CN102088047A - LED repairing device and method thereof - Google Patents
LED repairing device and method thereof Download PDFInfo
- Publication number
- CN102088047A CN102088047A CN2009102596831A CN200910259683A CN102088047A CN 102088047 A CN102088047 A CN 102088047A CN 2009102596831 A CN2009102596831 A CN 2009102596831A CN 200910259683 A CN200910259683 A CN 200910259683A CN 102088047 A CN102088047 A CN 102088047A
- Authority
- CN
- China
- Prior art keywords
- led chip
- reference position
- measuring
- measuring position
- consistent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Engineering & Computer Science (AREA)
- Led Devices (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Die Bonding (AREA)
- Led Device Packages (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses an LED repairing device comprising a video unit which is used to measuring the position of an LED chip relative to a lead wire frame; a control unit which is used to measure whether or not the X and Y measuring points on a plane of the LED chip measured by the video unit and the theta measuring point of a rotating angle along the axial direction (Z axis) perpendicular to the plane are in line with the X, Y and theta referential points of the LED chip; and a correction tool which corrects the position of the LED chip to align the measuring points with the referential points, when the control unit determines that the X, Y and theta measuring points are not in line with the X, Y and theta referential points of the LED chip. Therefore, the position of an LED chip placed in a lead wire frame can be automatically measured and precisely corrected through a video unit for measuring the LED chip position (X, Y and theta) and a correction tool for correcting the position of the LED chip.
Description
The cross reference of related application
The application requires the senior interest of the korean patent application No.2009-0119534 of submission on December 4th, 2009, and the disclosure with this korean patent application is incorporated into this paper in full by reference.
Technical field
The present invention relates to LED prosthetic device and method, relate more particularly to such LED prosthetic device and method, it automatically measures and proofreaies and correct the position (X, Y and θ) of led chip with respect to lead frame.
Background technology
Generally speaking, make LED by following steps: the joint technology that the wafer that has formed a plurality of led chips on it is joined to joint fastener; The wafer that is engaged to joint fastener is cut into the cutting technique of independent led chip; The chip separation process that independent led chip is separated with joint fastener; The led chip that separates with joint fastener is joined to the chip join technology of lead frame; Led chip is electrically connected to the wire welding tech of the connection pads of lead frame by welding wire; And with the moulding technology of epoxy resin mold led chip.
Especially, chip join technology is carried out by the chip join device, the chip join device comprises buanch unit and joint unit, and buanch unit is used to shift on it lead frame of placing, and joint unit is used to engage the led chip that is positioned on the lead frame to be maintained at joint unit.
At this, lead frame has the area greater than the led chip area, and is included in formed encapsulation region on its top, and led chip engages in encapsulation region.In addition, circuit pattern is formed on the encapsulation region of the encapsulation region of lead frame and led chip to correspond to each other.
At this, when led chip was not installed in the exact position on the lead frame and does not install with accurate posture, it was incomplete being electrically connected in follow-up wire bond process, therefore causes product failure.
That is to say, because circuit pattern, so led chip should accurately engage in the encapsulation region of lead frame.
Therefore, led chip typically stands to be used for the correction process whether definite bonding station exists the monitoring technology of inefficacy and be used to proofread and correct the bonding station of led chip after chip join technology.
Yet in the led chip joint technology of prior art, the workman uses microscope manually to determine whether to have inefficacy at bonding station, and if exist inefficacy to use tweezers manually to proofread and correct the position of led chip.In this case, may be different to the monitoring result of the bonding station of led chip to be monitored along with craftsmanship's difference, simultaneously, when manually proofreading and correct the bonding station of led chip, also be difficult to realize accurate control.
In addition, manually carry out monitoring and correction, need the plenty of time the led chip bonding station by the workman.
And the monitoring that the workman carries out can not be guaranteed to monitor fully because of workman's operating efficiency, but carries out on limited amount sample, therefore can not detect the inefficacy that is occurred in the zone of monitoring.
In addition, workman's carelessness also can cause losing efficacy.
In addition, because the monitoring and the correction of led chip bonding station are carried out, therefore reduced the efficient of manufacture process after joint technology.
Summary of the invention
The present invention is devoted to solve the problems referred to above of prior art, and the purpose of this invention is to provide such LED prosthetic device and method, and it automatically measures and proofread and correct the position (X, Y and θ) of led chip with respect to lead frame.
To achieve these goals, according to an aspect of the present invention, provide a kind of LED prosthetic device, it comprises: the video unit, and it is used to measure the position of led chip with respect to lead frame; Control unit, whether it is used for respectively determining X on the plane of the led chip measured by the video unit and Y measuring position and as along the θ measuring position perpendicular to the anglec of rotation of axial (Z-direction) on this plane, consistent with the X of led chip and Y reference position and θ reference position; And aligning tool, when control unit determined that X and Y measuring position and θ measuring position and X and Y reference position and θ reference position are inconsistent respectively, this aligning tool was proofreaied and correct the position of led chip, makes the measuring position consistent with the reference position.
The video unit can move measuring the position of led chip or lead frame along X-direction and Y direction, and aligning tool can move and rotates along the θ direction along X-axis, Y-axis and Z-direction.
X can be the angle (X that is connected led chip with the Y reference position
1, Y
1) and the diagonal angle (X of led chip
2, Y
2) the first nodal point C of line
1, first nodal point C
1As datum mark, X can be the angle (X that is connected the led chip of being measured by the video unit with the Y measuring position
3, Y
3) and the diagonal angle (X of led chip
4, Y
4) the second central point C of line
2, the θ reference position can be arctan (Y
2-Y
1/ X
2-X
1), the θ measuring position can be arctan (Y
4-Y
3/ X
4-X
3), and control unit can be by comparing first nodal point C
1With the second central point C
2Whether the X that determines led chip is consistent with X and Y reference position with the Y measuring position, and based on passing through arctan (Y
2-Y
1/ X
2-X
1) deduct arctan (Y
4-Y
3/ X
4-X
3) value that obtained determines whether the θ measuring position of led chip consistent with the θ reference position.
X and Y reference position can be the first nodal point C of lead frame
3, X and Y measuring position can be the second central point C of line at the diagonal angle of the angle that is connected the led chip of being measured by the video unit and led chip
4, the θ reference position can have and pass first nodal point C
3The first line stretcher L
1Corresponding datum line, θ measuring position can have and the second line stretcher L that is connected by the diagonal angle of the angle of the led chip of video unit measurement and led chip
2Corresponding datum line, control unit can be by comparing first nodal point C
3With the second central point C
4Whether the X that determines led chip is consistent with X and Y reference position with the Y measuring position, and based on the first line stretcher L
1With the second line stretcher L
2Between the angle of intersection deduct 45 ° of values that obtained and determine whether the θ measuring position of led chip consistent with the θ reference position.
According to first embodiment of the invention, a kind of LED restorative procedure is provided, it comprises the steps: that (a) measures the position of led chip with respect to lead frame; (b) determine respectively to be positioned on the plane of led chip X and Y measuring position with as along whether consistent perpendicular to the X of the θ measuring position of the anglec of rotation of axial (Z-direction) on this plane and led chip and Y reference position and θ reference position; And (c) when definite measuring position and reference position are inconsistent, proofread and correct the position of led chip, make the measuring position consistent with the reference position.
X can be the angle (X that is connected led chip with the Y reference position
1, Y
1) and the diagonal angle (X of led chip
2, Y
2) the first nodal point C of line
1, first nodal point C
1As datum mark, X can be the angle (X that is connected measured led chip with the Y measuring position
3, Y
3) and the diagonal angle (X of led chip
4, Y
4) the second central point C of line
2, and the θ reference position can be arctan (Y
2-Y
1/ X
2-X
1), the θ measuring position can be arctan (Y
4-Y
3/ X
4-X
3).
Step (b) can be by comparing first nodal point C
1With the second central point C
2Whether the X that determines led chip is consistent with X and Y reference position with the Y measuring position, and based on passing through arctan (Y
2-Y
1/ X
2-X
1) deduct arctan (Y
4-Y
3/ X
4-X
3) value that obtained determines whether the θ measuring position of led chip consistent with the θ reference position.
According to second embodiment of the invention, a kind of LED restorative procedure is provided, it comprises the steps: the position of (a) measuring lead wire framework; (b) measure the position of led chip with respect to lead frame; (c) determine respectively to be positioned on the plane of led chip X and Y measuring position and as along whether consistent perpendicular to the X of the θ measuring position of the anglec of rotation of axial (Z-direction) on this plane and the led chip that records from lead frame and Y reference position and θ reference position; And (d) when definite measuring position and reference position are inconsistent, proofread and correct the position of led chip, make the measuring position consistent with the reference position.
X and Y reference position can be the first nodal point C of lead frame
3, X and Y measuring position can be the second central point C of line at the diagonal angle of the angle that is connected led chip and led chip
4, the θ reference position can have and pass first nodal point C
3The first line stretcher L
1Corresponding datum line, θ measuring position can have the second line stretcher L with the diagonal angle of angle that is connected led chip and led chip
2Corresponding datum line.
Step (c) can be by comparing first nodal point C
3With the second central point C
4Whether the X that determines led chip is consistent with X and Y reference position with the Y measuring position, and based on the first line stretcher L
1With the second line stretcher L
2Between the angle of intersection deduct 45 ° of values that obtained and determine whether the θ measuring position of led chip consistent with the θ reference position.
A kind of chip join machine of the present invention can comprise above-mentioned LED prosthetic device.
Description of drawings
By the reference accompanying drawing in detail illustrative embodiments of the present invention is described in detail, those skilled in the art can more be expressly understood above and other objects of the present invention, feature and advantage, wherein:
Fig. 1 is the schematic diagram that chip join machine of the present invention (die bonder) is shown;
Fig. 2 is the enlarged drawing that the LED prosthetic device of Fig. 1 is shown;
Fig. 3 is according to the schematic diagram of first embodiment of the invention by the image of video unit photographs, and it illustrates the attached state of led chip;
Fig. 4 utilizes the image measurement of Fig. 3 and compares the detail drawing of the position of led chip;
Fig. 5 is the flow chart of diagram according to the LED restorative procedure of first embodiment of the invention;
Fig. 6 is according to the schematic diagram of second embodiment of the invention by the image of video unit photographs, and it illustrates the attached state of attached led chip;
Fig. 7 utilizes the image measurement of Fig. 6 and compares the detail drawing of the position of led chip; And
Fig. 8 is the flow chart of diagram according to the LED restorative procedure of second embodiment of the invention.
Embodiment
Illustrative embodiments of the present invention hereinafter is described in detail in detail with reference to the accompanying drawings.
Fig. 1 is the schematic diagram that chip join machine of the present invention is shown.
As shown in Figure 1, chip join machine A according to the present invention comprises the buanch unit 100 that is used to shift the lead frame LF that places on it; Be used to engage the joint unit 200 that is positioned at the led chip C on the lead frame LF that is placed on the buanch unit 100; And be used to proofread and correct the LED prosthetic device 300 of led chip C with respect to the position of lead frame LF.
In addition, joint unit 200 comprises and is used for epoxy resin is applied to spreading implement 210 on the lead frame LF; And be used for engaging the joining tool 220 that is positioned at the led chip on the lead frame LF by led chip closely being bonded to epoxy resin.
Therefore, chip join machine A of the present invention has increased LED prosthetic device 300 in the chip join technology of carrying out as single technology, therefore with execution finishing the led chip joint technology after to the art methods of the monitoring of led chip position and correction comparatively speaking, improved the efficient of manufacture process.
Next, LED prosthetic device 300 of the present invention will be described.
Fig. 2 is the enlarged drawing that the LED prosthetic device of Fig. 1 is shown.
As shown in Figure 2, LED prosthetic device 300 according to the present invention comprises: video unit 310, and it is used to measure the position of led chip C with respect to lead frame LF; Control unit 320, whether it is used for respectively determining X on the plane of the led chip C that measured by video unit 310 and Y measuring position and as along the θ measuring position perpendicular to the anglec of rotation of axial (Z-direction) on this plane, consistent with the X of led chip C and Y reference position and θ reference position; And aligning tool 330, it is used for when control unit 320 has determined that respectively X and Y measuring position and θ measuring position and X and Y reference position and θ reference position are inconsistent, and the position of proofreading and correct led chip C makes the measuring position consistent with the reference position.
In addition, video unit 310 moves to measure the position of led chip C or lead frame LF along X-direction and Y direction, and aligning tool 330 along X-axis, Y direction and Z-direction move and along θ direction rotation with rotating LED chip C, thereby the position of proofreading and correct led chip C.
That is to say,, therefore can reduce the operating time, reduce failure rate simultaneously because the position of led chip C is automatically measured and proofreaied and correct.
Next, describe a kind of being used for reference to following concrete example and determine the method whether led chip C and lead frame LF depart from by benchmark position and measuring position.
Execution mode 1
Fig. 3 is according to the schematic diagram of first embodiment of the invention by the image of video unit photographs, and it illustrates the attached state of led chip, and Fig. 4 utilizes the image measurement of Fig. 3 and compares the detail drawing of the position of led chip.
As shown, X and Y reference position are as 1. (X of (a) among Fig. 3 and the angle that is connected led chip C shown in (a) among Fig. 4
1, Y
1) and 2. (X of the diagonal angle of led chip C
2, Y
2) the first nodal point C of line
1, first nodal point C
1As datum mark.X and Y measuring position are as 3. (X of (b) among Fig. 3 and the angle that is connected the led chip C that is measured by video unit 310 shown in (b) among Fig. 4
3, Y
3) and 4. (X of the diagonal angle of led chip C
4, Y
4) the second central point C of line
2
1. and the inclination angle of line 2., i.e. arctan (Y in (b) among Fig. 4 in addition, the θ reference position is that the angle in (a) in the connection layout 3
2-Y
1/ X
2-X
1), 3. and inclination angle 4., i.e. arctan (Y in (b) among Fig. 4 the θ measuring position is that the angle in (b) in the connection layout 3
4-Y
3/ X
4-X
3).
X and Y reference position and θ reference position are based on the set positions of the led chip C that accurately is placed on the lead frame LF, and preferably are set at fixed value.Simultaneously, the location drawing that accurately is placed on the led chip C on the lead frame LF that is obtained by video unit 310 looks like can be used as the reference position.
That is to say that as shown in Figure 4, control unit 320 is by comparing first nodal point C
1With the second central point C
2Whether the X that determines led chip C is consistent with X and Y reference position with the Y measuring position, and based on passing through arctan (Y
2-Y
1/ X
2-X
1) deduct arctan (Y
4-Y
3/ X
4-X
3) value that obtained determines whether the θ measuring position of led chip C consistent with the θ reference position.
Next, with reference to Fig. 5 the method that LED prosthetic device that a kind of utilization has the first embodiment of the invention of above-mentioned structure is proofreaied and correct led chip C position is described.
Fig. 5 is the flow chart of diagram according to the LED restorative procedure of first embodiment of the invention.
At first, measure the position (S510) that is positioned over the led chip C on the lead frame LF by video unit 310.
Next, control unit 320 determine respectively to be positioned on the plane of led chip C X and Y measuring position and as along perpendicular to the X of the θ measuring position of the anglec of rotation of axial (Z-direction) on this plane and led chip C and Y reference position and θ reference position whether consistent (S520).
At this, when control unit 320 determines that the measuring position of led chip C and reference position are inconsistent, the position of using aligning tool 330 to proofread and correct led chip C, make measuring position consistent with the reference position (S530), and when the measuring position was consistent with the reference position, program turned back to step S510 is placed on the led chip C on the lead frame LF with measurement position.
Execution mode 2
Fig. 6 is according to the schematic diagram of second embodiment of the invention by the image of video unit photographs, and it illustrates the attached state of attached led chip, and Fig. 7 utilizes the image measurement of Fig. 6 and compares the detail drawing of the position of led chip.
As shown in the figure, X and Y reference position are the first nodal point C of the lead frame LF shown in (a) among Fig. 6
3, X and Y measuring position be shown in (b) among Fig. 6 the angle that is connected led chip C 6. with the second central point C of the diagonal angle line 7. of led chip C
4
In addition, the θ reference position has and passes Fig. 7 first nodal point C
3The first line stretcher L
1Corresponding datum line, θ measuring position have shown in (b) among Fig. 6, with the angle that is connected led chip C 6. with the diagonal angle second line stretcher L 7.
2Corresponding datum line.
That is to say that as shown in Figure 7, control unit 320 is by comparing first nodal point C
3With the second central point C
4Whether the X that determines led chip C is consistent with X and Y reference position with the Y measuring position, and based on the first line stretcher L
1With the second line stretcher L
2Between the angle of intersection deduct 45 ° of values that obtained and determine whether the θ measuring position of led chip C consistent with the θ reference position.
At this, a kind of first nodal point C that is used to measure is described with reference to Fig. 6
3Method.At first, the end points of measuring the straight line be parallel to limit, lead frame LF left side 1. and 2., measure then be positioned at place, lead frame LF right side end points 3..
Next, calculate end points 1. and mid point 2. 4., and 4. 5. be set at first nodal point C with the mid point that 3. end points obtains by connecting mid point
3.
At this, connecting mid point 4. is by first nodal point C with end points line 3.
3The first line stretcher L
1
To the first nodal point C of conduct by video unit 310 captured images
3With the first line stretcher L
1Calculate.
That is to say, as mentioned above, because therefore the image of the central point of shooting lead frame LF can proofread and correct the position of led chip C to determine the reference position, also be like this even take into account the deflection of lead frame LF.
Therefore, though first execution mode only calculates and proofread and correct the position of led chip C, second execution mode had both calculated and had proofreaied and correct the position that led chip C was also calculated and proofreaied and correct to the deflection of lead frame LF.
Simultaneously, the above-mentioned method that is used for the reference position of definite Fig. 6 only is the example of diagram second embodiment of the invention, and the present invention is not limited thereto.Therefore, be used for determining that the method for reference position can have various variations according to the shape of lead frame LF and the position of led chip C.
Hereinafter with reference to Fig. 8 the method that LED prosthetic device that a kind of use has second execution mode of above-mentioned structure is proofreaied and correct the position of led chip is described.
Fig. 8 is the flow chart of diagram according to the LED restorative procedure of second embodiment of the invention.
At first, by the position (S810) of video unit 310 measuring lead wire framework LF.
Next, measure the position (S820) that is positioned over the led chip C on the lead frame LF by video unit 310.
Then, control unit 320 determine respectively to be positioned on plane of led chip C X and Y measuring position and as along perpendicular to the θ measuring position of the anglec of rotation of axial (Z-direction) on this plane and the X that records from lead frame LF and Y reference position and θ reference position whether consistent (S830).
At this, when control unit 320 determines that measuring positions and reference position are inconsistent, position and the angle of using aligning tool 330 to proofread and correct led chip C, make measuring position consistent with the reference position (S840), and when the measuring position was consistent with the reference position, program turned back to step S810 to measure the position of follow-up lead frame LF.
As mentioned above, according to LED prosthetic device of the present invention, measure the video unit of led chip position (X, Y and θ) and be used to proofread and correct the aligning tool of led chip position by being used to, automatically measure and accurately proofread and correct the position that is placed on the led chip on the lead frame.
That is to say,, therefore can reduce the operating time, reduce failure rate simultaneously because the position of led chip C is automatically measured and proofreaied and correct.
The position of optionally proofreading and correct led chip in the time of in addition, can departing from the reference position in the measuring position.
And, because LED prosthetic device of the present invention is to provide, therefore improved the efficient of manufacture process in the chip join technology of carrying out as single technology.
In addition, because the led chip that accurately engages often stands follow-up wire bond, therefore improved precision in the encapsulation region of lead frame.
It will be apparent to one skilled in the art that and under the situation that does not break away from essence of the present invention or scope, to carry out various modifications above-mentioned illustrative embodiments of the present invention.Therefore, the invention is intended to be encompassed in all this modifications that propose in appended claim scope and the equivalency range thereof.
Claims (11)
1. LED prosthetic device comprises:
The video unit is used to measure the position of led chip with respect to lead frame;
Control unit, be used for respectively determining X on the plane of the described led chip measured by described video unit and Y measuring position and as along θ measuring position perpendicular to the anglec of rotation of axial (Z-direction) on described plane, whether consistent with the X of described led chip and Y reference position and θ reference position; And
Aligning tool, when described control unit determines that described X and Y measuring position and described θ measuring position and described X and Y reference position and described θ reference position are inconsistent respectively, described aligning tool is proofreaied and correct the position of described led chip, makes described measuring position consistent with described reference position.
2. device as claimed in claim 1, wherein said video unit moves measuring the position of described led chip or described lead frame along X-direction and Y direction, and described aligning tool moves and rotates along the θ direction along X-axis, Y-axis and Z-direction.
3. device as claimed in claim 2, wherein said X is the angle (X that is connected described led chip with the Y reference position
1, Y
1) and the diagonal angle (X of described led chip
2, Y
2) the first nodal point C of line
1, described first nodal point C
1As datum mark, described X is the angle (X that is connected the described led chip of being measured by described video unit with the Y measuring position
3, Y
3) and the diagonal angle (X of described led chip
4, Y
4) the second central point C of line
2,
Wherein, described θ reference position is arctan (Y
2-Y
1/ X
2-X
1), described θ measuring position is arctan (Y
4-Y
3/ X
4-X
3), and
Wherein, described control unit is by comparing first nodal point C
1With the second central point C
2Whether the X that determines described led chip is consistent with X and Y reference position with the Y measuring position, and based on passing through arctan (Y
2-Y
1/ X
2-X
1) deduct arctan (Y
4-Y
3/ X
4-X
3) value that obtained determines whether the θ measuring position of described led chip consistent with the θ reference position.
4. device as claimed in claim 2, wherein said X and Y reference position are the first nodal point C of described lead frame
3, described X and Y measuring position are the second central point C of line that is connected the diagonal angle of the angle of the described led chip of being measured by described video unit and described led chip
4,
Wherein, described θ reference position have with by described first nodal point C
3The first line stretcher L
1Corresponding datum line, described θ measuring position have and the second line stretcher L that is connected by the diagonal angle of the angle of the described led chip of described video unit measurement and described led chip
2Corresponding datum line,
Wherein, described control unit is by more described first nodal point C
3With the described second central point C
4Whether the X that determines described led chip is consistent with X and Y reference position with the Y measuring position, and based on the described first line stretcher L
1With the described second line stretcher L
2Between the angle of intersection deduct 45 ° of values that obtained and determine whether the θ measuring position of described led chip consistent with the θ reference position.
5. a LED restorative procedure comprises the steps:
(a) measure the position of led chip with respect to lead frame;
(b) determine respectively to be positioned on the plane of described led chip X and Y measuring position and as along whether consistent with the X of described led chip and Y reference position and θ reference position perpendicular to the θ measuring position of the anglec of rotation of axial (Z-direction) on described plane; And
(c) when definite described measuring position and described reference position were inconsistent, the position of proofreading and correct described led chip made described measuring position consistent with described reference position.
6. method as claimed in claim 5, wherein, described X is the angle (X that is connected described led chip with the Y reference position
1, Y
1) and the diagonal angle (X of described led chip
2, Y
2) the first nodal point C of line
1, described first nodal point C
1As datum mark, described X is the angle (X that is connected measured described led chip with the Y measuring position
3, Y
3) and the diagonal angle (X of described led chip
4, Y
4) the second central point C of line
2, and
Wherein, described θ reference position is arctan (Y
2-Y
1/ X
2-X
1), described θ measuring position is arctan (Y
4-Y
3/ X
4-X
3).
7. method as claimed in claim 6, wherein, described step (b) is by more described first nodal point C
1With the described second central point C
2Whether the X that determines described led chip is consistent with X and Y reference position with the Y measuring position, and based on passing through arctan (Y
2-Y
1/ X
2-X
1) deduct arctan (Y
4-Y
3/ X
4-X
3) value that obtained determines whether the θ measuring position of described led chip consistent with the θ reference position.
8. a LED restorative procedure comprises the steps:
(a) position of measuring lead wire framework;
(b) measure the position of led chip with respect to described lead frame;
(c) determine respectively to be positioned on the plane of described led chip X and Y measuring position and as along whether consistent with the X of the described led chip that records from described lead frame and Y reference position and θ reference position perpendicular to the θ measuring position of the anglec of rotation of axial (Z-direction) on described plane; And
(d) when definite described measuring position and described reference position were inconsistent, the position of proofreading and correct described led chip made described measuring position consistent with described reference position.
9. method as claimed in claim 8, wherein, described X and Y reference position are the first nodal point C of described lead frame
3, described X and Y measuring position are the second central point C of line that is connected the diagonal angle of the angle of described led chip and described led chip
4,
Wherein, described θ reference position has and passes described first nodal point C
3The first line stretcher L
1Corresponding datum line, described θ measuring position have the second line stretcher L with the diagonal angle of angle that is connected described led chip and described led chip
2Corresponding datum line.
10. method as claimed in claim 9, wherein, described step (c) is by more described first nodal point C
3With the described second central point C
4Whether the X that determines described led chip is consistent with X and Y reference position with the Y measuring position, and based on the described first line stretcher L
1With the described second line stretcher L
2Between the angle of intersection deduct 45 ° of values that obtained and determine whether the θ measuring position of described led chip consistent with the θ reference position.
11. a chip join machine, it comprises as each described LED prosthetic device in the claim 1 to 4.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0119534 | 2009-12-04 | ||
| KR1020090119534A KR20110062721A (en) | 2009-12-04 | 2009-12-04 | Led repair apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102088047A true CN102088047A (en) | 2011-06-08 |
Family
ID=44099754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102596831A Pending CN102088047A (en) | 2009-12-04 | 2009-12-22 | LED repairing device and method thereof |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20110062721A (en) |
| CN (1) | CN102088047A (en) |
| TW (1) | TW201121103A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426983A (en) * | 2013-08-28 | 2013-12-04 | 湘能华磊光电股份有限公司 | Method for repairing light-emitting diode chip |
| CN103681407A (en) * | 2012-09-13 | 2014-03-26 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| CN104364893A (en) * | 2013-01-30 | 2015-02-18 | 雅科贝思私人有限公司 | A planar positioning system and method of using the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI562695B (en) * | 2012-12-24 | 2016-12-11 | Hon Hai Prec Ind Co Ltd | Method for regulating lighting emitting module |
| KR102312858B1 (en) * | 2014-11-07 | 2021-10-14 | 세메스 주식회사 | Method of adjusting a bonding position for a die bonder |
| KR101649424B1 (en) * | 2014-12-31 | 2016-08-30 | 한국산업기술대학교산학협력단 | Position control system and method |
-
2009
- 2009-12-04 KR KR1020090119534A patent/KR20110062721A/en active Search and Examination
- 2009-12-22 CN CN2009102596831A patent/CN102088047A/en active Pending
- 2009-12-23 TW TW98144527A patent/TW201121103A/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681407A (en) * | 2012-09-13 | 2014-03-26 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| CN103681407B (en) * | 2012-09-13 | 2016-09-07 | 捷进科技有限公司 | Chip engagement machine and joint method |
| CN104364893A (en) * | 2013-01-30 | 2015-02-18 | 雅科贝思私人有限公司 | A planar positioning system and method of using the same |
| CN104364893B (en) * | 2013-01-30 | 2016-11-23 | 雅科贝思私人有限公司 | A kind of plane positioning system and the method using this plane positioning system |
| CN103426983A (en) * | 2013-08-28 | 2013-12-04 | 湘能华磊光电股份有限公司 | Method for repairing light-emitting diode chip |
| CN103426983B (en) * | 2013-08-28 | 2016-02-24 | 湘能华磊光电股份有限公司 | Repair the method for light-emitting diode chip for backlight unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110062721A (en) | 2011-06-10 |
| TW201121103A (en) | 2011-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102088047A (en) | LED repairing device and method thereof | |
| US9385104B2 (en) | Bonding apparatus | |
| US20160351528A1 (en) | Mounting apparatus and method of correcting offset amount of the same | |
| TW201201301A (en) | Process control and manufacturing method for fan out wafers | |
| US11574832B2 (en) | Die attach systems including a verification substrate | |
| US7929152B2 (en) | Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion | |
| TWI400759B (en) | Method of correcting bonding coordinates using reference bond pads | |
| CN101339656A (en) | Image processing process of full-automatic lead wire bonding machine image processing system | |
| TWI833149B (en) | Joining devices, joining methods and joining procedures | |
| US7624904B1 (en) | Calibration apparatus for bondhead of wire bonding machine | |
| JP2004146776A (en) | Machine and method for mounting flip-chip | |
| US20100072262A1 (en) | Wire bonding method | |
| JPH05160192A (en) | Semiconductor fabricating system | |
| JP5116176B2 (en) | Inspection device | |
| JP5006357B2 (en) | Bonding method and bonding apparatus | |
| TW202114008A (en) | Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine | |
| CN109029369B (en) | Detection method for flight shooting | |
| KR101659305B1 (en) | Inspection Method after Equipping Component | |
| JP5022598B2 (en) | Bonding apparatus and semiconductor device manufacturing method | |
| JPH06216170A (en) | Automatic die bonder | |
| KR101236795B1 (en) | Wire bonder having device for calculation bar value | |
| JP4073175B2 (en) | Bonding equipment | |
| CN110268521B (en) | Method for fixing an engaged product in a working area of an adapter | |
| JP2003273153A (en) | Wire bonding method and wire bonding device for implementing the wire bonding method | |
| TW201709370A (en) | Measuring method for semiconductor device increasing the number of measured samples to further effectively inspect defective products |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110608 |