CN102033077B - Method for testing contact thermal resistance of GH4169/K417 alloy - Google Patents

Method for testing contact thermal resistance of GH4169/K417 alloy Download PDF

Info

Publication number
CN102033077B
CN102033077B CN201010519714A CN201010519714A CN102033077B CN 102033077 B CN102033077 B CN 102033077B CN 201010519714 A CN201010519714 A CN 201010519714A CN 201010519714 A CN201010519714 A CN 201010519714A CN 102033077 B CN102033077 B CN 102033077B
Authority
CN
China
Prior art keywords
alloy
temperature
contact
contact thermal
contact resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010519714A
Other languages
Chinese (zh)
Other versions
CN102033077A (en
Inventor
马小兵
张卫方
王宗仁
唐庆云
侯卫国
丁美丽
刘肖
符丽君
刘升旺
赵丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beihang University
Original Assignee
Beihang University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beihang University filed Critical Beihang University
Priority to CN201010519714A priority Critical patent/CN102033077B/en
Publication of CN102033077A publication Critical patent/CN102033077A/en
Application granted granted Critical
Publication of CN102033077B publication Critical patent/CN102033077B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

The invention discloses a method for testing the contact thermal resistance of a GH4169/K417 alloy. The method comprises the following steps: first, confirming the reduced elastic moduli of two contact materials, and then modeling according to the plastic deformation theory of metal materials; simplifying models; confirming unknown parameters bo, b1, b2 and b3 through stepwise regression experiments, and obtaining an optimal regression equation; obtaining the contact thermal conduction of the GH4169/K417 alloy through regression analysis results, calculating the reciprocal of the contact thermal conduction, and obtaining the contact thermal resistance. When temperature is within the interval of 100-600 DEG C and independent variables choose the temperature and pressure value, hs=26.534T0.107P1.297, and when the independent variables only choose the pressure value, hs=41.43P1.291. By using the invention, the contact thermal conduction can be obtained according to a simple formula under the condition of randomly changing testing temperature and pressure only after the needed parameters b0, b1 and b3 are obtained through experiment data, and the testing process of the contact thermal resistance is simple and can be repeatedly used. Under the premise of ensuring engineering practicability and the accuracy of testing results, the testing process of the contact thermal conduction is greatly simplified.

Description

The thermal contact resistance method of testing that is used for the GH4169/K417 alloy
Technical field
The invention belongs to the high temperature metallic material technical field of measurement and test, be specifically related to a kind of thermal contact resistance method of testing of the GH4169/K417 of being used for alloy.
Background technology
There are the model, experience and the semi-empirical relation that much are used to predict contact conductane to be suggested in the past few decades.Classical model has the Mikic elastic model, CMY (Cooper, Mikic and Yovanovich) plasticity model and by the elastic-plastic deformation model of Sridar and Yovanovich.Theoretical research at home is mainly reflected in the numerical simulation of thermal contact resistance.
Thermal contact resistance test for two high-temperature materials in the prior art all is to carry out through lot of test; Process of the test is to choose the sample that boundary material is processed into certain size, certain interface roughness; Be that the interface provides specific interface temperature and interfacial pressure through pressurization and the process of heating then, at last through interface temperature is fallen with sample in the contact conductane that measures two storerooms of heat flow density.
Though existing measuring technology obtains to the contact conductane under fixed temperature, pressure and the interface roughness condition more accurately; But because its test process is complicated; The test condition relative fixed; Can not satisfy temperature changeable in the practical applications and pressure condition, the contact conductane data at material interface place can't promptly and accurately be provided.
Summary of the invention
The present invention is the basis with the test, selects proper model through theoretical analysis, and the utilization mathematical statistic method draws the practical thermal contact resistance computing formula of engineering, and passes through the accuracy of demonstration test verification model.The present invention provides a kind of thermal contact resistance method of testing of the GH4169/K417 of being used for alloy, comprises the steps:
The first step is confirmed the reduction elastic modulus of two contact materials.
E ′ = 2 [ ( 1 - v 1 2 ) / E 1 + ( 1 - v 2 2 ) / E 2 ] - 1
E wherein 1, E 2Be respectively the elastic modulus of GH4169 and K417 alloy, v 1, v 2Be respectively the Poisson ratio of GH4169 and K417 alloy.
Second step is according to the modeling of metal material theory of plastic strain in matrix.
ψ=(E′/H)tanθ。
Wherein, ψ is the plastic yield factor, and H is the K417 hardness of alloy, and tan θ is the absolute average pitch of contact interface profile.
According to theory of plastic strain in matrix, have:
h s=(1.13ktanθ/σ)(P/H) 0.94
The 3rd step, model simplification.
(1) according to the theory of plastic strain in matrix of Mikic, the harmonic-mean k expression formula of the thermal conductivity coefficient of two thermal contact resistance test materials is:
k=2k 1k 2/(k 1+k 2)
Because thermal conductivity coefficient k is proportional to temperature T, have
Figure BSA00000319321400021
X wherein 1Be coefficient to be determined.
(2) basis
Figure BSA00000319321400022
The roughness of thermal contact resistance test material is σ; The average height of exosyndrome material contact interface profile; Tan θ is the absolute average pitch of material contact interface profile, and θ is the average slope angle of material contact interface profile, therefore in other conditions one regularly; The absolute average pitch tan θ of profile and roughness σ positive correlation are so have
Figure BSA00000319321400023
X wherein 2Be coefficient to be determined.
(3) for fixed two thermal contact resistance test materials, select less hardness H for calculating hardness, H is for confirming amount, so have
Figure BSA00000319321400024
X wherein 3Be parameter to be determined.
This moment, contact conductane can be expressed as:
h s = x 0 T x 1 σ x 2 P x 3
Ask natural logarithm to get on the following formula both sides:
lnh s=lnx 0+x 1lnT+x 2lnσ+x 3lnP
Make the lnh in the formula s=Y, lnT=X 1, ln σ=X 2, lnP=X 3, and make b 0=lnx 0, b 1=x 1, b 2=x 2, b 3=x 3, then initial model is set up as follows:
Y=b 0+b 1X 1+b 2X 2+b 3X 3
In the 4th step,, confirm unknown parameter b through progressively returning test 0, b 1, b 2And b 3, obtain optimal regression equation.According to the regretional analysis result, obtain the contact conductane of GH4169/K417 alloy, contact conductane is got inverse, obtain thermal contact resistance.
The invention has the advantages that: thermal contact resistance method of testing provided by the invention only need obtain the parameter b that needs through test figure 0, b 1And b 3, just can obtain contact conductane according to simple formula changing under the condition of probe temperature and pressure arbitrarily, make the thermal contact resistance test process simply also can reuse.Because the contact conductane of storeroom can't be realized the comprehensive measurement under all temps, the pressure condition in the practical applications, method provided by the invention has been simplified the test process of contact conductane greatly under the prerequisite that guarantees engineering practicability and test result accuracy.
Embodiment
Below in conjunction with embodiment thermal contact resistance method of testing provided by the invention is elaborated.
Thermal contact resistance method of testing provided by the invention realizes through following steps:
The first step is confirmed the reduction elastic modulus of two contact materials.
For GH4169/K417 alloy thermal contact resistance test sample, the reduction elastic modulus of two contact materials is:
E ′ = 2 [ ( 1 - v 1 2 ) / E 1 + ( 1 - v 2 2 ) / E 2 ] - 1 - - - ( 1 )
For GH4169 and K417 alloy material, as shown in table 1 is described alloy material temperature and the corresponding relation of elastic modulus in 100 ℃~600 ℃ intervals:
The elastic modulus of table 1GH4169 and K417 is with the variation of temperature value
Corresponding relation to above-mentioned temperature and elastic modulus carries out linear fit, and the elastic modulus that obtains GH4169 and K417 alloy material with the variation of temperature relation is:
E 1=-0.0646T+208.27 (2)
E 2=-0.0651T+222.67 (3)
The Poisson ratio v of material 1, v 2Value is looked into " Chinese aeronautical material handbook the 2nd volume (the 2nd edition) " (Beijing: China Standard Press, 2001.8), is respectively v 1=0.3, v 2=0.29, so above-mentioned formula (1) further is written as:
E ′ = 2 [ ( 1 - v 1 2 ) / E 1 + ( 1 - v 2 2 ) / E 2 ] - 1
= 2 [ 1 - 0.3 2 - 0.0646 T + 208.27 + 1 - 0.29 2 - 0.0651 T + 222.67 ] - 1 - - - ( 4 )
Get T=600 ℃, try to achieve E '=195 * 10 3MPa.
Second step is according to the theory of plastic strain in matrix modeling.
Theoretical according to plastic deformation of metal material, plastic yield factor ψ is:
ψ=(E′/H)tanθ (5)
In the formula (5), tan θ is the absolute average pitch of material contact interface profile, and θ is the average slope angle of material contact interface profile, therefore has:
tan θ = θ 1 2 + θ 2 2 - - - ( 6 )
H is the hardness of the softer material of the surface of contact of two thermal contact resistance test materials; Because the GH4169 hardness of alloy is H=400Mpa; The hardness of alloy K417 is H=370Mpa; So choose lower hardness number as H=370Mpa this moment, hardness of alloy H obtains through consulting " Chinese aeronautical material handbook the 2nd volume (the 2nd edition) ".
The preparation the contact material roughness of surveying between 0.1 and 3.0, get maximum conditions:
σ 1=σ 2=0.1μm;θ 1=θ 2=0.03°。
σ 1, σ 2Be respectively GH4169 and K417 alloy interface roughness, θ 1, θ 2Be respectively the average slope angle of contact interface profile, bring formula (6), material hardness H and formula (4) into formula (5), have:
ψ = ( E ′ / H ) tan θ
= 195000 370 tan θ
= 527 × θ 1 2 + θ 2 2 - - - ( 7 )
= 527 × 0.04242
= 22.4
Because ψ>1, so this test findings also should meet the theory of plastic strain in matrix that Mikic proposes, its experimental formula is:
h s=(1.13ktanθ/σ)(P/H) 0.94 (8)
The 3rd step, model simplification.
The principal element that influences thermal contact resistance has surface of contact temperature T, pressure P and roughness σ etc., and choosing above three factors among the present invention is explanatory variable, adopts the method for regretional analysis, studies its degree of influence to thermal contact resistance.
(1) according to the theory of plastic strain in matrix of Mikic, parameter k is the harmonic-mean of the thermal conductivity coefficient of two thermal contact resistance test materials in the formula (8), and its expression formula is:
k=2k 1k 2/(k 1+k 2) (9)
According to " Chinese aeronautical material handbook the 2nd volume (the 2nd edition) ", obtain the thermal conductivity coefficient of GH4169 and K417 alloy material under the different temperatures, like table 2:
The thermal conductivity coefficient of table 2GH4169 and K417 is with the variation of temperature value
Figure BSA00000319321400046
Data are carried out linear fit in the his-and-hers watches 2, obtain the relation of thermal conductivity coefficient and temperature:
k 1=0.0141T+13.221 (10)
k 2=0.0117T+9.3246 (11)
So formula (9) can further be written as:
k = 2 k 1 k 2 / ( k 1 + k 2 )
= 2 ( 0.0141 T + 13.221 ) ( 0.0117 T + 9.3246 ) 0.0141 T + 13.221 + 0.0117 T + 9.3246 - - - ( 12 )
So thermal conductivity coefficient k is proportional to temperature T, according to formula (8),,
Figure BSA00000319321400049
X wherein 1Be coefficient to be determined.
(2) roughness according to
Figure BSA000003193214000410
thermal contact resistance test material in the formula (6) is σ; The average height of exosyndrome material contact interface profile; Tan θ is the absolute average pitch of material contact interface profile; θ is the average slope angle of material contact interface profile; Therefore in other conditions one regularly, the absolute average pitch tan θ of profile and roughness σ positive correlation are in conjunction with formula
(8), can have
Figure BSA00000319321400051
X wherein 2Be coefficient to be determined.
(3), select less hardness H to be calculating hardness, so H confirm amount in the formula (8), in conjunction with formula (8), so have for fixed two thermal contact resistance test materials X wherein 3Be parameter to be determined.
Formula this moment (8) can be expressed as:
h s = x 0 T x 1 σ x 2 P x 3 - - - ( 13 )
Ask natural logarithm to get on formula (13) both sides:
lnh s=lnx 0+x 1lnT+x 2lnσ+x 3lnP (14)
So far each parameter h s, set up linear relationship between T, σ and the P, utilize the method for regretional analysis to confirm that each unknown parameter can obtain the experimental formula of thermal contact resistance.
The explained variable (dependent variable) that adopts is the natural logarithm value (Y) of contact conductane, and explanatory variable (independent variable) is the natural logarithm value (X of interface temperature 1), the natural logarithm value (X of interfacial pressure 2) and the natural logarithm value (X of the compound roughness in interface 3).Make the lnh in the formula (14) s=Y, lnT=X 1, ln σ=X 2, lnP=X 3, and make b 0=lnx 0, b 1=x 1, b 2=x 2, b 3=x 3, then initial model is set up as follows:
Y=b 0+b 1X 1+b 2X 2+b 3X 3。(15)
In the 4th step,, confirm unknown parameter b through progressively returning test 0, b 1, b 2And b 3, obtain optimal regression equation.
In the present embodiment practical data all test from thermal contact resistance.Raw data is seen table 3:
Table 3 thermal contact resistance test figure
Figure BSA00000319321400061
13 groups of data are handled in the his-and-hers watches 3, promptly respectively contact conductane value, interface mean temperature, contact stress and compound roughness are asked the natural logrithm computing, the results are shown in Table 4 after the processing.
Table 4 is handled the back data
Figure BSA00000319321400062
Carry out regretional analysis below:
(1) find according to data analysis in the table 4: Ln σ is at Lnh sNumerical value in the constant interval is stable, just Ln σ and Lnh sCorrelativity is relatively poor relatively; The roughness of material is a microscopic quantity in addition; In engineering practice,, do not need to remeasure again to obtain as long as the roughness that guarantees material between 0.1-3.0, can meet the demands; So consider the engineering practicability of correlation of variables and formula, in follow-up regretional analysis with variables L n σ=X 2Reject, promptly only to linear equation Y=b 0+ b 1X 1+ b 3X 3Carry out regretional analysis, so need not calculate the value of b2 among the present invention.
With carrying out regretional analysis in the input of table 4 data after the handling SPSS data processing software, when independent variable is selected temperature and force value, gained model summary such as table 5:
Table 5 model gathers
Figure BSA00000319321400071
A. predictive variable: (constant), X3, X1.
On behalf of the linear combination of independent variable or independent variable, coefficient of multiple correlation R can explain dependent variable on much degree in the table 5, and the R=0.933 of model in the last table is so make us more satisfied.Multiple correlation coefficient square value R 2(R Square) explains variation shared ratio in dependent variable of regression model independent variable, near 100% best, and R in the table 2=0.870 also is more satisfactory.The 4th classifies the multiple correlation coefficient square value adjustment R of correction as 2(Adjusted R Square) is that the variable introduced is many more because secondary series is given people's a impression, and multiple correlation coefficient is big more, in order to eliminate this influence, provides the multiple correlation coefficient square value of correction.The standard deviation of estimating (Std.Error of the Estimate) explains that dependent variable much can not be explained by regression equation in addition.It also is to have only relative meaning, does not have absolute sense.
Following table 6 is the regression coefficient table of regression equation.
Table 6 regression coefficient b
Figure BSA00000319321400072
B. dependent variable: Y
Can obtain by table 6:
The significance test X of variable 1| t|=4.761>t 0.995(13)=3.0123
X 3|t|=8.186>t 0.995(13)=3.0123
Through checking us to see, the t value of model equation can reach requirement, explains that this model is reasonably on the whole, well fitting data.Principle according to progressively returning can know that the equation of model is an optimal regression equation.Promptly optimum progressively regression equation is:
Y=3.278+0.107X 1+1.297X 3
Be Lnh s=3.278+0.107LnT+1.297LnP
So: h s=26.534T 0.107P 1.297
According to R=1/h s, obtain thermal contact resistance R.
(2) carry out regretional analysis in the input of the data after will the handling SPSS data processing software, independent variable is only during selection pressure P, gained model summary such as table 7:
Table 7 model gathers
Figure BSA00000319321400081
C. predictive variable: (constant), X3.
On behalf of the linear combination of independent variable or independent variable, coefficient of multiple correlation R can explain dependent variable on much degree in the table 7, and the R=0.929 of model in the last table is so make us more satisfied.Multiple correlation coefficient square value R 2(R Square) explains variation shared ratio in dependent variable of regression model independent variable, near 100% best, and R in the table 2=0.863 also is more satisfactory.The 4th classifies the multiple correlation coefficient square value R of correction as 2(Adjusted R Square) is that the variable introduced is many more because secondary series is given people's a impression, and multiple correlation coefficient is big more, in order to eliminate this influence, provides the multiple correlation coefficient square value of correction.The standard deviation of estimating (Std.Error of the Estimate) explains that dependent variable much can not be explained by regression equation in addition.It also is to have only relative meaning, does not have absolute sense.
Following table 8 is the regression coefficient table of regression equation.
Table 8 regression coefficient d
Figure BSA00000319321400082
D. dependent variable: Y
Can obtain by table 8:
The significance test X of variable 3| t|=8.319>t 0.995(13)=3.0123
Through checking us to see, the t value of model equation can reach requirement, explains that this model is reasonably on the whole, well fitting data.Principle according to progressively returning can know that the equation of model is an optimal regression equation.Promptly optimum progressively regression equation is:
Y=3.724+1.291X 3
Be Lnh s=3.724+1.291LnP
So: h s=41.43P 1.291
According to thermal conductance h s, and then can obtain thermal resistance R=1/h s
Embodiment
For checking the correctness of definite thermal contact resistance model, carried out one group of proving test, result of the test sees Table 9:
Table 9 proving test data
Figure BSA00000319321400091
(1) the thermal contact resistance experimental formula in order to confirm: h s=26.534T 0.107P 1.297
Calculate h s:
Figure BSA00000319321400092
(2) the thermal contact resistance experimental formula in order to confirm: h s=41.43P 1.291
Calculate contact conductane h s:
Figure BSA00000319321400093
Figure BSA00000319321400101
Can draw through above-mentioned instance; Method of testing provided by the invention can change or has only under the situation of pressure change at temperature and pressure simultaneously; Directly bringing the temperature and pressure data into formula just can draw two contact conductanes between the material GH4169/K417, and then obtains the contact thermal resistance.A large amount of test operations that when changing the temperature and pressure condition of work, need carry out have been avoided.The thermal contact resistance of certain the two kinds of material that obtains through above-mentioned formula is compared with the actual tests data, and error rate can well satisfy the demand of practical applications less than 8.32%.
Described thermal contact resistance testing experiment is:
The first step; Process at least three samples; Comprise a heat flow meter sample and two test samples, be installed in the bottom heating arrangement and the top is answered between the force loading device with three samples are vertically coaxial, described sample is provided with thermopair; Thermopair is connected with data acquisition system (DAS), is used for the axial temperature of test sample.
In second step, to the sample heating, specimen temperature begins the collecting test temperature after reaching and stablizing.Described probe temperature comprises the test point temperature T of the test point on each sample i, i=1 ... N, n are test point number on the sample.Described test point temperature T iTest point thermopair through on sample, being uniformly distributed with is gathered.The probe of said test point thermopair is arranged on the axis of sample, guarantees the accuracy of thermometric.
In the 3rd step, the temperature on each test point on the sample is gathered and stored, and pass through the temperature variation curve at computer drawing test point place.
On per two adjacent samples, the temperature of two thermopairs nearest apart from contact interface is T nAnd T N+1, the medial temperature Δ T ' at then per two sample contact interface places is:
ΔT ′ = T n + T n + 1 2 .
In the 4th step, confirm that through the extrapolation thermograde Δ T falls in the temperature at adjacent samples contact interface place:
ΔT = ( T n - ( T 1 - T n ) ( n - 1 ) · l / n × l / 2 n ) - ( T n - 1 + ( T n + 1 - T 2 n ) ( n - 1 ) · l / n × l / 2 n )
= ( T n - 2 ( T 1 - T n ) n - 1 ) - ( T n + 1 + 2 ( T n + 1 - T 2 n ) n - 1 )
Wherein, l is a specimen length, and n is a number of checkpoints on each sample, from top to bottom the test point on each sample is numbered in order, then T 1, T n, T N+1, T 2nThe temperature of the 1st of first tested sample of difference, the temperature of a n test point, second tested sample n+1 and 2n test point.
The 5th goes on foot, and confirms the axial hot-fluid of sample according to selected heat flow meter.
Ignore the lateral heat flow loss of sample, as heat flow meter, be prepared into the heat flow meter sample with the same size of sample with metallic copper, then axially hot-fluid is:
q = λ T dt dx = λ T ( T 1 - T n ) / m
λ wherein TThermal conductivity for copper; T 1, T nTemperature for first test point and n test point on the heat flow meter sample; M is the distance between first test point and n the test point on the heat flow meter sample.
In the 6th step, calculate contact conductane and thermal contact resistance.
According to the axial hot-fluid in the 5th step, the contact conductane h in obtaining testing sAs follows:
h s = q ΔT = λ T ( T 1 - T n ) / m ( T n - 2 ( T 1 - T n ) n - 1 ) - ( T n + 1 + 2 ( T n + 1 - T 2 n ) n - 1 )
Fall Δ T according to the temperature at per two sample contact interface places and calculate thermal contact resistance R.
Described thermal contact resistance R is:
R = 1 h s = ΔT q
Wherein q is axial hot-fluid.

Claims (1)

1. be used for the thermal contact resistance method of testing of GH4169/K417 alloy, it is characterized in that:
The first step, confirm the reduction elastic modulus of two contact materials:
E ′ = 2 [ ( 1 - v 1 2 ) / E 1 + ( 1 - v 2 2 ) / E 2 ] - 1
E wherein 1, E 2Be respectively the elastic modulus of GH4169 and K417 alloy, v 1, v 2Be respectively the Poisson ratio of GH4169 and K417 alloy; E 1=-0.0646T+208.27, E 2=-0.0651T+222.67; v 1=0.3, v 2=0.29;
Second step is according to the modeling of metal material theory of plastic strain in matrix;
ψ=(E′/H)tanθ
Wherein, ψ is the plastic yield factor, and H is the K417 hardness of alloy, and tan θ is the absolute average pitch of contact interface profile, will
Figure FDA00001697030400012
Material hardness H=370Mpa and reduction elastic modulus are brought following formula into, get θ 12=0.03 °, have:
ψ = 2 [ ( 1 - v 1 2 ) / E 1 + ( 1 - v 2 2 ) / E 2 ] - 1 H × θ 1 2 + θ 2 2 = 22.4
Because ψ>1, so, have according to theory of plastic strain in matrix:
h s=(1.13ktanθ/σ)(P/H) 0.94
The 3rd step, model simplification;
(1) according to the theory of plastic strain in matrix of Mikic, the harmonic-mean k expression formula of the thermal conductivity coefficient of two thermal contact resistance test materials is:
k=2k 1k 2/(k 1+k 2)
K wherein 1=0.0141T+13.221, k 2=0.0117T+9.3246 is because thermal conductivity coefficient k 1, k 2Be proportional to temperature T, so have
Figure FDA00001697030400014
X wherein 1Be coefficient to be determined;
(2) basis The roughness of thermal contact resistance test material is σ; The average height of exosyndrome material contact interface profile; Tan θ is the absolute average pitch of material contact interface profile, and θ is the average slope angle of material contact interface profile, therefore in other conditions one regularly; The absolute average pitch tan θ of profile and roughness σ positive correlation are so have
Figure FDA00001697030400016
X wherein 2Be coefficient to be determined; The average slope angle θ of described material contact interface profile is 0.03 °, and roughness σ is between 0.1 and 3.0;
(3) for fixed two thermal contact resistance test materials, select less hardness H for calculating hardness, H is for confirming amount, so have
Figure FDA00001697030400017
X wherein 3Be parameter to be determined;
This moment, contact conductane was expressed as:
h s = x 0 T x 1 σ x 2 P x 3
Ask natural logarithm to get on the following formula both sides:
lnh s=lnx 0+x 1lnT+x 2lnσ+x 3lnP
Make the lnh in the formula s=Y, lnT=X 1, ln σ=X 2, lnP=X 3, and make b 0=lnx 0, b 1=x 1, b 2=x 2, b 3=x 3, then initial model is set up as follows:
Y=b 0+b 1X 1+b 2X 2+b 3X 3
In the 4th step,, confirm unknown parameter b through progressively returning test 0, b 1, b 2And b 3, obtain optimal regression equation; According to the regretional analysis result, obtain the contact conductane of GH4169/K417 alloy, contact conductane is got inverse, obtain thermal contact resistance;
In temperature is 100 ~ 600 ℃ of intervals, when independent variable is selected temperature and force value, h s=26.534T 0.107P 1.297, independent variable is only during the selection pressure value, h s=41.43P 1.291
CN201010519714A 2010-10-19 2010-10-19 Method for testing contact thermal resistance of GH4169/K417 alloy Expired - Fee Related CN102033077B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010519714A CN102033077B (en) 2010-10-19 2010-10-19 Method for testing contact thermal resistance of GH4169/K417 alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010519714A CN102033077B (en) 2010-10-19 2010-10-19 Method for testing contact thermal resistance of GH4169/K417 alloy

Publications (2)

Publication Number Publication Date
CN102033077A CN102033077A (en) 2011-04-27
CN102033077B true CN102033077B (en) 2012-09-05

Family

ID=43886255

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010519714A Expired - Fee Related CN102033077B (en) 2010-10-19 2010-10-19 Method for testing contact thermal resistance of GH4169/K417 alloy

Country Status (1)

Country Link
CN (1) CN102033077B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108491658B (en) * 2018-04-02 2019-05-07 北京航空航天大学 A kind of low cycle fatigue life appraisal procedure
CN113551585B (en) * 2020-04-26 2023-08-22 Oppo广东移动通信有限公司 Jig for detecting parallelism of sample and method for detecting parallelism of sample

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5711604A (en) 1993-12-14 1998-01-27 Seiko Instruments Inc. Method for measuring the coefficient of heat conductivity of a sample
CN101782541A (en) * 2009-12-09 2010-07-21 中国科学院工程热物理研究所 Method and device for testing thermal physical property of solid material with independent probe by using harmonic method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH063300A (en) * 1992-06-24 1994-01-11 Kyoto Electron Mfg Co Ltd Method, sensor unit and device for measuring thermal characteristic of pipe

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5711604A (en) 1993-12-14 1998-01-27 Seiko Instruments Inc. Method for measuring the coefficient of heat conductivity of a sample
CN101782541A (en) * 2009-12-09 2010-07-21 中国科学院工程热物理研究所 Method and device for testing thermal physical property of solid material with independent probe by using harmonic method

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特平开6-3300A 1994.01.11
真空中几种金属箔接触热导系数的实验研究;项立成;《航天器工程》;19970630;第6卷(第1、2期);98-102 *
项立成.真空中几种金属箔接触热导系数的实验研究.《航天器工程》.1997,第6卷(第1、2期),98-102.

Also Published As

Publication number Publication date
CN102033077A (en) 2011-04-27

Similar Documents

Publication Publication Date Title
CN1877313B (en) Method and apparatus for measuring solid interface contact heat exchange coefficient
CN105424498B (en) Method for compression test in compression testing machine and high temperature in concrete material high temperature
CN101929970B (en) Thermal contact resistance testing method and equipment
Ginder et al. A simple model for indentation creep
CN101929969B (en) Thermal contact resistance testing device with cooling device
CN104535609A (en) Device for determining heat-conductivity coefficient
CN101915780B (en) Test equipment applied to high-temperature and high-stress thermal contact resistance test
WO2013086933A1 (en) Method for calibration of parameters assessing brittle fracture of material based on beremin model
Liu et al. Can indentation technique measure unique elastoplastic properties?
CN103234898B (en) Ablation testing apparatus and method for applying load on-line
Dilmec et al. Effect of geometrical and process parameters on coefficient of friction in deep drawing process at the flange and the radius regions
CN111220648B (en) Method for measuring interface heat exchange coefficient of aluminum alloy hot stamping process
CN101980008B (en) Method for testing contact thermal resistance of GH4169/GH4169 by additional heating
CN109900554A (en) A method of fracture toughness is calculated using indentation method
CN107228878A (en) A kind of measuring method of fixed combinating surface thermal contact resistance
CN101975795B (en) Contact thermal resistance test method applied to GH4169/GH4169 high temperature alloy
CN102033077B (en) Method for testing contact thermal resistance of GH4169/K417 alloy
CN108414105A (en) A kind of dynamic temperature measurement method that the emulation secondary for dry friction is coupled with experiment
CN107315853A (en) A kind of method for numerical simulation of silicon carbide ceramics normal pressure solid-phase sintering process
CN103940663B (en) The Forecasting Methodology of fatigue of materials threshold value under different stress ratios
CN102033078B (en) Contact thermal resistance test method of GH4169/K417 alloy with additional heating
CN107101800B (en) Wind power measuring equipment and method for power transmission iron tower model
CN109490334B (en) Nondestructive testing method for T-shaped forge piece by using residual stress prediction model
CN107144597A (en) Measure the experimental rig and method of construction material thermal conductivity factor under service state
CN108562610A (en) A kind of method and system of determining thermal conductivity of rocks

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120905

Termination date: 20131019