CN102041407A - High-strength high-conductivity micro-boron copper alloy material and preparation method thereof - Google Patents
High-strength high-conductivity micro-boron copper alloy material and preparation method thereof Download PDFInfo
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 35
- 239000000956 alloy Substances 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000003723 Smelting Methods 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052796 boron Inorganic materials 0.000 claims abstract description 7
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 239000006104 solid solution Substances 0.000 claims description 12
- 238000005098 hot rolling Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000010791 quenching Methods 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 230000032683 aging Effects 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000000171 quenching effect Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000007772 electrode material Substances 0.000 abstract description 4
- 238000004064 recycling Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000005275 alloying Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- FZQBLSFKFKIKJI-UHFFFAOYSA-N boron copper Chemical compound [B].[Cu] FZQBLSFKFKIKJI-UHFFFAOYSA-N 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
一种高强度高导电性微硼铜合金材料，其成分按重量百分比为：0.01～0.2％的B、0.2～1.8％的稀有金属(稀有金属选自Zr、Te的一种或两种)、余量为Cu和不可避免的杂质。经熔炼及形变热处理后，制备出性能优良的铜基合金。所获得合金具有优越的综合性能，其抗拉强度530～600MPa、导电率78～95％IACS、延伸率≥12％、并且具有成本低、易回收再利用、易加工以及制备工艺简单等优点。本发明的铜合金材料主要适用于高速电气化铁路接触网导线、大规模集成线路引线框架、电极材料等领域，具有良好的工业应用前景。A high-strength and high-conductivity micro-boron-copper alloy material, its composition by weight percentage is: 0.01-0.2% B, 0.2-1.8% rare metal (rare metal is selected from one or two kinds of Zr and Te), The balance is Cu and unavoidable impurities. After smelting and deformation heat treatment, a copper-based alloy with excellent properties is prepared. The obtained alloy has superior comprehensive properties, its tensile strength is 530-600 MPa, its electrical conductivity is 78-95% IACS, its elongation is more than 12%, and it has the advantages of low cost, easy recycling, easy processing and simple preparation process. The copper alloy material of the invention is mainly applicable to the fields of high-speed electrified railway catenary conductors, large-scale integrated circuit lead frames, electrode materials and the like, and has good industrial application prospects.
Description
技术领域technical field
本发明涉及一种高强度高导电性铜合金材料及制备方法，特别是指一种高强度高导电性微硼铜合金材料及制备方法；属于有色金属材料技术领域。The invention relates to a high-strength and high-conductivity copper alloy material and a preparation method, in particular to a high-strength and high-conductivity micro-boron-copper alloy material and a preparation method; it belongs to the technical field of non-ferrous metal materials.
背景技术Background technique
铜及其合金因具有良好的导电性能、导热性能、抗疲劳性能、化学稳定性及强度和易于制造等特点，在电力、机械、电子、交通及能源等行业已具有广泛的应用，成为重要的电子金属材料。随着经济与科学技术的快速发展，对高速电气化铁路接触网导线、大规模集成线路引线框架及电极材料等领域所用的高强高导铜合金性能提出了更高的要求。然而，由于铜合金自身的物理特性而导致很难同时兼顾其强度和导电性，最终很难获得强度和导电性俱佳的铜合金。Copper and its alloys have been widely used in electric power, machinery, electronics, transportation and energy industries due to their good electrical conductivity, thermal conductivity, fatigue resistance, chemical stability, strength and ease of manufacture, and have become important Electronic metal materials. With the rapid development of economy and science and technology, higher requirements are put forward for the performance of high-strength and high-conductivity copper alloys used in the fields of high-speed electrified railway catenary wires, large-scale integrated circuit lead frames, and electrode materials. However, due to the physical properties of the copper alloy itself, it is difficult to balance its strength and electrical conductivity at the same time, and it is finally difficult to obtain a copper alloy with excellent strength and electrical conductivity.
目前，主要通过合金化法和复合材料法来解决铜合金高强度和高导电性的矛盾。复合材料法虽可获得超高强度铜合金，但其制备工艺复杂，不易规模化生产；合金化制备工艺较前者简单，目前得到广泛的应用，但仍然存在一些问题。申请号为02133772.1中国专利申请公布了一种接触网导线用铜合金材料，此种合金材料的成分为：合金含有重量百分比为0.1～1.2％Te、0.2～1.3％Mg、0.02～0.50％Li、余量为Cu和不可避免的杂质。其抗拉强度σb为523～576MPa、电导率为76～72.6％IACS，其综合性能比较差，不能很好地满足现代节能降耗的主题。申请号为200710066484.X中国专利申请公布了一种新型高强高导电铜合金及其制备方法，其实例2的合金成分为：1.0％Eu，1.0％Gd，1.0％Er，0.5％C，其余为铜，其抗拉强度＞600MPa，导电率＞80％IACS。虽然其性能基本满足要求，但其中添加了大量贵重的稀土元素，大大地提高其生产成本，而且不易回收再利用，有悖于可持续发展战略。因此，满足高强高导铜合金要求的同时，并且使铜合金具有生产成本低、易回收再利用、易加工和生产工艺简单等特点是本发明的主要任务之一。At present, the contradiction between high strength and high conductivity of copper alloy is mainly solved by alloying method and composite material method. Although the composite material method can obtain ultra-high-strength copper alloys, its preparation process is complicated and it is not easy to produce on a large scale; the alloying preparation process is simpler than the former and has been widely used at present, but there are still some problems. The application number is 02133772.1 Chinese patent application has announced a copper alloy material for catenary wires, the composition of this alloy material is: the alloy contains 0.1-1.2% Te, 0.2-1.3% Mg, 0.02-0.50% Li, The balance is Cu and unavoidable impurities. Its tensile strength σ b is 523-576 MPa, and its electrical conductivity is 76-72.6% IACS. Its comprehensive performance is relatively poor, and it cannot well meet the theme of modern energy saving and consumption reduction. The application number is 200710066484.X Chinese patent application has announced a new type of high-strength and high-conductivity copper alloy and its preparation method, the alloy composition of its example 2 is: 1.0% Eu, 1.0% Gd, 1.0% Er, 0.5% C, the rest is Copper, its tensile strength > 600MPa, electrical conductivity > 80% IACS. Although its performance basically meets the requirements, a large amount of precious rare earth elements are added to it, which greatly increases its production cost, and it is not easy to recycle and reuse, which is contrary to the sustainable development strategy. Therefore, it is one of the main tasks of the present invention to meet the requirements of high-strength and high-conductivity copper alloys, and to make the copper alloys have the characteristics of low production cost, easy recycling, easy processing and simple production process.
发明内容Contents of the invention
本发明的目的在于克服现有技术之不足而提供一种组分配比合理、生产工艺简单、生产成本低、制备的铜合金具有高强度和高导电性、易回收再利用的高强度高导电性微硼铜合金及制备方法。The purpose of the present invention is to overcome the deficiencies of the prior art and provide a high-strength and high-conductivity copper alloy with reasonable component distribution, simple production process, low production cost, high strength and high conductivity, and easy recycling and reuse. Micro-boron-copper alloy and preparation method thereof.
本发明一种高强度高导电性微硼铜合金，由下述组份按重量百分比组成：A high-strength and high-conductivity micro-boron-copper alloy of the present invention is composed of the following components by weight percentage:
硼 0.01～0.2％，Boron 0.01～0.2%,
稀有金属 0.2～1.8％，余量为Cu和不可避免的杂质，杂质的总含量不超过0.01％。Rare metals 0.2-1.8%, the balance is Cu and unavoidable impurities, the total content of impurities is not more than 0.01%.
本发明一种高强度高导电性微硼铜合金中，所述稀有金属选自Zr、Te中的至少一种。In the high-strength and high-conductivity micro-boron-copper alloy of the present invention, the rare metal is selected from at least one of Zr and Te.
本发明一种高强度高导电性微硼铜合金的制备方法，包括下述步骤：A method for preparing a high-strength and high-conductivity micro-boron-copper alloy of the present invention comprises the following steps:
第一步：熔炼Step 1: Smelting
按设计的合金各组分配比，分别称取硼、稀有金属及铜，在真空或大气中进行熔炼，熔炼温度为1200±50℃，铁模浇注成铸锭；According to the distribution ratio of each component of the alloy, boron, rare metals and copper are weighed respectively, and smelted in vacuum or in the atmosphere. The smelting temperature is 1200±50℃, and the iron mold is cast into an ingot;
第二步：一次固溶后热轧The second step: hot rolling after a solid solution
将第一步熔炼后的合金加热到900～1000℃，保温0.5～1.5h，水淬，进行一次固溶处理后，再将所述合金加热至800～900℃实施应变量为40～70％的热轧；Heat the alloy after the first step of smelting to 900-1000°C, keep it warm for 0.5-1.5h, quench it in water, perform a solid solution treatment, and then heat the alloy to 800-900°C to implement a strain of 40-70% of hot rolling;
第三步：二次固溶后进行轧制或拉拔The third step: rolling or drawing after secondary solid solution
将第二步热轧后的合金加热到900～1000℃，保温0.5～1.5h，水淬，进行二次固溶处理后，于室温下实施应变量为70～95％轧制或拉拔；Heating the alloy after the second step of hot rolling to 900-1000°C, keeping it warm for 0.5-1.5 hours, quenching in water, performing a second solid solution treatment, and performing rolling or drawing at room temperature with a strain of 70-95%;
第四步：时效Step Four: Aging
将第三步轧制和拉拔后的合金于300～500℃保温0.2～10小时后，水淬，即制得高强度高导电性微硼铜合金。The alloy after rolling and drawing in the third step is kept at 300-500° C. for 0.2-10 hours, and then quenched in water to obtain a high-strength and high-conductivity micro-boron-copper alloy.
本发明采用上述组份配比，在铜基体中添加微量的硼以及Zr、Te；由于B具有很强的除氧能力，可在铜及其合金中形成纳米级金属间化合物，可以弥散地分布在晶界，从而抑制了氧从合金表面通过晶界扩散向内部渗透引起的合金开裂，从而在一定程度上提高了合金强度和软化温度。而Zr元素可以有效提高铜合金的再结晶温度，提高铜合金的热稳定性。Te元素在铜合金中主要是起沉淀强化作用，由于沉淀第二相的本征特性和在铜合金中分布的特殊性，Te不仅不降低纯铜的导电性，而且还具有一定的抗电弧性。The present invention adopts the above-mentioned component ratio, and adds trace amounts of boron, Zr, and Te to the copper matrix; because B has a strong oxygen removal ability, it can form nano-scale intermetallic compounds in copper and its alloys, and can be dispersedly distributed At the grain boundary, the cracking of the alloy caused by the diffusion of oxygen from the surface of the alloy to the interior through the diffusion of the grain boundary is inhibited, thereby improving the strength and softening temperature of the alloy to a certain extent. The Zr element can effectively increase the recrystallization temperature of the copper alloy and improve the thermal stability of the copper alloy. Te element mainly plays a role of precipitation strengthening in copper alloys. Due to the intrinsic characteristics of the precipitated second phase and the particularity of distribution in copper alloys, Te not only does not reduce the conductivity of pure copper, but also has a certain degree of arc resistance. .
本发明的微硼铜合金与现有的技术相比，具有以下优点：Micro boron copper alloy of the present invention compares with existing technology, has following advantage:
1.本发明的高强度高导电性微硼铜合金具有优良的综合性能：抗拉强度达540～600MPa，电导率75～92％IACS、硬度≥160HV，延伸率≥11％，根据使用能力的要求，可以适当改变成分含量来调整抗拉强度和电导率；1. The high-strength and high-conductivity micro-boron-copper alloy of the present invention has excellent comprehensive properties: the tensile strength reaches 540-600 MPa, the electrical conductivity is 75-92% IACS, the hardness is ≥160HV, and the elongation is ≥11%. Requirements, the tensile strength and electrical conductivity can be adjusted by appropriately changing the composition content;
2.本发明的高强度高导电性微硼铜合金加入的合金元素的量少，容易回收再利用，且材料成本低；2. The amount of alloy elements added to the high-strength and high-conductivity micro-boron-copper alloy of the present invention is small, easy to recycle and reuse, and the material cost is low;
3.本发明的生产工艺、设备要求简单，生产成本低，适合规模化生产，具有良好的工业应用前景。3. The production process and equipment of the present invention have simple requirements, low production cost, are suitable for large-scale production, and have good industrial application prospects.
综上所述，本发明具有生产工艺简单、生产成本低和易回收再利用，适用于工业化的批量生产，具有一定的市场竞争优势，为工业界提供了一种综合性能优异的高性能铜合金材料；适用于高速电气化铁路接触网导线、大规模集成线路引线框架及电极材料等领域。In summary, the present invention has simple production process, low production cost and easy recycling, is suitable for industrialized batch production, has certain market competitive advantages, and provides a high-performance copper alloy with excellent comprehensive performance for the industry Materials; suitable for high-speed electrified railway catenary conductors, large-scale integrated circuit lead frames and electrode materials and other fields.
具体实施方式Detailed ways
下面结合具体实施例对本发明做进一步详细说明。The present invention will be described in further detail below in conjunction with specific embodiments.
本发明提供8个实施例，合金组份分别为：The present invention provides 8 embodiments, and the alloy components are respectively:
1、Cu0.07B0.5Zr，1. Cu0.07B0.5Zr,
2、Cu0.14B0.9Zr，2. Cu0.14B0.9Zr,
3、Cu0.02B0.2Zr，3. Cu0.02B0.2Zr,
4、Cu0.12B0.5Te，4. Cu0.12B0.5Te,
5、Cu0.06B0.5Te，5. Cu0.06B0.5Te,
6、Cu0.04B0.5Zr0.6Te6. Cu0.04B0.5Zr0.6Te
7、Cu0.2B0.5Zr0.6Te7. Cu0.2B0.5Zr0.6Te
8、Cu0.01B0.9Zr0.9Te8. Cu0.01B0.9Zr0.9Te
采用下述工艺方法制备、处理；Adopt the following process method to prepare and process;
第一步：熔炼Step 1: Smelting
按设计的合金各组分配比，分别称取硼、稀有金属及铜，在真空或大气中进行熔炼，熔炼温度在1200±50℃，铁模浇注成铸锭；According to the distribution ratio of each component of the alloy, boron, rare metals and copper are weighed respectively, and melted in vacuum or in the atmosphere. The melting temperature is 1200±50°C, and the iron mold is cast into an ingot;
第二步：一次固溶后热轧The second step: hot rolling after a solid solution
将第一步熔炼后的合金加热到900～1000℃，保温0.5～1.5h，水淬，进行一次固溶处理后，再将所述合金加热至800～900℃实施应变量为40～70％的热轧；Heat the alloy after the first step of smelting to 900-1000°C, keep it warm for 0.5-1.5h, quench it in water, perform a solid solution treatment, and then heat the alloy to 800-900°C to implement a strain of 40-70% of hot rolling;
第三步：二次固溶后进行轧制和拉拔The third step: rolling and drawing after secondary solid solution
将第二步热轧后的合金加热到900～1000℃，保温0.5～1.5h，水淬，进行二次固溶处理后，于室温下实施应变量为70～95％轧制或拉拔；Heating the alloy after the second step of hot rolling to 900-1000°C, keeping it warm for 0.5-1.5 hours, quenching in water, performing a second solid solution treatment, and performing rolling or drawing at room temperature with a strain of 70-95%;
第四步：时效Step Four: Aging
将第三步轧制和拉拔后的合金于300～500℃保温0.2～10小时后，水淬，即制得高强度高导电性微硼铜合金，编号依次为：1、2、3、4、5、6、7、8；其技术性能指标参见表1。The alloy after rolling and drawing in the third step is kept at 300-500°C for 0.2-10 hours, and then quenched in water to obtain a high-strength and high-conductivity micro-boron-copper alloy. The numbers are: 1, 2, 3, 4, 5, 6, 7, 8; see Table 1 for technical performance indicators.
表1Table 1
从表1的数据可以看出，采用本发明组份的微硼铜合金，其抗拉强度达540～600MPa，电导率75～92％IACS、硬度≥160HV，延伸率≥11％；在获得高强度的同时其导电率仍能保持良好的水平，能够很好的满足如今对高强高导铜合金材料性能要求，适用于高速电气化铁路接触网导线、大规模集成线路引线框架、电极材料等领域，具有良好的工业应用前景。As can be seen from the data in Table 1, the micro-boron-copper alloy adopting the composition of the present invention has a tensile strength of 540-600 MPa, an electrical conductivity of 75-92%IACS, a hardness of ≥160HV, and an elongation of ≥11%; Its electrical conductivity can still maintain a good level while maintaining strength, which can well meet the performance requirements of high-strength and high-conductivity copper alloy materials today. It is suitable for high-speed electrified railway catenary wires, large-scale integrated circuit lead frames, electrode materials and other fields. It has good industrial application prospect.
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| CN102676870A (en) * | 2012-06-07 | 2012-09-19 | 铁岭富兴铜业有限公司 | Lead-free copper alloy wire material and preparation method thereof |
| US20140205492A1 (en) * | 2011-09-29 | 2014-07-24 | Tohoku University | Copper alloy wire rod and method for manufacturing the same |
| CN105047245A (en) * | 2015-07-13 | 2015-11-11 | 江苏亨通线缆科技有限公司 | Copper magnesium alloy wire applied to cable introduction by user |
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| CN1285417A (en) * | 1999-08-20 | 2001-02-28 | 陈丕文 | High-conductivity copper base alloy for electrode of resistance welding |
| CN1410569A (en) * | 2002-09-18 | 2003-04-16 | 四川鑫炬矿业资源开发股份有限公司 | Copper alloy material for contact net wire |
| CN1676642A (en) * | 2004-03-29 | 2005-10-05 | 日本碍子株式会社 | Copper alloy having both strength and conductivity and copper alloy manufacturing method |
-
2011
- 2011-01-21 CN CN201110023960A patent/CN102041407B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1285417A (en) * | 1999-08-20 | 2001-02-28 | 陈丕文 | High-conductivity copper base alloy for electrode of resistance welding |
| CN1410569A (en) * | 2002-09-18 | 2003-04-16 | 四川鑫炬矿业资源开发股份有限公司 | Copper alloy material for contact net wire |
| CN1676642A (en) * | 2004-03-29 | 2005-10-05 | 日本碍子株式会社 | Copper alloy having both strength and conductivity and copper alloy manufacturing method |
Non-Patent Citations (1)
| Title |
|---|
| 《材料研究学报》 19970825 王吉会等 硼对铜合金组织和性能的影响 381-386 1-2 第11卷, 第04期 2 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140205492A1 (en) * | 2011-09-29 | 2014-07-24 | Tohoku University | Copper alloy wire rod and method for manufacturing the same |
| US9754703B2 (en) * | 2011-09-29 | 2017-09-05 | Ngk Insulators, Ltd. | Copper alloy wire rod and method for manufacturing the same |
| CN102676870A (en) * | 2012-06-07 | 2012-09-19 | 铁岭富兴铜业有限公司 | Lead-free copper alloy wire material and preparation method thereof |
| CN102676870B (en) * | 2012-06-07 | 2014-05-07 | 铁岭富兴铜业有限公司 | Lead-free copper alloy wire material and preparation method thereof |
| CN105047245A (en) * | 2015-07-13 | 2015-11-11 | 江苏亨通线缆科技有限公司 | Copper magnesium alloy wire applied to cable introduction by user |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102041407B (en) | 2011-12-14 |
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