CN102105040B - Heat radiating method and device - Google Patents
Heat radiating method and device Download PDFInfo
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- CN102105040B CN102105040B CN201110038917.7A CN201110038917A CN102105040B CN 102105040 B CN102105040 B CN 102105040B CN 201110038917 A CN201110038917 A CN 201110038917A CN 102105040 B CN102105040 B CN 102105040B
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Abstract
The invention provides a heat radiating method and device, wherein the heat radiating method comprises the following steps of: detecting a temperature of a terminal device in real time; and driving a telescopic heat radiating fin to extend towards the outside of the terminal device according to the temperature and an unfolding condition. The heat radiating method and device not only meet the requirements on the terminal for the appearance and the volume, but also realize good heat radiation.
Description
Technical field
The present invention relates to heat dissipation technology, relate in particular to a kind of heat dissipating method and device.
Background technology
Along with the develop rapidly of wireless communication technology, user is also improving constantly for the requirement of mobile terminal device, and market asks increasingly strong for the needs that can provide several functions and user to experience good mobile terminal device.The existence of internal resistance as everyone knows, multi-functionally must bring high electrical source consumption, because also must bring more heat power consumption in the time of high electrical source consumption; And from actual product form, the miniaturization of mobile terminal has become the target that each equipment manufacturers are pursued, will produce very serious heating problem like this.
With regard to current technical progress degree, the heat dissipation problem that solves certain mobile terminal product form (as minature data card) has two kinds of approach: the conversion efficiency that, improves power supply, by the power supply of the input useful power (power radiateing as mobile terminal antenna mouth etc.) that is converted into as much as possible, this need to do further research to power management chip aspect; Two, accelerate the dissipation of heat power consumption, the heat power consumption of accumulation is gradually passed by modes such as conduction, radiation, convection current fast.In general, the efficiency of conduction, radiation and convection current is all relevant to the area of dissipation of actual participation, and area is larger, the effect of heat radiation is better, and still, a specific product form generally has a fixing structure, have the requirement of thickness equidimension, this has just brought very large restriction to heat radiation.
Summary of the invention
In order to solve the problems of the technologies described above, the present invention proposes a kind of heat dissipating method and device, with when meeting terminal equipment portability, miniaturization, realize the good heat radiating of terminal equipment.
The present invention proposes a kind of heat dissipating method, be applied in terminal equipment, described method comprises:
Detect in real time the temperature of described terminal equipment;
According to described temperature and unfolding condition, drive telescopic fin to be stretched over the outside of described terminal equipment.
Preferably, above-mentioned heat dissipating method can have following features:
After the described fin of driving is stretched over the outside of described terminal equipment, described method also comprises:
According to described temperature and gathering condition, drive described fin to draw in.
Preferably, above-mentioned heat dissipating method also can have following features:
Described unfolding condition is:
When described temperature arrives expansion thresholding;
When described temperature arrives the setting-up time launching after thresholding; Or
When the number of times of described temperature arrival expansion thresholding reaches set point;
Described gathering condition is:
When described temperature is when drawing thresholding in;
When described temperature lower than draw in after thresholding setting-up time time; Or
When described temperature reaches set point lower than the number of times that draws thresholding in;
Wherein, described expansion thresholding is greater than described gathering thresholding.
Preferably, above-mentioned heat dissipating method also can have following features:
The temperature of the described terminal equipment of described real-time detection comprises:
Detect in real time the temperature of the chip on described terminal equipment printed circuit board (PCB) (PCB);
The outside that the telescopic fin of described driving is stretched over described terminal equipment refers to:
Drive part fin is stretched over the outside of described terminal equipment, and the fin of staying described terminal equipment inside is contacted with the radome of described PCB or described PCB.
Preferably, above-mentioned heat dissipating method also can have following features:
Described terminal equipment is hand-held terminal device.
The present invention also provides a kind of heat abstractor, is applied in terminal equipment, and described heat abstractor comprises temperature detecting module, main processing block, driver module and telescopic fin, wherein:
Described temperature detecting module, for detecting in real time the temperature of described terminal equipment;
Described main processing block, the temperature detecting for gathering described temperature detecting module, and send and launch instruction to described driver module according to described temperature and unfolding condition;
Described driver module, for being stretched over the outside of described terminal equipment according to fin described in described expansion order-driven.
Preferably, above-mentioned heat abstractor can have following features:
Described main processing block, also for driving at described driver module after described fin is stretched over the outside of described terminal equipment, gather the temperature that described temperature detecting module detects, and send and draw instruction in to described driver module according to described temperature and gathering condition;
Described driver module, also for drawing according to fin described in described gathering order-driven.
Preferably, above-mentioned heat abstractor also can have following features:
Described unfolding condition is:
When described temperature arrives expansion thresholding;
When described temperature arrives the setting-up time launching after thresholding; Or
When the number of times of described temperature arrival expansion thresholding reaches set point;
Described gathering condition is:
When described temperature is when drawing thresholding in;
When described temperature lower than draw in after thresholding setting-up time time; Or
When described temperature reaches set point lower than the number of times that draws thresholding in;
Wherein, described expansion thresholding is greater than described gathering thresholding.
Preferably, above-mentioned heat abstractor also can have following features:
Described temperature detecting module, is further used for detecting in real time the temperature of the chip on described terminal equipment printed circuit board (PCB) (PCB);
Described main processing block, is further used for the outside that drive part fin is stretched over described terminal equipment, and the fin of staying described terminal equipment inside is contacted with the radome of described PCB or described PCB.
Preferably, above-mentioned heat abstractor also can have following features:
Described terminal equipment is hand-held terminal device.
Above-mentioned heat dissipating method and device, both can meet the requirement of terminal equipment to outward appearance and volume, also can realize good heat radiation.
Accompanying drawing explanation
Fig. 1 is the structural representation of heat abstractor embodiment mono-of the present invention;
Fig. 2 is the structural representation of heat abstractor embodiment bis-of the present invention;
Fig. 3 is the flow chart of heat dissipating method embodiment of the present invention.
Embodiment
The scheme that proposed by the invention passing through is changed to heat radiating fin structure enhancing heat-sinking capability below in conjunction with accompanying drawing describes.
The invention provides a kind of heat abstractor, be applied in terminal equipment, described heat abstractor comprises temperature detecting module, main processing block, driver module and telescopic fin, wherein: described temperature detecting module is for detecting in real time the temperature of described terminal equipment; Described main processing block is used for gathering the temperature that described temperature detecting module detects, and sends and launch instruction to described driver module according to described temperature and unfolding condition; Described driver module is for being stretched over the outside of described terminal equipment according to fin described in described expansion order-driven.
Described main processing block is also for driving at described driver module after described fin is stretched over the outside of described terminal equipment, gather the temperature that described temperature detecting module detects, and send and draw instruction in to described driver module according to described temperature and gathering condition; Described driver module is also for drawing according to fin described in described gathering order-driven.
Wherein, this telescopic fin is metal material, can adopt the metal material that the capacity of heat transmissions such as aluminium are strong, because the efficiency of hot conduction, radiation and convection current is directly related with heat-conducting area, and less with Heat Conduction Material thickness relationship, therefore, fin can adopt thin skin stepped construction, rounding state is stepped construction, and deployed condition is planar structure.
Preferably, described unfolding condition can be: when described temperature arrives expansion thresholding; Or, when described temperature arrives the setting-up time launching after thresholding, for example, when arriving, temperature launches thresholding in the time of five minutes, and drive fin to trail; Or, when the number of times of described temperature arrival expansion thresholding reaches set point, for example, when the number of times of temperature arrival expansion thresholding reaches 3 times, drive fin to trail.Described gathering condition is: when described temperature is when drawing thresholding in; When described temperature lower than draw in after thresholding setting-up time time, for example, when temperature drives fin gathering lower than drawing thresholding in the time of 1 minute; Or when described temperature reaches set point lower than the number of times that draws thresholding in, for example, when reaching 2 times lower than the number of times that draws thresholding in, temperature drive fin to draw in; Wherein, described expansion thresholding is greater than described gathering thresholding.
As shown in Figure 1, for the structural representation of heat abstractor embodiment mono-of the present invention, in this embodiment, this heat abstractor is arranged in mobile terminal device, this heat abstractor comprises temperature detecting module 11, main processing block 12, driver module 13 and telescopic fin 14, wherein:
Temperature detecting module is responsible for detecting mobile terminal device internal temperature, preferably, can detect the upper chip of heat power consumption maximum of printed circuit board (PCB) (PCB) and the temperature of device; Main processing block is responsible for the temperature information gathering and treatment temperature detection module detects, and according to the temperature threshold values setting in advance, judges whether to send driving instruction to driver module; Driver module is according to the instruction of main processing block, and fin is launched and the operation such as gathering; Fin is accepted the control of driver module, implements the operations such as expansion and gathering.
In Fig. 1, fin is in collapsed state, inner in mobile terminal device, and this time, temperature detecting module synchronous working, detected the temperature of mobile terminal device in real time.Be elevated to while surpassing predetermined expansion thresholding Ta temperature being detected, main processing block sends and launches instruction to driver module, driver module is stretched over the outside of terminal equipment according to this expansion order-driven fin, concrete structure can be referring to Fig. 2, increased the area of conduction, radiation and the convection current of heat, thereby accelerated the heat conduction of mobile terminal device, can effectively reduce the temperature of mobile terminal device.
In Fig. 2, temperature detecting module detects the temperature of mobile terminal device in real time, main processing block receives this temperature data in real time, if this temperature is lower than drawing thresholding Tb in, send and draw instruction in to driver module, driver module receives after instruction, implement drive actions, the fin launching is drawn in, it should be noted that: thresholding Ta must be greater than Tb, and for fear of mobile terminal device continuous and adjustable fin at short notice, need to guarantee that the difference between Ta and Tb is enough large, this difference is dynamic setting as required.
Above-mentioned heat abstractor, both can meet the requirement of terminal equipment to outward appearance and volume, also can realize good heat radiation.
The invention provides a kind of heat dissipating method, be applied in terminal equipment, described method comprises:
Detect in real time the temperature of described terminal equipment;
According to described temperature and unfolding condition, drive telescopic fin to be stretched over the outside of described terminal equipment.
Particularly, can arrive and launch thresholding in the time of five minutes in temperature, drive fin to trail; Also, in the time of can reaching 3 times at the number of times of temperature arrival expansion thresholding, drive fin to trail; Can also, when temperature arrives expansion thresholding, drive fin to trail.
Wherein, after the described fin of driving is stretched over the outside of described terminal equipment, described method can also comprise:
According to described temperature and gathering condition, drive described fin to draw in.
Particularly, can drive fin to draw in when drawing thresholding in described temperature; Also can lower than drawing thresholding in, in the time of 1 minute, drive fin to draw in temperature; Can also when reaching 2 times lower than the number of times that draws thresholding in, temperature drive fin to draw in; Wherein, described expansion thresholding is greater than described gathering thresholding.
As shown in Figure 3, be the flow chart of heat dissipating method embodiment of the present invention, the method comprises:
Step 301, main processing block read the temperature T 1 that temperature detecting module detects;
Step 302, judge that whether T1 surpasses and launch thresholding Ta, if so, perform step 303, otherwise, turn to step 301;
Step 303, main processing block send and launch instruction to driver module;
Step 304, driver module drive fin to launch;
Step 305, through after a period of time, whether temperature detecting module detected temperatures lower than drawing thresholding Tb in, if so, perform step 306, otherwise fin is still in deployed condition;
Step 306, gathering fin, turn to step 301.
Above-mentioned heat dissipating method, when the temperature of terminal equipment being detected and raise to surpass the expansion temperature threshold Ta of appointment, by driver module, the telescopic fin of device interior is stretched over to casing outside, now, the fin trailing still retains fraction at device interior, and and the PCB of terminal equipment or the radome close contact of this PCB, thereby realize good heat conduction.When temperature detecting module detects temperature and is reduced to the gathering temperature threshold Tb of appointment, then by driver module, fin is regained to terminal equipment inside.
Because fin is metal material, the capacity of heat transmission is very strong, and the relative environment temperature rise of 3G and 4G wireless communication terminal kind equipment is larger, and the temperature difference inside and outside terminal equipment is larger, and capacity of heat transmission is stronger.So the thickness of fin is very little on the impact of heat-sinking capability, can do as far as possible more frivolously.
Above-mentioned heat dissipating method, both can meet the requirement of terminal equipment to outward appearance and volume, also can realize good heat radiation.
Above embodiment is only unrestricted in order to technical scheme of the present invention to be described, only with reference to preferred embodiment, the present invention is had been described in detail.Those of ordinary skill in the art should be appreciated that and can modify or be equal to replacement technical scheme of the present invention, and do not depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of claim scope of the present invention.
Claims (10)
1. a heat dissipating method, is applied in terminal equipment, and described method comprises:
Detect in real time the temperature of described terminal equipment;
According to described temperature and unfolding condition, drive telescopic fin to be stretched over the outside of described terminal equipment, described telescopic fin adopts thin skin stepped construction, and rounding state is stepped construction, and deployed condition is planar structure.
2. heat dissipating method according to claim 1, is characterized in that:
After the described fin of driving is stretched over the outside of described terminal equipment, described method also comprises:
According to described temperature and gathering condition, drive described fin to draw in.
3. heat dissipating method according to claim 2, is characterized in that:
Described unfolding condition is:
When described temperature arrives expansion thresholding;
When described temperature arrives the setting-up time launching after thresholding; Or
When the number of times of described temperature arrival expansion thresholding reaches set point;
Described gathering condition is:
When described temperature is when drawing thresholding in;
When described temperature lower than draw in after thresholding setting-up time time; Or
When described temperature reaches set point lower than the number of times that draws thresholding in;
Wherein, described expansion thresholding is greater than described gathering thresholding.
4. heat dissipating method according to claim 1, is characterized in that:
The temperature of the described terminal equipment of described real-time detection comprises:
Detect in real time the temperature of the chip on described terminal equipment printing board PCB;
The outside that the telescopic fin of described driving is stretched over described terminal equipment refers to:
Drive part fin is stretched over the outside of described terminal equipment, and the fin of staying described terminal equipment inside is contacted with the radome of described PCB or described PCB.
5. according to the heat dissipating method described in the arbitrary claim of claim 1-4, it is characterized in that:
Described terminal equipment is hand-held terminal device.
6. a heat abstractor, is applied in terminal equipment, and described heat abstractor comprises temperature detecting module, main processing block, driver module and telescopic fin, wherein:
Described telescopic fin adopts thin skin stepped construction, and rounding state is stepped construction, and deployed condition is planar structure;
Described temperature detecting module, for detecting in real time the temperature of described terminal equipment;
Described main processing block, the temperature detecting for gathering described temperature detecting module, and send and launch instruction to described driver module according to described temperature and unfolding condition;
Described driver module, for being stretched over the outside of described terminal equipment according to fin described in described expansion order-driven.
7. heat abstractor according to claim 6, is characterized in that:
Described main processing block, also for driving at described driver module after described fin is stretched over the outside of described terminal equipment, gather the temperature that described temperature detecting module detects, and send and draw instruction in to described driver module according to described temperature and gathering condition;
Described driver module, also for drawing according to fin described in described gathering order-driven.
8. heat abstractor according to claim 7, is characterized in that:
Described unfolding condition is:
When described temperature arrives expansion thresholding;
When described temperature arrives the setting-up time launching after thresholding; Or
When the number of times of described temperature arrival expansion thresholding reaches set point;
Described gathering condition is:
When described temperature is when drawing thresholding in;
When described temperature lower than draw in after thresholding setting-up time time; Or
When described temperature reaches set point lower than the number of times that draws thresholding in;
Wherein, described expansion thresholding is greater than described gathering thresholding.
9. heat abstractor according to claim 6, is characterized in that:
Described temperature detecting module, is further used for detecting in real time the temperature of the chip on described terminal equipment printing board PCB;
Described main processing block, is further used for the outside that drive part fin is stretched over described terminal equipment, and the fin of staying described terminal equipment inside is contacted with the radome of described PCB or described PCB.
10. according to the heat abstractor described in the arbitrary claim of claim 6-9, it is characterized in that:
Described terminal equipment is hand-held terminal device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110038917.7A CN102105040B (en) | 2011-02-16 | 2011-02-16 | Heat radiating method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110038917.7A CN102105040B (en) | 2011-02-16 | 2011-02-16 | Heat radiating method and device |
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| Publication Number | Publication Date |
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| CN102105040A CN102105040A (en) | 2011-06-22 |
| CN102105040B true CN102105040B (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110038917.7A Active CN102105040B (en) | 2011-02-16 | 2011-02-16 | Heat radiating method and device |
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| CN (1) | CN102105040B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107726272A (en) * | 2016-08-11 | 2018-02-23 | 浙江大丰实业股份有限公司 | Stage lighting fin deploys control system |
| WO2018235898A1 (en) * | 2017-06-22 | 2018-12-27 | 株式会社Ihi | Coil device |
| CN109634737A (en) * | 2018-12-21 | 2019-04-16 | 易相会 | Handheld terminal task distributor gear |
| CN112967655B (en) * | 2021-03-24 | 2023-06-02 | 维沃移动通信有限公司 | Control circuit of scroll screen, scroll screen and electronic equipment |
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| CN201303480Y (en) * | 2008-10-29 | 2009-09-02 | 深圳华为通信技术有限公司 | Data card |
| CN201398274Y (en) * | 2009-03-25 | 2010-02-03 | 深圳华为通信技术有限公司 | Heat dissipating device and electric device |
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| CN101686625A (en) * | 2008-09-24 | 2010-03-31 | 微星科技股份有限公司 | Air exhaust device |
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2011
- 2011-02-16 CN CN201110038917.7A patent/CN102105040B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282008A (en) * | 1999-07-26 | 2001-01-31 | 仁宝电脑工业股份有限公司 | Expandable portable type computer heat radiating device |
| CN101639723A (en) * | 2008-08-02 | 2010-02-03 | 联想（新加坡）私人有限公司 | Heat dissipation system for computers |
| CN201267084Y (en) * | 2008-09-24 | 2009-07-01 | 深圳华为通信技术有限公司 | Radiating equipment of mobile terminal and heat radiation type mobile terminal |
| CN101686625A (en) * | 2008-09-24 | 2010-03-31 | 微星科技股份有限公司 | Air exhaust device |
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| CN102105040A (en) | 2011-06-22 |
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