with welding manner, product must pass through high temperature reflow step (Reflow), this can cause product to hide property destruction, and the fall phenomenon of (peeling) of for example anti-welding lacquer glue causes the tin channelling and short circuit; Or conductive salient point bears incessantly high temperature and causes problem such as butt joint contact bad; Moreover above-mentioned reflow step also causes shortcomings such as the increase in man-hour, cost rising of the manufacturing side.
Again on the one hand,, must strengthen the space of product, for example increase the Layout space, cause the product size increase more than at least 15% in order to assemble above-mentioned metal cap body.
The present invention is because the above-mentioned traditional shortcoming of anti-electromagnetic structure when reality is used, and proposes a kind of reasonable in design and effectively improve the structure of the problems referred to above.
Summary of the invention
Main purpose of the present invention is to provide a kind of shielding construction with electromagnetic protection, this shielding construction directly takes shape in substrate with conducting membrane structure, make shielding construction of the present invention have the characteristic of anti-electromagnetic interference, and do not need the added metal lid, so can save operation, cost, improve the trustworthiness (Reliability) of qualification rate and module simultaneously.
Another object of the present invention, be to provide a kind of shielding construction with electromagnetic protection, this shielding construction utilizes the preparation technology of lower temperature, for example spray under the normal temperature or attach, conducting membrane structure is taken shape in substrate, therefore can not cause thermal impact, so can improve the reliability of product to element, substrate.
For achieving the above object, the present invention has adopted following technical scheme.
A kind of shielding construction with electromagnetic protection comprises: a substrate, and it comprises at least one and is electrically connected zone and a ground area; And a conducting membrane structure, it forms on this substrate and is electrically connected at this ground area; Thus, this conducting membrane structure is used for electromagnetic interference is conducted to this ground area.
Further, this is electrically connected the zone is a plurality of weld pads, and described weld pad is used to be electrically connected electronic component.
Further, also be formed with insulation system on this substrate, be used for insulated barriers this electrical connection zone and this conducting membrane structure.
Further, this insulation system is a pad shade, and this pad shade is by the insulating varnish moulding, and exposing this weld pad, and this conducting membrane structure is to take shape on this pad shade.
Further, this conducting membrane structure is to take shape on this pad shade with attaching method or with spraying method.
Further, this substrate also is provided with at least one earthing conductor structure, and this conducting membrane structure is electrically connected on this earthing conductor structure, and then is electrically connected at this ground area.
Further, this earthing conductor structure is a ground hole position.
A kind of shielding construction with electromagnetic protection, comprise: a substrate, it comprises at least one and is electrically connected zone and a ground area, this substrate is provided with an integrated circuit component, wherein this integrated circuit component has a body, and is formed at the metallization structure and of this body by the extended connecting portion of this body, this metallization structure is electrically connected on this ground area, and this connecting portion is electrically connected on this electrical connection zone; And a conducting membrane structure, it forms on this substrate and is electrically connected at this ground area; Thus, this metallization structure and this conducting membrane structure are used for electromagnetic interference is conducted to this ground area.
Further, this electrical connection zone comprises a plurality of weld pads, and described weld pad is the connecting portion that is used to be electrically connected an electronic component and this integrated circuit component.
Further, also be formed with insulation system on this substrate, this insulation system is used for insulated barriers this electrical connection zone and this conducting membrane structure.
Further, this insulation system is a pad shade, and this pad shade is by the moulding of insulating varnish institute, and exposing this weld pad, and this conducting membrane structure takes shape on this pad shade.
Further, this conducting membrane structure takes shape on this pad shade with attaching method or with spraying method, and this metallization structure takes shape in this body with attaching method or with spraying method.
Further, this substrate also is provided with at least one earthing conductor structure, and this conducting membrane structure and this metallization structure are electrically connected on this earthing conductor structure, and then is electrically connected at this ground area.
Further, this earthing conductor structure is a ground hole position.
Hence one can see that, in order to achieve the above object, the invention provides a kind of shielding construction with electromagnetic protection, comprises: a substrate, and it comprises at least one and is electrically connected zone and a ground area; And a conducting membrane structure, it forms on this substrate and is electrically connected at this ground area; Thus, this conducting membrane structure can conduct to electromagnetic interference this ground area.
The present invention also provides a kind of shielding construction with electromagnetic protection, comprise: a substrate, it comprises at least one and is electrically connected zone and a ground area, this substrate is provided with an integrated circuit component, wherein this integrated circuit component has a body, and is formed at the metallization structure and of this body by the extended connecting portion of this body, this metallization structure is electrically connected on this ground area, and this connecting portion is electrically connected on this electrical connection zone; And a conducting membrane structure, it forms on this substrate and is electrically connected at this ground area; Thus, this metallization structure and this conducting membrane structure can conduct to electromagnetic interference this ground area.
The present invention has following useful effect: the present invention directly takes shape in substrate with conducting membrane structure, therefore substrate itself promptly has the characteristic of anti-electromagnetic interference, so can omit traditional metal cap body, make whole preparation technology have less operation, with save time, cost; In addition, because the present invention does not need the mode assembling metal lid with the high temperature reflow,, improve the element reliability so can avoid element to be subjected to thermal impact.
Be further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet the accompanying drawing that is provided only provide with reference to and usefulness is described, be not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the schematic diagram of the shielding construction with electromagnetic protection of first embodiment of the invention.
Fig. 2 is the schematic diagram of the shielding construction with electromagnetic protection of second embodiment of the invention.
Embodiment
At first, see also shown in Figure 1ly, it is the first embodiment of the present invention, the present invention proposes a kind of shielding construction with electromagnetic protection, it mainly is moulding one conducting film on circuit substrate, reaching the effect of anti-electromagnetic interference, and solves the problem that tradition utilizes metal cap body to derive.This shielding construction with electromagnetic protection comprises: a substrate 10 and be formed in conducting membrane structure 11 on this substrate 10.
Please refer to Fig. 1, this substrate 10 has a loading end 10A and a back side 10B with respect to this loading end 10A, in the present embodiment, this loading end 10A comprises one or more electrical connection zone 101, electronic component 12 is fixedly arranged on this loading end 10A and goes up and be electrically connected on electrical connection zone 101, and this electrical connection zone 101 can comprise a plurality of weld pads, and this electronic component 12 is fixed in this weld pad by surface adhering technology (SMT), but not as limit, this electronic component 12 can be electrically connected on this weld pad with structures such as bonding wire (wire bonding), tin ball, conductive projections.In addition, conducting membrane structure 11 takes shape on the loading end 10A of this substrate 10, and this conducting membrane structure 11 is electrically connected on a ground area 102, so that this conducting membrane structure 11 conducts to this ground area 102 with electromagnetic interference (EMI).
On the other hand, this ground area 102 takes shape in the back side 10B of this substrate 10, and this substrate 10 also is provided with at least one earthing conductor structure 103, for example, in the present embodiment, periphery two side positions of this substrate 10 are provided with ground hole position (being earthing conductor structure 103), and this conducting membrane structure 11 can be electrically connected on this ground area 102 by above-mentioned ground hole position, thus, electromagnetic interference (EMI) can be passed to ground hole position (being earthing conductor structure 103) by conducting membrane structure 11, conduct to ground area 102 again, and then the dissipation electromagnetic interference, reach anti-electromagnetic interference, effect with electromagnetic protection.
In addition, in the design of circuit, electrically touch this ground area 102, also be formed with insulation system 104 on this substrate 10, should be electrically connected zone 101 and this conducting membrane structure 11 in order to insulated barriers for fear of electronic component 12.For example, in the present embodiment, can utilize insulating varnish or similar material to coat moulding pad shade (Solder mask on this substrate 10, be above-mentioned insulation system 104), to expose this weld pad (promptly be electrically connected zone 101), make electronic component 12 be electrically connected on this weld pad and do not electrically contact with this conducting membrane structure 11 and ground area 102.
On the one hand, conducting membrane structure 11 can utilize variety of way to take shape on this substrate 10 again, for example a kind of conducting film is attached to be fixed on this substrate 10 or with a kind of electric conducting material to be sprayed on this substrate 10, but does not exceed with above-mentioned.
Please refer to Fig. 2, it is the second embodiment of the present invention, itself and the first embodiment difference are: also be provided with an integrated circuit component (IC) 13 on this substrate 10, this integrated circuit component 13 has the metallization structure 132 that a body 131 and is formed at this body 131.This metallization structure 132 is electrically connected on this conducting membrane structure 11 and ground area 102, thereby electromagnetic interference or external electromagnetic interference that integrated circuit component 13 itself is produced all can dissipate, to reach anti-electromagnetic interference, to have the effect of electromagnetic protection.
Identical with first embodiment, this substrate 10 has a loading end 10A and a back side 10B with respect to this loading end 10A, in the present embodiment, this loading end 10A comprises one or more electrical connection zone 101, electronic component 12 is fixedly arranged on this loading end 10A with integrated circuit component 13 and is electrically connected on and is electrically connected zone 101, and this electrical connection zone 101 can comprise a plurality of weld pads, and this electronic component 12 is fixed in this weld pad with surface adhering technology (SMT), 13 connecting portions 133 with the bonding wire form of integrated circuit component are connected in weld pad, but, for example can be the tin ball not as limit, structures such as conductive projection.In addition, conducting membrane structure 11 takes shape on the loading end 10A of this substrate 10, and this conducting membrane structure 11 is electrically connected on a ground area 102, so that this conducting membrane structure 11 conducts to this ground area 102 with electromagnetic interference.
In order to reach preferable anti-electromagnetic interference effect, the metallization structure 132 of this integrated circuit component 13 is located in this body 131, does not electrically contact but do not form with above-mentioned connecting portion 133.Thus, this metallization structure 132 is electrically connected on this ground area 102, and the electromagnetic interference or the external electromagnetic interference that integrated circuit component 13 are excited by ground hole position (being earthing conductor structure 103) conduct to ground area 102, and is dissipated.
And in the present embodiment, this conducting membrane structure 11 can be made with following method with metallization structure 132, a kind of conducting film attached to be fixed on this substrate 10, the body 131 or with a kind of electric conducting material be sprayed on this substrate 10, the body 131, but do not exceed with above-mentioned.
On the other hand, structure shown in Figure 2 all can not repeat them here with reference to the explanation of first embodiment as insulation system 104 grades.
In sum, the present invention has following all advantage:
1, the present invention takes shape in conducting membrane structure on the substrate, for example utilize the above-mentioned conducting membrane structure of mode moulding that attaches or spray, reaching the effect of good anti-electromagnetic interference, and can avoid tradition to utilize reliability issues on the preparation technology that crown cap causes.In addition, this conducting membrane structure can dissipate it, and then avoid electromagnetic radiation to run helter-skelter in traditional crown cap with the electromagnetic radiation of disturbing element to earth terminal, causes the not good problem of characteristic of electronic product.
2, the present invention utilizes conducting membrane structure and integrated circuit component metallization structure on every side, reach the effect of anti-electromagnetic interference, and conducting membrane structure of the present invention and metallization structure can't improve the volume of whole shielding construction, in other words, the shielding construction with electromagnetic protection of the present invention has the effect of the volume that dwindles the bulk shielding structure.
3, the Layout design time can be saved the shared space of conventional metals lid welding, so the present invention can reduce product area 5%-10%, volume then can reduce 17%-20% or more than.
Claims (14)
1. the shielding construction with electromagnetic protection is characterized in that, comprises:
One substrate, it comprises at least one and is electrically connected zone and a ground area; And
One conducting membrane structure, it forms on this substrate and is electrically connected at this ground area;
Thus, this conducting membrane structure is used for electromagnetic interference is conducted to this ground area.
2. the shielding construction with electromagnetic protection as claimed in claim 1 is characterized in that, this is electrically connected the zone is a plurality of weld pads, and described weld pad is used to be electrically connected electronic component.
3. the shielding construction with electromagnetic protection as claimed in claim 2 is characterized in that, also is formed with insulation system on this substrate, is used for insulated barriers this electrical connection zone and this conducting membrane structure.
4. the shielding construction with electromagnetic protection as claimed in claim 3 is characterized in that, this insulation system is a pad shade, and this pad shade is by the insulating varnish moulding, and exposing this weld pad, and this conducting membrane structure is to take shape on this pad shade.
5. the shielding construction with electromagnetic protection as claimed in claim 4 is characterized in that, this conducting membrane structure is to take shape on this pad shade with attaching method or with spraying method.
6. the shielding construction with electromagnetic protection as claimed in claim 4 is characterized in that, this substrate also is provided with at least one earthing conductor structure, and this conducting membrane structure is electrically connected on this earthing conductor structure, and then is electrically connected at this ground area.
7. the shielding construction with electromagnetic protection as claimed in claim 6 is characterized in that, this earthing conductor structure is a ground hole position.
8. the shielding construction with electromagnetic protection is characterized in that, comprises:
One substrate, it comprises at least one and is electrically connected zone and a ground area, this substrate is provided with an integrated circuit component, wherein this integrated circuit component has a body, and is formed at the metallization structure and of this body by the extended connecting portion of this body, this metallization structure is electrically connected on this ground area, and this connecting portion is electrically connected on this electrical connection zone; And
One conducting membrane structure, it forms on this substrate and is electrically connected at this ground area;
Thus, this metallization structure and this conducting membrane structure are used for electromagnetic interference is conducted to this ground area.
9. the shielding construction with electromagnetic protection as claimed in claim 8 is characterized in that, this electrical connection zone comprises a plurality of weld pads, and described weld pad is the connecting portion that is used to be electrically connected an electronic component and this integrated circuit component.
10. the shielding construction with electromagnetic protection as claimed in claim 9 is characterized in that, also is formed with insulation system on this substrate, and this insulation system is used for insulated barriers this electrical connection zone and this conducting membrane structure.
11. as insulation system 10 described shielding constructions with electromagnetic protection, it is characterized in that this insulation system is a pad shade, this pad shade is by the moulding of insulating varnish institute, exposing this weld pad, and this conducting membrane structure takes shape on this pad shade.
12. as insulation system 11 described shielding constructions with electromagnetic protection, it is characterized in that, this conducting membrane structure takes shape on this pad shade with attaching method or with spraying method, and this metallization structure takes shape in this body with attaching method or with spraying method.
13. as insulation system 11 described shielding constructions with electromagnetic protection, it is characterized in that, this substrate also is provided with at least one earthing conductor structure, and this conducting membrane structure and this metallization structure are electrically connected on this earthing conductor structure, and then is electrically connected at this ground area.
14., it is characterized in that this earthing conductor structure is a ground hole position as insulation system 13 described shielding constructions with electromagnetic protection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110021152.6A CN102131374B (en) | 2010-01-19 | 2011-01-14 | Shielding structure with electromagnetic protection function |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010000861 | 2010-01-19 | ||
| CN201010000861.1 | 2010-01-19 | ||
| CN201110021152.6A CN102131374B (en) | 2010-01-19 | 2011-01-14 | Shielding structure with electromagnetic protection function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102131374A true CN102131374A (en) | 2011-07-20 |
| CN102131374B CN102131374B (en) | 2014-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110021152.6A Active CN102131374B (en) | 2010-01-19 | 2011-01-14 | Shielding structure with electromagnetic protection function |
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| Country | Link |
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| CN (1) | CN102131374B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0820218B1 (en) * | 1996-07-20 | 1999-01-20 | Siegfried Schaal Metallveredelung GmbH & Co. | Electronic device and shielding cap for an electronic device |
| CN2485920Y (en) * | 2001-06-25 | 2002-04-10 | 倚天资讯股份有限公司 | Shielding device for reducing interference to circuit board |
| CN1533685A (en) * | 2001-05-21 | 2004-09-29 | Method for shielding an electric circuit on printed circuit board and a corresponding combination of a printed circuit board and shield | |
| CN1549456A (en) * | 2003-05-09 | 2004-11-24 | 诺基亚公司 | Portable radio communication equipment |
| CN2877209Y (en) * | 2005-12-29 | 2007-03-07 | 环隆电气股份有限公司 | Module assembling structure with prevention EMI feature |
-
2011
- 2011-01-14 CN CN201110021152.6A patent/CN102131374B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0820218B1 (en) * | 1996-07-20 | 1999-01-20 | Siegfried Schaal Metallveredelung GmbH & Co. | Electronic device and shielding cap for an electronic device |
| CN1533685A (en) * | 2001-05-21 | 2004-09-29 | Method for shielding an electric circuit on printed circuit board and a corresponding combination of a printed circuit board and shield | |
| CN2485920Y (en) * | 2001-06-25 | 2002-04-10 | 倚天资讯股份有限公司 | Shielding device for reducing interference to circuit board |
| CN1549456A (en) * | 2003-05-09 | 2004-11-24 | 诺基亚公司 | Portable radio communication equipment |
| CN2877209Y (en) * | 2005-12-29 | 2007-03-07 | 环隆电气股份有限公司 | Module assembling structure with prevention EMI feature |
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| Publication number | Publication date |
|---|---|
| CN102131374B (en) | 2014-01-29 |
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Effective date of registration: 20150921 Address after: 201206 Shanghai City Jingqiao export processing zone of Pudong New Area dragon road 501 Patentee after: USI ELECTRONICS (SHANGHAI) CO., LTD. Address before: 201203 Shanghai Zhangjiang hi tech park, Zhang Road No. 1558 Patentee before: Huanxu Electronics Co., Ltd. Patentee before: Universal Global Scientific Industries Co., Ltd. |