CN102029484A - Low-silver electro vacuum brazing filler metal used for sealing weld of electronic device - Google Patents
Low-silver electro vacuum brazing filler metal used for sealing weld of electronic device Download PDFInfo
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- CN102029484A CN102029484A CN 201010588473 CN201010588473A CN102029484A CN 102029484 A CN102029484 A CN 102029484A CN 201010588473 CN201010588473 CN 201010588473 CN 201010588473 A CN201010588473 A CN 201010588473A CN 102029484 A CN102029484 A CN 102029484A
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Abstract
The invention relates to a low-silver electro vacuum brazing filler metal used for sealing weld of an electronic device, which belongs to the technical field of brazing materials. The low-silver electro vacuum brazing filler metal comprises the following chemical compositions in percentage by mass: 41 to 43 percent of silver (Ag), 51 to 53 percent of copper (Cu), 4 to 6 percent of stannum (Sn), less than or equal to 2 percent of indium (In) and less than or equal to 0.4 percent of nickel (Ni). The low-silver electro vacuum brazing filler metal has the advantages of: contributing to reducing the silver content so as to save resources and reduce cost, and contributing to guaranteeing a proper melting point, high plasticity and high machinability so as to replace Ag72Cu brazing filler metal.
Description
Technical field
The invention belongs to technical field of soldering materials, relate to a kind of low silver-colored electrovacuum solder that is used for electronic device soldering and sealing.
Background technology
The silver based electric vacuum solder is one of primary structure material of making vacuum electron device, be widely used in the metal of electronic device, vacuum switch tube, gas-discharge tube and breaker etc. and the soldering and sealing of pottery and metal and glass, the quality of soldering and sealing quality depends on the performance of solder to a great extent.
Handling characteristics according to vacuum electron device, have the harshness of following several respects to require to the electrovacuum solder: (1) does not contain high vapour pressure element such as Zn, Bi, Mg, Pb and/or Cd etc., in case device lost efficacy because of elements vaporization causes element leakage and soldering and sealing in manufacturing and use; (2) oxide-free is mingled with or nonmetallic inclusion, to eliminate the adverse effect that it brings device sealing; (3) do not contain gas (mainly being oxygen), cause the part short circuit in case splatter takes place during solder fusing; (4) has the automation of smooth bright and clean surface and ultra-thin thickness and precision with the miniaturization that adapts to electronic device, thinness, integrated and sealing charging.For this reason, select silver content height, welding procedure and processability are good, package reliability is high Ag72Cu eutectic alloy as the electrovacuum solder usually.
But as precious metal, silver is a kind of non-renewable state control resource (also claiming strategic resource), and a large amount of uses of silver-base solder greatly consume the noble metal resource of getting China.According to statistics, be worth up to billions of RMB with 30%～40% speed rapid growth silver-colored consumption every year of China in recent years.Therefore, the low silver-colored electrovacuum solder of developing a kind of alternative Ag72Cu alloy has important economic implications and remarkable social benefit.
Up to now, the electrovacuum solder of having developed already both at home and abroad roughly is divided into following three major types:
(1) serve as the main element that adds with low-melting Zn, Cd, the units such as Sn, In that add low melting point, low-vapor pressure simultaneously usually form the Ag-Cu based polybasic alloy soldering materials, as the JISBAg-2 of Japanese Industrial Standards, Japan Patent spy open clear 50-74551, the spy opens clear 51-62164 and the clear 51-117148 of Te Kai etc.This type of scolder can't be competent at the soldering and sealing requirement of electron tube because of containing high vapour pressure constituent element Zn, Cd element.
(2) do not contain Zn, Cd and serve as to add element with a small amount of Sn, In, Ni, in the hope of obtaining to satisfy electron tube soldering and sealing low-vapor pressure Ag-Cu base solder, open clear 56-4394 as the spy, the spy opens clear 56-4395 etc., the similar with it Ag-Cu base solder that adds a small amount of Ga and Si element in addition is as Chinese invention patent application publication number CN101569967A.This type of scolder is because alloying element content is low, and Sn, In content are smaller or equal to 4.5wt%, and Ge, Si content are smaller or equal to 2.5wt%, and the solder fusing point is higher, and brazing cost is high.
(3) be solvent with the Ag-Cu eutectic alloy, add In, the Sn element of high level simultaneously,, open clear 51-132147, special public clear 44-11009, special public clear 63-49598, CN1016358B etc. as the spy in the hope of obtaining the lower Ag-Cu base electrovacuum solder of fusing point.This type of scolder is owing to Sn, In constituent content height, and total amount reaches 20wt%～30wt%, although the solder fusing point is starkly lower than the Ag72Cu eutectic alloy, intermetallic compound quantity increases in the alloy, the alloy plasticity variation, and especially the processing of silk material is very difficult.
As can be known above-mentioned, existing solder has the following disadvantages:
(1) is target to reduce Ag-Cu solder fusing point, often adds more Sn, In element, cause solder plasticity significantly to descend, work as W
SnDuring＞10wt%, the hot candied difficulty of Ag-Cu base alloy.
(2) be the mentality of designing of solvent with the Ag-Cu eutectic alloy, its essence is in the composition design, earlier locking W
Ag: W
Cu≈ 72: 28 is considered as a kind of main constituent element with eutectic alloy, according to the Changing Pattern of bianry alloy liquidus temperature with composition, by adding the fusing point that the low melting point constituent element further reduces eutectic solder.Yet, for Ag-Cu-Sn (In) ternary alloy three-partalloy, the eutectic line projection be not with the composition triangle in Ag, Cu content isometric parallel coincide, but bigger departing from takes place.Therefore this mentality of designing must cause tin in the solder, indium content higher, and the alloy plasticity processing characteristics worsens.
(3) although Sn, In element are basic identical to the mechanism of action of Ag-Cu alloy, there is bigger difference in both at aspects such as fusing point, atomic radius, solid solubility and crystal structures, and especially indium belongs to noble metal, and price is up to 20 times more than of tin.Therefore, In as the main element that adds, is increased the cost of solder undoubtedly.
In fact, the key technical problem that current electrovacuum solder research and development are faced is, should reduce Ag content in the solder to reduce the solder cost to greatest extent, ensure that again solder has appropriate melting point (avoiding Ag content to reduce the rising of the alloy melting point that brings), will guarantee that also brazing filler metal alloy has good plasticity and processing characteristics and the welding technological properties close with the Ag72Cu solder.For this reason, In, Sn element addition can not be too low, can not be too high.Low then cause brazing temperature to raise, height then causes solder to be difficult to be shaped.In other words, the design of the composition of low-silver solder must take into account good processability and moderate fusing point.
For this reason, the applicant has carried out lasting and positive exploration, solder have appropriate melting point, good plasticity and processing characteristics and reasonably the silver-colored resource of saves valuable use to replace between this three of Ag72Cu solder and found equalization point, technical scheme described below produces under this background.
Summary of the invention
Task of the present invention is to provide a kind of and helps to reduce silver content and use and economize on resources and reduce cost, and helps ensureing appropriate melting point, excellent plasticity and processing characteristics and uses the low silver-colored electrovacuum solder that is used for electronic device soldering and sealing that substitutes the Ag72Cu solder.
Task of the present invention is finished like this, a kind of low silver-colored electrovacuum solder that is used for electronic device soldering and sealing, its chemical composition proportioning by mass percentage is: total percentage is 100%, wherein, 41%～43% Ag, 51%～53% Cu, 4%～6% Sn ,≤2% In and≤0.4% Ni.
In a specific embodiment of the present invention, the quality sum of described Sn and In is 6%.
In another specific embodiment of the present invention, described low silver-colored electrovacuum solder adopts simple metal Ag, Cu, Sn, In and Ni to melt in being furnished with the vacuum melting furnace of black-fead crucible and pour into a mould and forms, and casting mold is a metal mold.
Technical scheme provided by the invention, the selection of each chemical element and composition design principle are: at the performance requirement of electrovacuum solder, take all factors into consideration the factors such as price, fusing point, vapour pressure and electrical conductivity of alloying element, except that using Ag and Cu for the main added elements, three kinds of elements of Sn, In, Ni of also selecting low-vapor pressure are for adding element.Wherein, Sn element that fusing point is lower and In element can reduce the fusing point of alloy effectively, reduce the rising of the alloy melting point that is caused in order to the balance silver content.The price of considering indium is far above tin, and its addition is lower than tin.The interpolation of small amount of N i element not only can improve the wetability and the spreadability of solder, and helps reducing crystallization temperature interval, refinement brazing seam structure and improve joint mechanical property.The method for designing of each constituent content is, at first Ag content is determined in lower level (41%～43%Ag) according to preliminary experiment, in order to economizing on resources, determine the liquidus temperature scope of alloy and the content range of corresponding with it Sn element according to thermoisopleth in the Ag-Cu-Sn ternary alloy three-partalloy liquidus surface perspective view then, the liquidus temperature that makes alloy is smaller or equal to 779 ℃ (Ag-Cu eutectic temperatures).In the composition range of determining, adopt high pure metal (99.9%) Ag, Cu, Sn, In, Ni in being furnished with the vacuum melting furnace of black-fead crucible, to melt brazing filler metal alloy, and in stove, be shaped with metal type cast.Adopt the liquidus curve and the solidus temperature of DSC beta alloy, simultaneously in the general processing characteristics of rolling beta alloy on machine and the drawing machine, and then in exemplary alloy, add a small amount of In element (to replace the Sn content of part) and Ni element gradually, carry out the test of dsc analysis and processability again, by adjusting alloying component repeatedly, carry out fusing point, wetability and processability test analysis, finally obtain the alloying component that processability is good, fusing point is moderate.Experiment finds, when the quality sum of Sn and In be 6% and Ni content for less than 0.4% the time, the liquidus temperature of alloy is at 750～780 ℃, the crystallization temperature interval has excellent machinability at 25～35 ℃.
Description of drawings
Fig. 1 is an application examples schematic diagram of the present invention.
The specific embodiment
The low silver-colored electrovacuum solder that is used for electronic device soldering and sealing of the present invention, its chemical composition is by mass percentage: total percentage is 100%, wherein, 41%～43% Ag, 51%～53% Cu, 4%～6% Sn ,≤2%In and≤0.4% Ni.
Low silver-colored electrovacuum solder of the present invention, foundry alloy melt to join to pour into a mould in vacuum melting furnace with high pure metal (99.9%) Ag, Cu, Sn, In, Ni and form.Select the black-fead crucible fusing for use, the nodular cast iron type cast.The master alloy ingot chemical composition is even, and processability is good, and can obtain thickness through conventional rolling mill practice is 30-50 μ m solder paper tinsel.
With low silver-colored electrovacuum solder paper tinsel soldering and sealing gas discharge diode, earlier foil is clipped between earthenware to be welded and the kovar alloy sheet, be assembled into lap joint and be placed in the vacuum brazing furnace, seal bell again, as shown in Figure 1.Be evacuated to 10
-3The anti-A that fills behind the Pa
rGas to 5～10kPa.Heat temperature raising thereupon.When temperature in the stove reaches 800～830 ℃, insulation 19min.Cool to room temperature then with the furnace, can realize that the soldering of electron tube (gas discharge diode) connects.Use low silver-colored electrovacuum solder paper tinsel of the present invention to carry out soldering, conform to factory existing AgCu28 soldering processes, industrialization is easy to operate.Below describe with specific embodiment.
Embodiment 1:
Chemical composition is by mass percentage: 41% Ag, 52.85% Cu, 4% Sn, 2% In and 0.15% Ni.
The solidus temperature of the low silver-colored electrovacuum solder (foil) that is used for electronic device soldering and sealing of the thick about 30 μ m～50 μ m that obtained by the mentioned component proportioning is 690 ℃, and liquidus curve is 766 ℃, and the temperature interval is 32 ℃.Use and to carry out soldering and sealing to the gas discharge diode by low silver-colored electrovacuum solder paper tinsel.Welding method is: ask for an interview Fig. 1, earlier foil 1 be clipped between earthenware 2 to be welded and the kovar alloy sheet 3, be assembled into lap joint be placed on have vacuum orifice 6, air inlet 7 and being furnished with on the objective table 5 in the vacuum brazing furnace 4 of vacuum meter 8, seal bell again.As shown in Figure 1, by vacuum orifice 6 is evacuated to 10
-3Pa is after the air inlet 7 anti-A that fill
rGas to 5～10kPa.Thereupon through heating molybdenum filament 9 heat temperature raisings.When temperature in the stove reaches 800～830 ℃, insulation 19min.Cool to room temperature then with the furnace, can realize the soldering and sealing of gas discharge diode.The finished product gas-discharge tube is tested, and air-tightness is qualified, and 85 ℃～-40 ℃ cold experimental checks are qualified.
Embodiment 2:
Chemical composition is by mass percentage: 41.5% Ag, 52.4% Cu, 4.5% Sn, 1.5% In and 0.10% Ni.
The low silver-colored electrovacuum solder (foil) that is used for electronic device soldering and sealing of the thick about 35 μ m～50 μ m that obtain by the mentioned component proportioning.Solidus temperature is 692 ℃, and liquidus curve is 765 ℃, and the temperature interval is 32 ℃.Use and to hang down silver-colored electrovacuum solder alloy foil, electron tube (gas discharge diode) is carried out soldering and sealing.Welding method is: ask for an interview Fig. 1, earlier foil 1 be clipped between earthenware 2 to be welded and the kovar alloy sheet 3, be assembled into lap joint be placed on have vacuum orifice 6, air inlet 7 and being furnished with on the objective table 5 in the vacuum brazing furnace 4 of vacuum meter 8, seal bell again.As shown in Figure 1, by vacuum orifice 6 is evacuated to 10
-3Pa is after the air inlet 7 anti-A that fill
rGas to 5～10kPa.Thereupon through heating molybdenum filament 9 heat temperature raisings.When temperature in the stove reaches 800～830 ℃, insulation 19min.Cool to room temperature then with the furnace, can realize the soldering and sealing of gas discharge diode.The finished product gas-discharge tube is tested, and air-tightness is qualified, and 85 ℃～-40 ℃ cold experimental checks are qualified.
Embodiment 3:
Chemical composition is by mass percentage: 42% Ag, 51.8% Cu, 4% Sn, 2% In and 0.2% Ni.
The solidus temperature of the low silver-colored electrovacuum solder (foil) that is used for electronic device soldering and sealing of the thick about 34 μ m～50 μ m that obtained by the mentioned component proportioning is 693 ℃, and liquidus curve is 762 ℃, and the temperature interval is 90 ℃.Use and to hang down silver-colored electrovacuum solder alloy foil, electron tube (gas discharge diode) is carried out soldering and sealing.Ask for an interview Fig. 1, welding method is: earlier foil 1 is clipped between earthenware 2 to be welded and the kovar alloy sheet 3, be assembled into lap joint be placed on have vacuum orifice 6, air inlet 7 and being furnished with on the objective table 5 in the vacuum brazing furnace 4 of vacuum meter 8, seal bell again.As shown in Figure 1, vacuum orifice 6 is evacuated to 10
-3Pa is after the air inlet 7 anti-A that fill
rGas to 5～10kPa.Thereupon through heating molybdenum filament 9 heat temperature raisings.When temperature in the stove reaches 800～830 ℃, insulation 19min.Cool to room temperature then with the furnace, can realize the soldering and sealing of gas discharge diode.The finished product gas-discharge tube is tested, and air-tightness is qualified, and 85 ℃～-40 ℃ cold experimental checks are qualified.
Embodiment 4:
Chemical composition is by mass percentage: 42.5% Ag, 51.45% Cu, 5% Sn, 1% In and 0.05% Ni.
The solidus temperature of the low silver-colored electrovacuum solder (foil) that is used for electronic device soldering and sealing of the thick about 45 μ m～50 μ m that obtained by the mentioned component proportioning is 693 ℃, and liquidus curve is 761 ℃, and the temperature interval is 76 ℃.Use and to hang down silver-colored electrovacuum solder alloy foil, electron tube (gas discharge diode) is carried out soldering and sealing.Welding method is: ask for an interview Fig. 1, earlier foil 1 is clipped between earthenware 2 to be welded and the kovar alloy sheet 3, be assembled into lap joint be placed on have vacuum orifice 6, air inlet 7 and being furnished with on the objective table 5 in the vacuum brazing furnace 4 of vacuum meter 8, seal bell again, as shown in Figure 1 in a specific embodiment of the present invention, described, by vacuum orifice 6 is evacuated to 10
-3Pa is after the air inlet 7 anti-A that fill
rGas is to 5-10kPa.Thereupon through heating molybdenum filament 9 heat temperature raisings.When temperature in the stove reaches 800～830 ℃, insulation 19min.Cool to room temperature then with the furnace, can realize the soldering and sealing of gas discharge diode.The finished product gas-discharge tube is tested, and air-tightness is qualified, and 85 ℃～-40 ℃ cold experimental checks are qualified.
In sum, low silver-colored electrovacuum solder of the present invention has reduced the silver content in the silver based electric vacuum solder effectively, and device soldering and sealing is effective, has reduced production cost significantly, becomes the electrovacuum solder of new generation that can replace traditional AgCu28 solder.
Claims (3)
1. low silver-colored electrovacuum solder that is used for electronic device soldering and sealing, it is characterized in that its chemical composition by mass percentage proportioning be: total percentage is 100%, wherein, 41%～43% Ag, 51%～53% Cu, 4%～6% Sn ,≤2% In and≤0.4% Ni.
2. the low silver-colored electrovacuum solder that is used for electronic device soldering and sealing according to claim 1, the quality sum that it is characterized in that described Sn and In is 6%.
3. the low silver-colored electrovacuum solder that is used for electronic device soldering and sealing according to claim 1, it is characterized in that described low silver-colored electrovacuum solder adopts simple metal Ag, Cu, Sn, In and Ni to melt in being furnished with the vacuum melting furnace of black-fead crucible and pour into a mould and forms, casting mold is a metal mold.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010588473XA CN102029484B (en) | 2010-12-15 | 2010-12-15 | Low-silver electro vacuum brazing filler metal used for sealing weld of electronic device |
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| CN201010588473XA CN102029484B (en) | 2010-12-15 | 2010-12-15 | Low-silver electro vacuum brazing filler metal used for sealing weld of electronic device |
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| CN102029484B CN102029484B (en) | 2012-11-07 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625471A (en) * | 2014-12-18 | 2015-05-20 | 郴州市金贵银业股份有限公司 | Cadmium-free silver filler metal for vacuum electron brazing and preparation method thereof |
| CN106222478A (en) * | 2016-08-23 | 2016-12-14 | 无锡日月合金材料有限公司 | A kind of ternary-alloy sealing material and preparation method thereof |
| CN112004638A (en) * | 2018-04-23 | 2020-11-27 | 田中贵金属工业株式会社 | Silver solder and bonding method using the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564394A (en) * | 1979-06-22 | 1981-01-17 | Tanaka Kikinzoku Kogyo Kk | Silver braze alloy |
| JPS566796A (en) * | 1979-06-28 | 1981-01-23 | Tanaka Kikinzoku Kogyo Kk | Silver braze alloy |
| US4411864A (en) * | 1980-12-08 | 1983-10-25 | Mitsubishi Kinzoku Kabushiki Kaisha | Cu-Ag-Si Base alloy brazing filler material |
| CN1046194A (en) * | 1989-11-09 | 1990-10-17 | 中国有色金属工业总公司昆明贵金属研究所 | Low-steam pressure, low melting point silver based soldering alloy |
| CN1120480A (en) * | 1995-04-26 | 1996-04-17 | 东南大学 | Copper-base solder-silver substituted solder for electrical vacuum with low melting point, low vapour pressure and ductility |
| CN101007376A (en) * | 2007-01-24 | 2007-08-01 | 秦国义 | Silver based electric vacuum solder |
-
2010
- 2010-12-15 CN CN201010588473XA patent/CN102029484B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564394A (en) * | 1979-06-22 | 1981-01-17 | Tanaka Kikinzoku Kogyo Kk | Silver braze alloy |
| JPS566796A (en) * | 1979-06-28 | 1981-01-23 | Tanaka Kikinzoku Kogyo Kk | Silver braze alloy |
| US4411864A (en) * | 1980-12-08 | 1983-10-25 | Mitsubishi Kinzoku Kabushiki Kaisha | Cu-Ag-Si Base alloy brazing filler material |
| CN1046194A (en) * | 1989-11-09 | 1990-10-17 | 中国有色金属工业总公司昆明贵金属研究所 | Low-steam pressure, low melting point silver based soldering alloy |
| CN1120480A (en) * | 1995-04-26 | 1996-04-17 | 东南大学 | Copper-base solder-silver substituted solder for electrical vacuum with low melting point, low vapour pressure and ductility |
| CN101007376A (en) * | 2007-01-24 | 2007-08-01 | 秦国义 | Silver based electric vacuum solder |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625471A (en) * | 2014-12-18 | 2015-05-20 | 郴州市金贵银业股份有限公司 | Cadmium-free silver filler metal for vacuum electron brazing and preparation method thereof |
| CN106222478A (en) * | 2016-08-23 | 2016-12-14 | 无锡日月合金材料有限公司 | A kind of ternary-alloy sealing material and preparation method thereof |
| CN106222478B (en) * | 2016-08-23 | 2018-02-13 | 无锡日月合金材料有限公司 | A kind of ternary-alloy sealing material and preparation method thereof |
| CN112004638A (en) * | 2018-04-23 | 2020-11-27 | 田中贵金属工业株式会社 | Silver solder and bonding method using the same |
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| CN102029484B (en) | 2012-11-07 |
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