CN102049840A - Plastic packaging mold of electronic device as well as plastic packaging method - Google Patents
Plastic packaging mold of electronic device as well as plastic packaging method Download PDFInfo
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- CN102049840A CN102049840A CN2009102093813A CN200910209381A CN102049840A CN 102049840 A CN102049840 A CN 102049840A CN 2009102093813 A CN2009102093813 A CN 2009102093813A CN 200910209381 A CN200910209381 A CN 200910209381A CN 102049840 A CN102049840 A CN 102049840A
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- electronic device
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- injection
- plastic packaging
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Abstract
The invention provides a plastic packaging mold of an electronic device as well as a plastic packaging method. The plastic packaging mold comprises an injection mold, a cavity mold and a pushing part, wherein the injection mold is provided with an injection hole, the cavity mold is provided with an injection cavity which forms the appearance of the electronic device, and the pushing part directly acts on the surface of the encapsulated electronic device. In the plastic packaging production of the electronic device, the embodiment of the invention is used to avoid stripping between a carrier tape and the electronic device in demolding so as to improve the product yield, reduce the mold cleaning frequency and improve the utilization of the equipment and the production efficiency.
Description
Technical field
The present invention relates to the electron device package field, more particularly, relate to a kind of plastic package die and plastic packaging method of electronic device.
Background technology
Usually in electronic device carrier band shaft type plastic package process, employed mould has the plastic package die that comprises injecting hole and form the injection moulding cavity of electronic device outward appearance, and the pin pin that will finish the electronic device release cavity of injection moulding.Fig. 1 shows the vertical view that the electronic device on the carrier band is carried out plastic packaging according to prior art.Fig. 2 A and Fig. 2 B show the cutaway view according to the part 16 of Fig. 1 of prior art.
With reference to Fig. 1, Fig. 2 A and Fig. 2 B, in plastic package process, plastic package die 10 and the carrier band 12 that has an electronic device 14 are matched, by the capsulation material of injection resinae in plastic package die 10 and the injecting hole 11 that injection moulding cavity 15 is communicated with, finish injection moulding process then; After injection moulding process is finished, because the electronic device ectosome is the capsulation material of resinae, and capsulation material and injection moulding cavity 15 have certain bonding force, so need to promote electronic device 14 carrier band 12 on every side, thereby the electronic device that is formed with the plastic packaging ectosome on carrier band 12 14 released injection moulding cavitys 15 with pin pin 13.
Yet, after plastic package die is finished repeatedly the plastic packaging process, because the bonding force of electronic device and injection moulding cavity increases gradually, so, can cause plastic packaging material to separate when situation is serious with carrier band 12 when pin pin 13 can cause producing very big peeling force between carrier band 12 and the electronic device 14 when promoting carrier band 12.Therefore reduced the yield rate of product, and caused the frequent clean of injection moulding cavity because that the injection moulding cavity cleans difficulty is bigger, so its scavenging period usually at 2～3 hours, this has obviously reduced production efficiency.
Summary of the invention
The problems referred to above at the prior art existence, the object of the present invention is to provide a kind of plastic package die and plastic packaging method of electronic device, described plastic package die comprises the injection mould and the cavity mould of double layer design and the release parts that directly act on the encasing electronic components surface.By implementing example embodiment of the present invention, can avoid peeling off between carrier band and the electronic device taken place when the demoulding, solved the existing in prior technology problem.
An aspect of of the present present invention provides a kind of plastic package die of electronic device, and described plastic package die comprises: injection mould, this injection mould are provided with through the injecting hole of injection moulding cavity; Be incorporated into the cavity mould of the one side of described injection mould, its another side is used in conjunction with the carrier band for the treatment of the injection moulding electronic device, and be provided with the injection moulding cavity that runs through up and down in the described cavity mould, the cross section port of this injection moulding cavity is evenly or increase gradually along the direction away from described injection mould.
Plastic package die according to example embodiment of the present invention, also comprise the release parts, with be used for will finish the electronic device of plastic packaging release the injection moulding cavity, release parts and be pin pin or the pin of cross-sectional area less than the cross-sectional area of the port on described plastic packaging cavity and the one side that described injection mould combines.
Another aspect of the present invention provides a kind of plastic packaging method of electronic device, said method comprising the steps of: the first step, the plastic package die that will comprise injection mould and cavity mould earlier matches with the carrier band that has electronic device, by the capsulation material of injection resinae in described plastic package die and the injecting hole that the injection moulding cavity is communicated with, finish injection moulding process then; Second step, finish after injection moulding process and capsulation material solidify to finish, the injection mould on the upper strata in the described plastic package die is moved to the inoperative zone; The 3rd step promoted electronic device by the apparent release parts of the plastic packaging that directly acts on the electronic device of finishing plastic packaging, and the carrier band that is provided with electronic device is separated with the cavity mould.
In sum, in the electronic device plastic packaging is produced, by the use of example embodiment of the present invention, can avoid when the demoulding, taking place peeling off between carrier band and the electronic device, thereby improved the yield rate of product, and reduced the number of times that mould cleans, improved utilization rate of equipment and installations and production efficiency.
Description of drawings
Fig. 1 shows the vertical view that the electronic device on the carrier band is carried out plastic packaging according to prior art.
Fig. 2 A and Fig. 2 B show the partial sectional view according to the part 16 of Fig. 1 of prior art.
Fig. 3 A and Fig. 3 B are respectively the schematic diagram of the plastic package die of the plastic package die of prior art and example embodiment of the present invention.
Fig. 4 shows the flow chart according to the method for the plastic packaging electronic device of example embodiment of the present invention.
The specific embodiment
According to the plastic package die of example embodiment of the present invention, finish the plastic packaging and the knockout course of carrier band electronic device by adopting double-deck plastic package die and the release parts that act on the electronic device surface.
Hereinafter, describe example embodiment of the present invention with reference to the accompanying drawings in detail.Here need to prove that accompanying drawing only is a schematic diagram, wherein the size of each several part is not to draw in proportion.
With reference to Fig. 3 B, plastic package die according to example embodiment of the present invention comprises: be provided with the injection mould 20 and the cavity mould 22 that is provided with the injection moulding cavity 23 that runs through up and down that forms the electronic device outward appearance of the injecting hole 21 that runs through injection moulding cavity 23, described injection moulding cavity 23 has the cross section port that is evenly or increases gradually along the direction away from described injection mould 20.Certainly, the shape of injection moulding cavity 23 depends primarily on two aspects: the one, and the shape of the electronic device of its plastic packaging; The 2nd, must satisfy in the associated process conditions of the demoulding requirement about chamfering.For example, when the foursquare electronic device of needs plastic packaging, the shape of injection moulding cavity 23 can be the truncated rectangular pyramids of just putting.The shape that it is pointed out that the injection moulding cavity shown in Fig. 3 B only is in order to be illustrated more clearly in example embodiment of the present invention, and the shape of the injection moulding cavity of example embodiment of the present invention is not intended to be limited to this.
The one side of the cavity mould of the plastic package die of example embodiment of the present invention can with the injection mould formation double-decker of combining closely, its another side is used in conjunction with the carrier band for the treatment of the injection moulding electronic device.Compare with the plastic package die shown in Fig. 3 A according to prior art, improvement according to the plastic package die of example embodiment of the present invention is mainly reflected in two aspects: the one, the monoblock type mould of prior art is changed over double-decker formula mould, its top is the injection mould that is provided with injecting hole, and the bottom is the cavity mould that is provided with the injection moulding cavity that forms the electronic device outward appearance; The 2nd, replace traditional pin pin that acts on the carrier band with the release parts that act on the electronic device surface, described release parts are cross-sectional areas less than the pin pin or the pin of the cross-sectional area of the port on described plastic packaging cavity and the one side that described injection mould combines.
Fig. 4 shows the flow chart according to the method for the plastic packaging electronic device of example embodiment of the present invention.As shown in Figure 4, when the plastic packaging operation of carrying out electronic device, mainly carry out following three steps:
The first step 410, to match with the carrier band 12 that has electronic device 14 according to the plastic package die that comprises injection mould 20 and cavity mould 22 of example embodiment of the present invention earlier, by the capsulation material of injection resinae in described plastic package die and the injecting hole 21 that injection moulding cavity 23 is communicated with, finish injection moulding process then.Can obtain plastic package die by machine finishing, but the method for making according to the plastic package die of example embodiment of the present invention is not limited thereto according to example embodiment of the present invention.
In second step 420, after finishing injection moulding process and capsulation material curing end, described plastic package die injection mould 20 is at the middle and upper levels moved to the inoperative zone.
The 3rd step 430 promoted electronic devices 14 by the release parts 24 that act on the electronic device 14 that the surface is formed with capsulation material, and the electronic device that is arranged on the formation plastic packaging outward appearance on the carrier band is separated with the cavity mould.Release parts 24 according to example embodiment of the present invention can be pin pin or pin, but are not limited thereto.
In example embodiment of the present invention, release position component and be adjusted to electronic device center (shown in 430 among Fig. 4) by (as shown in Figure 1) around the electronic device.For the equipment of implementing according to the plastic package die of example embodiment of the present invention, in its operation, increased a mould and shifted out action and increased the corresponding Ministry of worker to place injection mould 20, the mould shift-out mechanism adjusts accordingly to be applicable to two moulds up and down respectively simultaneously.
Though, implement to do above-mentioned change according to the equipment needs of the plastic package die of example embodiment of the present invention, it is significant implementing the beneficial effect that the present invention brings.That is, in plastic package process is produced, by the use of example embodiment of the present invention, can avoid when the demoulding, taking place peeling off between carrier band and the electronic device, thereby improved the yield rate of product, and reduced the number of times that mould cleans, improved utilization rate of equipment and installations and production efficiency.
The invention is not restricted to above-mentioned example embodiment, without departing from the present invention, can carry out various changes and modifications.
Claims (3)
1. the plastic package die of an electronic device is characterized in that comprising:
Injection mould, this injection mould are provided with through the injecting hole of injection moulding cavity;
Be incorporated into the cavity mould of the one side of described injection mould, its another side is used in conjunction with the carrier band for the treatment of the injection moulding electronic device, and be provided with the injection moulding cavity that runs through up and down in the described cavity mould, the cross section port of this injection moulding cavity is evenly or increase gradually along the direction away from described injection mould.
2. plastic package die as claimed in claim 1, it is characterized in that also comprising the release parts, with be used for will finish the electronic device of plastic packaging release the injection moulding cavity, described release parts are cross-sectional areas less than the pin pin or the pin of the cross-sectional area of the port on described plastic packaging cavity and the one side that described injection mould combines.
3. the plastic packaging method of an electronic device said method comprising the steps of:
The first step, earlier the plastic package die of injection mould and cavity mould that comprises as claimed in claim 1 is matched with the carrier band that has electronic device, by the capsulation material of injection resinae in described plastic package die and the injecting hole that the injection moulding cavity is communicated with, finish injection moulding process then;
In second step, after finishing injection moulding process and capsulation material curing end, described plastic package die injection mould is at the middle and upper levels moved to the inoperative zone;
The 3rd step promoted electronic device by the apparent release parts of the plastic packaging that directly acts on the electronic device of finishing plastic packaging, and the electronic device that is arranged on the formation plastic packaging outward appearance on the carrier band is separated with the cavity mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209381 CN102049840B (en) | 2009-11-04 | 2009-11-04 | Plastic packaging mold of electronic device as well as plastic packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209381 CN102049840B (en) | 2009-11-04 | 2009-11-04 | Plastic packaging mold of electronic device as well as plastic packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102049840A true CN102049840A (en) | 2011-05-11 |
| CN102049840B CN102049840B (en) | 2013-04-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910209381 Expired - Fee Related CN102049840B (en) | 2009-11-04 | 2009-11-04 | Plastic packaging mold of electronic device as well as plastic packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102049840B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582572A (en) * | 1991-09-19 | 1993-04-02 | Nec Corp | Semiconductor device resin sealing mold and resin sealing method |
| JPH0740398A (en) * | 1993-07-28 | 1995-02-10 | Shinko Sellbick:Kk | Injection mold |
| CN2530349Y (en) * | 2002-03-14 | 2003-01-08 | 铜陵三佳模具股份有限公司 | Two-stage liftout plastic sealing mould |
| CN2920620Y (en) * | 2006-06-17 | 2007-07-11 | 铜陵三佳科技股份有限公司 | Epoxy mould capable of reducing electronic epoxy product air holes and air bubbles |
-
2009
- 2009-11-04 CN CN 200910209381 patent/CN102049840B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582572A (en) * | 1991-09-19 | 1993-04-02 | Nec Corp | Semiconductor device resin sealing mold and resin sealing method |
| JPH0740398A (en) * | 1993-07-28 | 1995-02-10 | Shinko Sellbick:Kk | Injection mold |
| CN2530349Y (en) * | 2002-03-14 | 2003-01-08 | 铜陵三佳模具股份有限公司 | Two-stage liftout plastic sealing mould |
| CN2920620Y (en) * | 2006-06-17 | 2007-07-11 | 铜陵三佳科技股份有限公司 | Epoxy mould capable of reducing electronic epoxy product air holes and air bubbles |
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| Publication number | Publication date |
|---|---|
| CN102049840B (en) | 2013-04-03 |
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Granted publication date: 20130403 Termination date: 20181104 |