CN102028444B

CN102028444B - Endoscope device

Info

Publication number: CN102028444B
Application number: CN2010101669414A
Authority: CN
Inventors: 神崎和宏
Original assignee: Olympus Corp
Current assignee: Yijingtong Co ltd
Priority date: 2009-10-07
Filing date: 2010-04-21
Publication date: 2012-09-19
Anticipated expiration: 2030-04-21
Also published as: CN102028444A; JP2011078566A; JP5466913B2

Abstract

The present invention provides an endoscope device. Even at a state that an LED driven by large current, the LED can be sufficiently cooled, and bright irradiation can be performed for an endoscopy object. The endoscope device comprises the following components: a metal mounting substrate (4) which is configured at a front end of an insertion part (2) and is provided with a projection (12) that projects to the front side; a flexible substrate (7) which is configured to a position except for the projection (12) on the mounting substrate (4) and is provided with an electrode pad (7b) at the surface side, while the back side is jointed with the mounting substrate (4) through thermal conductive jointing material (17); and an LED package (6) which is provided with electrodes (6c) that are welded on the electrode pads (7b) of the flexible substrate (7). Furthermore, the back part (6d) except for the electrodes (6c) on the LED package is jointed with a front surface of the projection (12) of the mounting substrate (4).

Description

Endoscope apparatus

Technical field

The present invention relates to endoscope apparatus.

Background technology

In the past, as endoscope apparatus, known had a structure of having fixed the substrate that LED is installed at the front end of insertion section.

[patent documentation 1] japanese kokai publication hei 11-267099 communique

But in the endoscope apparatus of patent documentation 1, the heat that in LED, produces is only discharged with the lead with thinner sectional area that is connected with conductor in the substrate inboard via the conductor that connects substrate, so, possibly can't fully cool off.Especially, in order to ensure higher light quantity, the LED with big current drives is used in expectation, and under this situation, the cooling problem maybe be more deep.

Therefore, it would be desirable following endoscope apparatus:, object can stably internally be looked and carry out bright illumination even under the situation of use, also can fully cool off to LED with the LED of big current drives.

Summary of the invention

A mode as means is a kind of endoscope apparatus, and this endoscope apparatus has: metal installation matrix, and the front end that it is disposed at the intraluminal insertion section of looking object in the insertion has the side-prominent protuberance of forward end; Flexible base, board, it is disposed at the position of avoiding said protuberance of this installation matrix, has electrode pad in the face side of this flexible base, board, and the rear side of this flexible base, board is engaged in said installation matrix through the heat conductivity grafting material; And the LED encapsulation, it has electrode overleaf, and this electrode soldering is in the electrode pad of said flexible base, board, and the back portion except that electrode of said LED encapsulation is engaged in the front end face of the protuberance of said installation matrix through the heat conductivity grafting material.

According to this mode; The electric current of supplying with via being fixed in the flexible base, board that matrix is installed; Supply to LED encapsulation via the electrode that is electrically connected with the electrode pad of substrate, send illumination light, to throwing light in the tube chamber of looking object in the front that is disposed at the insertion section from the LED encapsulation.Also luminous owing to supplying with electric current, so LED encapsulation heating, still, this heat easily rejects heat to the installation matrix from the position except that electrode at the back side that the LED that is engaged in metal installation matrix encapsulates through the heat conductivity grafting material.In addition, in the electrode part, the heat of LED encapsulation also connects the electrode pad of the flexible base, board that is engaged in metal installation matrix through the heat conductivity grafting material, easily reject heat to the installation matrix.Electrode pad can with LED encapsulate the back side electrode pair should and form bigger area, compare with lead in the past, can improve thermal diffusivity.

In aforesaid way; Endoscope apparatus also can have photographic optical system; This photographic optical system has and is configured to axially connecting said installation matrix and the light from said tube chamber is carried out a plurality of lens of optically focused and the lens frame of taking in the tubular of these lens, is provided with the bearing surface with the side butt of said LED encapsulation at the outer surface of said lens frame.

Like this, only be connected to bearing surface, just can make LED encapsulation and photographic optical system approaching as much as possible through the side that makes the LED encapsulation, and, the location of easily carrying out the LED encapsulation.Make the LED encapsulation near photographic optical system, thus, can realize the pathization of insertion section.

In aforesaid way, said bearing surface also can be configured in such position: compare the nearer position of distance from the center of said lens frame with being disposed at foremost the radial outer fringe position of the said lens of side in the said lens.

Like this, can make the optical axis of photographic optical system and LED encapsulation more approaching.A plurality of lens as constituting photographic optical system can make the lens that are configured in foremost big, make other lenses littler than these lens.Therefore, bearing surface is set, thus, can further realizes the pathization of insertion section, and can not block the light of assembling by photographic optical system in the position of this lenslet.

And, in aforesaid way, also can the position corresponding with said bearing surface of the circumferential part of the said lens of side be provided with otch being disposed at foremost.

Like this, can make the optical axis of photographic optical system and LED encapsulation more approaching.Not that to incide all light of photographic optical system all useful, even restriction from the part of the incident light of outermost of radial direction, also can access necessary information.Under this situation, also can bearing surface be set, also can realize the pathization of insertion section in the position that is disposed at lens foremost.

The present invention brings into play following effect: even under the situation of use with the LED of big current drives, also can fully cool off LED, can stably internally look object and carry out bright illumination.

Description of drawings

Fig. 1 is the partial, longitudinal cross-sectional that the endoscope apparatus of an embodiment of the invention is shown.

Fig. 2 is the assembling stereogram that the part illustrates the adapter that endoscope apparatus had of Fig. 1.

Fig. 3 is the exploded perspective view of the adapter of Fig. 2.

Fig. 4 is the axonometric chart at the back side that the LED that adapter the had encapsulation of Fig. 1 is shown.

Fig. 5 is the figure of number of assembling steps that the adapter of Fig. 1 is shown, and (a) is the figure that the coating of bonding agent is shown, and (b) is the bonding figure that flexible base, board is shown, and (c) is the figure that the coating of soldering paste is shown, and (d) is the figure that the assembling of LED encapsulation is shown.

Fig. 6 is the figure that the part illustrates the adapter that the number of assembling steps through Fig. 5 assembles.

Fig. 7 is the axonometric chart at the back side of LED encapsulation that the variation of presentation graphs 4 is shown.

Fig. 8 is the figure that the guide look display frame of adapter is shown.

Fig. 9 illustrates the figure that adapter is selected picture.

Figure 10 is the figure that the picture of the assembling of confirming adapter is shown.

Label declaration

1: endoscope apparatus; 2: the insertion section; 4: matrix is installed; 5: photographic optical system; 5a～5c: lens; 5d: lens frame; The 6:LED encapsulation; 6c: electrode; 6d: heat sink liner (back portion); 7: flexible base, board; 7b: electrode pad; 12:LED fixed part (protuberance); 16: bearing surface; 17: heat conductivity adhesives (heat conductivity grafting material); 18: soldering paste (heat conductivity grafting material); 50: display device; 90: menu bar; 100: real time imaging; 110: guide look display frame; 120: select picture; 130: confirm picture.

The specific embodiment

Below, with reference to the endoscope apparatus of description of drawings an embodiment of the invention.

As depicted in figs. 1 and 2, the endoscope apparatus 1 of this embodiment has the intraluminal insertion section 2 of looking object in being used to insert.2 front end is equipped with the adapter 3 of the medicated cap shape that covers this front end in the insertion section.

As depicted in figs. 1 and 2, adapter 3 has: the metal installation matrix 4 that is disposed at the front end of insertion section 2; The photographic optical system 5, LED encapsulation 6 and the flexible base, board 7 that are fixed in this installation matrix 4 are (with reference to Fig. 2.); Cover 9 with the glass plate 8 that covers these parts; And matrix 4 and cover 9 are fixed in insertion section 2 as one installing sleeve 10 will be installed.

The substrate fixed part 13 that matrix 4 is provided with the through hole 11 that photographic optical system 5 is installed, the LED fixed part 12 that LED encapsulation 6 is installed and installation flexible base, board 7 is being installed.Through hole 11 is located at end difference 14, and this end difference 14 is formed on the position higher than LED fixed part 12 and substrate fixed part 13.

In end difference 14, as shown in Figure 3, be provided with power supply in the both sides of through hole 11 with through hole 15, the power supply section (omitting diagram) that is fixed in insertion section 2 sides is configured to, and connects to supply power with through hole 15 and extend to the upper face side of end difference 14.

As shown in Figure 3, LED fixed part 12 and substrate fixed part 13 are located at when being fixed in the front end of insertion section 2 face towards preceding extreme direction.Through poor with the roughly the same ladder of the gauge of flexible base, board 7, LED fixed part 12 forms than substrate fixed part 13 high one-levels.

As shown in Figure 1, photographic optical system 5 has: along a plurality of

lens

5a, 5b, the 5c of optical axis direction arrangement; And the lens frame 5d that takes in the tubular of these lens 5a～5c.Lens frame 5d is chimeric with the through hole 11 of being located at installation matrix 4, and thus, lens frame 5d is installed on positioning states matrix 4 is installed.

Being configured in the most forward distolateral lens 5a among a plurality of lens 5a～5c is the lens with negative refraction power, has maximum outside dimension.Other lenses 5b, the 5c that is configured in the back level of these lens 5a has the less outside dimension that the light pencil by foremost lens 5a optically focused is passed through.

The lens frame 5d that takes in these lens 5a～5c has the shape that attenuates to the radial direction inboard in the position of the lens 5b of back level, 5c, and the outside dimension of this position constitutes the outside dimension less than foremost lens 5a.And, in this position, the bearing surface 16 of the side butt of lens frame 5d formation and LED encapsulation 6.

And as shown in Figure 2, the lens 5a foremost of photographic optical system 5 has the otch (D shape otch) that forms with the linearity cutting in a circumferential part that is forming circle.Slot arrangement in bearing surface 16 corresponding positions so that phase place is consistent.

LED encapsulation 6 has: supporting is disposed at the roughly foursquare tabular ceramic substrate 6a of inner LED (omitting diagram); And the roughly hemispheric mold 6b that forms by transparent resin material that coats LED.In the rear side of the opposition side that is disposed at mold 6b of ceramic substrate 6a, as shown in Figure 4, expose the electrode 6c that is connected with LED.As shown in Figure 4, electrode 6c avoids the central part of ceramic substrate 6a and disposes two places in both sides.And, be provided with the heat sink liner 6d of heat transmission at central part.

The heat sink liner 6d at the back side that is located at the ceramic substrate 6a of LED encapsulation 6 is being fixed in when matrix 4 is installed, and is located at the LED fixed part 12 that matrix 4 is installed and engages.Under this state, be located at ceramic substrate 6a the back side the two electrode 6c of place respectively with substrate fixed part 13 arranged opposite that matrix 4 is installed.

As shown in Figure 3, flexible base, board 7 thus, only forms electrode pad 7b on a surface for example through on the high softish film like base material 7a of this electrical insulating property of polyimide resin, forming the wiring pattern that is made up of conductive material.As shown in Figures 2 and 3, flexible base, board 7 bendings are used, be configured to the upper surface of end difference 14 from the substrate fixed part 13 that matrix 4 is installed.Power supply is with the upper surface open of through hole 15 at end difference 14, connects this power supply and is electrically connected with the electrode pad 7b of flexible base, board 7 with the power supply section of through hole 15 and the 2 sides extension from the insertion section, can be to the supply of the electrode pad 7b on the flexible base, board 7 electric current.

Flexible base, board 7 carries out with respect to the installation of installation matrix 4 with LED encapsulation 6 as follows.

In the through hole 11 that matrix 4 is installed, photographic optical system 5 is installed in advance.

Shown in Fig. 5 (a), flexible base, board 7 is adhered to the substrate fixed part 13 that matrix 4 is installed via the heat conductivity bonding agent 17 in its rear side coating.It is poor that substrate fixed part 13 and LED fixed part 12 have with the ladder of the size that the thickness after flexible base,

board

7 and 17 additions of heat conductivity bonding agent is roughly the same; So; When flexible base, board 7 is adhered to substrate fixed part 13; Shown in Fig. 5 (b), the surface of the electrode pad 7b of flexible base, board 7 and the surperficial general arrangement of LED fixed part 12 are at grade.

Under this state, shown in Fig. 5 (c),, shown in Fig. 5 (d), dispose LED encapsulation 6 above that at the surface of LED fixed part 12 and the surface coated soldering paste 18 of electrode pad 7b.LED encapsulates at 6 o'clock in configuration, and the side of the ceramic substrate 6a of LED encapsulation 6 is connected to the bearing surface 16 that is made up of lens frame 5d.Then, under this state, carry out reflow soldering, thus, can the electrode 6c that LED encapsulates 6 back sides be engaged in the electrode pad 7b of flexible base, board 7, and, can the heat sink liner 6d that LED encapsulates 6 back sides be engaged in the LED fixed part 12 that matrix 4 is installed.

Under this situation, even between the surface of the surface of the electrode pad 7b of flexible base, board 7 and LED fixed part 12, exist small ladder poor, it is poor also can when making the scolding tin fusion through reflow soldering, to absorb this ladder, and both are seamlessly engaged.

In addition, replace above-mentioned soldering paste 18, also can use the electric conductivity adhesives.

Like this, as shown in Figure 6, fixed LED encapsulation 6 with the electrode pad 7b of electrode 6c soldering in flexible base, board 7, be electrically connected thus.And, heat sink liner 6d soldering in LED fixed part 12, is formed heat-transfer path A thus.In addition; Because through heat conductivity bonding agent 17 bonding flexible base, boards 7 and the substrate fixed part 13 that matrix 4 is installed; So; Also form heat-transfer path B, this heat-transfer path B via the electrode 6c of LED encapsulation 6, have soldering and on the thickness direction of flexible base, board 7, connect in the flexible base, board 7 of the electrode pad 7b of this electrode 6c.

As shown in Figure 1, the cover 9 with glass plate 8 is coated on installing sleeve 10 has fixed the installation matrix 4 of flexible base, board 7 with the state of LED encapsulation 6, constitutes adapter 3 thus.Then, be anchored on the external screw thread (omitting diagram) that insertion section 2 is had through the female thread 10a that this installing sleeve 10 is had, this adapter 3 is fixed in insertion section 2 thus, constitutes the endoscope apparatus 1 of this embodiment.

The explanation effect of the endoscope apparatus 1 of this embodiment of formation so below.

Endoscope apparatus 1 according to this embodiment; As shown in Figure 6; Electric current C via power supply section 2 supplies from the insertion section; Via the wiring pattern of the flexible base, board that is connected with power supply section 7, the electrode pad 7b that constitutes from the part at this wiring pattern supplies to the electrode 6c that LED encapsulates 6 back sides, lights LED.

LED encapsulates 6 quilt covers 9 and covers, still, the illumination light of sending see through be located at cover 9 glass plate 8 to the place ahead of insertion section 2 irradiation, internally look in the tube chamber of object and throw light on.The light of front that in tube chamber, reflects etc. and turn back to insertion section 2 is through photographic optical system 6 optically focused, and photographs through the imaging apparatus (omitting diagram) of being located at insertion section 2 sides.Thus, can carry out intraluminal endoscopic observation.

Under this situation,, use the LED encapsulation that has by the LED of big current drives, thus, can produce bright illumination light, obtain the endoscopic images of intraluminal distinctness, can carry out endoscopic observation more reliably as LED encapsulation 6.Under this situation; Heating from LED encapsulation 6 increases; But according to the endoscope apparatus 1 of this embodiment, the heat sink liner 6d that LED encapsulates 6 back sides directly is engaged in metal installation matrix 4 via soldering paste 18; So the major part that encapsulates the heat of 6 generations from LED rejects heat to via this heat-transfer path A installs matrix 4 sides.

In addition; The electrode 6c that LED encapsulates 6 back sides also is engaged in electrode pad 7b via soldering paste 18, and flexible base, board 7 also is engaged in metal installation matrix 4 via heat conductivity bonding agent 17; So a part that encapsulates the heat of 6 generations from LED rejects heat to via this heat-transfer path B installs matrix 4 sides.Compare with lead in the past, electrode 6c and electrode pad 7b can form fully big sectional area, can guarantee heat-transfer path B significantly.Therefore, even, also can cool off it fully with the LED encapsulation 6 of the big current drives of height heating.

Like this, the endoscope apparatus 1 according to this embodiment has following advantage: carry out bright illumination, and the cooling LED encapsulation 6 fully, suppress the generation of picture noise, can access distinct endoscopic images.And, in the cooling of LED encapsulation 6, special radiator is not set, and utilizes metal installation matrix 4, so, can utilize easy structure to reduce number of components.

In addition,,, just can carry out LED encapsulation 6 with respect to the location that matrix 4 is installed only through side that makes LED encapsulation 6 and bearing surface 16 butts of being located at the lens frame 5d of photographic optical system 5 according to the endoscope apparatus 1 of this embodiment, easy to manufacture.And; Since bearing surface 16 be located at a plurality of lens 5a～5c that constitute photographic optical system 5 in the outer rim of the maximum lens 5a foremost of diameter compare the position of more leaning on the optical axis direction of photographic optical system 5; So; Has following advantage: can make photographic optical system 5 and fully closely configuration of LED encapsulation 6, and can realize the pathization of adapter 3 and the insertion section 2 that this adapter 3 is installed.

And a circumferential part that the LED of foremost lens 5a is encapsulated 6 sides is carried out D shape otch, so, reduce the situation of being blocked by photographic optical system 5 from the illumination light of LED encapsulation 6, can carry out the illumination of wide scope.

In addition; In this embodiment; Illustration have heat sink liner 6d and clip this heat sink liner 6d has electrode 6c in both sides situation in the back side central authorities of LED encapsulation 6, but be not limited thereto, as shown in Figure 7; The position of the position of heat sink liner 6d and electrode 6c also can be different with the situation of Fig. 4, also can adopt to be disposed at other LED encapsulation 6 of configuration arbitrarily.Under this situation, as long as form the LED fixed part 12 and substrate fixed part 13 that matrix 4 sides are installed according to the position of heat sink liner 6d and electrode 6c.

And; In this embodiment; Adopt soldering paste 18 as LED encapsulation 6 is engaged in the heat conductivity grafting material that matrix 4 is installed, adopt bonding agent as flexible base, board 7 being fixed in the heat conductivity grafting material that matrix 4 is installed, but be not limited thereto; Replace soldering paste 18, also can adopt other bonding agents with electric conductivity.

The endoscope apparatus of this embodiment is an adapter formula endoscope apparatus, so, can assemble a plurality of adapters.A plurality of adapters for example can be enumerated simple eye direct-view and use adapter with adapter, simple eye side-looking with adapter, measurement.

The endoscope apparatus of this embodiment can assemble a plurality of adapters 3, thus, can enlarge the viewing area in the endoscope apparatus.And the endoscope apparatus of this embodiment has display device, and thus, user can visually be selected adapter 3 easily and correctly, and it is assemblied in endoscope apparatus.

That is, under situation about use measuring, can correctly carry out the adapter selection through the step shown in following with adapter.

At first, when by user adapter 3 being assemblied in endoscope insertion part, display device 50 shows guide look display frame 110 shown in Figure 8.At this moment, in the background of guide look display frame 110, show to measure real time imaging 100 with adapter, so, can suppress user and from have a guide look of display frame 110, select simple eye direct-view by error with adapter, simple eye side-looking situation with adapter.

Then, display device 50 shows selection picture 120 shown in Figure 9.The adapter 3 that this selection picture 120 is used to supply user to select to be assembled is that direct-view is used adapter with adapter or side-looking.At this moment, also in the background of selecting picture 120, show the real time imaging of measuring with adapter 100.Direct-view with adapter and side-looking with adapter in, demonstration is different with the corresponding picture shape of adapter 3 in display device 50, so user is the identification adapter type visually.Selected under the situation of direct-view with adapter at user, endoscope apparatus reads and the optical data of looking at straight with the needed adapter of the corresponding calibration of adapter (calibration) from external memory storages such as endoscope apparatus or USB storages.

At last, display device 50 shows affirmation picture 130 shown in Figure 10.This affirmation picture 130 be behind the white image of the needed picture shape corresponding of correct decision calibration with adapter 3, the picture of pointing out user to note once more.Through making LED encapsulate the 6 luminous bright level of adjusting, thus, can determine the picture shape corresponding with adapter 3.

More than, can be according to the white view data of above-mentioned collimation optical data and the picture shape corresponding with adapter 3, the calibration process of the adapter 3 that is suitable for most being assembled.

In addition, producing on the picture of display device 50 under the situation of smear (smear) following the luminous of LED encapsulation 6, as long as suppress the luminous quantity of LED encapsulation 6.

Claims

1. an endoscope apparatus is characterized in that, this endoscope apparatus has:

Metal installation matrix, the front end that it is disposed at the insertion section has the side-prominent protuberance of forward end;

Flexible base, board, it is disposed at the position of avoiding said protuberance of this installation matrix, has electrode pad in the face side of this flexible base, board, and the rear side of this flexible base, board is engaged in said installation matrix through the heat conductivity grafting material; And

The LED encapsulation; It has electrode overleaf; This electrode is connected with the electrode pad of said flexible base, board via electroconductive component, and the back portion except that said electrode of said LED encapsulation is engaged in the front end face of the protuberance of said installation matrix through the heat conductivity grafting material.

2. endoscope apparatus according to claim 1, wherein,

This endoscope apparatus also has photographic optical system, and this photographic optical system has the lens and the lens frame of taking in the tubular of these lens that are configured at the said installation matrix of axial perforation,

The outer surface of said lens frame is provided with the bearing surface of the side butt that encapsulates with said LED.

3. endoscope apparatus according to claim 2, wherein,

Said bearing surface is configured in such position: compare the nearer position of distance from the center of said lens frame with being disposed at foremost the radial outer fringe position of the said lens of side in the said lens.

4. endoscope apparatus according to claim 3, wherein,

Said lens are provided with otch in its circumferential part, promptly corresponding with said bearing surface position.

5. endoscope apparatus according to claim 1, wherein,

Said installation matrix has: the LED fixed part, and it installs said LED encapsulation; The substrate fixed part, it installs said flexible base, board; And end difference, it is formed on than said LED fixed part and the high position of said substrate fixed part,

Said flexible base, board is arranged to extend to said end difference from said substrate fixed part.