CN102108479A - Method for tinning pins of plastics-sealed diodes and tinning device thereof - Google Patents
Method for tinning pins of plastics-sealed diodes and tinning device thereof Download PDFInfo
- Publication number
- CN102108479A CN102108479A CN 201010551991 CN201010551991A CN102108479A CN 102108479 A CN102108479 A CN 102108479A CN 201010551991 CN201010551991 CN 201010551991 CN 201010551991 A CN201010551991 A CN 201010551991A CN 102108479 A CN102108479 A CN 102108479A
- Authority
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- China
- Prior art keywords
- frame
- anchor clamps
- plastic package
- face
- pin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 60
- 230000003028 elevating effect Effects 0.000 claims description 17
- 230000007423 decrease Effects 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 7
- 239000003344 environmental pollutant Substances 0.000 abstract description 2
- 231100000719 pollutant Toxicity 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract 1
- 238000005488 sandblasting Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Lift-Guide Devices, And Elevator Ropes And Cables (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The invention provides a method for tinning pins of plastics-sealed diodes and a tinning device thereof. A special tinning device consisting of a fixture and a hanging frame is used, and the method comprises the following steps of: fixing the plastics-sealed diodes in upper and lower clamping frames of fixtures, and baking in a drying oven; performing water jet sand blasting; pushing the plurality of fixtures clamping the plastics-sealed diodes into the hanging frame with a guide slot, and completing the tinning process for the pins of the plastics-sealed diodes by two times by using the hanging frame through a lifting rod of a lifter. The invention radically abolishes a method for tinning the pins of the plastics-sealed diodes through an electroplating process, so that the emission of pollutants is reduced, and the environment is protected. The tinning device matched with the method for tinning the pins of the plastics-sealed diodes is simple in structure, easy to operate and high in practicability, can save a trouble of straightening the pins manually, and is labor-saving and time-saving.
Description
Technical field
The present invention relates to the electronic devices and components diode making process, the method for tin and last tin device thereof on particularly a kind of plastic package diode pin.
Background technology
In view of the requirement of use properties, the pin of electronic devices and components diode must be gone up tin, so that strengthen antioxidant property, the conductivity of pin and increase pin intensity, is convenient to welding operation.Traditional last tin method adopts electroplating technology to finish more.Yet the electroplate liquid that electroplating technology adopted is the high pollution chemical solution, and the electroplating effluent intractability is big, discharging back environmental pollution is serious.For this reason, the processing method that a kind of pin to diode is implemented wicking has been proposed, to finish in the industry to tin on the pin.But this wicking processing method can only be applicable to glass sealed diode, and this is because the material of glass sealed diode pin is a metallic iron, therefore can adopt magnet to suck the pin of glass sealed diode, drops into then and goes up tin in the wicking pond.And the plastic package diode pin mostly be copper, or copper-iron alloy material, inoperative to the magnetism of magnet, so can't implement the last process of tin of plastic package diode pin.So so far, the last tin of plastic package diode pin still adopts electroplating technology, not only pollute greatly, and the diameter of plastic package diode pin is thinner, and is crooked easily, and the necessary artificial stranding of the pin after the plating is straight, needs to spend a large amount of manpowers.
Summary of the invention
The present invention proposes the method for tin on a kind of plastic package diode pin and go up the tin device, purpose is the singularity at plastic package diode pin material, by the existing method that goes up tin is improved, and the last tin device that the method for tin is complementary and uses on development and the plastic package diode pin, adopt last tin method, minimizing pollutant emission and the trouble of removing the straight pin of artificial stranding from of electroplating technology with thorough abolishment plastic package diode pin.
The technical solution of the inventive method:
The concrete steps of the inventive method are:
(1) the good diode of a plurality of plastic packagings is arranged in parallel pack into go up the tin device the anchor clamps internal fixing it;
(2) the anchor clamps integral body that said fixing is equipped with plastic package diode is inserted in the baking oven, and setting the storing temperature scope and be 170-180 ℃, storing time is 5.5-7.5 hour, to solidify the plastic packaging of diode body;
(3) after baking finished, the whole anchor clamps that take out carried out the water-jet sandblast to the plastic package diode in the anchor clamps again, to remove the zone of oxidation of diode pin;
(4) the frame face with a plurality of monomer anchor clamps is arranged in parallel, the two ends of anchor clamps insert the tin device extension frame internal fixing it;
(5) will go up the tin device and hang the framework of frame and be connected on the elevating lever of wicking pond elevator, the decline elevating lever makes the plastic package diode one end pin of hanging in the frame immerse wicking in the metallic tin that has melted in the wicking pond;
(6) going up the tin device hangs in the frame on the plastic package diode one end pin behind the tin, the elevating lever of rising elevator, take off the tin device and hang frame, and 180 ° of upsets of whole do, the framework of hanging frame is connected on the elevating lever, the decline elevating lever makes the other end pin of hanging the plastic package diode in the frame immerse wicking in the wicking pond, so far finishes the last tin operation of plastic package diode two ends pin;
(7) rise the once more elevating lever of elevator will comprise that anchor clamps and whole the immersion in the hot water of the last tin device of hanging frame clean, and take off anchor clamps from the extension frame, and place baking oven to dry, and unload all monomer plastic package diodes from anchor clamps.
The technical solution of tin device in the present invention:
The tin device of going up of the present invention is made of anchor clamps and extension frame.Described anchor clamps are made up of the magnet piece of upper frame and following folder frame and the upper and lower folder frame of adhesive.The two ends edge of described upper and lower folder frame is provided with end face, and the bottom of both end faces overlaps, and described magnet piece is laid in edge end face bottom, upper and lower folder frame two ends and overlaps the corresponding position, position.
Described extension frame is made of the frame face frame and one group of weak point a group leader, one group leader is provided with the guide groove of putting relatively to two frames of frame, short minor face frame face to the frame face with long to frame or be connected as a single entity, or consistent with another minor face frame face, be that open-close type links into an integrated entity with length to frame together.The transverse section specification of described guide groove is consistent with the longitudinal section specification at anchor clamps two ends, and described weak point is consistent with anchor clamps length to the length of frame face, and when anchor clamps assembled with the extension frame, the two ends of anchor clamps can place in the guide groove.The material of described anchor clamps and extension frame is metal or metal alloy such as iron, aluminium.
Beneficial effect of the present invention
The method of tin on the plastic package diode pin that the present invention proposes is thoroughly abolished the last tin method that the plastic package diode pin adopts electroplating technology, thereby has reduced the discharging of pollutent, helps environment protection.The last tin device of the method coupling of tin on proposed by the invention and the plastic package diode pin, simple in structure, be beneficial to operation, practical, the trouble that also can remove the straight pin of artificial stranding from, laborsaving, saving of labor.
Description of drawings
Accompanying drawing 1 is the inventive method concrete steps schematic flow sheets;
Accompanying drawing 2 is the structural representation of tin device in the present invention;
Wherein, Fig. 2 A is the structural representation of last tin device anchor clamps (interior dress plastic package diode);
Fig. 2 B be last another embodiment of tin device anchor clamps structural representation;
The tin device is hung the structural representation of frame on Fig. 2 C;
Accompanying drawing 3 is the structural representation of vertical section that tin device (plastic package diode is housed in the anchor clamps) is connected with the elevating lever of wicking pond elevator in the present invention.
Embodiment
As shown in Figure 1
The inventive method just can obtain the plastic package diode of tin on the pin by the given flow operations of figure.
Shown in Fig. 2 A
Described anchor clamps 1 by upper frame 11, press from both sides frame 12 down and magnet piece 3 is formed.The two ends edge of described upper and lower folder frame is provided with end face 111, and the bottom of both end faces overlaps, and described magnet piece is laid in edge end face bottom, upper and lower folder frame two ends and overlaps the corresponding position, position.Plastic package diode 4 is arranged in parallel between the upper and lower folder frame, and the body 41 of plastic package diode is positioned at fixture cavity and has upper and lower folder frame to clamp, and pin 42 is positioned at outside the anchor clamps.
Be depicted as another embodiment of anchor clamps 1 as Fig. 2 B, this embodiment upper frame end face is sloping shape, and the bottom 112 of sloping shape end face overlaps with folder frame two ends edge 121 down; Described magnet piece is laid in corresponding position, edge coincidence part position, upper and lower folder frame two ends, and the placement of plastic package diode in anchor clamps is identical with last embodiment.
Shown in Fig. 2 B
Described extension frame 2 is made of frame face 23 frame 22 and one group of weak point a group leader, long two frames to frame are provided with the guide groove of putting relatively 221, short minor face frame face to the frame face with long to frame or be connected as a single entity, or consistent with another minor face frame face, the long end to frame that coexists links into an integrated entity (only representing an end among the figure) as open-close type.Minor face frame face is provided with hinge 231 with a long frame junction to frame, is provided with joint pin 232 with another frame junction, and with this length the corresponding position of frame is provided with lock ring 222.
As shown in Figure 3
Tin device in the present invention is because the transverse section specification of the guide groove 221 of extension frame 2 is consistent with the longitudinal section specification at anchor clamps two ends, short consistent with anchor clamps length to the length of frame face, so two ends dress plastic package diode in a plurality of anchor clamps 1() can push in the guide groove 221 of hanging frame 2, therefore the body 41 and the pin 42 of plastic package diode are vertical, the pin 42 of all body one ends immerses in the wicking pond 5, it is the detachable link span that is connected 24 that the extension frame is provided with hanging frame, and link span is connected with the elevating lever 6 of elevator (figure part omitted).
The device that the inventive method is passed through to be mated is connected with the elevating lever of elevator, behind tin on plastic package diode pin one end, take off and hang the frame upset, make all pins of the plastic package diode the other end immerse tin on the metallic tin pond, to finish the novel process of tin on the plastic package diode pin comprehensively.
Claims (8)
1. the method for tin on the plastic package diode pin, it is characterized in that: the concrete steps of this method are:
(1) the good diode of a plurality of plastic packagings is arranged in parallel pack into go up the tin device the anchor clamps internal fixing it;
(2) the anchor clamps integral body that said fixing is equipped with plastic package diode is inserted in the baking oven, and setting the storing temperature scope and be 170-180 ℃, storing time is 5.5-7.5 hour, to solidify the plastic packaging of diode body;
(3) after baking finished, the whole anchor clamps that take out carried out the water-jet sandblast to the plastic package diode in the anchor clamps again, to remove the zone of oxidation of diode pin;
(4) the frame face with a plurality of monomer anchor clamps is arranged in parallel, the two ends of anchor clamps insert the tin device extension frame internal fixing it;
(5) will go up the tin device and hang the framework of frame and be connected on the elevating lever of wicking pond elevator, the decline elevating lever makes the plastic package diode one end pin of hanging in the frame immerse wicking in the metallic tin that has melted in the wicking pond;
(6) going up the tin device hangs in the frame on the plastic package diode one end pin behind the tin, the elevating lever of rising elevator, take off the tin device and hang frame, and 180 ° of upsets of whole do, the framework of hanging frame is connected on the elevating lever, the decline elevating lever makes the other end pin of hanging the plastic package diode in the frame immerse wicking in the wicking pond, so far finishes the last tin operation of plastic package diode two ends pin;
(7) rise the once more elevating lever of elevator will comprise that anchor clamps and whole the immersion in the hot water of the last tin device of hanging frame clean, and take off anchor clamps from the extension frame, and place baking oven to dry, and unload all monomer plastic package diodes from anchor clamps.
2. the last tin device of plastic package diode pin, it is characterized in that: this device is connected with elevating lever, by anchor clamps with hang frame and constitute, described anchor clamps by upper frame and down the magnet piece of folder frame and the upper and lower folder frame of adhesive form; Described extension frame is made up of the frame face frame and one group of weak point a group leader, and a group leader is provided with the guide groove of putting relatively to two frames of frame.
3. the last tin device of plastic package diode pin according to claim 2 is characterized in that: the two ends edge of described upper and lower folder frame is provided with end face, and the bottom of both end faces overlaps; Described magnet piece is laid in edge end face bottom, upper and lower folder frame two ends and overlaps the corresponding position, position.
4. the last tin device of plastic package diode pin according to claim 3 is characterized in that: the set end face of two ends edge of described upper frame is sloping shape, and the bottom of sloping shape end face overlaps with following folder frame two ends edge; Described magnet piece is laid in corresponding position, edge coincidence part position, upper and lower folder frame two ends.
5. the last tin device of plastic package diode pin according to claim 2, it is characterized in that: the weak point of described extension frame to minor face frame face of frame face with long to frame or be connected as a single entity, or consistent with another minor face frame face, the long end to frame that coexists links into an integrated entity as open-close type.
6. the last tin device of plastic package diode pin according to claim 2 is characterized in that: the transverse section specification of described guide groove is consistent with the longitudinal section specification at anchor clamps two ends; Described weak point is consistent with anchor clamps length to the length of frame face, and when anchor clamps assembled with the extension frame, the two ends of anchor clamps can place in the guide groove of hanging frame.
7. the last tin device of plastic package diode pin according to claim 5, it is characterized in that: when described minor face frame face is connected shape with long end to frame as open-close type, minor face frame face is provided with hinge with a long frame junction to frame, be provided with joint pin with another frame junction, and this length is provided with lock ring to the corresponding position of frame.
8. the last tin device of plastic package diode pin according to claim 2 is characterized in that: it is the detachable link span that is connected that the described extension frame of going up the tin device is provided with hanging frame, and link span is connected with elevating lever.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105519914A CN102108479B (en) | 2010-11-19 | 2010-11-19 | Method for tinning pins of plastics-sealed diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105519914A CN102108479B (en) | 2010-11-19 | 2010-11-19 | Method for tinning pins of plastics-sealed diodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102108479A true CN102108479A (en) | 2011-06-29 |
| CN102108479B CN102108479B (en) | 2012-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105519914A Active CN102108479B (en) | 2010-11-19 | 2010-11-19 | Method for tinning pins of plastics-sealed diodes |
Country Status (1)
| Country | Link |
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| CN (1) | CN102108479B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102925840A (en) * | 2011-08-09 | 2013-02-13 | 广东易德半导体有限公司 | Tin dipped baseboard for glass sealed diode |
| CN104617022A (en) * | 2014-12-22 | 2015-05-13 | 苏州固锝电子股份有限公司 | Turnover device applied to manufacture of axial type diode |
| CN104617014A (en) * | 2014-12-22 | 2015-05-13 | 苏州固锝电子股份有限公司 | Efficient processing device for diode device |
| CN104651769A (en) * | 2015-01-29 | 2015-05-27 | 深圳市六一八工业自动化设备有限公司 | LED tin immersion process |
| CN105489488A (en) * | 2015-11-26 | 2016-04-13 | 钟运辉 | Manufacturing method for patch diode employing runner as body |
| CN113172296A (en) * | 2021-05-31 | 2021-07-27 | 福建火炬电子科技股份有限公司 | Capacitor lead wire tin immersion device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2086499U (en) * | 1990-06-26 | 1991-10-09 | 郭明宏 | Auomtatic tin-spraying machine |
| CN2124096U (en) * | 1992-05-16 | 1992-12-09 | 陈美容 | Tin furnace with brake |
| CN201500841U (en) * | 2008-11-21 | 2010-06-09 | 北京元六鸿远电子技术有限公司 | Semiautomatic dip-soldering machine |
| CN101768710A (en) * | 2010-01-05 | 2010-07-07 | 苏州群鑫电子有限公司 | Method for preparing heat dipping tin of plastic sealed axial diode |
| CN201896189U (en) * | 2010-11-19 | 2011-07-13 | 程远山 | Tinning device for plastic package diode pins |
-
2010
- 2010-11-19 CN CN2010105519914A patent/CN102108479B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2086499U (en) * | 1990-06-26 | 1991-10-09 | 郭明宏 | Auomtatic tin-spraying machine |
| CN2124096U (en) * | 1992-05-16 | 1992-12-09 | 陈美容 | Tin furnace with brake |
| CN201500841U (en) * | 2008-11-21 | 2010-06-09 | 北京元六鸿远电子技术有限公司 | Semiautomatic dip-soldering machine |
| CN101768710A (en) * | 2010-01-05 | 2010-07-07 | 苏州群鑫电子有限公司 | Method for preparing heat dipping tin of plastic sealed axial diode |
| CN201896189U (en) * | 2010-11-19 | 2011-07-13 | 程远山 | Tinning device for plastic package diode pins |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102925840A (en) * | 2011-08-09 | 2013-02-13 | 广东易德半导体有限公司 | Tin dipped baseboard for glass sealed diode |
| CN104617022A (en) * | 2014-12-22 | 2015-05-13 | 苏州固锝电子股份有限公司 | Turnover device applied to manufacture of axial type diode |
| CN104617014A (en) * | 2014-12-22 | 2015-05-13 | 苏州固锝电子股份有限公司 | Efficient processing device for diode device |
| CN104617022B (en) * | 2014-12-22 | 2017-09-26 | 苏州固锝电子股份有限公司 | The turnover device manufactured for axialmode diode |
| CN107978547A (en) * | 2014-12-22 | 2018-05-01 | 苏州固锝电子股份有限公司 | Diode component production epicyclical mechanism |
| CN107978546A (en) * | 2014-12-22 | 2018-05-01 | 苏州固锝电子股份有限公司 | Easy to the diode component turnover device of feeding |
| CN104617014B (en) * | 2014-12-22 | 2018-09-07 | 苏州固锝电子股份有限公司 | Highly-efficient processing device for diode component |
| CN107978546B (en) * | 2014-12-22 | 2020-08-07 | 苏州固锝电子股份有限公司 | Diode device turnover device convenient to material loading |
| CN104651769A (en) * | 2015-01-29 | 2015-05-27 | 深圳市六一八工业自动化设备有限公司 | LED tin immersion process |
| CN104651769B (en) * | 2015-01-29 | 2017-04-12 | 深圳市六一八工业自动化设备有限公司 | LED tin immersion process |
| CN105489488A (en) * | 2015-11-26 | 2016-04-13 | 钟运辉 | Manufacturing method for patch diode employing runner as body |
| CN113172296A (en) * | 2021-05-31 | 2021-07-27 | 福建火炬电子科技股份有限公司 | Capacitor lead wire tin immersion device and method |
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| Publication number | Publication date |
|---|---|
| CN102108479B (en) | 2012-03-07 |
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Effective date of registration: 20160831 Address after: Yanhuang Avenue South Development Zone 223400 Huaian city Jiangsu County of Lianshui Province Patentee after: Lianshui core Ocean Electronic Technology Co., Ltd. Address before: 223400, room 22, building 208, happy District, Huai Pu Road, Lianshui, Huaian, Jiangsu Patentee before: Cheng Yuanshan |