CN102122560A - Method for manufacturing inductive element - Google Patents
Method for manufacturing inductive element Download PDFInfo
- Publication number
- CN102122560A CN102122560A CN2010100014970A CN201010001497A CN102122560A CN 102122560 A CN102122560 A CN 102122560A CN 2010100014970 A CN2010100014970 A CN 2010100014970A CN 201010001497 A CN201010001497 A CN 201010001497A CN 102122560 A CN102122560 A CN 102122560A
- Authority
- CN
- China
- Prior art keywords
- coil
- ferro
- inductance element
- silicium
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a method for manufacturing an inductive element, comprising the steps of: manufacturing the inductive element by utilizing a die, wherein the die comprises a lower die core and an upper die core; causing the lower die core and the upper die core to relatively move to a filling position and an extrusion position along an axial direction; when the lower die core is located at the filling position, filling an iron silicon alloy material into a first space formed by the lower die core; placing a coil in the iron silicon alloy material in the first space and exposing an extension part of the coil out of the iron silicon alloy material; placing the upper die core at the filling position and filling the iron silicon alloy material into a second space formed by the upper die core to cover the coil body; then moving the upper and lower die cores to the extrusion position to ensure that the iron silicon alloy material is combined with the coil; and solidifying the iron silicon alloy material to ensure that the coil body is fixed in the iron silicon alloy material, wherein high magnetic conductivity is generated by matching the iron silicon alloy material with an integrated structure, the number of turns of the coil is reduced and the cost of the metal material of the coil is low so that the inductive element with low cost, low loss and high magnetic conductivity can be integrated.
Description
Technical field
The invention provides a kind of manufacture method of inductance element, refer to utilize especially down that die and upper cores relatively move in filler position and extrusion position, make it produce one-body molded, with low cost and have the inductance element of low-loss high permeability.
Background technology
Inductance element generally belongs to auxiliary character, and it mainly acts on the variation that is to hinder electric current, in order to keep the stability of electronic product.The form of its structure can be according to the difference of application circuit collocation, and designs not isostructure.The application circuit of inductor mainly is divided into two big classes at present, and one is the signal purposes, for example the application of store energy and inhibition immediate current etc.; Another kind of then is the noise suppressed purposes, as electromagnetic interference (ElectromagneticDisturbance, EMI) inhibition and noise filtering etc.
The product performance of inductance element mainly is subjected to core material to be influenced.Iron core is positioned at the hub of a spool position, is divided into two kinds of pottery and Ferrite Materials.The pottery iron core is the signal purposes, as ceramic wire-wound inductor and multilayer ceramic inductance; Ferrite iron core then is used to suppress electromagnetic interference, as choke (Power Choke), Tao Tie magnetic bead (Ferrite Bead, FB) and magnetic core (Ferrite Core).
And inductance element also can be divided into two kinds of winding-type and stack-up types according to structure, and wherein winding-type be the technology of generally using, it has, and loss is little, allowable current big, simply, low cost and other advantages, but its structure is subjected to the restriction of miniaturization.According to electromagnetic theory, be Inductive component with the coil Wound core, the past, how traditional inductance element was produced with the coiling form.The winding-type inductance element on the one hand can utilize the coil thickness to control anti-electric current, and also the may command pitch of the laps number of turns is adjusted inductance value on the other hand, and product design is than tool elasticity, however volume its shortcoming more greatly.
The mode that the existing manufacture method of utilizing ferro-silicium to make inductance element is assembled for the ferro-silicium material use that utilizes piece-shape type or block formula forms inductance element, please refer to Figure 10, it is the side cutaway view of existing inductance element, can find out by clear among the figure, this inductance element A includes loop A 1, and be provided with the ferro-silicium materials A 2 of piece-shape type or block formula in loop A 1 outer set, and the surfaces externally and internally of ferro-silicium materials A 2 all is formed with insulating barrier A3, and the group mode of establishing must be closed processing by a gluing, just can cause numerous and diverse operation and increase cost, on the other hand, mode by assembling makes loop A 1 be sleeved in the ferro-silicium materials A 2 by through hole A11, can there be space A4 unavoidably, so loop A 1 periphery just produces bigger magnetic-path (Le), and the through hole A11 inner periphery of loop A 1 is subjected to the influence of space A 4 and produces less sectional area, just make loop A 1 cause bigger electromagnetism rate loss, and also can't effectively reduce the thickness and the number of turns of coil, make metal material day by day down rare, the material cost of the required burden of enterprise is got over expensive.
So according to the consideration of above-mentioned all somes disappearance, the inventor analyses in depth and inquires at doing one on the characteristic of inductance element, and via assessing in many ways and consider, and by doing painstaking research and researching and developing, the beginning is designed the patent of invention of the manufacture method of this kind inductance element.
Summary of the invention
The inventor is because the disappearance of prior art, be manufacturing experience and the technology accumulation of being engaged in inductance element according to it, method at the various solutions of the concentrated research of above-mentioned disappearance, through after continuous research and the improvement, the development and Design invention that goes out a kind of manufacture method of brand-new inductance element finally is born.
The main purpose of the present invention inductance element that is formed in one out, its method is to utilize a mould, it includes down die and upper cores, can prolong one and axially relatively move to filler position and extrusion position, just can make the ferro-silicium material be filled to down die and be arranged in formed first space, filler position, put coil again in the ferro-silicium material in first space, and the extension of coil placed outside the ferro-silicium material, filling the ferro-silicium material once more moves in formed second space, filler position in upper cores, coil body is covered by the ferro-silicium material, die was in extrusion position under mobile afterwards upper cores reached, make the ferro-silicium material be squeezed and then combine with coil, carry out the curing schedule of ferro-silicium material again, coil body is fixed in the ferro-silicium material, so, do not have the space in the integrated inductance element, making coil hole body on every side is to be formed with bigger sectional area, and body is formed with short magnetic-path respectively around the hole, just can produce the inductance element of low-loss high permeability, making the integrated structure of ferro-silicium material fit is the effect with high permeability, the coil quantity of coil body need not twined too much, also can reach identical or better magnetic conduction effect, and then reduce material cost.
Secondary objective of the present invention is after the ferro-silicium material covering coil body, utilize upper cores to reach die extruding ferro-silicium material down, after being squeezed, the ferro-silicium material just can combine with coil, afterwards, the curing schedule that heats again just can make coil firmly fit mutually with the ferro-silicium material.
Description of drawings
Fig. 1 is the manufacturing flow chart of inductance element of the present invention.
Fig. 2 is the end view of die under the present invention and upper cores folding.
Fig. 3 fills the end view of ferro-silicium material for the present invention.
Fig. 4 puts the end view of coil on following die for the present invention.
Fig. 5 is positioned at the end view of filling position for upper cores of the present invention.
Fig. 6 fills the end view of ferro-silicium material once more for the present invention.
Fig. 7 is the side-looking of die under the present invention and upper cores impact extrusion ferro-silicium material.
Fig. 8 is the stereo appearance figure of inductance element moulding of the present invention.
Fig. 9 is the side cutaway view of inductance element moulding of the present invention.
Figure 10 is the side cutaway view of existing inductance element.
[main element symbol description]
1, following die
101, first space 112, groove
11, pedestal 12, Xia Chong
111, through hole
2, upper cores
21, middle mould 22, upper punch
211, through hole 201, second space
3, inductance element
31, ferro-silicium material 322, extension
32, coil 3210, hole
321, body
4, pay-off
A, inductance element
A1, loop A 3, insulating barrier
A11, through hole A4, space
A2, ferro-silicium material
Embodiment
For reaching above-mentioned purpose and effect, the technology used in the present invention means and structure thereof, drawing now illustrates in detail that with regard to preferred embodiment of the present invention its feature and function are as follows, understand fully in order to do profit.
Please also refer to Fig. 1～Fig. 7, manufacturing flow chart for inductance element of the present invention, the end view of following die and upper cores folding, fill the end view of ferro-silicium material, put the end view of coil on following die, upper cores is positioned at the end view of filling position, fill the end view of ferro-silicium material and the end view of following die and upper cores impact extrusion ferro-silicium material once more, can find out by clear among the figure, the present invention produces integrated inductance element for utilizing a mould, its mould is for including down die 1 and upper cores 2, and can make down die 1 and upper cores 2 axially relatively move to filler position and extrusion position for prolonging one, its manufacturing process includes:
(100) packing material makes down die 1 be positioned at the filler position, and ferro-silicium material 31 is filled to down in die 1 formed first space 101.
(101) put coil, put coil 32 in the ferro-silicium material 31 in first space 101, and the extension 322 of coil 32 is exposed outside the ferro-silicium material 31.
(102) packing material makes upper cores 2 be positioned at the filler position, and upper cores 2 forms second space 201 with coil 32 bodies 321, and ferro-silicium material 31 is filled in second space 201, covers coil 32 bodies 321.
(103) mould impact extrusion is positioned at upper cores 2 and following die 1 in extrusion position, makes ferro-silicium material 31 and coil 32 mutually combine.
(104) curing molding solidifies ferro-silicium material 31, and sets firmly coil 32 bodies 321 in ferro-silicium material 31.
(105) the moulding inductor element 3.
The manufacture method of the one-body molded inductance element of the present invention is die 1 and a upper cores 2 under the first folding, and mobile die 1 down is to the filler position, carry out the filler step first time (lst Fill With Material), know clearly it, following die 1 is for including pedestal 11, and pedestal 11 is for having through hole 111, make down and dash 12 movable displacements in through hole 111, and pedestal 11 with dash down 12 when the filler position for having drop, meaning promptly, dashing 12 down is positioned at away from upper cores 2, and pedestal 11 is bordering on the mode of upper cores 2 and is provided with, and dash down 12 and pedestal 11 be enclosed with first space 101 because of drop, so, just can make down die 1 folding when the filler position, pay-off 4 is for being filled to ferro-silicium material 31 in first space 101.
Moreover, after ferro-silicium material 31 is inserted first space 101, put coil step (Position Coil), meaning promptly further is placed in down coil 32 2 of die 1 and upper cores, the part body 321 of coil 32 can be placed in the ferro-silicium material 31 in first space 101, and the surface that pedestal 11 is adjacent to upper cores 2 is the groove 112 with L kenel, the extension 322 of coil 32 is put wherein, the extension 322 of coil 32 is exposed outside the ferro-silicium material 31, avoid the extension 322 of coil 32 to be coated by ferro-silicium material 31, cause the product defect situation that can't electrically connect with circuit board, the kenel of this groove 112 can have different kenel or the modes of being provided with the pattern of extension 322 or position, yet, above-mentioned kenel or the mode of being provided with is not limited among the present invention only for the embodiment of the present invention's explanation.
Afterwards, mobile again upper cores 2 is in the filler position, carry out the filler step second time (2st Fill With Material), know clearly it, upper cores 2 is mould 21 in including, and middle mould 21 is for having through hole 211, make upper punch 22 movable displacements in through hole 211, when upper punch 22 with middle mould 21 during in initial position for having drop, the definition of this drop is, upper punch 22 is away from following die 1, and the mode that middle mould 21 is bordering on counterdie benevolence 1 is provided with, when if upper cores 2 moves to the filler position, then mould 21 is to move to the surface that pedestal 11 is provided with coil 32 extensions 111 in the expression, at this moment, middle mould 21 and coil 32 are for can produce second space 201, and extension 111 clampings that also can make coil 32 are in 21 of pedestal 11 and middle moulds, and the position of fixed coil 32 between following die 1 and upper cores 2, carry out secondary filler action again, similarly, it is filled to ferro-silicium material 31 in second space 201 for utilizing pay-off 4, makes second space 201 cover coil 32, so just can make body 321 external packets of coil 32 be covered with ferro-silicium material 31.
And after the body 321 of coil 32 coats ferro-silicium material 31, die 1 and upper cores 2 are to extrusion position under moving, that is to say, utilize respectively behind following die 1 and upper cores 2 matched moulds and dash the 12 ferro-silicium materials 31 that reach from lower to upper in upper punch 22 impact extrusion (Compacting Press) first space 101 and second space 201 down, and make ferro-silicium material 31 coil 32 bodies 321 that mutually combine, carry out the curing schedule of ferro-silicium material 31 again, this curing schedule is for including ultraviolet irradiation or heating, removing originally is contained moisture in the fluid properties ferro-silicium material 31, make coil 32 bodies 321 be fixedly arranged in the ferro-silicium material 31 so just plastic inductance element 3.
Afterwards, move back mould step (Unloading theWorking Article) again, the inductance element 3 of moulding is withdrawed from down 2 of die 1 and upper cores, and inductance element 3 itself also can carry out insulation processing.
Please also refer to Fig. 8,9 again, stereo appearance figure and side cutaway view for inductance element moulding of the present invention, can find out by clear among the figure, inductance element 3 after the moulding is for including ferro-silicium material 31 and coil 32, inductance element 3 after the moulding of the present invention is the surface mount kenel, it utilizes the surface adhering mode, and (Surface mount technology is SMT) with circuit board (graphic not shown) Joint.
In general, for making inductance element 3 for having good permeance, therefore the present invention coats coil 32 for utilizing ferro-silicium, its ferro-silicium can be a powder kenel, and the ferro-silicium powder is for further including the glue material, and this glue material and ferro-silicium powder are for being uniformly mixed to form ferro-silicium material 31.
Learn by above-mentioned, inductance element 3 is for including the ferro-silicium material 31 of coil 32 and coating coil 32 outsides, wherein coil 32 is that metal material is made, it is for having body 321, this body 321 is a pitch of the laps kenel, it is in order to formation magnetic field, and has extension 322 in body 321 dual side-edges, and extension 322 is for carrying out the positive and negative polarities portion of affixed step with circuit board.
And because of body 321 is a pitch of the laps kenel, it is for being penetrated with hole 3210, similarly, also form ferro-silicium material 31 in this hole 3210,321 of bodies around this moment hole 3210 are for to be formed with bigger sectional area (Ae), and the body 321 around the hole 3210 is formed with the magnetic-path (Le) of weak point respectively, not only can make this kind inductance element 3 higher for having permeability, the advantage that the power loss rate is low also can effectively reduce the cost of ferro-silicium material 31 materials.
In general, coil 32 is all by metal material, as manufacturings such as copper, albronzes, yet, these a little metal materials are down rare day by day, material price is expensive day by day, utilize ferro-silicium material 31 to coat coil 32 bodies 321, and then moulding inductor element 3, just can be because of ferro-silicium material 31 high permeability and these integrated structures of arranging in pairs or groups that produced own, inductance element 3 can be reached under the identical or better magnetic conduction effect,, effectively reduce the cost of metal material for reducing the number of turns of coil 32 bodies 321 relatively.
And utilize above-mentioned manufacture just the ferro-silicium material 31 of inductance element 3 can't be able to be had the space for the coil 32 that mutually combines, therefore inductance element 3 also can have the smaller volume kenel, at electronic installation day by day under the microminiaturization, these less inductance element 3 kenels are occupied littler space for providing under the situation of better function.
In sum, the above-mentioned inductance element 3 of the present invention is when making, for having following advantage:
(1) the present invention is displaced between filler position and extrusion position for die 1 and upper cores 2 under the utilization, formed first space 101 when making ferro-silicium material 31 can insert down die 1 to be arranged in the filler position, put coil 32 again in the ferro-silicium material 31 in first space 101, and the extension 322 that exposes coil 32 is outside ferro-silicium material 31, recharging ferro-silicium material 31 to upper cores 3 moves in formed second space 201, filler position, and make ferro-silicium material 32 cover coil 32 bodies 321, die 1 and upper cores 2 are in extrusion position under moving again, extruding ferro-silicium material 31 combines with coil 32, solidify ferro-silicium material 31 again, coil 32 bodies are fixed in the ferro-silicium material 31, by integrated manufacture, just can make and avoid producing the space in the inductance element 3, the body 321 that makes coil 32 holes 3210 both sides is for being formed with bigger sectional area, and both sides body 321 is formed with short magnetic-path respectively, just can produce the inductance element 3 of low-loss high permeability, and this integrated inductance element 3 is cooperated utilizes ferro-silicium material 31 to coat coil 32 outsides, have on the high magnetic conduction efficient at ferro-silicium material 31, the coil quantity of coil 32 bodies 321 need not twined too much, also can reach identical or better magnetic conduction effect, just can effectively reduce the material cost of coil.
(2) inductance element 3 of the present invention pushes ferro-silicium material 31 simultaneously for die 1 and upper cores 2 under the utilization, and ferro-silicium material 31 is combined with coil 32, the step that is heating and curing again just can make coil 32 bodies 322 firmly be fixed in ferro-silicium material 31 inside.
The above only is preferred embodiment of the present invention, and is non-so promptly limit to claim of the present invention, so simple and easy modification that every utilization specification of the present invention and accompanying drawing content are done and equivalent structure change, all should in like manner be contained in the claim of the present invention.
In sum, the above-mentioned inductance element of the present invention for reaching its effect and purpose really, so the present invention really is the invention of a practicality excellence, for meeting the application requirement of patent of invention, is filed an application when making in accordance with the law.
Claims (7)
1. the manufacture method of an inductance element, outstanding pointer is to the integral formation method of the inductance element of surface adhesion type attitude, and this inductance element is characterized in that for including coil and ferro-silicium material step includes:
(A) make down die be positioned at the filler position, the ferro-silicium material is filled to down in formed first space of die;
(B) put coil in the ferro-silicium material in first space, and the extension of coil is exposed outside the ferro-silicium material;
(C) make upper cores be positioned at the filler position, upper cores and coil body form second space, and the ferro-silicium material is filled in second space, cover coil body;
(D) mould impact extrusion is positioned at upper cores and following die in extrusion position, makes ferro-silicium material and coil mutually combine;
(E) curing molding solidifies the ferro-silicium material, and sets firmly coil body in the ferro-silicium material;
(F) moulding inductor element.
2. the manufacture method of inductance element according to claim 1 is characterized in that, this time die is for including pedestal, and pedestal is for having through hole, makes down towards movable displacement in through hole and produce filler position and extrusion position.
3. as the manufacture method of inductance element as described in the claim 2, it is characterized in that serving as reasons down and dash and pedestal surrounds in this first space.
4. as the manufacture method of inductance element as described in the claim 2, it is characterized in that this pedestal is adjacent to the surface of upper cores for having groove, just the extension of coil is put wherein.
5. as the manufacture method of inductance element as described in the claim 4, it is characterized in that this groove is the L kenel.
6. the manufacture method of inductance element according to claim 1, it is characterized in that, this upper cores is for including middle mould, and middle mould is for having through hole, make the movable displacement of upper punch in through hole and produce filler position and extrusion position, if upper cores is when moving to the filler position, middle mould is to move to the surface that pedestal is provided with the coil extension, and middle mould and coil are for can produce second space.
7. the manufacture method of inductance element according to claim 1 is characterized in that, this curing schedule is the mode by heating, makes the glue material sclerosis in the ferro-silicium material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100014970A CN102122560A (en) | 2010-01-12 | 2010-01-12 | Method for manufacturing inductive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100014970A CN102122560A (en) | 2010-01-12 | 2010-01-12 | Method for manufacturing inductive element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102122560A true CN102122560A (en) | 2011-07-13 |
Family
ID=44251091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010100014970A Pending CN102122560A (en) | 2010-01-12 | 2010-01-12 | Method for manufacturing inductive element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102122560A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102360908A (en) * | 2011-10-20 | 2012-02-22 | 和瑞电子(中山)有限公司 | Device and method for producing integrally formed inductor |
| CN103035395A (en) * | 2011-10-09 | 2013-04-10 | 弘邺科技有限公司 | Shaping method of inductance element |
| CN105575644A (en) * | 2014-11-07 | 2016-05-11 | 昆山玛冀电子有限公司 | Fabrication method for inductor free of welding point |
| CN106158248A (en) * | 2016-08-31 | 2016-11-23 | 和瑞电子(中山)有限公司 | A kind of line bag method for implantation |
| CN110381715A (en) * | 2018-04-13 | 2019-10-25 | 乾坤科技股份有限公司 | Shielding magnetic device and its manufacturing method |
| CN111243853A (en) * | 2020-03-02 | 2020-06-05 | 深圳市铂科新材料股份有限公司 | Manufacturing method of integrally-formed high-density inductor |
-
2010
- 2010-01-12 CN CN2010100014970A patent/CN102122560A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103035395A (en) * | 2011-10-09 | 2013-04-10 | 弘邺科技有限公司 | Shaping method of inductance element |
| CN102360908A (en) * | 2011-10-20 | 2012-02-22 | 和瑞电子(中山)有限公司 | Device and method for producing integrally formed inductor |
| CN105575644A (en) * | 2014-11-07 | 2016-05-11 | 昆山玛冀电子有限公司 | Fabrication method for inductor free of welding point |
| CN106158248A (en) * | 2016-08-31 | 2016-11-23 | 和瑞电子(中山)有限公司 | A kind of line bag method for implantation |
| CN110381715A (en) * | 2018-04-13 | 2019-10-25 | 乾坤科技股份有限公司 | Shielding magnetic device and its manufacturing method |
| CN111243853A (en) * | 2020-03-02 | 2020-06-05 | 深圳市铂科新材料股份有限公司 | Manufacturing method of integrally-formed high-density inductor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102009694B1 (en) | Method of manufacturing surface mount multiphase inductor | |
| KR102009696B1 (en) | Surface mount multiphase inductor and method of manufacturing the same | |
| KR101866150B1 (en) | Surface-mounted inductor and manufacturing method therefor | |
| JP4049246B2 (en) | Coil-enclosed magnetic component and method for manufacturing the same | |
| CN101790766B (en) | Coil component and method for manufacturing coil component | |
| CN102122560A (en) | Method for manufacturing inductive element | |
| CN101098087B (en) | Magnetic powder metal composite core for electrical machines | |
| CN103915236A (en) | Novel inductor and manufacturing method thereof | |
| CN103295754A (en) | Method of manufacturing surface mount inductor | |
| CN102856037A (en) | Power inductance element formed by molding and manufacturing method thereof | |
| CN104616878B (en) | A kind of miniature molding inductance element and its manufacturing method | |
| US9907184B2 (en) | Manufacturing method for a power supply module | |
| CN107452466B (en) | Electronic component | |
| JP2019186279A (en) | Surface-mount inductor and manufacturing method thereof | |
| CN112289542A (en) | Inductor and integrated forming method | |
| JP5944373B2 (en) | Electronic component manufacturing method, electronic component | |
| CN101414505A (en) | Inductance structure | |
| TW201123226A (en) | Method for manufacturing inductors. | |
| JP2006019706A (en) | Coil-encapsulated dust core manufacturing method and coil encapsulated dust core | |
| CN111627650B (en) | Magnetic element and preparation method thereof | |
| CN105575644A (en) | Fabrication method for inductor free of welding point | |
| KR102310477B1 (en) | Inductor and producing method of the same | |
| CN104681267A (en) | Manufacturing method of chip type inductor | |
| CN201681688U (en) | Magnetic core-replaceable inductance component | |
| CN201266533Y (en) | Improved structure for inducer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110713 |