A kind of LED light fixture with hollow cooling base
Technical field
The present invention relates to a kind of LED light fixture
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Background technology
At present traditional LED light fixture adopts LED chip is packaged in Metal Substrate board slot, and metal substrate adds radiating fin as cooling base or power supply is put in other heat radiation assembling and suitable lamp outer casing shell is made.Due to the limitation of LED chip self light emitting anger (maximum light emitting anger is 150 degree), the lighting angle of light fixture is also all below 150 degree.Conventionally in order to change rising angle, be generally to adopt the mode of the additional secondary optical lens of LED to change the final beam angle of light fixture by changing the direction of propagation of LED emergent ray.Adopt maximum in this way and also can only realize 180 degree light emitting angers, and light efficiency is lower.
Summary of the invention
The technical assignment of the technical problem to be solved in the present invention and proposition is that prior art scheme is improved and improved, and a kind of LED light fixture with hollow cooling base is provided, and to reach when guaranteeing wide-angle bright dipping, improves the object of light efficiency.For this reason, the present invention takes following technical scheme.
A kind of LED light fixture with hollow cooling base, comprise cooling base, be located at the LED base plate for packaging on cooling base, it is characterized in that: described cooling base is the column construction that middle part is provided with the airflow path of perforation, its lateral surface is provided with a plurality of light source stationary planes, and light source stationary plane is provided with LED base plate for packaging; Described LED base plate for packaging is provided with LED chip.Cooling base is the column construction that middle part is provided with the airflow path of perforation, and because reducing the material of airflow path, lightweight, cost is low.And airflow path is for the circulation of inner air and outer air, and heat is taken out of fast, improve radiating effect.The LED base plate for packaging that carries LED chip is established in the side of cylindricality cooling base, is beneficial to wide-angle, and the even omnibearing bright dipping of 360 degree, owing to not needing secondary optical lens, reduces assembling link, reduces costs, and reduce weight, and light efficiency is good.
As the further of technique scheme improved and supplemented, the present invention also comprises following additional technical feature.
The external cross section of described cooling base is polygonized structure, and wherein at least three side planes are provided with light source stationary plane.LED base plate for packaging can directly be fixed on side plane, using side plane as light source stationary plane, also can on side plane, have groove, and by fixed L ED base plate for packaging on this groove; Because at least three side planes are provided with the bright dipping that light source stationary plane has been realized wide-angle.
The Plane intersects place, adjacent outside of cooling base is provided with arc-shaped transitional surface.Cooling base is aluminium section bar, and arc-shaped transitional surface facilitates the processing of aluminium section bar, does not prick the hand, and also plays in addition the effect of avoiding shading.
Cooling base middle part is provided with a plurality of airflow paths, the circumferential annular arrangement of a plurality of airflow paths.
Cooling base middle part is provided with an airflow path, and the external cross section shape of described airflow path and cooling base matches.When external cross section is hexagon, airflow path is also corresponding hexagon, and when external cross section is triangle, airflow path is also corresponding triangle, makes the wall thickness of cooling base even, and the heat of each several part is transmitted basic identical, and is beneficial to processing and manufacturing.
In described airflow path, be provided with a plurality of reinforcements, reinforcement is arranged radially, and its outer end is connected with airflow path.Reinforcement removes when strengthening cooling base intensity, improves area of dissipation.But reinforcement is too much unsuitable, can affect airflow path inner air convection too much, and improve production cost, be directed at percent defective and rise.
Described reinforcement the inner is provided with connecting ring, described reinforcement, connecting ring and cooling base one extrusion molding, and reinforcement, connecting ring are identical with the height of cooling base.Production efficiency is high.
Described cooling base overcoat has diffuser, and described diffuser is provided with air-vent, and described air-vent is relative with cooling base airflow path.Be provided with air-vent, can accelerate the circulation of air.
The end face of described LED base plate for packaging is provided with for carrying the groove of LED chip, and the top of LED chip covers light transmission medium layer, optical material layer or light conversion layer and forms LED packaging body; The both sides of groove are respectively equipped with the positive and negative electrode lead district of indent.For prevent that light transmission medium etc. is excessive and avoid LED chip to damage in making, use, transportation, the height of LED packaging body is less than or equal to the degree of depth of groove.
The one or both ends of cooling base are stiff end, and stiff end is provided with for fixing location division; Described cooling base lateral surface is provided with "T"-shaped groove, and groove bottom is light source stationary plane; LED base plate for packaging and "T"-shaped groove match, and make in the "T"-shaped groove of its cooling base of pegging graft, and are fixed on cooling base by tack coat or weld layer or screw, are provided with at least one LED base plate for packaging in a "T"-shaped groove.LED base plate for packaging area of section is equal to or slightly less than "T"-shaped groove, and shape is identical with "T"-shaped groove, forms seamless connection with "T"-shaped groove.In different "T"-shaped grooves, can insert the different base plate for packaging of quantity, the convenient LED light fixture beam angle of adjusting.
Beneficial effect: cooling base provided by the invention is hollow structure, lightweight, and cost is low, and be conducive to the circulation of inner air and outer air, improve radiating efficiency; The end of cooling base is provided with fixing part structure, is convenient to the flexible installation of LED light source.Beam angle is easy to adjust, only needs to change the installation quantity of LED light source base plate for packaging; Meanwhile, configure different lamp outer casings and power supply and can form multi-form LED light fixture, realize the diversified market demand of LED light fixture.
Accompanying drawing explanation
Fig. 1 is a kind of explosion structure chart of the present invention;
Fig. 2 is the another kind of explosion structure chart of the present invention;
Fig. 3 is the first cooling base cross-sectional structure schematic diagram of the present invention;
Fig. 4 is the second cooling base cross-sectional structure schematic diagram of the present invention;
Fig. 5 is the third cooling base cross-sectional structure schematic diagram of the present invention;
Fig. 6 (a) is a kind of LED package substrate construction schematic diagram of the present invention;
Fig. 6 (b) is the A-A sectional structure chart of Fig. 6 (a);
Fig. 7 (a) is another kind of LED package substrate construction schematic diagram of the present invention;
Fig. 7 (b) is the A-A sectional structure chart of Fig. 7 (a).
The specific embodiment
Below in conjunction with Figure of description, technical scheme of the present invention is described in further detail.
As shown in Figure 1, 2, the present invention includes cooling base 1, be located at the LED base plate for packaging 2 on cooling base 1, cooling base 1 is provided with the column construction of the airflow path 3 of perforation for middle part, and its lateral surface is provided with a plurality of light source stationary planes, and light source stationary plane is provided with LED base plate for packaging 2; LED base plate for packaging 2 is provided with LED chip.The external cross section of cooling base 1 is polygonized structure, and wherein at least three side planes are provided with light source stationary plane.Be fixedly connected with for convenience, one end of cooling base 1 is stiff end, and stiff end is provided with for fixing location division.Cooling base 1 is aluminium extrusion or die casting.
As shown in Figure 2,3, 4, cooling base 1 is hollow regular triangular prism, and lateral surface consists of three side planes that intersect, and three side plane intersections are provided with arc-shaped transitional surface.When three side planes, all establish LED chip and can realize 360 comprehensive bright dippings.
Cooling base 1 also can be hollow positive pentagonal prism structure as shown in Figure 5 in addition, and lateral surface consists of five side planes that intersect, and five side plane intersections are provided with arc-shaped transitional surface.
Cooling base 1 middle part is provided with a plurality of airflow paths 3, the circumferential annular arrangement of a plurality of airflow paths 3.Certainly, cooling base 1 middle part also can only be provided with an airflow path 3, and airflow path 3 matches with the external cross section shape of cooling base 1; For strengthening the intensity of cooling base 1, increase area of dissipation, improve radiating effect, can in airflow path 3, set up a plurality of reinforcements 4, as shown in Figure 1, reinforcement 4 is arranged radially, its outer end is connected with airflow path 3, reinforcement 4 the inners are provided with connecting ring, reinforcement 4, connecting ring 9 and cooling base 1 one extrusion molding, and reinforcement 4, connecting ring are identical with the height of cooling base 1.Cooling base 1 overcoat has diffuser 6, and diffuser 6 is provided with air-vent 7, and air-vent 7 is relative with cooling base 1 airflow path 3.
As shown in Fig. 6 (a), 6 (b), 7 (a), 7 (b), the end face of LED base plate for packaging 2 is provided with for carrying the groove 8 of LED chip, and the degree of depth of groove 8 is 0.4mm-0.6mm; When covering light transmission medium layer, optical material layer or light conversion layer, the top of LED chip forms LED packaging body; Excessive for preventing light transmission medium etc., avoid LED chip to damage in making, use, transportation, the height of LED packaging body is less than or equal to the degree of depth of groove 8; The both sides of groove 8 are respectively equipped with the positive and negative electrode lead district of indent.In 6 (a), 6 (b), positive and negative electrode lead district communicates with groove 8, and in 7 (a), 7 (b), positive and negative electrode lead district and groove 8 cut off.
As shown in Fig. 3,5, cooling base 1 lateral surface is provided with "T"-shaped groove 5, and groove bottom is light source stationary plane; LED base plate for packaging 2 matches with "T"-shaped groove 5, and LED base plate for packaging 2 is pegged graft in the "T"-shaped groove 5 of cooling base 1, and is fixed on cooling base 1 by tack coat or weld layer or screw, in a "T"-shaped groove 5, at least inserts a LED base plate for packaging 2.As shown in Figure 4, the side plane of cooling base 1 also can be directly as the light source stationary plane for fixed L ED base plate for packaging 2.