A kind of LED light fixture with hollow cooling base
Technical field
The present invention relates to a kind of LED light fixture.
Background technology
At present traditional LED light fixture adopts led chip is packaged in the Metal Substrate board slot, and metal substrate adds radiating fin as cooling base or power supply is put in other heat radiation assembling and suitable lamp outer casing shell is made.Because the limitation of the luminous angle of led chip self (maximum luminous angle is 150 degree), the lighting angle of light fixture is also all below 150 degree.Usually in order to change rising angle, generally be that the mode that adopts LED to add secondary optical lens changes the final beam angle of light fixture by the direction of propagation that changes the LED emergent ray.Adopt this mode maximum also can only realize the luminous angle of 180 degree, and light efficiency is lower.
Summary of the invention
The technical assignment of the technical problem to be solved in the present invention and proposition is that the prior art scheme is improved and improved, and a kind of LED light fixture with hollow cooling base is provided, and to reach when guaranteeing the wide-angle bright dipping, improves the purpose of light efficiency.For this reason, the present invention takes following technical scheme.
A kind of LED light fixture with hollow cooling base, comprise cooling base, be located at the LED base plate for packaging on the cooling base, it is characterized in that: described cooling base is the column construction that the middle part is provided with the airflow path of perforation, its lateral surface is provided with a plurality of light source stationary planes, and the light source stationary plane is provided with the LED base plate for packaging; Described LED base plate for packaging is provided with led chip.Cooling base is the column construction that the middle part is provided with the airflow path of perforation, and because of reducing the material of airflow path, in light weight, cost is low.And airflow path is used for the circulation of inner air and outer air, and heat is taken out of fast, improves radiating effect.The LED base plate for packaging that carries led chip is established in the side of cylindricality cooling base, is beneficial to wide-angle, even the omnibearing bright dipping of 360 degree, owing to do not need secondary optical lens, reduces the assembling link, reduces cost, and reduce weight, and light efficiency is good.
As the further of technique scheme improved and replenish, the present invention also comprises following additional technical feature.
The external cross section of described cooling base is polygonized structure, and wherein at least three side planes are provided with the light source stationary plane.The LED base plate for packaging can directly be fixed on the side plane, and side plane as the light source stationary plane, also can be had groove on side plane, and with fixed L ED base plate for packaging on this groove; Because at least three side planes are provided with the bright dipping that the light source stationary plane has been realized wide-angle.
The Plane intersects place, the adjacent outside of cooling base is provided with the arc transition face.Cooling base is an aluminium section bar, and the arc transition face makes things convenient for the processing of aluminium section bar, does not prick the hand, and also plays the effect of avoiding shading in addition.
The cooling base middle part is provided with a plurality of airflow paths, and the circumferential annular of a plurality of airflow paths is arranged.
The cooling base middle part is provided with an airflow path, and the external cross section shape of described airflow path and cooling base matches.When external cross section was hexagon, airflow path also was corresponding hexagon, and when external cross section was triangle, airflow path also was corresponding triangle, makes the wall thickness of cooling base even, and the heat of each several part is transmitted basic identical, and is beneficial to processing and manufacturing.
Be provided with a plurality of reinforcements in the described airflow path, reinforcement is arranged radially, and its outer end is connected with airflow path.Reinforcement removes when strengthening cooling base intensity, improves area of dissipation.But reinforcement is too much unsuitable, then can influence the airflow path inner air convection too much, and improves production cost, is directed at percent defective and rises.
Described reinforcement the inner is provided with connecting ring, described reinforcement, connecting ring and cooling base one extrusion molding, and reinforcement, connecting ring are identical with the height of cooling base.The production efficiency height.
Described cooling base is with diffuser outward, and described diffuser is provided with air-vent, and described air-vent is relative with the cooling base airflow path.Be provided with air-vent, can accelerate the circulation of air.
The end face of described LED base plate for packaging is provided with the groove that is used to carry led chip, and the top of led chip covers light transmission medium layer, optical material layer or light conversion layer and forms the LED packaging body; The both sides of groove are respectively equipped with the positive and negative electrode lead district of indent.For prevent that light transmission medium etc. is excessive and avoid led chip to damage in making, use, transportation, the height of LED packaging body is less than or equal to the degree of depth of groove.
The one or both ends of cooling base are stiff end, and stiff end is provided with the location division that is used for fixing; Described cooling base lateral surface is provided with "T"-shaped groove, and groove bottom is the light source stationary plane; LED base plate for packaging and "T"-shaped groove match, and make in the "T"-shaped groove of its cooling base of pegging graft, and are fixed on the cooling base by tack coat or weld layer or screw, are provided with at least one LED base plate for packaging in a "T"-shaped groove.LED base plate for packaging area of section is equal to or slightly less than "T"-shaped groove, and shape is identical with "T"-shaped groove, forms seamless connection with "T"-shaped groove.In different "T"-shaped grooves, can insert the different base plate for packaging of quantity, the convenient LED light fixture beam angle of adjusting.
Beneficial effect: cooling base provided by the invention is hollow structure, and is in light weight, and cost is low, and helps the circulation of inner air and outer air, improves radiating efficiency; The end of cooling base is provided with fixing part structure, is convenient to the flexible installation of led light source.Beam angle is easy to adjust, only needs to change the installation quantity of led light source base plate for packaging; Simultaneously, dispose different lamp outer casings and power supply and can form multi-form LED light fixture, realize the diversified market demand of LED light fixture.
Description of drawings
Fig. 1 is a kind of explosion structure chart of the present invention;
Fig. 2 is the another kind of explosion structure chart of the present invention;
Fig. 3 is first kind of cooling base cross-sectional structure schematic diagram of the present invention;
Fig. 4 is second kind of cooling base cross-sectional structure schematic diagram of the present invention;
Fig. 5 is the third cooling base cross-sectional structure schematic diagram of the present invention;
Fig. 6 (a) is a kind of LED package substrate construction schematic diagram of the present invention;
Fig. 6 (b) is the A-A sectional structure chart of Fig. 6 (a);
Fig. 7 (a) is an another kind of LED package substrate construction schematic diagram of the present invention;
Fig. 7 (b) is the A-A sectional structure chart of Fig. 7 (a).
The specific embodiment
Below in conjunction with Figure of description technical scheme of the present invention is described in further detail.
As shown in Figure 1, 2, the present invention includes cooling base 1, be located at the LED base plate for packaging 2 on the cooling base 1, cooling base 1 is provided with the column construction of the airflow path 3 of perforation for the middle part, and its lateral surface is provided with a plurality of light source stationary planes, and the light source stationary plane is provided with LED base plate for packaging 2; LED base plate for packaging 2 is provided with led chip.The external cross section of cooling base 1 is polygonized structure, and wherein at least three side planes are provided with the light source stationary plane.For convenient fixedly connected, an end of cooling base 1 is a stiff end, and stiff end is provided with the location division that is used for fixing.Cooling base 1 is aluminium extrusion or die casting.
Shown in Fig. 2,3,4, cooling base 1 is hollow regular triangular prism, and lateral surface is made of three side planes that intersect, and three side plane intersections are provided with the arc transition face.All establish led chip when three side planes and then can realize 360 comprehensive bright dippings.
Cooling base 1 also can be hollow positive pentagonal prism structure as shown in Figure 5 in addition, and lateral surface is made of five side planes that intersect, and five side plane intersections are provided with the arc transition face.
Cooling base 1 middle part is provided with a plurality of airflow paths 3, and a plurality of airflow path 3 circumferential annulars are arranged.Certainly, cooling base 1 middle part also can only be provided with an airflow path 3, and airflow path 3 matches with the external cross section shape of cooling base 1; For strengthening the intensity of cooling base 1, increase area of dissipation, improve radiating effect, can set up a plurality of reinforcements 4 in airflow path 3, as shown in Figure 1, reinforcement 4 is arranged radially, its outer end is connected with airflow path 3, reinforcement 4 the inners are provided with connecting ring, reinforcement 4, connecting ring 9 and cooling base 1 one extrusion molding, and reinforcement 4, connecting ring are identical with the height of cooling base 1.Be with diffuser 6 outside the cooling base 1, diffuser 6 is provided with air-vent 7, and air-vent 7 is relative with cooling base 1 airflow path 3.
Shown in Fig. 6 (a), 6 (b), 7 (a), 7 (b), the end face of LED base plate for packaging 2 is provided with the groove 8 that is used to carry led chip, and the degree of depth of groove 8 is 0.4mm-0.6mm; When covering light transmission medium layer, optical material layer or light conversion layer, the top of led chip forms the LED packaging body; Excessive for preventing light transmission medium etc., avoid led chip in making, use, transportation, to damage, the height of LED packaging body is less than or equal to the degree of depth of groove 8; The both sides of groove 8 are respectively equipped with the positive and negative electrode lead district of indent.The positive and negative electrode lead district communicates with groove 8 in 6 (a), 6 (b), and positive and negative electrode lead district and groove 8 cut off in 7 (a), 7 (b).
Shown in Fig. 3,5, cooling base 1 lateral surface is provided with "T"-shaped groove 5, and groove bottom is the light source stationary plane; LED base plate for packaging 2 matches with "T"-shaped groove 5, and LED base plate for packaging 2 pegs graft in the "T"-shaped groove 5 of cooling base 1, and is fixed on the cooling base 1 by tack coat or weld layer or screw, inserts a LED base plate for packaging 2 at least in a "T"-shaped groove 5.As shown in Figure 4, the side plane of cooling base 1 also can be directly as the light source stationary plane that is used for fixing LED base plate for packaging 2.