CN102127785A - Plating apparatus and method of manufacturing printed circuit board - Google Patents
Plating apparatus and method of manufacturing printed circuit board Download PDFInfo
- Publication number
- CN102127785A CN102127785A CN2010106102937A CN201010610293A CN102127785A CN 102127785 A CN102127785 A CN 102127785A CN 2010106102937 A CN2010106102937 A CN 2010106102937A CN 201010610293 A CN201010610293 A CN 201010610293A CN 102127785 A CN102127785 A CN 102127785A
- Authority
- CN
- China
- Prior art keywords
- anode
- mentioned
- lengthwise shape
- shape substrate
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0642—Anodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
Abstract
The invention provides a plating apparatus and a method of manufacturing printed circuit board. The plating apparatus includes a plating tank. The plating tank contains a plating solution. A long-sized substrate is transported by transport rollers to pass through inside of the plating tank. Three or more bar-shaped anodes are provided in the plating tank to line up along the long-sized substrate. A surface area of each of the anodes arranged at both ends is smaller than a surface area of another anode.
Description
Technical field
The present invention relates to the manufacture method of electroplanting device and wired circuit board.
Background technology
In recent years, in various electronicss, use the wired circuit board of densification and miniaturization.When making wired circuit board, for example in the formation operation of wiring pattern, adopt electroplanting device, on preformed crystal seed layer, implement electrolysis plating (electrolytic plating).
For example the described electroplanting device of TOHKEMY 2003-321796 communique has the plating tank that holds electroplate liquid.In plating tank, dispose anode electrode.By the slit on the sidewall that is formed on plating tank, in plating tank, carry lengthwise shape substrate.Under this state, between the zone that will implement the electrolysis plating of anode electrode and lengthwise shape substrate, be applied with voltage.Thus, in plating tank, on lengthwise shape substrate, implement the electrolysis plating.
When the electric current that flows to anode electrode is excessive, occur utilizing electrolysis to plate the shaggy phenomenon (coating burns, Plating burned) of the metal level of separating out sometimes.Thereby, the electric current that flows to anode electrode need be adjusted into below the higher limit that does not produce the empyreumatic electric current of coating.
Like this, in order to improve electroplating efficiency, in plating tank, dispose a plurality of anode electrodes sometimes side by side.But in this case, the electric current that flows to a plurality of anode electrodes produces deviation.In order to prevent the empyreumatic generation of coating, the electric current that flows to all anode electrodes need be adjusted into below the higher limit that does not produce the empyreumatic electric current of coating.Therefore, the electric current that causes sometimes flowing to a part of anode electrode obviously diminishes.Thus, can not electroplate expeditiously.
Summary of the invention
The object of the present invention is to provide and to prevent that coating from burning and can improve the manufacture method of the electroplanting device and the wired circuit board of electroplating efficiency.
(1) electroplanting device of a technical scheme of the present invention is that lengthwise shape substrate is implemented galvanized electroplanting device, and this electroplanting device comprises: the electroplate liquid accommodation section, and it is used to hold electroplate liquid; Delivery section, it carries lengthwise shape substrate along the length direction of lengthwise shape substrate in the electroplate liquid accommodation section; A plurality of anodes more than 3, they are configured in the electroplate liquid accommodation section in the mode of arranging along the lengthwise shape substrate that is transported by delivery section; Power supply, it is that negative electrode ground applies voltage between lengthwise shape substrate and a plurality of anode with lengthwise shape substrate; In this electroplanting device, other at least 1 anodic surface-area of the anodic surface area ratio that is configured in two ends in a plurality of anodes is little.
In this electroplanting device, in accommodating the electroplate liquid accommodation section of electroplate liquid, utilize delivery section to carry lengthwise shape substrate along the length direction of lengthwise shape substrate.In the electroplate liquid accommodation section, dispose a plurality of anodes more than 3 in the mode of arranging along the throughput direction of lengthwise shape substrate.Under this state, utilizing power supply is that negative electrode ground is to applying voltage between a plurality of anodes and the lengthwise shape substrate with lengthwise shape substrate.
According to contriver's experiment and research as can be known, to when a plurality of anodes of lengthwise shape substrate configuration are supplied with the constant electric current, have the current ratio that flows to lengthwise shape substrate from the anode at two ends flows to lengthwise shape substrate from other anodes the big tendency of electric current.Therefore, the current density of the part of the lengthwise shape substrate that the current density ratio of the part of the lengthwise shape substrate relative with the anode at two ends is relative with other anode is big.
Therefore, in the electroplanting device of a technical scheme of the present invention, other at least 1 the anodic surface-area of the anodic surface area ratio that is configured in two ends that is set in a plurality of anodes is little.In this case, it is bigger than other at least 1 anodic resistance value to be configured in the anodic resistance value at two ends.Thus, can suppress to flow to the electric current of lengthwise shape substrate from the anode at two ends.Thereby, can make to flow to electric current that the electric current of lengthwise shape substrate and at least 1 anode from other flow to lengthwise shape substrate from the anode at two ends and equate or be close.Thus, the current density of the part relative with other at least 1 anode of the current density of the lengthwise shape part relative with anodes two ends substrate and lengthwise shape substrate is equated or be close.In this case, supply to a plurality of anodic constant currents and increase by making, can make from the anode at two ends to flow to the electric current of lengthwise shape substrate and approach not produce the higher limit of the empyreumatic electric current of coating from the electric current that other at least 1 anode flows to lengthwise shape substrate.Its result can prevent that coating from burning and can improve the electroplating efficiency of lengthwise shape substrate.
(2) a plurality of anodes are made of bar-shaped metal respectively, and the anodic that is configured in two ends and the area in the vertical cross section of length direction also can be littler than other at least 1 anodic and the area in the vertical cross section of length direction.
In this case, when making each anode,, can adjust each anodic surface-area accurately by adjusting the anodic that constitutes by bar-shaped metal and the area in the vertical cross section of length direction.Thereby, area by making the anodic that is configured in two ends and the vertical cross section of length direction is littler than other at least 1 anodic and the area in the vertical cross section of length direction, can make accurately to flow to electric current that the electric current of lengthwise shape substrate and at least 1 anode from other flow to lengthwise shape substrate from the anode at two ends and equate or be close.
(3) a plurality of anodes comprise a plurality of spherical metals respectively and hold the housing of a plurality of spherical metals, and the quantity of the spherical metal of anodic that is configured in two ends in a plurality of anodes also can be lacked than other the quantity of 1 spherical metal of anodic at least.
In this case, by adjusting the quantity of the spherical metal of each anodic, can easily adjust each anodic surface-area.Thereby, lack than the quantity of other at least 1 spherical metal of anodic by the quantity that makes the spherical metal of anodic that is configured in two ends, can easily make to flow to electric current that the electric current of lengthwise shape substrate and at least 1 anode from other flow to lengthwise shape substrate from the anode at two ends and equate or be close.
(4) also can little by little become big to the anodic surface-area that is configured in central authorities from the anode that is configured in two ends.
In this case, the electric current that flows to lengthwise shape substrate from a plurality of anodes is equated mutually or be close.Thus, can prevent that coating from burning and can improve more fully the electroplating efficiency of lengthwise shape substrate.
(5) manufacture method of the wired circuit board of another technical scheme of the present invention, comprise the operation of preparing lengthwise shape substrate and the operation that lengthwise shape substrate enforcement electrolysis is plated, the operation of implementing the electrolysis plating comprises: the operation of carrying lengthwise shape substrate in accommodating the electroplate liquid accommodation section of electroplate liquid along the length direction of lengthwise shape substrate; To being configured in the operation that applies voltage between a plurality of anodes more than 3 in the electroplate liquid accommodation section and the lengthwise shape substrate, these a plurality of anodes are arranged along the lengthwise shape substrate that transports, and other at least 1 anodic surface-area of the anodic surface area ratio that is configured in two ends in a plurality of anodes is little.
In the manufacture method of this wired circuit board, in accommodating the electroplate liquid accommodation section of electroplate liquid, utilize delivery section to carry lengthwise shape substrate along the length direction of lengthwise shape substrate.And, in the electroplate liquid accommodation section, dispose a plurality of anodes more than 3 in the mode of arranging along the throughput direction of lengthwise shape substrate.Under this state, utilizing power supply is negative electrode ground to applying voltage between a plurality of anodes and the lengthwise shape substrate with lengthwise shape substrate, thereby implements the electrolysis plating on lengthwise shape substrate.
In this case, because other at least 1 the anodic surface-area of the anodic surface area ratio that is configured in two ends that is set in a plurality of anodes is little, so it is bigger than other at least 1 anodic resistance value to be configured in the anodic resistance value at two ends.Thus, can suppress to flow to the electric current of lengthwise shape substrate from the anode at two ends.Thereby, can make to flow to electric current that the electric current of lengthwise shape substrate and at least 1 anode from other flow to lengthwise shape substrate from the anode at two ends and equate or be close.Thus, the current density of the part relative with other at least 1 anode of the current density of the lengthwise shape part relative with anodes two ends substrate and lengthwise shape substrate is equated or be close.In this case, supply to a plurality of anodic constant currents and increase by making, can make from the anode at two ends to flow to the electric current of lengthwise shape substrate and approach not produce the higher limit of the empyreumatic electric current of coating from the electric current that other at least 1 anode flows to lengthwise shape substrate.Thereby, can prevent that coating from burning and can improve the electroplating efficiency of lengthwise shape substrate.Its result can be well and make wired circuit board efficiently.
Adopt the present invention, can make from the anode at two ends to flow to the electric current of lengthwise shape substrate and approach not produce the higher limit of the empyreumatic electric current of coating from the electric current that other at least 1 anode flows to lengthwise shape substrate.Thereby, can prevent that coating from burning and can improve the electroplating efficiency of lengthwise shape substrate.
Description of drawings
Fig. 1 is the schematic perspective view of the electroplanting device of embodiments of the present invention.
Fig. 2 is the figure of anode electrode of the electroplanting device of presentation graphs 1.
Fig. 3 is the schematic operation sectional view of an example of the expression manufacture method that adopts the wired circuit board that the electroplanting device of present embodiment makes.
Fig. 4 is the figure of structure of anode electrode of the electroplanting device of expression the 2nd embodiment.
Fig. 5 be expression embodiment 1 flow to the figure of the electric current of strip substrate from each anode electrode.
Fig. 6 be expression comparative example 1 flow to the figure of the electric current of strip substrate from each anode electrode.
Fig. 7 be expression embodiment 2, embodiment 3 and comparative example 2 flow to the figure of the electric current of strip substrate from each anode electrode.
Embodiment
Below, with reference to the manufacture method of the electroplanting device and the wired circuit board of description of drawings one embodiment of the present invention.
(1) the 1st embodiment
(1-1) structure of electroplanting device
Fig. 1 is the schematic perspective view of the electroplanting device 100 of the 1st embodiment.As shown in Figure 1, electroplanting device 100 has the plating tank 102 of box.Plating tank 102 has bottom surface sections and 4 side surface part.On two mutual relative side surface part of plating tank 102, be respectively equipped with the opening 103 of the lengthwise shape that extends along the vertical direction.
Mode with an inaccessible opening 103 can be provided with a pair of conveying roller 101a, the 101b that extends along the vertical direction rotatably, and a pair of conveying roller 101c, the 101d of extension along the vertical direction can be set rotatably in the mode of inaccessible another opening 103.In this case, utilize conveying roller 101a～101d liquid thickly to seal two openings 103.
In plating tank 102, accommodate the electroplate liquid that for example comprises copper sulfate.In addition, when the cupric ion in the electroplate liquid is not enough, also can in electroplate liquid, further add pulverous cupric oxide.In addition, in the bottom of plating tank 102, also can dispose the holding tank (not shown) that is used to receive the electroplate liquid that spills from plating tank 102.In this case, utilize pump to make to accumulate in the electroplate liquid in the holding tank to turn back in the plating tank 102.
Utilize a pair of conveying roller 101a, 101b and a pair of conveying roller 101c, 101d clamping lengthwise shape substrate 10.And, by making conveying roller 101a～101d rotation, carry lengthwise shape substrate 10 that it is passed through in the plating tank 102 along the direction shown in the arrow MD (below, be called throughput direction).Thus, lengthwise shape substrate 10 is immersed in the electroplate liquid in the plating tank 102 continuously.
On the throughput direction of lengthwise shape substrate 10 than conveying roller 101a, 101b by the position of upstream side, can be provided with power supply roller 50a around the axis of above-below direction rotatably.In addition, on the throughput direction of lengthwise shape substrate 10 than conveying roller 101c, 101d by the position in downstream side, can be provided with power supply roller 50b around the axis of above-below direction rotatably.
A surface of power supply roller 50a, 50b and lengthwise shape substrate 10 is rotated in contact.On a surface of lengthwise shape substrate 10, be provided with the plating area that to carry out the electrolysis plating.Contact with a surface of lengthwise shape substrate 10 by power supply roller 50a, 50b, power supply roller 50a, 50b are electrically connected with the plating area of lengthwise shape substrate 10 respectively.In addition, power supply roller 50a, 50b are connected with the negative pole of rectifier 42 respectively.Rectifier 42 is connected with AC power (not shown).
In plating tank 102, be provided with the bar-shaped anode electrode 1 that (is 6 in the present example) more than 3 in the mode of arranging along lengthwise shape substrate 10.In this case, a plurality of anode electrodes 1 are configured to relative with an above-mentioned surface (being provided with the surface of plating area) of lengthwise shape substrate 10 and are close.As each anode electrode 1, the bar-shaped titanium that for example adopts oxidized iridium to cover.A plurality of anode electrodes 1 are connected with the positive pole of rectifier 42 mutually with arranging.
By rectifier 42, apply voltage between the plating area to a plurality of anode electrodes 1 and the lengthwise shape substrate 10 that is connected with power supply roller 50a, 50b.In this case, in plating tank 102, the plating area of lengthwise shape substrate 10 becomes negative electrode (カ ソ one De).Thus, electrolysis plating (copper facing) is implemented in the plating area of lengthwise shape substrate 10.
In addition, rectifier 42 comprises constant-current control circuit, will be controlled to be constant from the electric current (below, be called supply with electric current) that rectifier 42 supplies to a plurality of anode electrodes 1.
At this, in the present embodiment, other the surface-area of at least 1 anode electrode 1 of the surface area ratio of the anode electrode that is configured in two ends 1 in a plurality of anode electrodes 1 is little.Below, the surface-area of each anode electrode 1 is described.
(1-2) about the surface-area of anode electrode
Fig. 2 is the enlarged view of a plurality of anode electrodes 1 of the electroplanting device 100 of present embodiment.Below, two anode electrodes 1 in a plurality of anode electrodes 1, that be configured in two ends are called two ends anode 1 respectively, two adjacent with this two two ends anodes 1 respectively anode electrodes 1 are called grading electrode 1 respectively, two anode electrodes 1 that are configured between these two grading electrodes 1 are called central anode 1 respectively.In addition, the sectional area that the area with the vertical cross section of length direction of each anode electrode 1 is called each anode electrode 1.
As shown in Figure 2, in the present embodiment, two two ends anodes 1 are mutual identical shape, and two grading electrodes 1 are mutual identical shape, and two central anodes 1 are mutual identical shape.In addition, the length on the above-below direction of two ends anode 1, grading electrode 1 and central anode 1 equates mutually.In addition, the sectional area of each grading electrode 1 of the sectional area ratio of each two ends anode 1 is little, and the sectional area of each central anode 1 of the sectional area ratio of each grading electrode 1 is little.
Therefore, the surface-area of each grading electrode 1 of the surface area ratio of each two ends anode 1 is little, and the surface-area of each central anode 1 of the surface area ratio of each grading electrode 1 is little.The surface-area of two ends anode 1 for example is 300cm
2～900cm
2, the surface-area of grading electrode 1 for example is 500cm
2～1500cm
2, the surface-area of central anode 1 for example is 1000cm
2～2000cm
2In addition, the surface-area of two ends anode 1 be central anode 1 surface-area for example 30%～50%, the surface-area of grading electrode 1 be central anode 1 surface-area for example 50%～70%.
Thus, the resistance value of two ends anode 1 is bigger than the resistance value of grading electrode 1, and the resistance value of grading electrode 1 is bigger than the resistance value of central anode 1.
In addition, preferably the length on the above-below direction of each anode electrode 1 for example be 100mm～500mm, each anode electrode 1 for example for example be 20mm～80mm in the length on the throughput direction of lengthwise shape substrate 10 for the length with on the lengthwise shape substrate 10 vertical directions of 20mm～150mm, each anode electrode 1.
(1-3) manufacture method of wired circuit board
Fig. 3 is the schematic operation sectional view of an example of the expression manufacture method that adopts the wired circuit board that the electroplanting device of present embodiment makes.
At first, shown in Fig. 3 (a), for example prepare the insulation layer 20 of the lengthwise shape that constitutes by polyimide.Then, shown in Fig. 3 (b), on insulation layer 20, form the crystal seed layer 21 that for example constitutes by nickel-chromium by electroless plating or (cathode) sputtering.Then, shown in Fig. 3 (c), stacked dry film etc. and expose and develop on crystal seed layer 21, thus form anti-coating 22 with pattern opposite with the wiring pattern that in back operation, forms.Thus, form lengthwise shape substrate 10 (Fig. 1).
Then, use the electroplanting device 100 of Fig. 1 as described above lengthwise shape substrate 10 to be implemented the electrolysis plating, thereby shown in Fig. 3 (d), on the part of the crystal seed layer 21 that is not formed with anti-coating 22, form the wiring layer 23 that for example constitutes by copper.In this case, the part that is not formed with the crystal seed layer 21 of anti-coating 22 is equivalent to above-mentioned plating area.
Then, shown in Fig. 3 (e), remove after the anti-coating 22, use etching solution to remove crystal seed layer 21 except the crystal seed layer 21 of the lower zone of wiring layer 23 by peeling off etc.Thus, formed the wired circuit board 25 that on insulation layer 20, is formed with the wiring pattern 24 that constitutes by crystal seed layer 21 and wiring layer 23.
(1-4) effect
According to contriver's experiment and research as can be known, to supplying with along a plurality of anode electrodes 1 of lengthwise shape substrate 10 configuration when the constant electric current is arranged, have the current ratio that flows to lengthwise shape substrate 10 from the anode electrode 1 at two ends flows to lengthwise shape substrate 10 from other anode electrodes 1 the big tendency of electric current.Therefore, the current density of the part that the anode electrode 1 with other of the current density ratio lengthwise shape substrate 10 of the part that anode electrode lengthwise shape substrate 10 and two ends 1 is relative is relative is big.
Therefore, in the electroplanting device 100 of the 1st embodiment, other the surface-area of anode electrode 1 of the surface area ratio of each two ends anode 1 in a plurality of anode electrodes 1 is little.In this case, the resistance value of two ends anode 1 is bigger than the resistance value of other anode electrode 1.
Thus, can suppress to flow to the electric current of lengthwise shape substrate 10 from two ends anode 1.Thereby, can make to flow to electric current that the electric current of lengthwise shape substrate 10 and anode electrode 1 from other flow to lengthwise shape substrate 10 from two ends anode 1 and equate or be close.The current density of the part that the anode electrode 1 with other of the current density of the part relative with two ends anode 1 that thus, can make lengthwise shape substrate 10 and lengthwise shape substrate 10 is relative equates or is close.
In this case, by the constant current (supply electric current) that supplies to a plurality of anode electrodes 1 is increased, can make from two ends anode 1 to flow to the electric current of lengthwise shape substrate 10 and approach not produce the higher limit of the empyreumatic electric current of coating from the electric current that other anode electrode 1 flows to lengthwise shape substrate 10.Its result can prevent that coating from burning and can improve the electroplating efficiency of lengthwise shape substrate 10.
In addition, in the electroplanting device 100 of present embodiment, a plurality of anode electrodes 1 are formed by bar-shaped metal, therefore, the anode electrode 1 and area vertical cross section of length direction that is made of bar-shaped metal when making each anode electrode 1 by being adjusted at can be adjusted the surface-area of each anode electrode 1 accurately.Thereby, can make accurately to flow to electric current that the electric current of lengthwise shape substrate 10 and anode electrode 1 from other flow to lengthwise shape substrate 10 from two ends anode 1 and equate or be close.
In addition, in the electroplanting device 100 of present embodiment, 1 the surface-area from two ends anode 1 to central anode that is set in a plurality of anode electrodes 1 little by little becomes big.Thereby, the electric current that flows to lengthwise shape substrate 10 from all anode electrodes 1 is equated mutually or be close.Thus, can prevent that coating from burning and improve the electroplating efficiency of lengthwise shape substrate 10 more fully.
In addition, as long as the electric current that flows to lengthwise shape substrate 10 from a plurality of anode electrodes 1 is equated mutually or be close, the surface-area of each grading electrode 1 also can equate with the surface-area of each central anode 1 or be littler than the surface-area of each central anode 1.
In addition, can make the shape of two two ends anodes 1 different, also can make the shape of two grading electrodes 1 different, also can make the shape of two central anodes 1 different.
(2) the 2nd embodiments
About the electroplanting device 100 of the 2nd embodiment of the present invention, the place different with the electroplanting device 100 of above-mentioned the 1st embodiment is described.
Fig. 4 is the figure of structure of a plurality of anode electrodes 2 of the electroplanting device 100 of expression the 2nd embodiment.As shown in Figure 4, the electroplanting device 100 of the 2nd embodiment replaces the anode electrode 1 more than 3 and has the anode electrode 2 that (is 6 in the present example) more than 3.Each anode electrode 2 has the structure of for example holding a plurality of globular anode balls 112 that are made of copper in the netted housing 110 that for example is made of titanium.Each anode electrode 2 is to be contained in state configuration in the acid proof anode cap 113 in plating tank 102.
Below, two anode electrodes 2 in a plurality of anode electrodes 2, that be configured in two ends are called two ends anode 2 respectively, two adjacent with this two two ends anodes 2 respectively anode electrodes 2 are called grading electrode 2 respectively, two anode electrodes 2 that are configured between these two grading electrodes 2 are called central anode 2 respectively.
In the electroplanting device 100 of present embodiment, the quantity of the anode ball 112 of two two ends anodes 2 equates that mutually the quantity of the anode ball 112 of two grading electrodes 2 equates that mutually the quantity of the anode ball 112 of two central anodes 2 equates mutually.In addition, the quantity of the anode ball 112 of each two ends anode 2 is lacked than the quantity of the anode ball 112 of each grading electrode 2, and the quantity of the anode ball 112 of each grading electrode 2 is lacked than the quantity of the anode ball 112 of each central anode 2.
The quantity of the anode ball 112 of each anode electrode 2 is big or small corresponding with the surface-area of each anode electrode 2.That is, the quantity of anode ball 112 is many more, and the surface-area of anode electrode 2 is big more.Thereby the surface-area of each grading electrode 2 of the surface area ratio of each two ends anode 2 is little, and the surface-area of each central anode 2 of the surface area ratio of each grading electrode 2 is little.When using diameter for example as the anode ball 112 of 27mm, the quantity of the anode ball 112 of each two ends anode 2 for example is 10～40, the quantity of the anode ball 112 of each grading electrode 2 for example is 30～80, and the quantity of the anode ball 112 of each central anode 2 for example is 60～120.
In the electroplanting device 100 of the 2nd embodiment, the quantity of the anode ball 112 of each two ends anode 2 in a plurality of anode electrodes 2 is lacked than the quantity of the anode ball 112 of other anode electrode 2.In this case, the resistance value of two ends anode 2 is bigger than the resistance value of other anode electrode 2.
Thus, can suppress to flow to the electric current of lengthwise shape substrate 10 from two ends anode 2.Thereby, can make to flow to electric current that the electric current of lengthwise shape substrate 10 and anode electrode 2 from other flow to lengthwise shape substrate 10 from two ends anode 2 and equate or be close.The current density of the part that the anode electrode 2 with other of the current density of the part relative with two ends anode 2 that thus, can make lengthwise shape substrate 10 and lengthwise shape substrate 10 is relative equates or is close.
In this case, by the constant current (supply electric current) that supplies to a plurality of anode electrodes 2 is increased, can make from two ends anode 2 to flow to the electric current of lengthwise shape substrate 10 and approach not produce the higher limit of the empyreumatic electric current of coating from the electric current that other anode electrode 2 flows to lengthwise shape substrate 10.Its result can prevent that coating from burning and can improve the electroplating efficiency of lengthwise shape substrate 10.
In addition, in the electroplanting device 100 of present embodiment, a plurality of anode electrodes 2 are made of housing 110 and the anode balls 112 that are contained in this housing 110, therefore, the quantity of the anode ball 112 by adjusting each anode electrode 2 can easily be adjusted the surface-area of each anode electrode 2.Thereby, can easily make to flow to electric current that the electric current of lengthwise shape substrate 10 and anode electrode 2 from other flow to lengthwise shape substrate 10 from two ends anode 2 and equate or be close.
In addition, the diameter of each anode ball 112 for example is 10mm～30mm.Length on the above-below direction of each housing 110 for example is 100mm～500mm, length on the throughput direction of the lengthwise shape substrate 10 of housing 110 for example is 20mm～150mm, and the length with on the lengthwise shape substrate 10 vertical directions of each housing 110 for example is 20mm～80mm.
In addition, as long as the electric current that flows to lengthwise shape substrate 10 from a plurality of anode electrodes 2 is equated mutually or be close, can make the quantity of anode ball 112 of two two ends anodes 2 different, also can make the quantity of anode ball 112 of two grading electrodes 2 different, also can make the quantity of anode ball 112 of two central anodes 2 different.
In addition, the shape of the housing 110 of a plurality of anode electrodes 2 can be identical mutually, perhaps also can be different.But in a plurality of anode electrodes 2, the configuration width on the above-below direction of preferred a plurality of anode balls 112 equates.
(3) variation
In the above-mentioned the 1st and the 2nd embodiment, in plating tank 102, be provided with 6 anode electrodes 1,2, but be not limited to this, the anode electrode 1,2 more than 3～5 or 7 also can be set in plating tank 102.
In this case, it is little to be set at other the surface-area of at least 1 anode electrode 1,2 of surface area ratio of anode electrode 1,2 at two ends.And the surface-area that is preferably set to from the anode electrode 1,2 at two ends to the anode electrode 1,2 of central authorities little by little becomes big.
(4) embodiment and comparative example
Utilize 100 pairs of lengthwise shapes of electroplanting device substrate 10 to carry out the electrolysis plating under various conditions, measure the electric current that flows to each anode electrode.
(4-1) embodiment 1
In embodiment 1, adopted the electroplanting device 100 of above-mentioned the 1st embodiment.In addition, making the surface-area of each two ends anode 1 is 450cm
2, the surface-area that makes each grading electrode 1 is 750cm
2, make the surface-area of each central anode 1 be made as 1500cm
2In this case, the surface-area of two ends anode 1 be central anode 1 surface-area 30%, the surface-area of grading electrode 1 be central anode 1 surface-area 50%.
(4-2) embodiment 2 and embodiment 3
In embodiment 2 and embodiment 3, adopted the electroplanting device 100 of above-mentioned the 2nd embodiment.In embodiment 2, adopting diameter is the anode ball 112 of 27mm, and making the quantity of the anode ball 112 of each two ends anode 2 is 25, and making the quantity of the anode ball 112 of each grading electrode 2 is 45, and the quantity that makes the anode ball 112 of each central anode 2 is 80.In embodiment 3, adopting diameter is the anode ball 112 of 27mm, the quantity that makes the anode ball 112 of each two ends anode 2 is 25, making the quantity of anode ball 112 of the grading electrode 2 of the upstream side on the throughput direction of lengthwise shape substrate 10 is 45, making the quantity of anode ball 112 of the grading electrode 2 in the downstream side on the throughput direction of lengthwise shape substrate 10 is 50, and the quantity that makes the anode ball 112 of each central anode 2 is 80.
(4-3) comparative example 1
In comparative example 1, adopting the surface-area except 6 anode electrodes 1 all is 1500cm
2The electroplanting device 100 of other and the foregoing description 1 same structure outside this point.
(4-4) comparative example 2
In comparative example 2, adopt quantity except the anode ball 112 of 6 anode electrodes 2 to be respectively 80 this point the electroplanting device 100 of other and the foregoing description 2,3 same structures.
(4-5) evaluation of embodiment 1 and comparative example 1
In embodiment 1 and comparative example 1, will be adjusted into 30A, 45A and 60A from the constant current (supply electric current) that rectifier 42 flows to a plurality of anode electrodes 1, investigation flows to the electric current of strip substrate 10 from each anode electrode 1.In Fig. 5, show the electric current that in embodiment 1, flows to strip substrate 10 from each anode electrode 1.In Fig. 6, show the electric current that in comparative example 1, flows to strip substrate 10 from each anode electrode 1.
In Fig. 5 and Fig. 6, transverse axis is represented the position of each anode electrode 1 on the throughput direction (direction shown in the arrow MD) of lengthwise shape substrate 10, and the longitudinal axis represents to flow to from each anode electrode 1 electric current [A] of strip substrate 10.
As shown in Figure 5, in embodiment 1, be that the electric current that flows to strip substrate 10 from 6 anode electrodes 1 is all roughly even under any situation among 30A, 45A and the 60A supplying with electric current.On the other hand, as shown in Figure 6, in comparative example 1, be under any situation among 30A, 45A and the 60A supplying with electric current, the electric current that flows to strip substrate 10 from two ends anode 1 is all big than the electric current that flows to strip substrate 10 from central anode 1 and grading electrode 1.That is it is even, to flow to the current unevenness of strip substrate 10 from 6 anode electrodes 1.
(4-6) evaluation of embodiment 2,3 and comparative example 2
In embodiment 2,3 and comparative example 2, will be adjusted into 45A from the constant current (supply electric current) that rectifier 42 flows to a plurality of anode electrodes 2, investigation flows to the electric current of strip substrate 10 from each anode electrode 2.In Fig. 7, show the electric current that in embodiment 2,3 and comparative example 2, flows to strip substrate 10 from each anode electrode 2.
In Fig. 7, transverse axis is represented the position of each anode electrode 2 on the throughput direction (direction shown in the arrow MD) of lengthwise shape substrate 10, and the longitudinal axis represents to flow to from each anode electrode 2 electric current [A] of strip substrate 10.
As shown in Figure 7, in embodiment 2,3, the electric current that flows to strip substrate 10 from 6 anode electrodes 2 is roughly even.On the other hand, in comparative example 2, the current ratio that flows to strip substrate 10 from two ends anode 2 is big from the electric current that central anode 2 and grading electrode 2 flow to strip substrate 10.That is it is even, to flow to the current unevenness of strip substrate 10 from 6 anode electrodes 2.
According to these results as can be known, other the surface-area of anode electrode 1,2 of surface area ratio by being set at the anode electrode that is configured in two ends 1,2 in a plurality of anode electrodes 1,2 is little, can make to flow to electric current that the electric current of lengthwise shape substrate 10 and anode electrode 1,2 from other flow to lengthwise shape substrate 10 from two ends anode 1,2 and equate or be close.
Thereby, by the electric current of supplying with to a plurality of anode electrodes 1,2 is increased, can make from the anode electrode 1,2 at two ends to flow to the electric current of lengthwise shape substrate 10 and approach not produce the higher limit of the empyreumatic electric current of coating from the electric current that other anode electrode 1,2 flows to lengthwise shape substrate 10.
(5) corresponding relation of the various piece of each textural element of claim and embodiment
Below, the corresponding relation of the various piece of each textural element of claim and embodiment is described, but the present invention is not limited to following example.
In the above-described embodiment, lengthwise shape substrate 10 is the example of lengthwise shape substrate, electroplanting device 100 is the example of electroplanting device, plating tank 102 is the example of electroplate liquid accommodation section, conveying roller 101a～101d is the example of delivery section, rectifier 42 and power supply roller 50a, 50b are the example of power supply, anode electrode 1,2 is the anodic example, anode electrode 1 is the example of bar-shaped metal, anode ball 112 is the example of spherical metal, housing 110 is the example of housing, and wired circuit board 25 is the example of wired circuit board.
As each textural element of claim, also can adopt other various key elements with the described structure of claim or function.
Claims (5)
1. electroplanting device, it implements to electroplate to lengthwise shape substrate, and this electroplanting device comprises:
The electroplate liquid accommodation section, it is used to hold electroplate liquid;
Delivery section, it is used for carrying above-mentioned lengthwise shape substrate along the length direction of above-mentioned lengthwise shape substrate in above-mentioned electroplate liquid accommodation section;
A plurality of anodes more than 3, they are configured in the above-mentioned electroplate liquid accommodation section in the mode of arranging along the above-mentioned lengthwise shape substrate that is transported by above-mentioned delivery section;
Power supply, it is used for above-mentioned lengthwise shape substrate is that negative electrode ground is to applying voltage between above-mentioned lengthwise shape substrate and the above-mentioned a plurality of anode;
In this electroplanting device, other at least 1 anodic surface-area of the anodic surface area ratio that is configured in two ends in above-mentioned a plurality of anodes is little.
2. electroplanting device according to claim 1 is characterized in that,
Above-mentioned a plurality of anode is made of bar-shaped metal respectively,
The area in the above-mentioned anodic that is disposed at two ends and the vertical cross section of length direction is littler than other at least 1 anodic and the area in the vertical cross section of length direction.
3. electroplanting device according to claim 1 is characterized in that,
Above-mentioned a plurality of anode comprises a plurality of spherical metals respectively and holds the housing of above-mentioned a plurality of spherical metals,
The quantity of the above-mentioned spherical metal of anodic that is configured in two ends in above-mentioned a plurality of anode is lacked than the quantity of other 1 above-mentioned spherical metal of anodic at least.
4. electroplanting device according to claim 1 is characterized in that,
To the anode that is configured in central authorities, it is big that the anodic surface-area little by little becomes from the above-mentioned anode that is configured in two ends.
5. the manufacture method of a wired circuit board, it comprises the operation of preparing lengthwise shape substrate and above-mentioned lengthwise shape substrate is implemented the operation of electrolysis plating,
The operation of above-mentioned enforcement electrolysis plating comprises:
In accommodating the electroplate liquid accommodation section of electroplate liquid, carry the operation of above-mentioned lengthwise shape substrate along the length direction of above-mentioned lengthwise shape substrate;
To being configured in the operation that applies voltage between a plurality of anodes more than 3 in the above-mentioned electroplate liquid accommodation section and the above-mentioned lengthwise shape substrate, these a plurality of anodes are arranged along the lengthwise shape substrate that transports;
And other at least 1 anodic surface-area of the anodic surface area ratio that is configured in two ends in above-mentioned a plurality of anodes is little.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-286193 | 2009-12-17 | ||
| JP2009286193A JP2011127172A (en) | 2009-12-17 | 2009-12-17 | Plating device and method of fabricating wiring circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102127785A true CN102127785A (en) | 2011-07-20 |
| CN102127785B CN102127785B (en) | 2014-12-03 |
Family
ID=44149569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010610293.7A Expired - Fee Related CN102127785B (en) | 2009-12-17 | 2010-12-17 | Plating apparatus and method of manufacturing printed circuit board |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20110147221A1 (en) |
| JP (1) | JP2011127172A (en) |
| CN (1) | CN102127785B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103930599A (en) * | 2011-11-15 | 2014-07-16 | Posco公司 | High speed horizontal electroforming apparatus for manufacturing metal foil and method for manufacturing metal foil |
| CN105369337A (en) * | 2014-08-11 | 2016-03-02 | 亚智科技股份有限公司 | Multi-anode control device and electroplating equipment with same |
| CN110257887A (en) * | 2019-06-28 | 2019-09-20 | 上海运城制版有限公司 | A kind of electroplanting device |
| CN110306230A (en) * | 2019-06-26 | 2019-10-08 | 南安易盾格商贸有限公司 | A kind of electroplating device of flexible circuit board manufacture |
| CN111304715A (en) * | 2015-08-28 | 2020-06-19 | 株式会社荏原制作所 | Plating apparatus and plating method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103266334B (en) * | 2013-04-24 | 2015-12-02 | 东莞市鸿展机械设备有限公司 | Separated liquid transfer means |
| GB2518387B (en) | 2013-09-19 | 2017-07-12 | Dst Innovations Ltd | Electronic circuit production |
| US9393759B2 (en) * | 2013-10-24 | 2016-07-19 | General Electric Company | Metal laminate structures with systems and methods for treating |
| JP6655145B1 (en) * | 2018-10-03 | 2020-02-26 | 株式会社フジクラ | Plating equipment |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3300396A (en) * | 1965-11-24 | 1967-01-24 | Charles T Walker | Electroplating techniques and anode assemblies therefor |
| US4119515A (en) * | 1977-03-28 | 1978-10-10 | National Steel Corporation | Apparatus for electroplating sheet metals |
| FR2390517A1 (en) * | 1977-05-10 | 1978-12-08 | Coppertron Sa | INSTALLATION FOR THE ELECTRO-PRODUCTION OF COPPER IN SHEETS INTENDED TO BE APPLIED IN PARTICULAR TO DIELECTRIC MATERIALS |
| US4462874A (en) * | 1983-11-16 | 1984-07-31 | Omi International Corporation | Cyanide-free copper plating process |
| JP3328535B2 (en) * | 1997-01-22 | 2002-09-24 | 秀行 小林 | Product transport mechanism of electroplating equipment |
| KR100877923B1 (en) * | 2001-06-07 | 2009-01-12 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | Electrolytic copper plating method |
| JP3723963B2 (en) * | 2003-06-06 | 2005-12-07 | 三井金属鉱業株式会社 | Plating apparatus and film carrier tape manufacturing method for electronic component mounting |
| KR100686778B1 (en) * | 2005-01-12 | 2007-02-23 | 엘에스전선 주식회사 | Apparatus for manufacturing electrolytic metal foil |
| TW200741037A (en) * | 2006-01-30 | 2007-11-01 | Ibiden Co Ltd | Plating apparatus and plating method |
| US8177945B2 (en) * | 2007-01-26 | 2012-05-15 | International Business Machines Corporation | Multi-anode system for uniform plating of alloys |
-
2009
- 2009-12-17 JP JP2009286193A patent/JP2011127172A/en active Pending
-
2010
- 2010-12-15 US US12/968,487 patent/US20110147221A1/en not_active Abandoned
- 2010-12-17 CN CN201010610293.7A patent/CN102127785B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103930599A (en) * | 2011-11-15 | 2014-07-16 | Posco公司 | High speed horizontal electroforming apparatus for manufacturing metal foil and method for manufacturing metal foil |
| CN105369337A (en) * | 2014-08-11 | 2016-03-02 | 亚智科技股份有限公司 | Multi-anode control device and electroplating equipment with same |
| CN111304715A (en) * | 2015-08-28 | 2020-06-19 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN111304715B (en) * | 2015-08-28 | 2021-01-26 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN110306230A (en) * | 2019-06-26 | 2019-10-08 | 南安易盾格商贸有限公司 | A kind of electroplating device of flexible circuit board manufacture |
| CN110257887A (en) * | 2019-06-28 | 2019-09-20 | 上海运城制版有限公司 | A kind of electroplanting device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110147221A1 (en) | 2011-06-23 |
| JP2011127172A (en) | 2011-06-30 |
| CN102127785B (en) | 2014-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102127785B (en) | Plating apparatus and method of manufacturing printed circuit board | |
| US20060016691A1 (en) | Electrochemical deposition method utilizing microdroplets of solution | |
| US20170335485A1 (en) | Method and apparatus for electrolytically depositing a deposition metal on a workpiece | |
| CN110785515A (en) | Apparatus for manufacturing electrolytic copper foil | |
| JP6411928B2 (en) | Electrolytic plating equipment | |
| JP2015537123A (en) | Device and method for electrolytic coating of objects | |
| CN202492595U (en) | Electroplating device | |
| JPH06228791A (en) | Electroplating device | |
| EP3206236B1 (en) | Method for horizontally electrochemically depositing metal | |
| US7641775B2 (en) | Apparatus for manufacturing electrolytic metal foil | |
| KR20020042730A (en) | Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method | |
| CN102534733A (en) | Electroplating device and electroplating method | |
| CN102560612A (en) | Anode assembly for electroplating and electroplating device | |
| CN210163539U (en) | Printing pen | |
| KR100748791B1 (en) | Apparatus for perpendicular type coating and method thereof | |
| CN202509152U (en) | Anode subassembly for electroplating and electroplating device | |
| CN102787307B (en) | The manufacture method of electroless plating device, electroless plating method and wired circuit board | |
| CN202284230U (en) | Plating bath | |
| CN102459716A (en) | Method and device for the controlled electrolytic treatment of thin layers | |
| JP2012527525A (en) | Method and apparatus for controlling electrochemical surface treatment | |
| EP2436805A1 (en) | Barrel apparatus for barrel plating | |
| US5939677A (en) | Roller electrode for use in a continuous electroplating process | |
| JP2009256772A (en) | Electrode base body in electrolytic metal foil production apparatus | |
| ES2252661T3 (en) | ELECTRODEPOSITION CHAIN WITH MECHANICAL CONVEYORS AND METHOD OF ELECTROLYTIC METALLIC COATING OF A PART TO BE HANDLED. | |
| CN202492609U (en) | Anode assembly for electroplating and electroplating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20161217 |