CN102091866A - Processing visual device for light-emitting diode (LED) laser cutting-up machine - Google Patents
Processing visual device for light-emitting diode (LED) laser cutting-up machine Download PDFInfo
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- CN102091866A CN102091866A CN2010106117379A CN201010611737A CN102091866A CN 102091866 A CN102091866 A CN 102091866A CN 2010106117379 A CN2010106117379 A CN 2010106117379A CN 201010611737 A CN201010611737 A CN 201010611737A CN 102091866 A CN102091866 A CN 102091866A
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Abstract
The invention provides a processing visual device for a light-emitting diode (LED) laser cutting-up machine and relates to the technical field of laser cutting-up machines. The processing visual device mainly comprises a front alignment optical path and a bottom alignment optical path; the front alignment optical path is coaxial with a laser processing optical path and used for identifying and positioning the back of a transparent wafer and monitoring processing in real time; the bottom alignment optical path is coaxial with the laser processing optical path and used for identifying and positioning the front of a special coarsened wafer; and a bottom alignment lens is arranged at the bottom of a wafer chuck (24) and is coaxial with the front alignment lens; and the wafer is arranged on the wafer chuck (24) with an upward back. The front alignment of the wafer can be realized, the cutting-up process requirements of the coarsened wafer can be met in a mode of back cutting-up of the wafer, and the identification and alignment, and scratch monitoring of different wafers can be performed so as to contribute to improving production quality and automation degree. The wafer can be accurately focused by a laser focusing optical path and the cost is relatively low.
Description
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Technical field
The present invention relates to laser cutting-up machine technology field, especially a kind of sighting device of light emitting diode laser cutting-up machine.
Background technology
The global demand of brightness blue light LED (light emitting diode) has driven the continuous development of new production process, and an especially flourish field is a die separation technology.The Ultra-Violet Laser cutting-up compared to traditional mechanical separation method, has increased yield and production capacity as a kind of emerging alternative method of cutting blue-ray LED significantly, has cut down equipment operation and maintenance cost.Blue-ray LED backing material sapphire wafer is extremely hard, transparent, cost an arm and a leg, and is to reduce material cost, and the crystal grain miniaturization and the paddle-tumble utmost point narrow and become trend; For improving luminous efficiency, wafer plated film and alligatoring become main flow.Therefore precision and the compatibility that image is aimed at had higher requirement.
The vision system of conventional laser cutting-up machine adopts a camera lens of installing with the different axle of laser optical path mostly, can only aim at the front of wafer, thereby it is powerless that the wafer back of the body is drawn the situation that needs to aim at the back side under the mode, also just can not satisfy the cutting-up technological requirement of alligatoring wafer.In addition, the inconsistent error of bringing of wafer thickness need accurately be focused before cutting-up, and height sensor can be realized this function, but price is higher.
Summary of the invention
The purpose of this invention is to provide a kind of light emitting diode laser cutting-up machined sighting device, can not only realize the front of wafer is aimed at, and draw the cutting-up technological requirement that also can satisfy the alligatoring wafer under the mode at the wafer back of the body, the identification aligning and the cut monitoring of different wafers be can carry out, the quality of production and automaticity helped improving.If, also can carry out accurate focusing, and cost is lower to wafer by laser focusing light path.
The present invention is achieved in that a kind of light emitting diode laser cutting-up machined sighting device, it is characterized in that having a front optical system for alignment with the Laser Processing light path coaxial, is used for the identification location, the back side and the processing monitoring in real time of transparent wafer; The front optical system for alignment is equipped with focusing objective len, the first half anti-mirrors, the second half anti-mirrors, attachment objective and CCD camera from the bottom up successively, and laser beam is by the first half coaxial front optical system for alignment that are coupled into of anti-mirror; Bottom alignment light path with the Laser Processing light path coaxial is used for the identification location, front of special alligatoring wafer, and the bottom alignment light path is equipped with object lens, first speculum, the 4 half anti-mirror, tube mirror and CCD camera from top to bottom successively; The bottom alignment camera lens is installed in wafer-supporting platform bottom, and to aim at camera lens coaxial with the front; Wafer rear places on the wafer-supporting platform up, to transparent wafer, by front optical system for alignment identification block, carries out automatic contraposition; For the alligatoring wafer,, carry out automatic contraposition by bottom alignment light path identification block.
Described front optical system for alignment and Laser Processing light path, shared focusing objective len and the first half anti-mirrors, laser beam is by the first half coaxial front optical system for alignment that are coupled into of anti-mirror.The first half anti-mirrors are to the laser reflectivity of 355nm〉99%, visible light transmissivity to 460nm-650nm〉97%, there are bigger axial chromatic aberration in Ultra-Violet Laser and visible light by focusing objective len, attachment objective has certain regulated quantity, change image distance and come compensate for chromatic aberration, the front optical system for alignment is overlapped with the focal plane of Laser Processing light path, carry out cut and monitor in real time.To transparent wafer,, carry out automatic contraposition by front optical system for alignment identification block.
The aligning camera lens of described front optical system for alignment adopts the backlight recognition effect better, and wafer-supporting platform is the clear glass wafer-supporting platform.
The on-axis point light source of described bottom alignment light path uses better as the backlight of front optical system for alignment.
Described bottom alignment light path is with positive to aim at camera lens coaxial, and the bottom alignment camera lens is installed in bottom the wafer-supporting platform; The speculum cavity is used for fixing first speculum, second speculum and the 4 half anti-mirror, and object lens are connected with the speculum cavity by screw thread, carries out ± the 2mm adjusting.Wafer rear places on the wafer-supporting platform up, for the alligatoring wafer, by bottom alignment light path identification block, carries out automatic contraposition.
Described LED laser cutting-up machined sighting device, it is characterized in that being provided with a laser focusing light path with the different axle of Laser Processing light path, the accurate focusing that is used for the processing of wafer location, laser focusing light path is equipped with 10 from the bottom up successively and shows speck mirror, the 3 half anti-mirror, Guan Jing and CCD camera.
The depth of field 3um of the focus lens of described laser focusing light path is better.
Described laser focusing light path and front optical system for alignment, spot light adopts the Kohler illumination mode better, and design has the light-resource fousing mirror.
Good effect of the present invention is: patent of the present invention provides a kind of three road vision systems of the LED of being used for laser cutting-up machine, comprises a front optical system for alignment with the Laser Processing light path coaxial, is used for the identification location, the back side and the processing monitoring in real time of transparent wafer; Bottom alignment light path with the Laser Processing light path coaxial is used for the identification location, front of special alligatoring wafer; Laser focusing light path with the different axle of Laser Processing light path replaces height sensor, is used for the accurate focusing of wafer.Three road imaging optical path compact conformations cooperate adjustable lighting source flexibly, can realize that the identification of multiple different wafers is aimed at, the accurate focusing and the cut monitoring.The present invention is directed to the special requirement of LED laser cutting-up machine, its vision system not only is used for common identification location, monitoring in real time, can satisfy transparent wafer, the alligatoring wafer is just being drawn and carry on the back under the mode of drawing to alignment request.Also be used to replace height sensor to come the locating laser focal plane, the focusing accuracy height, and cost is lower than sensor.Can effectively improve the automaticity of production, be widely used in the semiconductor automated production equipment.
Make detailed explanation below in conjunction with a preferred embodiment and accompanying drawing thereof, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the structure principle chart of the embodiment of the invention 1.
Fig. 2 is the bottom alignment lens construction schematic diagram among Fig. 1.
Fig. 3 is the positive alignment mirror header structure schematic diagram among Fig. 1.
Fig. 4 is the laser focus lens structural representation among Fig. 1.
Each label declaration among the figure: 1-object lens, 2-speculum cavity, 3-spot light, 4-tube mirror, the 5-adapter sleeve, 6-CCD camera, 7-first speculum, 8-the 4 half anti-mirror, 9-second speculum, 10-spot light, 11-light-resource fousing mirror, 12-the second half anti-mirrors, 13-the first half anti-mirrors, 14-focusing objective len, 15-attachment objective, 16-CCD camera, the 17-laser optical path, 18-spot light, 19-light-resource fousing mirror, 20-the 3 half anti-mirror, the 21-10X object lens, 22-manages mirror, 23-CCD camera, 24-wafer-supporting platform.
The specific embodiment
Embodiment 1: referring to Fig. 1～Fig. 7, this LED(light emitting diode) laser cutting-up machined sighting device, has a front optical system for alignment with the Laser Processing light path coaxial, be used for the identification location, the back side and the processing monitoring in real time of transparent wafer, the front optical system for alignment is equipped with focusing objective len (14), the first half anti-mirrors (13), the second half anti-mirrors (12), attachment objective (15) and CCD camera (16) from the bottom up successively, and laser beam is by the first half coaxial front optical system for alignment that are coupled into of anti-mirror (13); Bottom alignment light path with the Laser Processing light path coaxial, be used for the identification location, front of special alligatoring wafer, the bottom alignment light path is equipped with object lens (1), first speculum (7), the 4 half anti-mirror (8), tube mirror (4) and CCD camera (6) from top to bottom successively; The bottom alignment camera lens is installed in wafer-supporting platform (24) bottom, and to aim at camera lens coaxial with the front; Wafer rear places on the wafer-supporting platform (24) up, to transparent wafer, by front optical system for alignment identification block, carries out automatic contraposition; For the alligatoring wafer,, carry out automatic contraposition by bottom alignment light path identification block.
Front optical system for alignment and Laser Processing light path, shared focusing objective len (14) and the first half anti-mirrors (13), the first half anti-mirrors (13) are to the laser reflectivity of 355nm〉99%, visible light transmissivity to 460nm-650nm〉97%, there are bigger axial chromatic aberration in Ultra-Violet Laser and visible light by focusing objective len (14), and attachment objective (15) has certain regulated quantity, change image distance and come compensate for chromatic aberration, the front optical system for alignment is overlapped with the focal plane of Laser Processing light path, carry out cut and monitor in real time.The backlight of the aligning camera lens of front optical system for alignment is the on-axis point light source (3) of bottom alignment light path.Bottom alignment light path and Laser Processing light path are installed on wafer-supporting platform (24) bottom, and wafer-supporting platform (24) is the clear glass wafer-supporting platform.Speculum cavity (2) is used for fixing first speculum (7), second speculum (9) and the 4 half anti-mirror (8), and object lens (1) are connected with speculum cavity (2) by screw thread, carry out ± the 2mm accurate focusing.
Be provided with a laser focusing light path with the different axle of Laser Processing light path, the accurate focusing that is used for the processing of wafer location, laser focusing light path is equipped with 10 from the bottom up successively and shows speck mirror (21), the 3 half anti-mirror (20), Guan Jing (22) and CCD camera (23).The depth of field 3um of the focus lens of laser focusing light path.The spot light (10,18) of laser focusing light path and front optical system for alignment adopts the Kohler illumination mode, and design has light-resource fousing mirror (11,19).
1, front optical system for alignment and Laser Processing light path coaxial are installed on the workbench front, by one the first half anti-mirror coupling, shared focusing objective len.Spot light is coupled into light path by the second half anti-mirrors, carries out coaxial-illuminating, for making full use of luminous energy, adopts the Kohler illumination mode to design the light-resource fousing mirror.To transparent wafer, adopt positive the aligning, back lighting recognition effect the best, the green spot light of bottom alignment light path can be simultaneously backlight as positive light path.The first half anti-mirrors and the second half anti-mirrors can cause the light beam deviation among Fig. 1, considered this deviation in the structural design, and micromatic setting is arranged.
The first half special plated films of anti-mirror wherein are to the laser reflectivity of 355nm〉99%, to the visible light transmissivity of 460nm-650nm〉97%.Wherein attachment objective and the common imaging of laser focusing objective len, composition diagram be as optical system for alignment, and focusing objective len is at Ultra-Violet Laser aberration correction and the plating anti-reflection film of 355nm, but to the visible light of 460nm-650nm, aberration is bigger.There are bigger axial chromatic aberration in Ultra-Violet Laser and visible light by focusing objective len, the attachment objective of autonomous Design has certain regulated quantity, comes compensate for chromatic aberration by changing image distance, guarantees that the front optical system for alignment overlaps with the focal plane of Laser Processing light path, aligning efficient height, and can carry out cut and monitor in real time.
2, the improvement of user's technology has impelled the appearance of the LED sapphire wafer of more alligatoring and special coating, the wafer printing opacity rate variance of alligatoring, draw under the mode at the back of the body, the direct picture alignment system is difficult to identification, so the design bottom optical system for alignment, at the front of alligatoring wafer Direct Recognition wafer.Camera lens adopts the design of ZEMAX software, considers the process and assemble error, carries out TOLERANCE ANALYSIS.
Bottom alignment camera lens and Laser Processing light path coaxial are installed on the rotary table bottom, turntable hollow, and wafer-supporting platform is a clear optical glass.The lens construction compactness, operating distance is big, has avoided the issuable interference of working table movement fully.As shown in Figure 2, object lens are axially adjustable ± 1.5mm, be used for the instrumentality distance; The tube mirror is axially adjustable ± 5mm, be used to regulate image distance; The base plate two-dimensional adjustable, it is coaxial to make bottom alignment camera lens and front aim at camera lens.The alligatoring wafer back of the body is drawn under the mode, adopted bottom alignment camera lens identification wafer frontside, on-axis point light source recognition effect is better.
3, the cutting-up depth tolerances of technological requirement LED wafer be controlled at ± 2um in, focusing accuracy is had relatively high expectations.Height sensor cost height, therefore and be vulnerable to the influence of different materials surface reflectivity, utilize high power microcobjective resolution ratio height, characteristics that the depth of field is little, designed focus lens, need only the clear mixed and disorderly cut that recognizes wafer rear, can find the focal position of Laser Processing.
The different axle of laser focusing light path and Laser Processing light path is installed on the workbench front side by side.Select ripe high-power microscope head for use, comprise the object lens of a 10X and supporting Guan Jing, by the 4 half anti-mirror, be coupled into the green spot light of illumination, camera lens depth of field 3um between object lens and the Guan Jing.The difference of record focus lens focus and Laser Processing focus in the debugging is recorded in the EOP as a processing compensating parameter, as long as focus lens recognizes the wafer rear cut, just can correspondingly obtain the coordinate figure of Laser Processing focus.Focusing light path light path is big, and optical energy loss is big, adopts the Kohler illumination mode, and design light-resource fousing mirror makes full use of luminous energy.Experiment finds that green spot light more helps identification.
Present embodiment front aligning, bottom alignment and laser focusing three cover light paths three road imaging optical path compact conformations, cooperate adjustable lighting source flexibly, can realize that multiple different LED wafer, controllable silicon wafer just drawing or carrying on the back pattern alignment under the mode of drawing, monitoring and laser focus function in real time, compact in design is compatible strong.
Embodiment also can only comprise front optical system for alignment and bottom alignment light path, does not contain laser focusing light path (figure slightly).The focusing of wafer realizes that by height sensor the focusing precision also can satisfy the demands, but cost is higher.
Claims (8)
1. light emitting diode laser cutting-up machined sighting device, it is characterized in that having a front optical system for alignment with the Laser Processing light path coaxial, be used for the identification location, the back side and the processing monitoring in real time of transparent wafer, the front optical system for alignment is equipped with focusing objective len (14), the first half anti-mirrors (13), the second half anti-mirrors (12), attachment objective (15) and CCD camera (16) from the bottom up successively; Bottom alignment light path with the Laser Processing light path coaxial, be used for the identification location, front of special alligatoring wafer, the bottom alignment light path is equipped with object lens (1), first speculum (7), the 4 half anti-mirror (8), tube mirror (4) and CCD camera (6) from top to bottom successively.
2. light emitting diode laser cutting-up machined sighting device according to claim 1, it is characterized in that described front optical system for alignment and Laser Processing light path, shared focusing objective len (14) and the first half anti-mirrors (13), laser beam is by the first half coaxial front optical system for alignment that are coupled into of anti-mirror (13), the first half anti-mirrors (13) are to the laser reflectivity of 355nm〉99%, visible light transmissivity to 460nm-650nm〉97%, there are bigger axial chromatic aberration in Ultra-Violet Laser and visible light by focusing objective len (14), attachment objective (15) has certain regulated quantity, change image distance and come compensate for chromatic aberration, the front optical system for alignment is overlapped with the focal plane of Laser Processing light path, carrying out cut monitors in real time, to transparent wafer,, carry out automatic contraposition by front optical system for alignment identification block.
3. light emitting diode laser cutting-up machined sighting device according to claim 2 is characterized in that the aligning camera lens of described front optical system for alignment has backlight, and wafer-supporting platform (24) is the clear glass wafer-supporting platform.
4. light emitting diode laser cutting-up machined sighting device according to claim 3, the backlight that it is characterized in that the aligning camera lens of described front optical system for alignment is the on-axis point light source (3) of bottom alignment light path.
5. light emitting diode laser cutting-up machined sighting device according to claim 1, it is coaxial to it is characterized in that camera lens is aimed in described bottom alignment light path and front, and the bottom alignment camera lens is installed in wafer-supporting platform (24) bottom; Speculum cavity (2) is used for fixing first speculum (7), second speculum (9) and the 4 half anti-mirror (8), object lens (1) are connected with speculum cavity (2) by screw thread, carry out ± the 2mm adjusting, wafer rear places on the wafer-supporting platform (24) up, for the alligatoring wafer, by bottom alignment light path identification block, carry out automatic contraposition.
6. according to claim 1,2,3,4 or 5 described light emitting diode laser cutting-up machined sighting devices, it is characterized in that being provided with a laser focusing light path with the different axle of Laser Processing light path, the accurate focusing that is used for the processing of wafer location, laser focusing light path is equipped with 10 from the bottom up successively and shows speck mirror (21), the 3 half anti-mirror (20), Guan Jing (22) and CCD camera (23).
7. light emitting diode laser cutting-up machined sighting device according to claim 6 is characterized in that the depth of field 3um of the focus lens of described laser focusing light path.
8. light emitting diode laser cutting-up machined sighting device according to claim 6 is characterized in that described laser focusing light path and front optical system for alignment, adopts the on-axis point light source, spot light (10,18) adopt the Kohler illumination mode, design has light-resource fousing mirror (11,19).
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| CN106077959A (en) * | 2016-07-06 | 2016-11-09 | 中国电子科技集团公司第四十五研究所 | A kind of laser scribing mode for GPP bottom alignment |
| CN106392343A (en) * | 2016-09-26 | 2017-02-15 | 中国电子科技集团公司第四十八研究所 | Laser processing device for solar cell piece |
| CN110091075A (en) * | 2019-05-31 | 2019-08-06 | 大族激光科技产业集团股份有限公司 | Wafer grooving method and device |
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Application publication date: 20110615 |