CN102110621B - Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device - Google Patents
Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device Download PDFInfo
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- CN102110621B CN102110621B CN2010105705119A CN201010570511A CN102110621B CN 102110621 B CN102110621 B CN 102110621B CN 2010105705119 A CN2010105705119 A CN 2010105705119A CN 201010570511 A CN201010570511 A CN 201010570511A CN 102110621 B CN102110621 B CN 102110621B
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- power semiconductor
- insulated tension
- tension pole
- butterfly spring
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Abstract
The invention discloses an insulated pull rod and a pressing device for a power semiconductor, as well as an assembly method of the pressing device. The insulated pull rod comprises the main body of the insulated pull rod, force-bearing fixing ends, at least two countersunk through holes and at least two nuts, wherein the main body of the insulated pull rod is a main force bearing part of the insulated pull rod for the power semiconductor; the force-bearing fixing ends are located at two ends of the main body of the insulated pull rod for fixing the insulated pull rod for the power semiconductor; the countersunk through holes are located at the force-bearing fixing ends of the insulated pull rod for the power semiconductor and used for fixing the insulated pull rod for the power semiconductor and the pressing device for the power semiconductor; and the two nuts are located at the force-bearing fixing ends of the insulated pull rod for the power semiconductor and used for fixing the insulated pull rod for the power semiconductor and an external installation platform. Due to the adoption of the technical scheme disclosed by the invention, pressure requirements of power semiconductor devices, as well as insulation requirements of each voltage grade structure can be met, and the problem of the insulated pull rod which has great deformation in the case of thermal expansion and cold contraction, caused by ambient temperature, can be solved.
Description
Technical field
The present invention relates to a kind of power semiconductor insulated tension pole and hold down gag and assemble method thereof, especially relate to power semiconductor insulated tension pole and hold down gag and assemble method thereof that a kind of flat power semiconductor device series connection that is applied to the power semiconductor field of power electronics press-fits usefulness.
Background technology
Follow the invention and the application of a large amount of new techniques; The client is to the increasingly stringent that requires of equipment volume; Power semiconductor assembly is towards high voltage more and more small size development, and the thing followed promptly is more the small size Insulation Problems down and the pressure assurance problem of power semiconductor.
In the prior art, for flat power semiconductor device, traditional press-fit approach all is directly to produce the thrust to the power semiconductor two ends through straining at tight metal screw, and its two poles of the earth insulation realizes by the insulating sleeve that is enclosed within on the stretching screw.But when in the high-voltage applications field, the miniaturization device of high reliability more and more receives client's favorable comment, the scheme that compresses of a kind of use insulation blanket stud (insulating material making) alternative metals screw rod also occurred for this reason.
1. in the prior art; Use metal screw when tradition press-fits can satisfy the pressure requirement of power semiconductor from the tensile strength aspect; But metal is as a kind of conductor, and the Insulation Problems under hyperbaric environment is a very crucial problem, adopts the bag insulating sleeve to realize high-tension isolation usually; But insulating sleeve is accompanied by its withstand voltage properties of oxidation can significantly descend, and finally has influence on reliability of products.
2. in the prior art, using insulation blanket stud alternative metals screw rod is many a kind of schemes of using at present, and insulation blanket stud also can satisfy the pressure requirement of power semiconductor through type selecting; But its stressed sectional area is little, and under identical stressed sectional area, the mechanical property of insulation blanket stud is directly proportional with the tensile strength of its material; The cost of high tensile is very high, and the processing technology requirement is very harsh, causes the insulation blanket stud cost very high; And when ambient temperature has bigger variation; Usually influenced by ambient temperature expanding with heat and contract with cold causes the actual pressure of power semiconductor to come and go, and is in for a long time in the frequent environment of this variation of ambient temperature; Can cause the insulation blanket stud stress fatigue, finally have influence on reliability of products.
Summary of the invention
The plate type semiconductor device that the purpose of this invention is to provide a kind of highly versatile, goes for various flat power devices and radiator thereof, can satisfy the power semiconductor pressure demand simultaneously and solve each electric pressure structure Insulation Problems preferably press-fits power semiconductor insulated tension pole and the hold down gag and the assemble method thereof of usefulness; Be particularly useful for the high pressure field that the series connection of high-voltage power semiconductor device press-fits application, in order to substitute metal screw of the prior art and insulation blanket stud and hold down gag and assemble method thereof.
The present invention provides a kind of embodiment of power semiconductor insulated tension pole; The described a kind of power semiconductor insulated tension pole of this execution mode comprises: the insulated tension pole main body; Stressed stiff end, countersunk head through hole and nut, the insulated tension pole main body is the main force part of power semiconductor insulated tension pole; Stressed stiff end is positioned at the two ends of insulated tension pole main body; Be used for the power semiconductor insulated tension pole is connected fixing, at least two countersunk head through holes lay respectively at two stressed stiff ends of power semiconductor insulated tension pole, are used for fixing between power semiconductor insulated tension pole and the power semiconductor hold down gag; At least two nuts lay respectively at two stressed stiff ends of power semiconductor insulated tension pole, are used for fixing between power semiconductor insulated tension pole and the extraneous mounting platform.
As the further execution mode of a kind of power semiconductor insulated tension pole of the present invention, the power semiconductor insulated tension pole comprises that further at least one is strengthened gusset, strengthens gusset and is positioned on the insulated tension pole main body.
As the further execution mode of a kind of power semiconductor insulated tension pole of the present invention, the power semiconductor insulated tension pole further comprises at least one groove, and groove is positioned at the relative reverse side of strengthening the gusset installed surface on the insulated tension pole main body.
As the further execution mode of a kind of power semiconductor insulated tension pole of the present invention, the countersunk head through hole further is two groups totally four, and every group of two countersunk head through holes lay respectively at two stressed stiff ends of power semiconductor insulated tension pole.
As the further execution mode of a kind of power semiconductor insulated tension pole of the present invention, nut is inserted nut further, has two groups totally six, and every group of three nuts lay respectively at two stressed stiff ends of power semiconductor insulated tension pole.
The present invention also provides a kind of embodiment of power semiconductor insulated tension pole hold down gag; The described hold down gag of this execution mode comprises the power semiconductor insulated tension pole, upper mounted plate, bottom plate and power semiconductor compression module; Two power semiconductor insulated tension poles and fixed head and bottom plate are formed the framework of hold down gag; Overall fixed is on firm banking, and the power semiconductor compression module is placed in the framework of hold down gag, and is installed in the upper end of semiconductor power component.
As the further execution mode of a kind of power semiconductor insulated tension pole of the present invention hold down gag; The power semiconductor compression module further comprises guide post, butterfly spring lower baffle plate, butterfly spring, butterfly spring overhead gage, fixedly cushion block, clamp nut and stop nut; Guide post, butterfly spring lower baffle plate, butterfly spring, butterfly spring overhead gage, fixedly cushion block, clamp nut and stop nut assembling successively from bottom to up, through clamp nut and stop nut with guide post, butterfly spring lower baffle plate, butterfly spring, butterfly spring overhead gage, fixedly cushion block and semiconductor power component are pressed abd fixed between upper mounted plate and the bottom plate.
The present invention also provides a kind of embodiment of power semiconductor insulated tension pole hold down gag assemble method, and the described a kind of power semiconductor insulated tension pole hold down gag assemble method of this execution mode may further comprise the steps:
With the framework of two power semiconductor insulated tension poles and fixed head and bottom plate composition hold down gag, overall fixed is on firm banking then;
The power semiconductor compression module is placed in the framework of hold down gag, and is installed in the upper end of semiconductor power component, semiconductor power component is press-fited;
A pressure sensor is installed in upper end at semiconductor power component; Use torque spanner to rotatably compress nut then; Promote the butterfly spring overhead gage and compress butterfly spring, pressure is conveyed to guide post, act on then on semiconductor power component and the pressure sensor through butterfly spring; When pressure sensor readings satisfies the needed pressure of semiconductor power component, record torque spanner reading A at that time;
The reverse rotation clamp nut rushes down internal pressure, and pressure sensor is taken off; Re-use torque spanner and rotatably compress nut, promote the butterfly spring overhead gage and compress butterfly spring, pressure is conveyed to guide post through butterfly spring; When the moment of torque spanner reaches A, promptly satisfied the pressure demand of semiconductor power component, use stop nut that hold down gag is locked then; Prevent that clamp nut is loosening, accomplish the assembling of whole hold down gag.
Embodiment of the present invention provides the application of a kind of power semiconductor insulated tension pole in the high pressure soft starting field in addition.
Through using the described power semiconductor insulated tension pole of embodiment of the present invention and hold down gag and assemble method thereof, can satisfy the power semiconductor pressure demand simultaneously and solve the problem of each electric pressure structure insulation preferably.Because insulated tension pole of the present invention is to strengthen its maximum tension stress that can bear according to increasing stressed sectional area, can also solve the big problem of the deflection that expands with heat and contract with cold that ambient temperature causes insulated tension pole simultaneously.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation one-front view of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 2 is the structural representation two-rearview of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 3 is the structural representation three-vertical view of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 4 is the structural representation four-upward view of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 5 is the structural representation five-left view of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 6 is the structural representation six-right view of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 7 is the structural representation seven-stereogram 1 of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 8 is the structural representation eight-stereogram 2 of the power semiconductor insulated tension pole of one embodiment of the present invention;
Fig. 9 is the structural representation of the execution mode of a kind of hold down gag that utilizes the power semiconductor insulated tension pole of the present invention;
Wherein: 1,1 '-the insulated tension pole main body, 2,2 '-stressed stiff end, 3-strengthens gusset, 4-countersunk head through hole, 5-nut; The 6-upper mounted plate, 7-bottom plate, 8-semiconductor power component, 9-guide post; 10-butterfly spring lower baffle plate, the 11-butterfly spring, 12-butterfly spring overhead gage, 13-is cushion block fixedly; The 14-clamp nut, 15-stop nut, 16-firm banking, 17-groove.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
As the embodiment of a kind of power semiconductor insulated tension pole of the present invention, to shown in Figure 8, be a kind of embodiment that specifically is applied in the power semiconductor insulated tension pole in power electronics high pressure soft starting field like Fig. 1.The series connection that this embodiment specifically is used for the high pressure flat power semiconductor device press-fits.The power semiconductor insulated tension pole comprises: insulated tension pole main body 1, and stressed stiff end 2,2 '; Countersunk head through hole 4 and nut 5, insulated tension pole main body 1 is the main force part of power semiconductor insulated tension pole, stressed stiff end 2; 2 ' be positioned at the two ends of insulated tension pole main body 1, be used for the power semiconductor insulated tension pole is connected fixing, countersunk head through hole 4 is two groups totally four; Every group of two countersunk head through hole 4 lay respectively at two stressed stiff ends 2,2 of power semiconductor insulated tension pole ', be used for fixing between power semiconductor insulated tension pole and the power semiconductor hold down gag; Nut 5 is inserted nut, has two groups totally six, and every group of three nuts 5 lay respectively at two stressed stiff ends 2 of power semiconductor insulated tension pole; 2 ', be used for fixing between power semiconductor insulated tension pole and the extraneous mounting platform.The power semiconductor insulated tension pole comprises that at least one is strengthened gusset 3, strengthens gusset 3 and is positioned on the insulated tension pole main body 1.The power semiconductor insulated tension pole also comprises at least one groove 17; Groove 17 is positioned at the relative reverse side of strengthening gusset 3 installed surfaces on the insulated tension pole main body 1; Can under the prerequisite that satisfies power semiconductor insulated tension pole tensile strength, further save material through design groove 17.
1 is the insulated tension pole main body, and the main force part as the power semiconductor insulated tension pole itself has bigger sectional area, under the situation of same material, has better mechanics tensile property than insulation blanket stud, and is not vulnerable to the influence of ambient temperature; 2 and 2 ' be stressed stiff end, in order to the fixed insulation pull bar, guarantee the stability of pull bar; 3 for strengthening gusset, at first increased the stressed sectional area of pull bar, guaranteed the mechanical property of insulated tension pole, secondly, also can carry out location positioning to the radiator of the flat power semiconductor assembly that press-fited, guarantees to press-fit the requirement of positional precision; 4 is the countersunk head through hole, and the hold down gag that is used for press-fiting with the flat power semiconductor assembly is connected fixing; 5 is inserted nut, is used for fixing the power semiconductor insulated tension pole on mounting platform, is that the flat power semiconductor assembly press-fits and the extraneous parts of fixing that are connected.
Wherein, the material of power semiconductor insulated tension pole use has: polyethylene, SMC, DMC etc.The SMC material is the abbreviation of Sheet molding compound, i.e. sheet molding compound.DMC (BMC) is the abbreviation of Dough (Bulk) molding compound, i.e. BMC.The domestic unsaturated polyester (UP) BMC that often is called.
The described power semiconductor insulated tension pole of the specific embodiment of the invention has the following advantages:
1. have good withstand voltage properties
Insulated tension pole itself is to use insulating material to make, and itself just has very strong withstand voltage properties, more can increase the surperficial anti-creepage performance of insulated tension pole through surface treatment, and difficult because of the aging withstand voltage properties that influences insulated tension pole.
2. have good mechanical property
By computing formula: σ
b=F
b/ S
o
In the formula: F
b--the maximum, force of being born when sample is broken, N (newton); S
o--the original cross-sectional area of sample, mm
2σ
b--the tensile strength of sample material, unit is N/mm
2(MPa).
In order to satisfy the insulated tension pole mechanical property requirements, selected a kind of insulating material, its tensile strength sigma
bBe fixed, change its stressed sectional area S
oSize, just can change the maximum, force F that is born when sample is broken
bSelect through the three, just can find a perfect balance point, in order to satisfy the mechanical property requirements of mechanics insulated tension pole.
3. cost is lower
Because the stressed sectional area ratio of insulated tension pole is bigger, by σ
b=F
b/ S
oCan draw F
b=σ
B*S
o, in order to satisfy F
b, at stressed sectional area S
oUnder the big situation, just can select σ
bLittle insulating material can reduce the requirement to the insulated tension pole material significantly, thereby reduce product cost.
4. production simple and fast
The insulated tension pole outward appearance is simple, easily uses injection mold production; Select a kind of molding powder of insulating material for use, use injection mold to produce fast in a large number, and can guarantee the dimensional accuracy of insulated tension pole, and can not have the waste problem of material, on certain, also reduced the insulated tension pole cost.Large batch of typing production, advantage is more obvious.
A kind of power semiconductor insulated tension pole hold down gag as shown in Figure 9; Comprise the power semiconductor insulated tension pole, upper mounted plate 6, bottom plate 7 and power semiconductor compression module; Two power semiconductor insulated tension poles and fixed head 6 and bottom plate 7 are formed the framework of hold down gags; Overall fixed is on firm banking 16, and the power semiconductor compression module is placed in the framework of hold down gag, and is installed in the upper end of semiconductor power component 8.The power semiconductor compression module further comprises guide post 9, butterfly spring lower baffle plate 10, butterfly spring 11, butterfly spring overhead gage 12, fixedly cushion block 13, clamp nut 14 and stop nut 15; Guide post 9, butterfly spring lower baffle plate 10, butterfly spring 11, butterfly spring overhead gage 12, fixedly cushion block 13, clamp nut 14 and stop nut 15 assembling successively from bottom to up, through clamp nut 14 and stop nut 15 with guide post 9, butterfly spring lower baffle plate 10, butterfly spring 11, butterfly spring overhead gage 12, fixedly cushion block 13 and semiconductor power component 8 are pressed abd fixed between upper mounted plate 6 and the bottom plate 7.
A kind of power semiconductor insulated tension pole hold down gag assemble method, with the framework of two power semiconductor insulated tension poles and fixed head 6 and bottom plate 7 composition hold down gags, overall fixed is on firm banking 16 then; The power semiconductor compression module is placed in the framework of hold down gag, and is installed in the upper end of semiconductor power component 8, semiconductor power component 8 is press-fited; A pressure sensor is installed in the upper end of semiconductor power component 8, and the upper end minimum that is stressed in order to guarantee element pressure, therefore is installed in the top with pressure sensor like this.Use torque spanner to rotatably compress nut 14 then; Promote butterfly spring overhead gage 12 and compress butterfly spring 11; Through butterfly spring 11 pressure is conveyed to guide post 9; Act on then on semiconductor power component 8 and the pressure sensor, when pressure sensor readings satisfies semiconductor power component 8 needed pressure, record torque spanner reading A at that time; Reverse rotation clamp nut 14 rushes down internal pressure, and pressure sensor is taken off; Re-use torque spanner and rotatably compress nut 14, promote butterfly spring overhead gage 12 and compress butterfly spring 11, pressure is conveyed to guide post 9 through butterfly spring 11; When the moment of torque spanner reaches A, promptly satisfied the pressure demand of semiconductor power component 8, use stop nut 15 that hold down gag is locked then; Prevent that clamp nut 14 is loosening, accomplish the assembling of whole hold down gag.Two power semiconductor insulated tension poles are main tension parts of whole power semiconductor insulated tension pole hold down gag, and semiconductor power component 8 is had certain positioning action.
The described scheme of above-mentioned embodiment is mainly used in the 10KV system at present; Require insulated tension pole to receive tensile force f>25KN, withstand voltage properties satisfies the requirement (industrial frequency withstand voltage 42KV, surface creepage satisfies 25KV/100mm) of 10KV; Material is the SMC molding powder, and tool production is touched in hot injection moulding.Certainly this programme can also be used for other fields similar and the different capacity grade.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (8)
1. a power semiconductor insulated tension pole is characterized in that: comprise insulated tension pole main body (1), stressed stiff end (2; 2 '), countersunk head through hole (4) and nut (5), insulated tension pole main body (1) is the main force part of power semiconductor insulated tension pole; Stressed stiff end (2,2 ') is positioned at the two ends of insulated tension pole main body (1), is used for connecting fixing to the power semiconductor insulated tension pole; At least two countersunk head through holes (4) lay respectively at two stressed stiff ends (2 of power semiconductor insulated tension pole; 2 '), being used for fixing between power semiconductor insulated tension pole and the power semiconductor hold down gag, at least two nuts (5) lay respectively at two stressed stiff ends (2 of power semiconductor insulated tension pole; 2 '), be used for fixing between power semiconductor insulated tension pole and the extraneous mounting platform; Described power semiconductor insulated tension pole comprises that at least one is strengthened gusset (3), strengthens gusset (3) and is positioned on the insulated tension pole main body (1).
2. a kind of power semiconductor insulated tension pole according to claim 1; It is characterized in that: described power semiconductor insulated tension pole comprises at least one groove (17), and described groove (17) is positioned at insulated tension pole main body (1) and goes up the relative reverse side of strengthening gusset (3) installed surface.
3. a kind of power semiconductor insulated tension pole according to claim 2; It is characterized in that: described countersunk head through hole (4) is two groups totally four; Every group two countersunk head through holes (4) lay respectively at two stressed stiff ends (2,2 ') of power semiconductor insulated tension pole.
4. a kind of power semiconductor insulated tension pole according to claim 3; It is characterized in that: described nut (5) is inserted nut; Have two groups totally six, three every group nuts (5) lay respectively at two stressed stiff ends (2,2 ') of power semiconductor insulated tension pole.
5. hold down gag that utilizes the described a kind of power semiconductor insulated tension pole of arbitrary claim in the claim 1,3 or 4; It is characterized in that: described hold down gag comprises the power semiconductor insulated tension pole; Upper mounted plate (6); Bottom plate (7) and power semiconductor compression module, two power semiconductor insulated tension poles and fixed head (6) and bottom plate (7) are formed the framework of hold down gag, and overall fixed is on firm banking (16); The power semiconductor compression module is placed in the framework of hold down gag, and is installed in the upper end of semiconductor power component (8).
6. a kind of power semiconductor insulated tension pole hold down gag according to claim 5; It is characterized in that: described power semiconductor compression module comprises guide post (9), butterfly spring lower baffle plate (10), butterfly spring (11), butterfly spring overhead gage (12), fixedly cushion block (13), clamp nut (14) and stop nut (15); Described guide post (9), butterfly spring lower baffle plate (10), butterfly spring (11), butterfly spring overhead gage (12), fixedly cushion block (13), clamp nut (14) and stop nut (15) assembling successively from bottom to up, through clamp nut (14) and stop nut (15) with guide post (9), butterfly spring lower baffle plate (10), butterfly spring (11), butterfly spring overhead gage (12), fixedly cushion block (13) and semiconductor power component (8) are pressed abd fixed between upper mounted plate (6) and the bottom plate (7).
7. the assemble method of a kind of power semiconductor insulated tension pole hold down gag according to claim 5 is characterized in that, may further comprise the steps:
With the framework of two power semiconductor insulated tension poles and fixed head (6) and bottom plate (7) composition hold down gag, overall fixed is on firm banking (16) then;
The power semiconductor compression module is placed in the framework of hold down gag, and is installed in the upper end of semiconductor power component (8), semiconductor power component (8) is press-fited;
A pressure sensor is installed in upper end at semiconductor power component (8); Use torque spanner to rotatably compress nut (14) then; Promote butterfly spring overhead gage (12) and compress butterfly spring (11), pressure is conveyed to guide post (9), act on then on semiconductor power component (8) and the pressure sensor through butterfly spring (11); When pressure sensor readings satisfies the needed pressure of semiconductor power component (8), record torque spanner reading A at that time;
Reverse rotation clamp nut (14) rushes down internal pressure, and pressure sensor is taken off; Re-use torque spanner and rotatably compress nut (14); Promote butterfly spring overhead gage (12) and compress butterfly spring (11), through butterfly spring (11) pressure is conveyed to guide post (9), when the moment of torque spanner reaches A; Promptly satisfied the pressure demand of semiconductor power component (8); Use stop nut (15) with hold down gag locking then, prevent that clamp nut (14) is loosening, accomplish the assembling of whole hold down gag.
8. one kind according to the application of the described a kind of power semiconductor insulated tension pole of arbitrary claim in the claim 1,3 or 4 in the high pressure soft starting field; It is characterized in that: said power semiconductor insulated tension pole is used for the 10KV system; Require insulated tension pole to receive tensile force f>25KN, withstand voltage properties satisfies the requirement of 10KV.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105705119A CN102110621B (en) | 2010-12-02 | 2010-12-02 | Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105705119A CN102110621B (en) | 2010-12-02 | 2010-12-02 | Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102110621A CN102110621A (en) | 2011-06-29 |
| CN102110621B true CN102110621B (en) | 2012-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105705119A Active CN102110621B (en) | 2010-12-02 | 2010-12-02 | Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device |
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|---|---|
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3864607A (en) * | 1972-03-16 | 1975-02-04 | Programmed Power | Stackable heat sink assembly |
| CN201282038Y (en) * | 2008-09-15 | 2009-07-29 | 江苏省如高高压电器有限公司 | Vacuum impregnation epoxy glass tube-distributing insulated draw rod |
| CN201449911U (en) * | 2009-07-10 | 2010-05-05 | 陈分红 | High-voltage insulating tension pole |
| CN201868396U (en) * | 2010-12-02 | 2011-06-15 | 株洲变流技术国家工程研究中心有限公司 | Insulated pull rod of power semiconductor and pressing device thereof |
-
2010
- 2010-12-02 CN CN2010105705119A patent/CN102110621B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3864607A (en) * | 1972-03-16 | 1975-02-04 | Programmed Power | Stackable heat sink assembly |
| CN201282038Y (en) * | 2008-09-15 | 2009-07-29 | 江苏省如高高压电器有限公司 | Vacuum impregnation epoxy glass tube-distributing insulated draw rod |
| CN201449911U (en) * | 2009-07-10 | 2010-05-05 | 陈分红 | High-voltage insulating tension pole |
| CN201868396U (en) * | 2010-12-02 | 2011-06-15 | 株洲变流技术国家工程研究中心有限公司 | Insulated pull rod of power semiconductor and pressing device thereof |
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| Publication number | Publication date |
|---|---|
| CN102110621A (en) | 2011-06-29 |
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