CN102033363B - Liquid crystal display panel and forming method of liquid crystal layer thereof - Google Patents

Liquid crystal display panel and forming method of liquid crystal layer thereof Download PDF

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CN102033363B
CN102033363B CN 201010545695 CN201010545695A CN102033363B CN 102033363 B CN102033363 B CN 102033363B CN 201010545695 CN201010545695 CN 201010545695 CN 201010545695 A CN201010545695 A CN 201010545695A CN 102033363 B CN102033363 B CN 102033363B
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liquid crystal
frame glue
distributions
glue material
transistor
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CN102033363A (en
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林志维
王闵正
徐志宇
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Wujiang Fenhu Technology Entrepreneurship Service Co ltd
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CPT Video Wujiang Co Ltd
Chunghwa Picture Tubes Ltd
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Abstract

The invention discloses a liquid crystal display panel, comprising a transistor array substrate, a color filter substrate, a liquid crystal layer and a frame glue material, wherein the transistor array substrate comprises a transparent substrate, a transistor array and a plurality of peripheral wirings; the transparent substrate has a display area and a non-display area beside the display area; the transistor array is arranged in the display area; the peripheral wirings are arranged in the non-display area and electrically connected with the transistor array; the transmissivity of the non-display area is less than 30%; the liquid crystal layer is arranged between the color filter substrate and the transistor array substrate; and the frame glue material is arranged in the non-display area and connected between the color filter substrate and the transistor array substrate, and surrounds the liquid crystal layer.

Description

The formation method of display panels and liquid crystal layer thereof
Technical field
The invention relates to a kind of display panels (Liquid Crystal Display Panel, LCD Panel) with and the formation method of liquid crystal layer (liquid crystal layer), and particularly relevant for a kind of utilize display panels that liquid crystal splashes into processing procedure (One Drop Filling Process, ODF Process) manufacturing with and the formation method of liquid crystal layer.
Background technology
Existing display panels manufacturing technology has developed a kind of liquid crystal and splash into processing procedure, and this processing procedure is liquid crystal material to be inserted to frame glue (sealant) in the mode that splashes into (dropping) centered in the closed region (closed area) that forms, and then forms liquid crystal layer.After liquid crystal material splashes into to the closed region, see through this frame glue, fit together with colored optical filtering substrates (color filter substrate) with being about to transistor (TFT) array substrate (transistor array substrate).
Then, irradiating ultraviolet light (ultraviolet) is in frame glue, to carry out photo-hardening processing procedure (photo-curing process).Above-mentioned frame glue has the characteristic of photo-hardening mostly, and therefore, when UV-irradiation during in frame glue, frame glue can also bind transistor (TFT) array substrate and colored optical filtering substrates by partially hardened.Afterwards, heating frame glue to carry out thermmohardening processing procedure (heat curing process), allows frame glue harden fully.So, transistor (TFT) array substrate, colored optical filtering substrates and frame glue are able to the encapsulated liquid crystals material, and then form liquid crystal layer.
In present monitor market, LCD is the main flow commodity in the monitor market, thereby has a very big market demand (demand), so how to shorten the manufacturing time of display panels, to improve the output of LCD, be that many LCD manufacturing plant endeavours the problem studied invariably.
Summary of the invention
The invention provides a kind of display panels, it can see through the mode that splashes into liquid crystal material and make under the condition of omitting above-mentioned photo-hardening processing procedure.
The present invention also provides a kind of formation method of liquid crystal layer of display panels, omitting above-mentioned photo-hardening processing procedure, and then shortens the manufacturing time of display panels.
The present invention proposes a kind of display panels, and it comprises a transistor (TFT) array substrate, a colored optical filtering substrates, a liquid crystal layer and a frame glue material.Transistor (TFT) array substrate comprises a transparency carrier, a transistor array and many peripheral distributions.Transparency carrier has a viewing area (display area) and a non-display area (non-display area), and non-display area is positioned at by the viewing area.Transistor array is disposed in the viewing area.These peripheral distributions are disposed in the non-display area, and electrically connect transistor array.The transmitance of non-display area is less than 30%.Liquid crystal layer is disposed between colored optical filtering substrates and the transistor (TFT) array substrate.The frame glue material is disposed in the non-display area, and is connected between colored optical filtering substrates and the transistor (TFT) array substrate.The frame glue material is around liquid crystal layer.
In an embodiment of the present invention, the live width of each bar periphery distribution is more than or equal to 50 microns.
In an embodiment of the present invention, above-mentioned frame glue material is shaped as closed ring.
In an embodiment of the present invention, above-mentioned transistor (TFT) array substrate also comprises a dielectric layer (dielectric layer).These peripheral distributions comprise many first distributions and many second distributions.These first distributions and dielectric layer all are disposed on the transparency carrier, and dielectric layer covers these second distributions.These first distributions are disposed on the dielectric layer.
In an embodiment of the present invention, have one at interval (gap) between adjacent two second distributions, and these first distributions lay respectively at these at interval directly over.
In an embodiment of the present invention, these second distributions hide these respectively at interval.
In an embodiment of the present invention, the material of above-mentioned frame glue material comprises a resin material and a thermoinitiators.
In an embodiment of the present invention, above-mentioned resin material comprises acrylate resin (Polymethylmethacrylate resin, PMMA resin can be described as acryl resin again) and epoxy resin (epoxy).
The present invention also proposes the formation method of a kind of display panels and liquid crystal layer thereof, and it may further comprise the steps.At first, form a frame glue material at one first substrate, its center glue material surrounds into a closed region.Then, splash into a liquid crystal material to the closed region.Splash into liquid crystal material to the closed region after, make the frame glue material bind one second substrate, its center glue material is between first substrate and second substrate.Afterwards, at the frame glue material under the condition of a photo-hardening processing procedure, the heating frame glue material.
In an embodiment of the present invention, above-mentioned first substrate is a transistor (TFT) array substrate, and second substrate is a colored optical filtering substrates.
In an embodiment of the present invention, above-mentioned first substrate is a colored optical filtering substrates, and second substrate is a transistor (TFT) array substrate.
In an embodiment of the present invention, in the process of heating frame glue material, the temperature of heating frame glue material is between 120 ℃ to 150 ℃, and the time of heating frame glue material is between 30 minutes to 90 minutes.
Based on above-mentioned, utilize above-mentioned frame glue material, the present invention can omit the photo-hardening processing procedure, with the manufacturing time of shortening display panels, thus the output of raising LCD, and then satisfy the market demand of LCD now.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Embodiment
Figure 1A is the diagrammatic cross-section of the display panels of one embodiment of the invention.See also Figure 1A, display panels 100 comprises a transistor (TFT) array substrate 110, a colored optical filtering substrates 120, a liquid crystal layer 130 and a frame glue material 140.Liquid crystal layer 130 is that the liquid crystal material by liquid state is formed, and is disposed between colored optical filtering substrates 120 and the transistor (TFT) array substrate 110, and frame glue material 140 is connected between colored optical filtering substrates 120 and the transistor (TFT) array substrate 110.
Frame glue material 140 can bind colored optical filtering substrates 120 and transistor (TFT) array substrate 110, so that colored optical filtering substrates 120 firmly combines with transistor (TFT) array substrate 110.The material of frame glue material 140 can comprise a resin material and a thermoinitiators, so frame glue material 140 is a kind of thermmohardening glue (thermal curing adhesive).Specifically, frame glue material 140 can harden via the thermmohardening processing procedure, and namely frame glue material 140 can be heated and harden.In addition, above-mentioned resin material can comprise acrylate resin and epoxy resin.
In the present embodiment, frame glue material 140 can not contain any photo-hardening agent (photo-curing adhesive).Irradiating ultraviolet light or visible light (visible light) that is to say, even, still can not make 140 sclerosis of frame glue material in frame glue material 140.Therefore, ultraviolet light or visible light can't allow frame glue material 140 produce the chemical reaction of sclerosis on the whole.
Figure 1B is the schematic top plan view of transistor (TFT) array substrate among Figure 1A, wherein the display panels shown in Figure 1A 100 be transistor (TFT) array substrate 110 in Figure 1B in conjunction with after the colored optical filtering substrates 120, I-I section along the line is drawn.See also Figure 1A and Figure 1B, transistor (TFT) array substrate 110 comprises a transparency carrier 112, a transistor array 114 and many peripheral distributions 116 and 118a.
Transparency carrier 112 has a viewing area 112a and a non-display area 112b, and non-display area 112b is positioned at by the 112a of viewing area, and can center on viewing area 112a.Transistor array 114 is disposed in the 112a of viewing area, and peripheral distribution 116 all is disposed in the non-display area 112b with 118a.These peripheral distributions 116,118a electrically connect transistor array 114, and can be all metal wire, and wherein the quantity of peripheral distribution 116 is one, and the quantity of peripheral distribution 118a is many.
Transistor array 114 can be the transistor array of known display panels, and can comprise a plurality of picture elements unit (pixel unit does not illustrate), multi-strip scanning line (scan line does not illustrate) and many data lines (data line does not illustrate).When transistor array 114 was the known transistors array, even without the structure of introducing and illustrate transistor array 114, the persond having ordinary knowledge in the technical field of the present invention still knew the structure of transistor array 114.
Periphery distribution 116 can be common lines, and in order to transmitting share voltage (common voltage), and each bar periphery distribution 118a electrically connects sweep trace or the data line of transistor array 114.In the present embodiment, display panels 100 can also comprise a plurality of chips 150, and these chips 150 electrically connect these peripheral distribution 118a, so chip 150 can be from peripheral distribution 118a output electric signal to transistor array 114, so that display panels 100 runnings.In addition, the live width W1 of peripheral distribution 116 can be more than or equal to 50 microns.
Frame glue material 140 is disposed in the non-display area 112b, and around liquid crystal layer 130.Specifically, the shape of frame glue material 140 can be closed ring, and liquid crystal layer 130 is positioned at the closed region Z1 that forms that frame glue material 140 centers on.Frame glue material 140 closely fit colored optical filtering substrates 120 and transistor (TFT) array substrate 110 are so that transistor (TFT) array substrate 110, a colored optical filtering substrates 120 and frame glue material 140 three's sealing liquid crystal layers 130 prevent that liquid crystal material from leaking outside.
In addition, transistor (TFT) array substrate 110 can also comprise a dielectric layer 119, and wherein peripheral distribution 116 is disposed on the transparency carrier 112, and is covered by dielectric layer 119.In addition, the material of dielectric layer 119 can be insulating material such as silicon dioxide or silicon nitride, and dielectric layer 119 also can be the gate insulator (gate insulation layer) that covers sweep trace.
Fig. 1 C be among Figure 1B transistor (TFT) array substrate in the diagrammatic cross-section of drawing in conjunction with the J-J section back along the line of colored optical filtering substrates.See also Figure 1B and Fig. 1 C, transistor (TFT) array substrate 110 can also comprise many peripheral distribution 118b, and peripheral distribution 118b also can be metal wire, wherein peripheral distribution 118a is first distribution, and peripheral distribution 118b is second distribution, so the peripheral distribution of all in the present embodiment comprises many first distributions (being peripheral distribution 118a) and many second distributions (being peripheral distribution 118b).
These peripheral distribution 118a, 118b and dielectric layer 119 all are disposed on the transparency carrier 112, and wherein dielectric layer 119 covers these peripheral distribution 118b comprehensively, and these peripheral distribution 118a are disposed on the dielectric layer 119, and the local dielectric layer 119 that covers.Therefore, dielectric layer 119 is between peripheral distribution 118a and peripheral distribution 118b, shown in Fig. 1 C.In addition, the live width of each bar periphery distribution all can be more than or equal to 50 microns, so not only the live width W1 of peripheral distribution 116 can be more than or equal to 50 microns, the live width W3 of the live width W2 of peripheral distribution 118a and peripheral distribution 118b also all can be more than or equal to 50 microns.
The transmitance of non-display area 112b is less than 30%, and this transmitance is represented the ratio of light penetration non-display area 112b.Transmitance is more high, and the ratio of expression light penetration non-display area 112b is more high, and for example the color of non-display area 112b more is tending towards transparent.Transmitance is more low, and the ratio of expression light penetration non-display area 112b is more low, and for example the color of non-display area 112b more is tending towards obscure.In addition, when transmitance equalled zero, expression light can't penetrate non-display area 112b basically.
In the present embodiment, above-mentioned transmitance is defined by following mathematical expression (1) basically:
Figure 459179DEST_PATH_IMAGE001
……………………………………………...（1）
Wherein T is transmitance, and satisfies: the relational expression of T＜0.3.W is the live width of peripheral distribution, for example is live width W1, W2 or W3.D is the distance between adjacent two peripheral distributions, for example is the distance B 1 between adjacent two peripheral distribution 118a, or the distance B 2 between adjacent two peripheral distribution 118b.
In addition, the transmitance of non-display area 112b is not only less than 0.3, and can equal zero.Specifically, have a G1 at interval between adjacent two peripheral distribution 118a, and have a G2 at interval between adjacent two peripheral distribution 118b, wherein these peripheral distribution 118a lay respectively at these at interval G2 directly over, and can hide these G2 at interval respectively.Therefore, as peripheral distribution 118a, when 118b is all metal wire, the light that comes from transparency carrier 112 can be blocked (blocking) and can't penetrate non-display area 112b by peripheral distribution 118a and 118b, to such an extent as to the transmitance of non-display area 112b can equal zero.
Fig. 2 A to Fig. 2 C is the schematic flow sheet of formation method of the liquid crystal layer of the display panels among Figure 1A.See also Fig. 2 A, the formation method of liquid crystal layer 130 may further comprise the steps.At first, form frame glue material 140 at one first substrate 161.First substrate 161 can be transistor (TFT) array substrate 110 or colored optical filtering substrates 120, and frame glue material 140 can be to be formed in 161 coatings of first substrate by a gluing board 20.In addition, the frame glue material 140 of this moment can surround into closed region Z1, and wherein closed region Z1 is centered on fully by frame glue material 140, and frame glue material 140 does not have any breach.
See also Fig. 2 B, then, splash into a liquid crystal material 132 to the Z1 of closed region, wherein liquid crystal material 132 can splash into to the Z1 of closed region from board 30.Centered on fully because closed region Z1 does not have 140 of the frame glue materials of any breach, so frame glue material 140 can form trough body structure with closed region Z1.So, liquid crystal material 132 is placed in the Z1 of closed region.
See also Fig. 2 C, splash into liquid crystal material 132 to the Z1 of closed region after, make frame glue material 140 bind one second substrate 162, its center glue material 140 is between first substrate 161 and second substrate 162.Because frame glue material 140 is thermmohardening glue, therefore before frame glue material 140 was not heated, frame glue material 140 can have stickiness, thereby can bind first substrate 161 and second substrate 162.
Second substrate 162 also can be transistor (TFT) array substrate 110 or colored optical filtering substrates 120.But, when second substrate 162 was transistor (TFT) array substrate 110, first substrate 161 was colored optical filtering substrates 120; And when second substrate 162 was colored optical filtering substrates 120,161 of first substrates were transistor (TFT) array substrate 110.Therefore, first substrate 161 and second substrate 162 the two can not be all transistor (TFT) array substrate 110 or colored optical filtering substrates 120 simultaneously.
Then, under the condition of photo-hardening processing procedure, just do not have under the situation of illuminated ultraviolet light or visible light heating frame glue material 140 at frame glue material 140 at frame glue material 140, to carry out the thermmohardening processing procedure, its center glue material 140 can see through a heating board 40 and toast.So, frame glue material 140 can be hardened, and liquid crystal material 132 can be sealed and form liquid crystal layer 130(and see also Figure 1A).So far, display panels 100 has been made basically and has been finished.
What deserves to be mentioned is that frame glue material 140 can be selected from now the raw material merchant at the specific glue material of peddling on the market, it for example is that (SEKISUI CHEMICAL CO., the glue material of LTD.) peddling similarly are SR series glue material in Sekisui Chemical Co., Ltd.This frame glue material 140 before the specific glue material of peddling on the market can make heating has good structural strength, and then in the process of frame glue material 140 bondings second substrate 162, liquid crystal material 132 can the frame glue material 140 that puncture reach the effect that prevents that liquid crystal material 132 from leaking outside because of the influence that is subjected to draught head.
Secondly, in the process of heating frame glue material 140, above-mentioned specific glue material can also reduce the material from 140 strippings of frame glue material to liquid crystal material 132, thereby reduces the influence to Liquid Crystal Molecules Alignment, avoids destroying the image quality of display panels 100.Moreover this glue material of peddling on the market can also keep the then intensity of frame glue material 140 before being heated, and to reduce because following undercapacity the situation that first substrate 161 separates with second substrate 162 takes place.
In addition, specific glue material can also improve the setting rate that adds the frame glue material of pining for 140, and the viscosity (viscosity) that reduces frame glue material 140 changes, thereby can shorten time of heating frame glue material 140, for example in the process of heating frame glue material 140, the temperature of heating frame glue material 140 can be between 120 ℃ to 150 ℃, and the time of heating frame glue material 140 can for example be about 60 minutes between 30 minutes to 90 minutes.
In sum, splash into processing procedure compared to known liquid crystal, the present invention sees through above-mentioned frame glue material, can omit the photo-hardening processing procedure, with the manufacturing time of shortening display panels, thus the output of raising LCD, and then satisfy the market demand of LCD now.
Secondly, because the present invention can omit the photo-hardening processing procedure, so the non-display area of transistor (TFT) array substrate can have the transmitance less than 30%, even also can have null transmitance.So, when many peripheral distributions in the non-display area of design, need not to consider light penetrating non-display area, so that these peripheral distributions have diversified wiring (layout) design, the live width that for example increases peripheral distribution reduces the resistance of peripheral distribution, or improves the distribution density of peripheral distribution with the resolution of increase display panels.
Moreover frame glue material of the present invention can be selected from above-mentioned specific glue material, to improve the setting rate of frame glue material, allow the temperature of heating frame glue material can be between 120 ℃ to 150 ℃, and the time of heating frame glue material can be between 30 minute to 90 minutes.Compared to known technology, frame glue material of the present invention has less heat time heating time, thereby more can shorten the manufacturing time of display panels effectively.
Though the present invention is with preferred embodiment openly as above, so it is not in order to limiting the present invention, anyly has the knack of alike skill person, without departing from the spirit and scope of the present invention, the equivalence doing to change with retouching replace, still be in the scope of patent protection of the present invention.

Claims (4)

1. display panels comprises:
One transistor (TFT) array substrate comprises:
One transparency carrier has a viewing area and a non-display area, and this non-display area is positioned at by this viewing area; One transistor array is disposed in this viewing area;
One colored optical filtering substrates;
One liquid crystal layer is disposed between this colored optical filtering substrates and this transistor (TFT) array substrate; And
One frame glue material is disposed in this non-display area, and is connected between this colored optical filtering substrates and this transistor (TFT) array substrate, and wherein this frame glue material is around this liquid crystal layer;
It is characterized in that, also comprise:
Many peripheral distributions are disposed in this non-display area, and electrically connect this transistor array, and this periphery distribution is metal wiring;
Wherein, this transistor (TFT) array substrate also comprises a dielectric layer, those peripheral distributions comprise many first distributions and many second distributions, those first distributions and this dielectric layer all are disposed on this transparency carrier, and this dielectric layer covers those second distributions, those first distributions are disposed on this dielectric layer, make the transmitance of this non-display area less than 30%.
2. display panels as claimed in claim 1 is characterized in that, this frame glue material be shaped as closed ring.
3. display panels as claimed in claim 1 is characterized in that, has one between adjacent two second distributions at interval, and those first distributions lay respectively at those at interval directly over.
4. as claim 3 a described display panels, it is characterized in that those second distributions hide those respectively at interval.
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CN103087641A (en) * 2013-01-23 2013-05-08 深圳市华星光电技术有限公司 Frame plastic material, liquid crystal panel and corresponding liquid crystal displayer
CN103064208B (en) * 2013-01-23 2015-06-10 深圳市华星光电技术有限公司 Polymer stable vertical alignment liquid crystal display panel and liquid crystal display
CN109324453A (en) * 2018-09-30 2019-02-12 惠科股份有限公司 Display panel and display device
CN110488541A (en) 2019-08-20 2019-11-22 深圳市华星光电技术有限公司 Display panel and its manufacturing method

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JP2004233836A (en) * 2003-01-31 2004-08-19 Chuka Eikan Kofun Yugenkoshi Structure of liquid crystal display and its manufacturing method
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CN101504501A (en) * 2008-02-04 2009-08-12 立景光电股份有限公司 Silica-based liquid crystal display panel and electronic device using the same

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CN101054505A (en) * 2007-05-30 2007-10-17 友达光电股份有限公司 Single hot set property frame gum
CN101504501A (en) * 2008-02-04 2009-08-12 立景光电股份有限公司 Silica-based liquid crystal display panel and electronic device using the same

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