CN102059472A - Halogen-free lead-free soldering paste - Google Patents
Halogen-free lead-free soldering paste Download PDFInfo
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- CN102059472A CN102059472A CN2011100045969A CN201110004596A CN102059472A CN 102059472 A CN102059472 A CN 102059472A CN 2011100045969 A CN2011100045969 A CN 2011100045969A CN 201110004596 A CN201110004596 A CN 201110004596A CN 102059472 A CN102059472 A CN 102059472A
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Abstract
The invention relates to the technical field of soldering pasts, in particular to a halogen-free lead-free soldering paste meeting the REACH command of European Union. The soldering past comprises the following components in parts by mass per unit mass: 37-38 parts of tin, 52-53 parts of bismuth, 4-6 parts of rosin, 3-5 parts of non-fluorine non-chlorine type environment-friendly organic solvent, 0.3-0.4 part of thixotropic agent, 0.2-0.4 part of organic active agent, 0.1-0.2 part of corrosion inhibitor and 0.1-0.2 part of surfactant. The soldering paste obtained according to the technical scheme of the invention meets the related commands of European Union, and contains no lead or related halogen. In addition, the halogen-free lead-free soldering paste has high soldering reliability, cannot form defective soldering points, and can form full and bright soldering points.
Description
Technical field:
The present invention relates to technical field of soldering paste, refer in particular to compound a kind of the meet REACH of European Union instruction, not halogen-containing leadless soldering tin paste.
Background technology:
Solder(ing) paste is a kind of solder, and solder(ing) paste can be fixed on electronic devices and components on the circuit board.After it is heated to uniform temperature, it will be melted, and soldered components and parts and circuit board are linked together, treat fusing point cooling after, promptly solidify and form fixing solder joint.
The solder(ing) paste of Cai Yonging was a tin lead welding cream in the past, but environmental requirement, at present leadless soldering tin paste now generally uses, because the Effect on Performance such as wetting of lead-free alloy itself, make the activating agent that generally uses halogen in the leadless soldering tin paste, with the problems such as wetting poor, failure welding that solve welding.But because halogen-containing activating agent can produce harmful gas in welding process, so by the strict restriction in many countries.
European Union announced first SVHC investigation material, totally 15 kinds of materials towards the public among the REACH on June 18th, 2008.On January 13rd, 2010, European chemicals administration (ECHA) confirms that 15 kinds of materials are included in the REACH rules mandate candidate list.On June 18th, 2010, ECHA formally lists the 3rd crowd of SVHC that comprises 8 materials in the candidate list motion.Like this, up to now, the high material of paying close attention to just comprises that material all can not exceed standard in 38 in the REACH instruction, and the content of related substances can not surpass 0.1% in the product.
In the afore mentioned rules many materials commonly used in the tin cream have all been made strict restriction, such as: halogen, lead (Pb) etc., so now, if the associated electrical product is if the European Union area of outlet, its soldering paste that adopts must reach the related request of REACH, and this also is that the inventor creates reason of the present invention place.
Summary of the invention:
Technical problem to be solved by this invention is exactly in order to make solder(ing) paste meet European Union's relevant regulations, and a kind of not halogen-containing leadless soldering tin paste is provided.
For solving the problems of the technologies described above, the present invention has adopted following technical scheme: the quality proportioning of each composition is in the composition of this solder(ing) paste and the unit mass: tin 37-38 part; Bismuth 52-53 part; Rosin 4-6 part; Non-fluorine chlorine type environmental protection organic solvent 3-5 part; Thixotropic agent 0.3-0.4 part; Organic active agent 0.2-0.4 part; Corrosion inhibitor 0.1-0.2 part; Surfactant 0.1-0.2 part.
In the technique scheme, described organic acid activator is: a kind of or combination in glutaric acid, the ethylenediamine.
In the technique scheme, described thixotropic agent is a rilanit special.
In the technique scheme, described corrosion inhibitor is a BTA.
In the technique scheme, described surfactant is: Triton X-100.
In the technique scheme, the environmental protection of described non-fluorine chlorine type is: one or more in diethylene glycol monobutyl ether, glycol propyl ether, EGME, propane diols, the hexylene glycol.
In the technique scheme, also adding in the described solder(ing) paste has viscosity modifier, and its quality proportioning is 0.1-0.2 part.
In the technique scheme, also adding in the described solder(ing) paste has active synthetic, and its quality proportioning is 0.2-0.4 part.
After the present invention adopted technique scheme, product met European Union's dependent instruction, not leaded and relevant halogen.In addition, welding reliability of the present invention is higher, can not form bad solder joint, and solder joint is full, light.
The specific embodiment:
The designed solder(ing) paste of the present invention is a kind of lead-free halogen free soldering paste, and its composition is as follows:
Solder powder adopts tin and bismuth, and its granularity generally should be at 25～45 μ m.
Resin adopts conventional rosin material, and it plays and strengthens the tin cream adhesiveness, and the effect of protecting and preventing the oxidation once again of postwelding circuit board is arranged.
The non-fluorine chlorine of solvent type environmental protection organic solvent: one or more in diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, glycol propyl ether, EGME, propane diols, the hexylene glycol.Solvent stirs tin cream, regulate evenly in tin cream manufacturing process.
Activator adopts organic activator, and the effect that it can remove the oxidation material of circuit board top layer and part welding position has the effect that reduces tin surfaces tension force simultaneously.For example: a kind of or combination in glutaric acid, the ethylenediamine.
Thixotropic agent adopts rilanit special, and it mainly is viscosity and a printing performance of regulating solder(ing) paste.
Other auxiliary agents are to improve the performance of solder(ing) paste.For example adopt the corrosion inhibitor of BTA; Adopt the surfactant of Triton X-100; Viscosity modifier; Also add in the described solder(ing) paste active synthetic is arranged.
The proportioning of each composition and unit mass is in composition of the present invention and the unit mass:
Tin 37-38 part
Bismuth 52-53 part
Rosin 4-6 part
Non-fluorine chlorine type environmental protection organic solvent 3-5 part
Thixotropic agent 0.3-0.4 part
Organic active agent 0.2-0.4 part
Corrosion inhibitor 0.1-0.2 part
Surfactant 0.1-0.2 part
Viscosity modifier 0.1-0.2 part is optional
Active synthetic 0.2-0.4 part is optional
Embodiment 1:
Each component is in the present embodiment 1 of unit mass: 37 parts in tin; 53 parts of bismuths; 4 parts of rosin; 4 parts of diethylene glycol monobutyl ethers; 0.3 part of rilanit special; 0.15 part of glutaric acid; 0.1 part of BTA; 0.2 part of Triton X-100; 0.1 part of viscosity modifier, 0.15 part of active synthetic.
Below be the test result of present embodiment:
Embodiment 2:
Each component is in the present embodiment 2 of unit mass: 38 parts in tin; 52 parts of bismuths; 5 parts of rosin; 4 parts of glycol propyl ethers; 0.4 part of rilanit special; 0.15 part of ethylenediamine; 0.1 part of BTA; 0.1 part of Triton X-100; 0.1 part of viscosity modifier, 0.15 part of active synthetic.
Certainly, the above only is example of the present invention, is not to limit the scope of the present invention, and all equivalences of doing according to the described structure of the present patent application claim, feature and principle change or modify, and all should be included in the present patent application claim.
Claims (8)
1. not halogen-containing leadless soldering tin paste, it is characterized in that: the quality proportioning of each composition is in the composition of this solder(ing) paste and the unit mass:
Tin 37-38 part
Bismuth 52-53 part
Rosin 4-6 part
Non-fluorine chlorine type environmental protection organic solvent 3-5 part
Thixotropic agent 0.3-0.4 part
Organic active agent 0.2-0.4 part
Corrosion inhibitor 0.1-0.2 part
Surfactant 0.1-0.2 part.
2. a kind of not halogen-containing leadless soldering tin paste according to claim 1, it is characterized in that: described organic active agent is: a kind of or combination in glutaric acid, the ethylenediamine.
3. a kind of not halogen-containing leadless soldering tin paste according to claim 2, it is characterized in that: described thixotropic agent is a rilanit special.
4. a kind of not halogen-containing leadless soldering tin paste according to claim 3, it is characterized in that: described corrosion inhibitor is a BTA.
5. a kind of not halogen-containing leadless soldering tin paste according to claim 4, it is characterized in that: described surfactant is: Triton X-100.
6. a kind of not halogen-containing leadless soldering tin paste according to claim 5 is characterized in that: described non-fluorine chlorine type environmental protection organic solvent is: one or more combinations in diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, glycol propyl ether, EGME, propane diols, the hexylene glycol.
7. according to any described a kind of not halogen-containing leadless soldering tin paste among the claim 1-6, it is characterized in that: also adding in the described solder(ing) paste has viscosity modifier, and its quality proportioning is 0.1-0.2 part.
8. not halogen-containing leadless soldering tin paste according to claim 7 is characterized in that: also adding in the described solder(ing) paste has active synthetic, and its quality proportioning is 0.2-0.4 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100045969A CN102059472A (en) | 2011-01-11 | 2011-01-11 | Halogen-free lead-free soldering paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100045969A CN102059472A (en) | 2011-01-11 | 2011-01-11 | Halogen-free lead-free soldering paste |
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| CN102059472A true CN102059472A (en) | 2011-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011100045969A Pending CN102059472A (en) | 2011-01-11 | 2011-01-11 | Halogen-free lead-free soldering paste |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248321A (en) * | 2011-07-06 | 2011-11-23 | 江西理工大学 | Lead-free solder paste used for halogen-free LED (light-emitting diode) lamp |
| CN102513735A (en) * | 2011-12-27 | 2012-06-27 | 厦门市及时雨焊料有限公司 | Flux paste for high-bismuth content solder paste and preparation method thereof |
| CN102848093A (en) * | 2011-07-01 | 2013-01-02 | 北京有色金属与稀土应用研究所 | Lead-free soldering paste, preparation method and application thereof for low temperature brazing for aluminum radiator |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN104551435A (en) * | 2011-12-30 | 2015-04-29 | 深圳市晨日科技有限公司 | High temperature lead-free halogen-free solder paste and preparation method thereof |
| CN117083148A (en) * | 2021-03-31 | 2023-11-17 | 千住金属工业株式会社 | Soldering flux and soldering paste |
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| US20060011267A1 (en) * | 2004-05-28 | 2006-01-19 | Kay Lawrence C | Solder paste and process |
| CN1895836A (en) * | 2005-07-12 | 2007-01-17 | 倪潮锋 | Low-temperature and lead-free tin soldering cream and its preparation |
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2011
- 2011-01-11 CN CN2011100045969A patent/CN102059472A/en active Pending
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| US20060011267A1 (en) * | 2004-05-28 | 2006-01-19 | Kay Lawrence C | Solder paste and process |
| JP2006007288A (en) * | 2004-06-28 | 2006-01-12 | Mitsubishi Materials Corp | Au-Sn ALLOY POWDER FOR SOLDER PASTE |
| CN1895836A (en) * | 2005-07-12 | 2007-01-17 | 倪潮锋 | Low-temperature and lead-free tin soldering cream and its preparation |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102848093A (en) * | 2011-07-01 | 2013-01-02 | 北京有色金属与稀土应用研究所 | Lead-free soldering paste, preparation method and application thereof for low temperature brazing for aluminum radiator |
| CN102848093B (en) * | 2011-07-01 | 2015-05-13 | 北京有色金属与稀土应用研究所 | Lead-free soldering paste, preparation method and application thereof for low temperature brazing for aluminum radiator |
| CN102248321A (en) * | 2011-07-06 | 2011-11-23 | 江西理工大学 | Lead-free solder paste used for halogen-free LED (light-emitting diode) lamp |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN102513735A (en) * | 2011-12-27 | 2012-06-27 | 厦门市及时雨焊料有限公司 | Flux paste for high-bismuth content solder paste and preparation method thereof |
| CN104551435A (en) * | 2011-12-30 | 2015-04-29 | 深圳市晨日科技有限公司 | High temperature lead-free halogen-free solder paste and preparation method thereof |
| CN117083148A (en) * | 2021-03-31 | 2023-11-17 | 千住金属工业株式会社 | Soldering flux and soldering paste |
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Application publication date: 20110518 |