CN102121639B - Backlight module and assembling method thereof - Google Patents
Backlight module and assembling method thereof Download PDFInfo
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- CN102121639B CN102121639B CN 201110009691 CN201110009691A CN102121639B CN 102121639 B CN102121639 B CN 102121639B CN 201110009691 CN201110009691 CN 201110009691 CN 201110009691 A CN201110009691 A CN 201110009691A CN 102121639 B CN102121639 B CN 102121639B
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- 238000000034 method Methods 0.000 title claims description 19
- 238000004020 luminiscence type Methods 0.000 claims description 82
- 230000003287 optical effect Effects 0.000 claims description 28
- 239000004568 cement Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 3
- 240000001439 Opuntia Species 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
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Abstract
A backlight module comprises a substrate, a light guide plate, a light guide block and a light emitting component. The light guide plate is provided with a first light incident surface, and the first light incident surface is provided with a first thickness. The light guide block is provided with a second light incident surface and a second light emergent surface, and the second light emergent surface is opposite to the first light incident surface. The second light-emitting surface has a second thickness, the second light-incident surface has a third thickness, the second thickness of the second light-emitting surface is smaller than or equal to the first thickness of the first light-incident surface, and the second light-emitting surface is covered by the first light-incident surface. The light emitting assembly is arranged opposite to the second light incident surface of the light guide block, the light emitting assembly has a fourth thickness, the fourth thickness of the light emitting assembly is smaller than or equal to the third thickness of the second light incident surface, and a light emitting surface of the light emitting assembly is covered by the second light incident surface.
Description
Technical field
The present invention relates to a kind of backlight module and its assemble method, particularly a kind of backlight module and assemble method thereof with the leaded light piece that can promote light utilization efficiency.
Background technology
Recently, development along with display panels, the electronic product of various application display panels is mobile phone (Mobile Phone) for example, and the designer trends of personal digital assistant (PDA) and mobile computer (Notebook) etc. are all towards light, thin, short, little development.Wherein, the electronic product of slimming is consumed especially popular institute and is liked, therefore the backlight module that is used to provide backlight uses the light emitting diode (LED) of small volume to replace the relatively large cathode fluorescent tube (CCFL) of traditional volume as light source generator, in order to reduce the volume of backlight module gradually.Therefore, be used in the design that LGP in the backlight modular structure in the liquid crystal display also tends to slimming.Yet, because LGP and the difference in thickness between light emitting diode of slimming are excessive, and cause both light utilization efficiencies after assembling to need further to improve.
Please refer to Fig. 1.Fig. 1 is the generalized section of prior art backlight modular structure.As shown in Figure 1, prior art backlight module 10 comprises the side that a LGP 11 and a plurality of light-emitting diode component 12 are arranged at LGP 11.LGP 11 has an incidence surface 111, and the incidence surface 111 of LGP 11 has one first thickness H1.Each light-emitting diode component 12 has one second thickness H2, and the second thickness H2 of each light-emitting diode component 12 is greater than the first thickness H1 of the incidence surface 111 of LGP 11.Because of between the two difference in thickness, cause light-emitting diode component 12 can't be fully by the incidence surface 111 of LGP 11 to covering.Therefore, the part light 121 that the light-emitting diode component 12 that is not covered by the incidence surface 111 of LGP 11 is launched can't directly enter in the incidence surface 111 of LGP 11, and causes the loss of light, and then reduces the utilization rate of light.Therefore, the light utilization efficiency of prior art backlight module 10 needs further to improve.
Summary of the invention
Technical problem to be solved by this invention provides a kind of backlight module and assemble method thereof in order to the light utilization efficiency that promotes backlight module.
To achieve these goals, the invention provides a kind of backlight module, comprise a substrate, a LGP, a leaded light piece and a luminescence component.LGP has one first incidence surface, and the first incidence surface has one first thickness.The leaded light piece has one second incidence surface and one second exiting surface, and the second exiting surface and the first incidence surface are oppositely arranged.The second exiting surface has one second thickness, and the second incidence surface has one the 3rd thickness, and the second thickness of the second exiting surface is less than or equal to the first thickness of the first incidence surface, and the second exiting surface is covered by the first incidence surface.Luminescence component and the second incidence surface are oppositely arranged, and wherein luminescence component has one the 4th thickness, and the 4th thickness of luminescence component is less than or equal to the 3rd thickness of the second incidence surface, and a light-emitting area of luminescence component is covered by this second incidence surface.
In order to realize better above-mentioned purpose, the present invention also provides a kind of assemble method of backlight module, comprises the following steps.One LGP is provided, and wherein LGP has one first incidence surface, and the first incidence surface has one first thickness.One leaded light piece is provided, and wherein the leaded light piece has one second incidence surface and one second exiting surface, and the second exiting surface has one second thickness, and the second incidence surface has one the 3rd thickness, and the second thickness of the second exiting surface is less than or equal to the first thickness of the first incidence surface.Then, utilize the first incidence surface of the bonding LGP of an optical cement and the second exiting surface of leaded light piece.A plurality of luminescence components, wherein luminescence component has one the 4th thickness, and the 4th thickness of each luminescence component is less than or equal to the 3rd thickness of the second incidence surface.At last, the second incidence surface of luminescence component and leaded light piece is oppositely arranged, and a light-emitting area of luminescence component is covered by the second incidence surface.
Technique effect of the present invention is: backlight module of the present invention and its assemble method are by arranging a leaded light piece between luminescence component and LGP, wherein, the thickness of luminescence component is less than or equal to the thickness of the incidence surface of leaded light piece, and the thickness of the exiting surface of leaded light piece is less than or equal to the thickness of the incidence surface of LGP.By this, the light-emitting area of luminescence component is covered by the incidence surface of leaded light piece, and the exiting surface of leaded light piece is covered by the incidence surface of LGP, therefore the light that can effectively luminescence component be produced imports in the LGP, and then significantly promotes the light utilization efficiency of backlight module.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the generalized section of prior art backlight modular structure;
Fig. 2 A is the schematic diagram of the backlight module of the present invention's one first preferred embodiment;
Fig. 2 B is the schematic diagram of alternate embodiment of the backlight module of the present invention's one second preferred embodiment;
Fig. 3 is the generalized section along the backlight module of the hatching line A-A ' of Fig. 2 A and Fig. 2 B;
Fig. 4 A is the leaded light piece of one embodiment of the invention and the local enlarged diagram of luminescence component;
Fig. 4 B is the leaded light piece of Fig. 4 A and the generalized section of luminescence component;
Fig. 5 A is the leaded light piece of another embodiment of the present invention and the local enlarged diagram of luminescence component;
Fig. 5 B is the leaded light piece of Fig. 5 A and the generalized section of luminescence component;
Fig. 6 is the generalized section of the backlight module of another preferred embodiment of the present invention;
Fig. 7 to Figure 10 is the schematic diagram of assemble method of the backlight module of a preferred embodiment of the present invention.
Wherein, Reference numeral
10 backlight modules, 11 LGPs
12 light-emitting diode components
111 incidence surfaces, 121 light
H1 the first thickness H2 the second thickness
20 backlight modules, 21 LGPs
22 leaded light pieces, 23 luminescence components
24 reflecting plates, 25 frameworks
26,29 optical cements, 27 platforms
211 first incidence surfaces, 212 first exiting surfaces
213 bottom surfaces, 214 end faces
221 second incidence surfaces, 222 second exiting surfaces
223 bottom surfaces, 224 end faces
231 light-emitting areas, 251 reflectings surface
28 driven unit T1 the first thickness
T2 the second thickness T 3 the 3rd thickness
T4 the 4th thickness
The specific embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
Please refer to Fig. 2 A, Fig. 2 B and Fig. 3.Fig. 2 A be the present invention's one first preferred embodiment backlight module on look schematic diagram, Fig. 2 B be the present invention's one second preferred embodiment backlight module alternate embodiment on look schematic diagram, Fig. 3 is the generalized section along the backlight module of the hatching line A-A ' of Fig. 2 A and Fig. 2 B, wherein be subject to the angle that illustrates different, the part assembly is not illustrated in the partial graph.Such as Fig. 2 A, Fig. 2 B and shown in Figure 3, the backlight module 20 of the present embodiment comprises that a LGP 21, at least one leaded light piece 22, a plurality of luminescence component 23, a reflecting plate 24 are (for ease of explanation, do not draw reflecting plate 24 among Fig. 2 A, Fig. 2 B) and a framework 25 (for ease of explanation, not drawing framework 25 among Fig. 2 A, Fig. 2 B).LGP 21 has one first incidence surface 211 and one first exiting surface 212, and leaded light piece 22 has one second incidence surface 221 and one second exiting surface 222.One bottom surface 223 of one bottom surface 213 of LGP 21, leaded light piece 22 is arranged on the same level with a bottom surface 233 of luminescence component 23.The second exiting surface 222 of leaded light piece 22 is oppositely arranged with the first incidence surface 211 of LGP 21, and the second exiting surface 222 of leaded light piece 22 is covered by the first incidence surface 211 of LGP 21, also namely the optical range that goes out of the second exiting surface 222 is positioned at entering within the optical range of the first incidence surface 211, and the light that is penetrated by the second exiting surface 222 by this can enter the first incidence surface 211 fully.In addition, the first incidence surface 211 of LGP 21 has one first thickness T 1, and the second exiting surface 222 of leaded light piece 22 and the second incidence surface 221 have respectively one second thickness T 2 and one the 3rd thickness T 3.The second thickness T 2 of the second exiting surface 222 of leaded light piece 22 is less than or equal to the first thickness T 1 of the first incidence surface 211 of LGP 21, and the present embodiment equals the first thickness T 1 take the second thickness T 2 form is the example explanation, but not as limit.Each luminescence component 23 has a light-emitting area 231, and the second incidence surface 221 of light-emitting area 231 and leaded light piece 22 is oppositely arranged.Each luminescence component 23 has one the 4th thickness T 4, and the 4th thickness T 4 of each luminescence component 23 is less than or equal to the 3rd thickness T 3 of the second incidence surface 221 of leaded light piece 22, and the light-emitting area 231 of luminescence component 23 can be covered by the second incidence surface 221.The present embodiment equals the 3rd thickness T 3 as the example explanation take the 4th thickness T 4, but not as limit.By above-mentioned configuration, the light that the light-emitting area 231 of luminescence component 23 is sent can fully enter leaded light piece 22, penetrate leaded light piece 22 and enter LGP 21 via the first incidence surface 211 via the second exiting surface 222 again via the second incidence surface 221, offers the display panels (not shown) that is positioned at the first exiting surface 212 tops by the first exiting surface 212 ejaculations of LGP 21 more at last and uses as backlight.
In the embodiment shown in Fig. 2 A, leaded light piece 22 is single existence and a side that is arranged at LGP 21, but not as limit.For example, shown in the alternate embodiment shown in Fig. 2 B, leaded light piece 22 can be a plurality of existence, be arranged between luminescence component 23 and the LGP 21, and the number of leaded light piece 22 and setting position can be adjusted according to number and the setting position retinue of luminescence component 23.In the present embodiment, luminescence component 23 can be for example light-emitting diode component, but not as limit, also can be other all types of luminescence component, and does not also limit and use a plurality of luminescence components 23 and can use single luminescence component 23.For example, luminescence component 23 also can be a fluorescent tube for example cathode fluorescent tube (CCFL) or be provided with the striation (light bar) of single or multiple luminescence component.In addition, framework 25 is arranged at the top of each luminescence component 23 and leaded light piece 22, and framework 25 has a reflecting surface 251, by this can be with light reflection to leaded light piece 22 inside, to increase light utilization efficiency.In addition, equal among the embodiment of the first thickness T 1 of the first incidence surface 211 in the second thickness T 2 of the second exiting surface 222, or equal among the embodiment of the 3rd thickness T 3 of the second incidence surface 221 in the 4th thickness T 4 of luminescence component 23, the assembling of backlight module 20 can be on a platform, carried out, the effect that reduces light loss can be reached to reduce assembly error.
In other embodiments, when the second thickness T 2 of using the second exiting surface 222 during less than the design of the first thickness T 1 of the first incidence surface 211, even because dimensional tolerance or the bad situation of the contraposition in assembling process of each assembly, and when causing assembly error to occur, still can guarantee the optical range that enters that optical range can be positioned at the first incidence surface 211 that of the second exiting surface 222 less than the design of the first thickness T 1 by the second thickness T 2, and make the light that penetrates via leaded light piece 22 can enter in the LGP 21 fully, and the situation of light loss can not occur, but not as limit.In addition, in other embodiments, when the 4th thickness T 4 of using luminescence component 23 during less than the design of the 3rd thickness T 3 of the second incidence surface 221 of leaded light piece 22, even during because of the dimensional tolerance of each assembly or the error that the bad situation of the contraposition in assembling process causes generation, by the design of the 4th thickness T 4 less than the 3rd thickness T 3, still can guarantee each luminescence component 23 light-emitting area 231 go out the entering within the optical range of the second incidence surface 221 that optical range can be positioned at leaded light piece 22, and so that luminescence component 23 emitted light can enter in the second incidence surface 221 of leaded light piece 22 fully, and the situation of light loss can not occur.
In the present embodiment, the section shape of leaded light piece 22 similar is trapezoidal, that is to say, the second incidence surface 221 of leaded light piece 22 is two parallel planes with the second exiting surface 222, the bottom surface 223 of leaded light piece 22 is a plane, and the end face 224 of leaded light piece 22 has an interior recess, but not as limit.For example be less than or equal under the condition of the first thickness T 1 of the first incidence surface 211 of LGP 21 in the second thickness T 2 that meets the second exiting surface 222, and be less than or equal in the 4th thickness T 4 that meets each luminescence component 23 under the condition of the 3rd thickness T 3 of the second incidence surface 221 of leaded light piece 22, the section shape of leaded light piece 22 can be arbitrary rule or irregular geometry.In addition, in the present embodiment the bottom surface 213 of LGP 21, the bottom surface 223 of leaded light piece 22 and the bottom surface 233 of each luminescence component 23 are arranged on the same level, can reduce the light bang path, also can reduce simultaneously the loss that causes the light that scattering of light and refraction form because of light Transfer Medium and refractive index different, and the utilization rate of increase light.Also can reduce the bad situation of contraposition that produces in assembling process occurs.In addition, LGP 21 has a first refractive rate and leaded light piece 22 has one second refractive index.The better first refractive rate less than LGP 21 of the second refractive index of leaded light piece 22 can make via the light of leaded light piece 22 is more concentrated to enter in the LGP 21 by this, and reduces the possibility of light loss, but not as limit.For example, the second refractive index of leaded light piece 22 also can equal the first refractive rate of LGP 21, and minimizing causes light loss because of anaclasis that refractive index difference causes.
In the present embodiment, the second exiting surface 222 of leaded light piece 22 and 211 of first incidence surfaces of LGP 21 can utilize an optical cement 26 to paste, and the second incidence surface 221 of leaded light piece 22 and 23 of each luminescence components also can utilize an optical cement 29 to paste. Optical cement 26,29 has good light transmission and viscosity, can effectively each luminescence component 23, leaded light piece 22 be bonded together and keep the penetrance of light with LGP 21.Simultaneously, between better the second refractive index and the first refractive rate of LGP 21 between leaded light piece 22 of optical cement 26,29 refractive index, or be equal to the second refractive index of leaded light piece 22, or be equal to the first refractive rate of LGP 21.In the present embodiment, each luminescence component 23, leaded light piece 22 and LGP 21 are that to utilize optical cement 26,29 to carry out bonding, but not as limit.For example, each luminescence component 23, leaded light piece 22 and 21 of LGPs also can utilize the mode of assembling design to carry out combination, for example do not using optical cement 26,29 to carry out under the bonding condition, the second exiting surface 222 of leaded light piece 22 can directly contact with the first incidence surface 211 of LGP 21, and the second incidence surface 221 of leaded light piece 22 also can directly contact with the light-emitting area 231 of each luminescence component 23.
In order to increase light utilization efficiency and light diffusion effect, the second exiting surface 222 of leaded light piece 22 of the present invention also can be provided with surface texture.Please refer to Fig. 4 A and Fig. 4 B.Fig. 4 A is the leaded light piece of one embodiment of the invention and the local enlarged diagram of luminescence component, and Fig. 4 B is the leaded light piece of Fig. 4 A and the generalized section of luminescence component.Shown in Fig. 4 A and Fig. 4 B, the second incidence surface 221 of leaded light piece 22 is provided with surface texture, and in the present embodiment, each surface texture is a groove 22M, the quantity of groove 22M can be corresponding with the number of luminescence component 23, and luminescence component 23 can embed among the groove 22M of the second incidence surface 221 of leaded light piece 22.By this, even luminescence component 23 has the bright dipping of part lateral, also can effectively inject in the leaded light piece 22 and can increase light utilization efficiency.Refer again to Fig. 5 A and Fig. 5 B.Fig. 5 A is the leaded light piece of another embodiment of the present invention and the local enlarged diagram of luminescence component, and Fig. 5 B is the leaded light piece of Fig. 5 A and the generalized section of luminescence component.Shown in Fig. 5 A and Fig. 5 B, in the present embodiment, each surface texture is a projection 22S, is positioned on the second incidence surface 221 of leaded light piece 22, in order to the light of concentrating each luminescence component 23 to produce, to increase the utilization rate of light.
Backlight module of the present invention is not limited with above-described embodiment.Hereinafter will introduce the backlight module of other preferred embodiment of the present invention, and for the ease of relatively different place and the simplified illustration of each embodiment, use in the following embodiments the identical identical assembly of symbol mark, and describe mainly for different place between each embodiment, and no longer repeating part is given unnecessary details.
Please refer to Fig. 6, Fig. 6 is the generalized section of the backlight module of another preferred embodiment of the present invention.As shown in Figure 6, compared to previous embodiment, in the change type of the present embodiment, leaded light piece 22 is the setting of turning upside down, the bottom surface 223 that also is leaded light piece 22 changes the position that is arranged in the face of framework 25 into from being arranged at position in the face of reflecting plate 24 shown in Figure 3, and an end face 214 (also being the first exiting surface of LGP 21) of a bottom surface 223 of the leaded light piece 22 of backlight module 20 and LGP 21 is positioned on the same level.Under this configuration, because the end face 224 of leaded light piece 22 can be in the face of reflecting plate 24 and so that the interior recess of end face 224 can form a space, thus can be with the driven unit 28 of backlight module 20, a circuit board for example, insert in this space, use the assembling volume that reduces Integral back optical module 20.
Please refer to Fig. 7 to Figure 10.Fig. 7 to Figure 10 is the schematic diagram of assemble method of the backlight module of a preferred embodiment of the present invention.As shown in Figure 7, at first provide a LGP 21, and an optical cement 26 is sticked on the first incidence surface 211 of LGP 21.Then, as shown in Figure 8, the LGP 21 and the leaded light piece 22 that are pasted with optical cement 26 are positioned on the platform 27, make a bottom surface 213 of LGP 21 and a bottom surface 223 of leaded light piece 22 be positioned on the same level bit errors that causes when assembling in order to reduce.Follow again, with the first incidence surface 211 relative applyings of the second exiting surface 222 with the LGP 21 that is pasted with optical cement 26 of leaded light piece 22.As shown in Figure 9, provide subsequently a plurality of luminescence components 23, and utilize an optical cement 29 light-emitting area 231 of each luminescence component 23 to be adhered to the second incidence surface 221 of leaded light piece 22.In addition, the assemble method of the backlight module of the present embodiment also can comprise provides a reflecting plate 24, and reflecting plate 24 is arranged at the bottom surface 213 of LGP 21 and the bottom surface 223 of leaded light piece 22.As shown in figure 10, the assemble method of the backlight module of the present embodiment also can comprise provides a framework 25, its middle frame 25 has a reflecting surface 251, and framework 25 is arranged at the top of each luminescence component 23 and leaded light piece 22, and the reflecting surface 251 of framework 25 is oppositely arranged with leaded light piece 22 with each luminescence component 23, then finishes this backlight module 20.
The assemble method of backlight module of the present invention is not limited with above-described embodiment.For example, utilizing optical cement to engage in the step of LGP and leaded light piece, be not limited to first the first incidence surface of the bonding LGP of optical cement is fitted in the second exiting surface of leaded light piece the opposite side of optical cement again.In other words, also can first optical cement be sticked on the second exiting surface of leaded light piece, again the first incidence surface of LGP is fitted in the second exiting surface of leaded light piece, can reach equally the purpose that engages leaded light piece and LGP.
In sum, in backlight module of the present invention, the leaded light piece is set between luminescence component and LGP, and the first thickness that is less than or equal to the first incidence surface of LGP at the second thickness of the second exiting surface of leaded light piece, and the 4th thickness of luminescence component is less than or equal under the condition of the 3rd thickness of the second incidence surface of leaded light piece, can effectively reduce light and when transmitting, disperse the light loss that causes, and then increase the utilization rate of light.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (12)
1. a backlight module is characterized in that, comprising:
One LGP has one first incidence surface, and this first incidence surface has one first thickness;
One leaded light piece, have one second incidence surface and one second exiting surface, wherein this second exiting surface and this first incidence surface are oppositely arranged, this second exiting surface has one second thickness, this second incidence surface has one the 3rd thickness, this second thickness of this second exiting surface is less than or equal to this first thickness of this first incidence surface, and this second exiting surface covered by this first incidence surface, and this second incidence surface of this leaded light piece also has a plurality of surface textures; And
One luminescence component, be oppositely arranged with this second incidence surface of this leaded light piece, wherein this luminescence component has one the 4th thickness, and the 4th thickness of this luminescence component is less than or equal to the 3rd thickness of this second incidence surface, and a light-emitting area of this luminescence component is covered by this second incidence surface;
Wherein, the thickness of LGP is less than the thickness of luminescence component;
One bottom surface of one bottom surface of this LGP, a bottom surface of this leaded light piece and this luminescence component is arranged on the same level.
2. backlight module as claimed in claim 1 is characterized in that, a section shape of this leaded light piece is trapezoidal.
3. backlight module as claimed in claim 1 is characterized in that, this LGP has a first refractive rate, and this leaded light piece has one second refractive index, and this second refractive index is less than or equal to this first refractive rate.
4. backlight module as claimed in claim 1 is characterized in that, this luminescence component comprises a plurality of luminescence components, and respectively this surface texture is a groove, and respectively this luminescence component is arranged at respectively respectively in this groove.
5. backlight module as claimed in claim 1 is characterized in that, this luminescence component comprises a light-emitting diode component.
6. backlight module as claimed in claim 1 is characterized in that, also comprises an optical cement, is arranged between this first incidence surface and this second exiting surface, in order to this LGP and this leaded light piece of adhering.
7. backlight module as claimed in claim 1 is characterized in that, also comprises another optical cement, is arranged between this light-emitting area of this second incidence surface and this luminescence component, in order to this leaded light piece and this luminescence component of adhering.
8. backlight module as claimed in claim 1 is characterized in that, also comprises a reflecting plate, is arranged at a bottom surface of this LGP and a bottom surface of this leaded light piece.
9. backlight module as claimed in claim 1 is characterized in that, also comprises a framework, have a reflecting surface and be arranged on this luminescence component and this leaded light piece, and this reflecting surface and this luminescence component and this leaded light piece is oppositely arranged.
10. the assemble method of a backlight module is characterized in that, comprising:
One LGP is provided, and wherein this LGP has one first incidence surface, and this first incidence surface of this LGP has one first thickness;
One leaded light piece is provided, wherein this leaded light piece has one second incidence surface and one second exiting surface, this second exiting surface has one second thickness, this second incidence surface has one the 3rd thickness, and this second thickness of this second exiting surface is less than or equal to this first thickness of this first incidence surface, and this second incidence surface of this leaded light piece also has a plurality of surface textures;
Utilize this first incidence surface of bonding this LGP of an optical cement and this second exiting surface of this leaded light piece, and this second exiting surface is covered by this first incidence surface;
One luminescence component is provided, and wherein this luminescence component has one the 4th thickness, and the 4th thickness of this luminescence component is less than or equal to the 3rd thickness of this second incidence surface of this leaded light piece; And
This second incidence surface of this luminescence component and this leaded light piece is oppositely arranged, and a light-emitting area of this luminescence component is covered by this second incidence surface;
Wherein, the thickness of LGP is less than the thickness of luminescence component;
Utilize the step of this second exiting surface of this first incidence surface of bonding this LGP of this optical cement and this leaded light piece to comprise:
This LGP and this leaded light piece are put on the platform; And
Utilize bonding this first incidence surface of this optical cement and this second exiting surface, and make a bottom surface of this LGP and a bottom surface of this leaded light piece be positioned at same level by this platform.
11. the assemble method of backlight module as claimed in claim 10 is characterized in that, also comprises a reflecting plate is arranged at a bottom surface of this LGP and a bottom surface of this leaded light piece.
12. the assemble method of backlight module as claimed in claim 10 is characterized in that, the top that also is included in this luminescence component and this leaded light piece arranges a framework, and a reflecting surface of this framework and this luminescence component and this leaded light piece are oppositely arranged.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099142800 | 2010-12-08 | ||
| TW99142800A TW201224602A (en) | 2010-12-08 | 2010-12-08 | Back light module and assembly method of back light module |
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| Publication Number | Publication Date |
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| CN102121639A CN102121639A (en) | 2011-07-13 |
| CN102121639B true CN102121639B (en) | 2013-03-06 |
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| US11846794B2 (en) | 2015-08-14 | 2023-12-19 | S.V.V. Technology Innovations, Inc. | Method of making backlight units for LCD displays using side-emitting LEDs and optical waveguides |
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| CN106287321A (en) * | 2015-05-21 | 2017-01-04 | 鸿富锦精密工业（深圳）有限公司 | Light source and backlight module |
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| CN1707332A (en) * | 2002-08-30 | 2005-12-14 | 富士通显示技术株式会社 | Lighting device and display device |
| CN101382698A (en) * | 2007-09-06 | 2009-03-11 | 富士迈半导体精密工业（上海）有限公司 | Backlight module unit |
| CN101676620A (en) * | 2008-09-17 | 2010-03-24 | 奇美电子股份有限公司 | Liquid crystal display device, backlight module and light-emitting unit |
-
2010
- 2010-12-08 TW TW99142800A patent/TW201224602A/en unknown
-
2011
- 2011-01-11 CN CN 201110009691 patent/CN102121639B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1707332A (en) * | 2002-08-30 | 2005-12-14 | 富士通显示技术株式会社 | Lighting device and display device |
| CN101382698A (en) * | 2007-09-06 | 2009-03-11 | 富士迈半导体精密工业（上海）有限公司 | Backlight module unit |
| CN101676620A (en) * | 2008-09-17 | 2010-03-24 | 奇美电子股份有限公司 | Liquid crystal display device, backlight module and light-emitting unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11846794B2 (en) | 2015-08-14 | 2023-12-19 | S.V.V. Technology Innovations, Inc. | Method of making backlight units for LCD displays using side-emitting LEDs and optical waveguides |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201224602A (en) | 2012-06-16 |
| CN102121639A (en) | 2011-07-13 |
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